TWI227579B - Contact used in a connector, and method for manufacturing an element to be soldered - Google Patents
Contact used in a connector, and method for manufacturing an element to be soldered Download PDFInfo
- Publication number
- TWI227579B TWI227579B TW092128152A TW92128152A TWI227579B TW I227579 B TWI227579 B TW I227579B TW 092128152 A TW092128152 A TW 092128152A TW 92128152 A TW92128152 A TW 92128152A TW I227579 B TWI227579 B TW I227579B
- Authority
- TW
- Taiwan
- Prior art keywords
- gold
- laser beam
- plating layer
- layer
- irradiated
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 38
- 238000004519 manufacturing process Methods 0.000 title claims description 20
- 239000010931 gold Substances 0.000 claims abstract description 154
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 153
- 229910052737 gold Inorganic materials 0.000 claims abstract description 153
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 140
- 238000009792 diffusion process Methods 0.000 claims abstract description 95
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 69
- 229910000679 solder Inorganic materials 0.000 claims abstract description 65
- 229910000990 Ni alloy Inorganic materials 0.000 claims abstract description 30
- 229910052751 metal Inorganic materials 0.000 claims abstract description 5
- 239000002184 metal Substances 0.000 claims abstract description 5
- 230000001678 irradiating effect Effects 0.000 claims abstract 2
- 238000007747 plating Methods 0.000 claims description 128
- 230000002265 prevention Effects 0.000 claims description 61
- 239000000956 alloy Substances 0.000 claims description 44
- 229910045601 alloy Inorganic materials 0.000 claims description 42
- 238000003466 welding Methods 0.000 claims description 16
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 15
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims description 15
- 238000005476 soldering Methods 0.000 claims description 14
- 238000012545 processing Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 239000007769 metal material Substances 0.000 claims description 4
- 238000005275 alloying Methods 0.000 claims description 3
- 238000003892 spreading Methods 0.000 claims description 3
- 230000007480 spreading Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims description 2
- 230000008020 evaporation Effects 0.000 claims 3
- 238000001704 evaporation Methods 0.000 claims 3
- 230000008016 vaporization Effects 0.000 claims 1
- 229910001020 Au alloy Inorganic materials 0.000 abstract description 2
- 238000009736 wetting Methods 0.000 abstract description 2
- 239000000047 product Substances 0.000 description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 239000007788 liquid Substances 0.000 description 9
- 238000002844 melting Methods 0.000 description 8
- 230000008018 melting Effects 0.000 description 8
- 230000004048 modification Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 7
- 238000009713 electroplating Methods 0.000 description 6
- 101100165177 Caenorhabditis elegans bath-15 gene Proteins 0.000 description 5
- 239000011265 semifinished product Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 239000002689 soil Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 210000002784 stomach Anatomy 0.000 description 2
- 229910017398 Au—Ni Inorganic materials 0.000 description 1
- 235000018185 Betula X alpestris Nutrition 0.000 description 1
- 235000018212 Betula X uliginosa Nutrition 0.000 description 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 229910000713 I alloy Inorganic materials 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 208000003251 Pruritus Diseases 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000001996 bearing alloy Substances 0.000 description 1
