TWI223345B - Method and apparatus for cleaning semiconductor wafers and other flat media - Google Patents
Method and apparatus for cleaning semiconductor wafers and other flat media Download PDFInfo
- Publication number
- TWI223345B TWI223345B TW91115539A TW91115539A TWI223345B TW I223345 B TWI223345 B TW I223345B TW 91115539 A TW91115539 A TW 91115539A TW 91115539 A TW91115539 A TW 91115539A TW I223345 B TWI223345 B TW I223345B
- Authority
- TW
- Taiwan
- Prior art keywords
- surfactant
- rotor
- water
- spray
- box
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 69
- 235000012431 wafers Nutrition 0.000 title claims description 22
- 238000000034 method Methods 0.000 title claims description 20
- 239000004065 semiconductor Substances 0.000 title claims description 7
- 239000007921 spray Substances 0.000 claims abstract description 136
- 239000004094 surface-active agent Substances 0.000 claims abstract description 107
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 96
- 238000000429 assembly Methods 0.000 claims abstract description 22
- 230000000712 assembly Effects 0.000 claims abstract description 22
- 238000003860 storage Methods 0.000 claims abstract description 19
- 239000000203 mixture Substances 0.000 claims abstract description 17
- 239000000969 carrier Substances 0.000 claims abstract description 4
- 238000003491 array Methods 0.000 claims abstract 2
- 239000007788 liquid Substances 0.000 claims description 57
- 238000005507 spraying Methods 0.000 claims description 30
- 238000001035 drying Methods 0.000 claims description 15
- 238000002156 mixing Methods 0.000 claims description 13
- 238000002347 injection Methods 0.000 claims description 11
- 239000007924 injection Substances 0.000 claims description 11
- 238000011084 recovery Methods 0.000 claims description 10
- 238000005086 pumping Methods 0.000 claims description 5
- 239000008367 deionised water Substances 0.000 claims description 4
- 229910021641 deionized water Inorganic materials 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 239000003344 environmental pollutant Substances 0.000 claims description 3
- 231100000719 pollutant Toxicity 0.000 claims description 3
- 239000002351 wastewater Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 claims description 2
- 238000006073 displacement reaction Methods 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 claims description 2
- 238000005406 washing Methods 0.000 claims description 2
- 238000000605 extraction Methods 0.000 claims 5
- PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 claims 1
- 241000251468 Actinopterygii Species 0.000 claims 1
- 239000013543 active substance Substances 0.000 claims 1
- 238000005516 engineering process Methods 0.000 claims 1
- 238000010397 one-hybrid screening Methods 0.000 claims 1
- MFOUDYKPLGXPGO-UHFFFAOYSA-N propachlor Chemical compound ClCC(=O)N(C(C)C)C1=CC=CC=C1 MFOUDYKPLGXPGO-UHFFFAOYSA-N 0.000 claims 1
- 239000002689 soil Substances 0.000 claims 1
- 239000008400 supply water Substances 0.000 claims 1
- 239000003599 detergent Substances 0.000 abstract description 7
- 239000000356 contaminant Substances 0.000 abstract description 3
- 238000009987 spinning Methods 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 238000011068 loading method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
- 239000012459 cleaning agent Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 238000010923 batch production Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 241000894006 Bacteria Species 0.000 description 1
- 241001342895 Chorus Species 0.000 description 1
- 241001331845 Equus asinus x caballus Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 238000009395 breeding Methods 0.000 description 1
- 230000001488 breeding effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- HAORKNGNJCEJBX-UHFFFAOYSA-N cyprodinil Chemical compound N=1C(C)=CC(C2CC2)=NC=1NC1=CC=CC=C1 HAORKNGNJCEJBX-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000005923 long-lasting effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000037452 priming Effects 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US90503001A | 2001-07-12 | 2001-07-12 | |
