KR100798438B1 - 드레싱장치 및 폴리싱장치 - Google Patents

드레싱장치 및 폴리싱장치 Download PDF

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Publication number
KR100798438B1
KR100798438B1 KR1020027012337A KR20027012337A KR100798438B1 KR 100798438 B1 KR100798438 B1 KR 100798438B1 KR 1020027012337 A KR1020027012337 A KR 1020027012337A KR 20027012337 A KR20027012337 A KR 20027012337A KR 100798438 B1 KR100798438 B1 KR 100798438B1
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KR
South Korea
Prior art keywords
dresser
dressing
polishing
plate
load
Prior art date
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Expired - Lifetime
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KR1020027012337A
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English (en)
Korean (ko)
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KR20020092993A (ko
Inventor
도가와데츠지
노지이쿠타로
고지마순이치로
다카다노부유키
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
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Publication date
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Publication of KR20020092993A publication Critical patent/KR20020092993A/ko
Application granted granted Critical
Publication of KR100798438B1 publication Critical patent/KR100798438B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B24B41/047—Grinding heads for working on plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
KR1020027012337A 2001-01-19 2002-01-17 드레싱장치 및 폴리싱장치 Expired - Lifetime KR100798438B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2001-00011730 2001-01-19
JP2001011730A JP4072810B2 (ja) 2001-01-19 2001-01-19 ドレッシング装置および該ドレッシング装置を備えたポリッシング装置

Publications (2)

Publication Number Publication Date
KR20020092993A KR20020092993A (ko) 2002-12-12
KR100798438B1 true KR100798438B1 (ko) 2008-01-28

Family

ID=18878832

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020027012337A Expired - Lifetime KR100798438B1 (ko) 2001-01-19 2002-01-17 드레싱장치 및 폴리싱장치

Country Status (6)

Country Link
US (1) US6899604B2 (enExample)
EP (1) EP1261454B1 (enExample)
JP (1) JP4072810B2 (enExample)
KR (1) KR100798438B1 (enExample)
TW (1) TWI236949B (enExample)
WO (1) WO2002057051A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200127328A (ko) * 2019-05-02 2020-11-11 삼성전자주식회사 컨디셔너, 이를 포함하는 화학 기계적 연마 장치 및 이 장치를 이용한 반도체 장치의 제조 방법

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3922887B2 (ja) * 2001-03-16 2007-05-30 株式会社荏原製作所 ドレッサ及びポリッシング装置
US7288165B2 (en) * 2003-10-24 2007-10-30 Applied Materials, Inc. Pad conditioning head for CMP process
WO2007082556A1 (en) * 2006-01-23 2007-07-26 Freescale Semiconductor, Inc. Method and apparatus for conditioning a cmp pad
CN100441377C (zh) * 2006-12-05 2008-12-10 中国科学院上海光学精密机械研究所 用于环行抛光机的校正板
US8042240B2 (en) 2007-01-26 2011-10-25 Honda Motor Co., Ltd. Machine tool
JP4382099B2 (ja) * 2007-01-26 2009-12-09 本田技研工業株式会社 工作機械
JP5236515B2 (ja) * 2009-01-28 2013-07-17 株式会社荏原製作所 ドレッシング装置、化学的機械的研磨装置及び方法
CN105122428B (zh) * 2013-04-19 2017-11-28 应用材料公司 多盘化学机械抛光衬垫调节器与方法
JP6592355B2 (ja) * 2015-01-30 2019-10-16 株式会社荏原製作所 連結機構および基板研磨装置
US10814457B2 (en) * 2018-03-19 2020-10-27 Globalfoundries Inc. Gimbal for CMP tool conditioning disk having flexible metal diaphragm
KR102128780B1 (ko) * 2018-12-03 2020-07-01 한국생산기술연구원 Cmp설비용 컨디셔닝장치의 디스크결합체
CN110125745A (zh) * 2019-05-27 2019-08-16 广东技术师范大学 一种工业抛光打磨机器人
CN113183031A (zh) * 2021-05-20 2021-07-30 杭州众硅电子科技有限公司 一种修整头旋转部件、抛光垫修整头和修整器
CN114193326A (zh) * 2021-12-22 2022-03-18 莱玛特·沃尔特斯（沈阳）精密机械有限公司 一种抛光机的抛光盘修整装置
CN115771086A (zh) * 2022-11-15 2023-03-10 重庆大学 一种万向浮动打磨机构
CN116021427B (zh) * 2023-02-01 2025-06-24 江西联洲研磨科技有限公司 一种树脂砂轮加工用表面修整装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000202758A (ja) * 1999-01-18 2000-07-25 Tokyo Seimitsu Co Ltd 研磨布コンディショナを備えたウェハ研磨装置
JP2000343406A (ja) * 1999-06-02 2000-12-12 Sumitomo Metal Ind Ltd 試料研磨方法及び試料研磨装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5981056A (ja) 1982-10-29 1984-05-10 Tohoku Metal Ind Ltd 定盤修正装置
US5885137A (en) * 1997-06-27 1999-03-23 Siemens Aktiengesellschaft Chemical mechanical polishing pad conditioner
US6200199B1 (en) 1998-03-31 2001-03-13 Applied Materials, Inc. Chemical mechanical polishing conditioner
US6263605B1 (en) * 1998-12-21 2001-07-24 Motorola, Inc. Pad conditioner coupling and end effector for a chemical mechanical planarization system and method therefor
US6217429B1 (en) * 1999-07-09 2001-04-17 Applied Materials, Inc. Polishing pad conditioner
JP2001246550A (ja) 2000-03-02 2001-09-11 Ebara Corp 研磨装置
US6572446B1 (en) * 2000-09-18 2003-06-03 Applied Materials Inc. Chemical mechanical polishing pad conditioning element with discrete points and compliant membrane

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000202758A (ja) * 1999-01-18 2000-07-25 Tokyo Seimitsu Co Ltd 研磨布コンディショナを備えたウェハ研磨装置
JP2000343406A (ja) * 1999-06-02 2000-12-12 Sumitomo Metal Ind Ltd 試料研磨方法及び試料研磨装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200127328A (ko) * 2019-05-02 2020-11-11 삼성전자주식회사 컨디셔너, 이를 포함하는 화학 기계적 연마 장치 및 이 장치를 이용한 반도체 장치의 제조 방법
KR102705647B1 (ko) * 2019-05-02 2024-09-11 삼성전자주식회사 컨디셔너, 이를 포함하는 화학 기계적 연마 장치 및 이 장치를 이용한 반도체 장치의 제조 방법

Also Published As

Publication number Publication date
JP4072810B2 (ja) 2008-04-09
JP2002210650A (ja) 2002-07-30
EP1261454A1 (en) 2002-12-04
TWI236949B (en) 2005-08-01
US6899604B2 (en) 2005-05-31
US20030148707A1 (en) 2003-08-07
WO2002057051A1 (en) 2002-07-25
KR20020092993A (ko) 2002-12-12
EP1261454B1 (en) 2012-08-01

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