- 230000033558 biomineral tissue development Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000004043 dyeing Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- 230000007803 itching Effects 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 1
- DITXJPASYXFQAS-UHFFFAOYSA-N nickel;sulfamic acid Chemical compound [Ni].NS(O)(=O)=O DITXJPASYXFQAS-UHFFFAOYSA-N 0.000 description 1
- 150000002828 nitro derivatives Chemical class 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000035755 proliferation Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000005028 tinplate Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
- H01R4/028—Soldered or welded connections comprising means for preventing flowing or wicking of solder or flux in parts not desired
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002297880 | 2002-10-10 | ||
| JP2003114759A JP2004315941A (ja) | 2003-04-18 | 2003-04-18 | 半田付け用端子の製造方法 |
| JP2003185748A JP4003705B2 (ja) | 2003-06-27 | 2003-06-27 | 半田付け用端子の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200414617A TW200414617A (en) | 2004-08-01 |
| TWI227579B true TWI227579B (en) | 2005-02-01 |
Family
ID=32096712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW092128152A TWI227579B (en) | 2002-10-10 | 2003-10-09 | Contact used in a connector, and method for manufacturing an element to be soldered |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8294063B2 (ja) |
| EP (1) | EP1551081B1 (ja) |
| KR (1) | KR100597068B1 (ja) |
| TW (1) | TWI227579B (ja) |
| WO (1) | WO2004034521A1 (ja) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7172438B2 (en) * | 2005-03-03 | 2007-02-06 | Samtec, Inc. | Electrical contacts having solder stops |
| US20060196857A1 (en) * | 2005-03-03 | 2006-09-07 | Samtec, Inc. | Methods of manufacturing electrical contacts having solder stops |
| CN101248556B (zh) | 2005-08-23 | 2011-03-23 | 第一电子工业株式会社 | 超小型触点及其制造方法和电子部件 |
| KR100912181B1 (ko) * | 2007-09-20 | 2009-08-14 | 노승백 | 레이져 표면처리단계를 이용한 납오름 방지용 부분도금방법 |
| DE102008042777A1 (de) * | 2008-10-13 | 2010-04-15 | Robert Bosch Gmbh | Selektiver Lötstop |
| JP5479406B2 (ja) * | 2011-06-30 | 2014-04-23 | 日本航空電子工業株式会社 | コネクタ |
| JP2013171976A (ja) * | 2012-02-21 | 2013-09-02 | Fujitsu Ltd | プリント配線板の製造方法及びプリント配線板 |
| JP6309372B2 (ja) * | 2014-07-01 | 2018-04-11 | 日本航空電子工業株式会社 | コネクタ |
| DE102014017886A1 (de) * | 2014-12-04 | 2016-06-09 | Auto-Kabel Management Gmbh | Verfahren zum Herstellen eines elektrischen Anschlussteils |
| DE102018125300A1 (de) * | 2018-10-12 | 2020-04-16 | Osram Opto Semiconductors Gmbh | Elektronisches Bauteil und Verfahren zum Aufbringen von zumindest einem Lötpad auf ein elektronisches Bauteil |
| US11394146B2 (en) * | 2020-04-07 | 2022-07-19 | Quanta Computer Inc. | Treated connection pins for high speed expansion sockets |
| JP7354944B2 (ja) * | 2020-07-06 | 2023-10-03 | トヨタ自動車株式会社 | 配線基板の製造方法 |
| JP7456330B2 (ja) * | 2020-08-21 | 2024-03-27 | トヨタ自動車株式会社 | 配線基板の製造方法 |
| CN114138058A (zh) * | 2020-09-03 | 2022-03-04 | 联想（新加坡）私人有限公司 | 电子设备 |
| CN116710290A (zh) * | 2020-12-22 | 2023-09-05 | 陆逊梯卡有限公司 | 优选地但非排他地用于眼镜的部件等的用于在由金属制成的材料上形成装饰和/或标识的方法 |
| KR102501388B1 (ko) * | 2022-02-25 | 2023-02-21 | 주식회사 제이앤티씨 | 실장기립부를 갖는 전자기기용 커넥터 제조방법 |
| JP2024033060A (ja) * | 2022-08-30 | 2024-03-13 | モレックス エルエルシー | コネクタ及びコネクタ対 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4424527A (en) * | 1981-07-31 | 1984-01-03 | Optical Information Systems, Inc. | Bonding pad metallization for semiconductor devices |