| US10/108,278 US6691718B2 (en) | 1999-07-28 | 2002-03-26 | Wafer container cleaning system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWI223345B true TWI223345B (en) | 2004-11-01 |
Family
ID=26805734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW91115539A TWI223345B (en) | 2001-07-12 | 2002-07-12 | Method and apparatus for cleaning semiconductor wafers and other flat media |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP1404463A4 (enExample) |
| JP (1) | JP2004535071A (enExample) |
| TW (1) | TWI223345B (enExample) |
| WO (1) | WO2003006183A2 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110808219A (zh) * | 2019-11-01 | 2020-02-18 | 江苏亚电科技有限公司 | 一种晶圆存放盒清洗装置及清洗方法 |
| CN116037592A (zh) * | 2022-12-27 | 2023-05-02 | 无锡亚电智能装备有限公司 | 晶圆盒晶圆篮清洗设备 |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101886414B1 (ko) * | 2016-09-27 | 2018-08-09 | 주식회사 유닉 | 웨이퍼 용기 클리닝 장치 및 시스템 |
| CN108565235B (zh) * | 2018-05-31 | 2024-03-01 | 亚智系统科技(苏州)有限公司 | 用于扇出型晶圆级芯片的表面处理、封装系统及操作方法 |
| SG11202100082XA (en) * | 2018-07-06 | 2021-02-25 | Oem Group Llc | Systems and methods for a spray measurement apparatus |
| CN108940996A (zh) * | 2018-07-27 | 2018-12-07 | 深圳市凯尔迪光电科技有限公司 | 高精密集成电路离心清洗设备 |
| CN111081594B (zh) * | 2019-09-25 | 2022-09-30 | 北京时代民芯科技有限公司 | 一种jlcc图像传感器电路封装前的清洗工装及方法 |
| CN112191588B (zh) * | 2020-09-18 | 2021-12-21 | 程瑶 | 太阳能发电板生产过程配用清洁机及清洗方法 |
| KR102587371B1 (ko) * | 2020-12-21 | 2023-10-12 | 주식회사 뉴파워 프라즈마 | 리프팅 커버 도어를 포함하는 글라스 세정 챔버, 이를 포함하는 글라스 화학 강화 설비, 및 초박형 글라스의 화학 강화 방법 |
| CN115338173B (zh) * | 2022-08-31 | 2023-09-26 | 浙江中科智谷光电科技有限公司 | 一种液晶模组加工用清洗设备以及控制方法 |
| CN117206242B (zh) * | 2023-10-03 | 2024-08-13 | 上海芯畀科技有限公司 | 半自动离心式晶圆传送盒清洗机 |
| CN117644074A (zh) * | 2024-01-30 | 2024-03-05 | 深圳市龙图光罩股份有限公司 | 掩模版清洗方法、装置、终端设备以及存储介质 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4437479A (en) * | 1981-12-30 | 1984-03-20 | Atcor | Decontamination apparatus for semiconductor wafer handling equipment |
| US4736759A (en) * | 1986-02-21 | 1988-04-12 | Robert A. Coberly | Apparatus for cleaning rinsing and drying substrates |
| US5238503A (en) * | 1991-04-09 | 1993-08-24 | International Business Machines Corporation | Device for decontaminating a semiconductor wafer container |
| US5363867A (en) * | 1992-01-21 | 1994-11-15 | Shinko Electric Co., Ltd. | Article storage house in a clean room |
| US5301700A (en) * | 1992-03-05 | 1994-04-12 | Tokyo Electron Limited | Washing system |
| US5224503A (en) * | 1992-06-15 | 1993-07-06 | Semitool, Inc. | Centrifugal wafer carrier cleaning apparatus |
| US5520205A (en) * | 1994-07-01 | 1996-05-28 | Texas Instruments Incorporated | Apparatus for wafer cleaning with rotation |
| US6096100A (en) * | 1997-12-12 | 2000-08-01 | Texas Instruments Incorporated | Method for processing wafers and cleaning wafer-handling implements |
| DE19740352A1 (de) * | 1997-09-13 | 1999-03-18 | Zf Frledrichshafen Aktiengesel | Verfahren zum Montieren eines Lenkventils mit einer Zentriereinheit |
| KR100560077B1 (ko) * | 1998-01-09 | 2006-03-13 | 인티그리스, 인코포레이티드 | 컨테이너 세척 장치 |
| US6412502B1 (en) * | 1999-07-28 | 2002-07-02 | Semitool, Inc. | Wafer container cleaning system |
-
2002
- 2002-07-09 JP JP2003511982A patent/JP2004535071A/ja active Pending
- 2002-07-09 EP EP02749953A patent/EP1404463A4/en not_active Withdrawn
- 2002-07-09 WO PCT/US2002/021997 patent/WO2003006183A2/en not_active Ceased
- 2002-07-12 TW TW91115539A patent/TWI223345B/zh not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110808219A (zh) * | 2019-11-01 | 2020-02-18 | 江苏亚电科技有限公司 | 一种晶圆存放盒清洗装置及清洗方法 |
| CN116037592A (zh) * | 2022-12-27 | 2023-05-02 | 无锡亚电智能装备有限公司 | 晶圆盒晶圆篮清洗设备 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2003006183A2 (en) | 2003-01-23 |
| EP1404463A2 (en) | 2004-04-07 |
| EP1404463A4 (en) | 2004-10-06 |
| JP2004535071A (ja) | 2004-11-18 |
| WO2003006183A3 (en) | 2003-02-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |