TWI234002B - Adapter for testing one or more conductor assemblies - Google Patents

Adapter for testing one or more conductor assemblies Download PDF

Info

Publication number
TWI234002B
TWI234002B TW092132186A TW92132186A TWI234002B TW I234002 B TWI234002 B TW I234002B TW 092132186 A TW092132186 A TW 092132186A TW 92132186 A TW92132186 A TW 92132186A TW I234002 B TWI234002 B TW I234002B
Authority
TW
Taiwan
Prior art keywords
contact
adapter
conductor
item
scope
Prior art date
Application number
TW092132186A
Other languages
English (en)
Chinese (zh)
Other versions
TW200413740A (en
Inventor
Manfred Prokopp
Viktor Romanov
Original Assignee
Atg Test Systems Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atg Test Systems Gmbh filed Critical Atg Test Systems Gmbh
Publication of TW200413740A publication Critical patent/TW200413740A/zh
Application granted granted Critical
Publication of TWI234002B publication Critical patent/TWI234002B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2805—Bare printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
TW092132186A 2002-12-20 2003-11-17 Adapter for testing one or more conductor assemblies TWI234002B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10260238A DE10260238B4 (de) 2002-12-20 2002-12-20 Adapter zum Testen einer oder mehrerer Leiteranordnungen und Verfahren

Publications (2)

Publication Number Publication Date
TW200413740A TW200413740A (en) 2004-08-01
TWI234002B true TWI234002B (en) 2005-06-11

Family

ID=32519240

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092132186A TWI234002B (en) 2002-12-20 2003-11-17 Adapter for testing one or more conductor assemblies

Country Status (7)

Country Link
JP (1) JP2006510026A (ko)
KR (1) KR100638330B1 (ko)
CN (1) CN1714294A (ko)
AU (1) AU2003292115A1 (ko)
DE (1) DE10260238B4 (ko)
TW (1) TWI234002B (ko)
WO (1) WO2004059329A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI413777B (zh) * 2010-09-01 2013-11-01 Multi - power circuit board and its application probe card

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4845031B2 (ja) 2006-11-10 2011-12-28 株式会社ヨコオ 中継コネクター
KR101396604B1 (ko) * 2006-11-27 2014-05-16 엘지디스플레이 주식회사 액정표시장치용 검사장치
CN102721835B (zh) * 2012-07-03 2014-06-04 航天科工防御技术研究试验中心 测试适配器
CN104073427B (zh) * 2014-06-27 2016-03-30 江苏卓微生物科技有限公司 细胞检测芯片适配器
CN104073426B (zh) * 2014-06-27 2016-03-30 江苏卓微生物科技有限公司 细胞检测芯片适配器安装座
CN104031823B (zh) * 2014-06-27 2016-08-24 江苏卓微生物科技有限公司 细胞检测芯片及其适配器
DE102015113046A1 (de) * 2015-08-07 2017-02-09 Xcerra Corp. Positioniereinrichtung für einen Paralleltester zum Testen von Leiterplatten und Paralleltester zum Testen von Leiterplatten
CN105044402A (zh) * 2015-08-25 2015-11-11 贵州航天计量测试技术研究所 一种封装微波压控振荡器测试装置
DE102018120337B3 (de) * 2018-08-21 2020-02-27 Preh Gmbh Berührempfindliches bedienelement für ein kraftfahrzeug

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3838413A1 (de) * 1988-11-12 1990-05-17 Mania Gmbh Adapter fuer elektronische pruefvorrichtungen fuer leiterplatten und dergl.
US5469064A (en) * 1992-01-14 1995-11-21 Hewlett-Packard Company Electrical assembly testing using robotic positioning of probes
DE19541307C2 (de) * 1995-11-06 2001-09-27 Atg Test Systems Gmbh Verfahren zum Prüfen von elektrischen Leiteranordnungen und Vorrichtung zum Ausführen des Verfahrens
DE19644725C1 (de) * 1996-10-28 1998-04-02 Atg Test Systems Gmbh Vorrichtung und Verfahren zum Prüfen von Leiterplatten
TW360790B (en) * 1996-10-28 1999-06-11 Atg Test Systems Gmbh Printed circuit board test apparatus and method
DE19718637A1 (de) 1997-05-02 1998-11-05 Atg Test Systems Gmbh Vorrichtung und Verfahren zum Prüfen von Leiterplatten
JP3214415B2 (ja) * 1997-10-30 2001-10-02 日本電産リード株式会社 基板検査装置および基板検査方法
JP2000009755A (ja) * 1998-06-23 2000-01-14 Jsr Corp プリント基板検査用治具基板およびプリント基板検査方法
DE10024875B4 (de) * 2000-05-16 2004-07-01 Infineon Technologies Ag Bauteilhaltersystem zur Verwendung mit Testvorrichtungen zum Testen elektronischer Bauteile

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI413777B (zh) * 2010-09-01 2013-11-01 Multi - power circuit board and its application probe card

Also Published As

Publication number Publication date
CN1714294A (zh) 2005-12-28
WO2004059329A1 (de) 2004-07-15
KR100638330B1 (ko) 2006-10-25
DE10260238B4 (de) 2007-04-05
KR20050091013A (ko) 2005-09-14
TW200413740A (en) 2004-08-01
JP2006510026A (ja) 2006-03-23
DE10260238A1 (de) 2004-07-22
AU2003292115A1 (en) 2004-07-22

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MM4A Annulment or lapse of patent due to non-payment of fees