| JPS60238489A (ja) * | 1984-05-12 | 1985-11-27 | Daiki Gomme Kogyo Kk | 表面被覆金属層の作製する方法 |
| JPH0215662A (ja) | 1988-07-01 | 1990-01-19 | Fujitsu Ltd | 集積回路のリードメッキ方法 |
| JPH0590835A (ja) | 1991-09-26 | 1993-04-09 | Toshiba Corp | アレイアンテナ |
| JPH05315408A (ja) * | 1992-05-12 | 1993-11-26 | Nitto Denko Corp | フィルムキャリアおよびこれを用いた半導体装置 |
| JP2583155Y2 (ja) * | 1992-05-14 | 1998-10-15 | 日本航空電子工業株式会社 | コンタクト |
| JPH0773121B2 (ja) | 1992-12-28 | 1995-08-02 | 日本電気株式会社 | 半導体装置用パッケージ及びその製造方法 |
| US5957736A (en) * | 1997-11-19 | 1999-09-28 | Ddk Ltd. | Electronic part |
| JP3143089B2 (ja) * | 1996-12-31 | 2001-03-07 | 第一電子工業株式会社 | 電子部品 |
| US6300678B1 (en) * | 1997-10-03 | 2001-10-09 | Fujitsu Limited | I/O pin having solder dam for connecting substrates |
| JP4079527B2 (ja) * | 1998-07-15 | 2008-04-23 | 富士通コンポーネント株式会社 | リードピンの部分めっき方法 |
| EP1202390B1 (en) * | 2000-10-25 | 2008-05-21 | Japan Aviation Electronics Industry, Limited | An electronic component and a method of manufacturing the same |
| JP2003045530A (ja) * | 2001-07-27 | 2003-02-14 | Japan Aviation Electronics Industry Ltd | コネクタ及びそれに備えられるコンタクトの製造方法 |
-
2003
- 2003-10-09 TW TW092128152A patent/TWI227579B/zh not_active IP Right Cessation
- 2003-10-10 US US10/505,453 patent/US8294063B2/en active Active
- 2003-10-10 KR KR1020047011963A patent/KR100597068B1/ko active IP Right Grant
- 2003-10-10 WO PCT/JP2003/013094 patent/WO2004034521A1/ja active Application Filing
- 2003-10-10 EP EP03751468A patent/EP1551081B1/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| KR20040101217A (ko) | 2004-12-02 |
| EP1551081A1 (en) | 2005-07-06 |
| US8294063B2 (en) | 2012-10-23 |
| KR100597068B1 (ko) | 2006-07-06 |
| TW200414617A (en) | 2004-08-01 |
| WO2004034521A1 (ja) | 2004-04-22 |
| US20050103761A1 (en) | 2005-05-19 |
| EP1551081A4 (en) | 2007-07-25 |
| EP1551081B1 (en) | 2012-02-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI227579B (en) | Contact used in a connector, and method for manufacturing an element to be soldered | |
| JP2873954B2 (ja) | チップサイズ半導体パッケージの製造方法 | |
| US5635755A (en) | Solderable intergrated circuit lead frames plated with tin and palladium | |
| CN102576693B (zh) | 半导体芯片搭载用基板及其制造方法 | |
| CN1112729C (zh) | 电子器件中的电连接结构和导体表面材料的形成方法 | |
| CN101248556B (zh) | 超小型触点及其制造方法和电子部件 | |
| TW201005124A (en) | Composite material for electrical/electronic component and electrical/electronic component using the same | |
| TW201102208A (en) | Solder-coated component, process for producing same, and method for mounting same | |
| JPH09318650A (ja) | センサ装置及びその製造方法 | |
| TW593792B (en) | Method for forming plating film and electronic component having plating film formed thereon by same method | |
| JP4997837B2 (ja) | 半導体素子の接合方法および半導体装置 | |
| JP2008300359A (ja) | 半田付け端子の表面の処理方法 | |
| JP4660231B2 (ja) | 表面処理方法およびそれを用いる電子部品の製造方法 | |
| JP2010043346A (ja) | 導電性パターンの形成方法及びめっき端子の製造方法 | |
| US20040089945A1 (en) | Semiconductor device | |
| CN104070294B (zh) | 电子器件用的接合构造和电子器件 | |
| TWI271901B (en) | Electronic part and surface treatment method of the same | |
| JPH02256249A (ja) | 回路基板およびその表面処理方法 | |
| CN100405564C (zh) | 引线框以及制造该引线框的方法 | |
| JP2004152750A (ja) | 半田付け端子、及び半田付け端子の表面の処理方法 | |
| JP4003705B2 (ja) | 半田付け用端子の製造方法 | |
| JPH04356937A (ja) | 誘電体基板上の導体間の電流誘起電気化学的デンドライト形成を防止するための組成及びコーティング | |
| JPS62204557A (ja) | リ−ドフレ−ム | |
| JP3201356B2 (ja) | エキシマレ―ザによる基板表面処理方法 | |
| JP3794620B2 (ja) | 電子部品実装用フィルムキャリアテープの製造方法および電子部品実装用フィルムキャリアテープの製造装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4A | Expiration of patent term of an invention patent |