JP4072810B2 - ドレッシング装置および該ドレッシング装置を備えたポリッシング装置 - Google Patents

ドレッシング装置および該ドレッシング装置を備えたポリッシング装置 Download PDF

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Publication number
JP4072810B2
JP4072810B2 JP2001011730A JP2001011730A JP4072810B2 JP 4072810 B2 JP4072810 B2 JP 4072810B2 JP 2001011730 A JP2001011730 A JP 2001011730A JP 2001011730 A JP2001011730 A JP 2001011730A JP 4072810 B2 JP4072810 B2 JP 4072810B2
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JP
Japan
Prior art keywords
dresser
dressing
polishing
plate
load
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2001011730A
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English (en)
Japanese (ja)
Other versions
JP2002210650A (ja
JP2002210650A5 (enExample
Inventor
哲二 戸川
郁太郎 野路
俊市朗 兒嶋
暢行 高田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2001011730A priority Critical patent/JP4072810B2/ja
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to US10/204,600 priority patent/US6899604B2/en
Priority to KR1020027012337A priority patent/KR100798438B1/ko
Priority to EP02715775A priority patent/EP1261454B1/en
Priority to PCT/JP2002/000274 priority patent/WO2002057051A1/en
Priority to TW091100738A priority patent/TWI236949B/zh
Publication of JP2002210650A publication Critical patent/JP2002210650A/ja
Publication of JP2002210650A5 publication Critical patent/JP2002210650A5/ja
Application granted granted Critical
Publication of JP4072810B2 publication Critical patent/JP4072810B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B24B41/047—Grinding heads for working on plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
JP2001011730A 2001-01-19 2001-01-19 ドレッシング装置および該ドレッシング装置を備えたポリッシング装置 Expired - Lifetime JP4072810B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2001011730A JP4072810B2 (ja) 2001-01-19 2001-01-19 ドレッシング装置および該ドレッシング装置を備えたポリッシング装置
KR1020027012337A KR100798438B1 (ko) 2001-01-19 2002-01-17 드레싱장치 및 폴리싱장치
EP02715775A EP1261454B1 (en) 2001-01-19 2002-01-17 Dressing apparatus and polishing apparatus
PCT/JP2002/000274 WO2002057051A1 (en) 2001-01-19 2002-01-17 Dressing apparatus and polishing apparatus
US10/204,600 US6899604B2 (en) 2001-01-19 2002-01-17 Dressing apparatus and polishing apparatus
TW091100738A TWI236949B (en) 2001-01-19 2002-01-18 Dressing apparatus and polishing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001011730A JP4072810B2 (ja) 2001-01-19 2001-01-19 ドレッシング装置および該ドレッシング装置を備えたポリッシング装置

Publications (3)

Publication Number Publication Date
JP2002210650A JP2002210650A (ja) 2002-07-30
JP2002210650A5 JP2002210650A5 (enExample) 2005-07-14
JP4072810B2 true JP4072810B2 (ja) 2008-04-09

Family

ID=18878832

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001011730A Expired - Lifetime JP4072810B2 (ja) 2001-01-19 2001-01-19 ドレッシング装置および該ドレッシング装置を備えたポリッシング装置

Country Status (6)

Country Link
US (1) US6899604B2 (enExample)
EP (1) EP1261454B1 (enExample)
JP (1) JP4072810B2 (enExample)
KR (1) KR100798438B1 (enExample)
TW (1) TWI236949B (enExample)
WO (1) WO2002057051A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8382558B2 (en) 2009-01-28 2013-02-26 Ebara Corporation Apparatus for dressing a polishing pad, chemical mechanical polishing apparatus and method

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3922887B2 (ja) * 2001-03-16 2007-05-30 株式会社荏原製作所 ドレッサ及びポリッシング装置
US7288165B2 (en) * 2003-10-24 2007-10-30 Applied Materials, Inc. Pad conditioning head for CMP process
WO2007082556A1 (en) * 2006-01-23 2007-07-26 Freescale Semiconductor, Inc. Method and apparatus for conditioning a cmp pad
CN100441377C (zh) * 2006-12-05 2008-12-10 中国科学院上海光学精密机械研究所 用于环行抛光机的校正板
US8042240B2 (en) 2007-01-26 2011-10-25 Honda Motor Co., Ltd. Machine tool
JP4382099B2 (ja) * 2007-01-26 2009-12-09 本田技研工業株式会社 工作機械
CN105122428B (zh) * 2013-04-19 2017-11-28 应用材料公司 多盘化学机械抛光衬垫调节器与方法
JP6592355B2 (ja) * 2015-01-30 2019-10-16 株式会社荏原製作所 連結機構および基板研磨装置
US10814457B2 (en) * 2018-03-19 2020-10-27 Globalfoundries Inc. Gimbal for CMP tool conditioning disk having flexible metal diaphragm
KR102128780B1 (ko) * 2018-12-03 2020-07-01 한국생산기술연구원 Cmp설비용 컨디셔닝장치의 디스크결합체
KR102705647B1 (ko) 2019-05-02 2024-09-11 삼성전자주식회사 컨디셔너, 이를 포함하는 화학 기계적 연마 장치 및 이 장치를 이용한 반도체 장치의 제조 방법
CN110125745A (zh) * 2019-05-27 2019-08-16 广东技术师范大学 一种工业抛光打磨机器人
CN113183031A (zh) * 2021-05-20 2021-07-30 杭州众硅电子科技有限公司 一种修整头旋转部件、抛光垫修整头和修整器
CN114193326A (zh) * 2021-12-22 2022-03-18 莱玛特·沃尔特斯（沈阳）精密机械有限公司 一种抛光机的抛光盘修整装置
CN115771086A (zh) * 2022-11-15 2023-03-10 重庆大学 一种万向浮动打磨机构
CN116021427B (zh) * 2023-02-01 2025-06-24 江西联洲研磨科技有限公司 一种树脂砂轮加工用表面修整装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5981056A (ja) 1982-10-29 1984-05-10 Tohoku Metal Ind Ltd 定盤修正装置
US5885137A (en) * 1997-06-27 1999-03-23 Siemens Aktiengesellschaft Chemical mechanical polishing pad conditioner
US6200199B1 (en) 1998-03-31 2001-03-13 Applied Materials, Inc. Chemical mechanical polishing conditioner
US6263605B1 (en) * 1998-12-21 2001-07-24 Motorola, Inc. Pad conditioner coupling and end effector for a chemical mechanical planarization system and method therefor
JP3045236B1 (ja) 1999-01-18 2000-05-29 株式会社東京精密 研磨布コンディショナを備えたウェハ研磨装置
JP3945940B2 (ja) 1999-06-02 2007-07-18 東京エレクトロン株式会社 試料研磨方法及び試料研磨装置
US6217429B1 (en) * 1999-07-09 2001-04-17 Applied Materials, Inc. Polishing pad conditioner
JP2001246550A (ja) 2000-03-02 2001-09-11 Ebara Corp 研磨装置
US6572446B1 (en) * 2000-09-18 2003-06-03 Applied Materials Inc. Chemical mechanical polishing pad conditioning element with discrete points and compliant membrane

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8382558B2 (en) 2009-01-28 2013-02-26 Ebara Corporation Apparatus for dressing a polishing pad, chemical mechanical polishing apparatus and method

Also Published As

Publication number Publication date
JP2002210650A (ja) 2002-07-30
EP1261454A1 (en) 2002-12-04
TWI236949B (en) 2005-08-01
US6899604B2 (en) 2005-05-31
US20030148707A1 (en) 2003-08-07
WO2002057051A1 (en) 2002-07-25
KR20020092993A (ko) 2002-12-12
EP1261454B1 (en) 2012-08-01
KR100798438B1 (ko) 2008-01-28

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