TWI222955B - Self-aligning optical micro-mechanical device package - Google Patents
Self-aligning optical micro-mechanical device package Download PDFInfo
- Publication number
- TWI222955B TWI222955B TW091114628A TW91114628A TWI222955B TW I222955 B TWI222955 B TW I222955B TW 091114628 A TW091114628 A TW 091114628A TW 91114628 A TW91114628 A TW 91114628A TW I222955 B TWI222955 B TW I222955B
- Authority
- TW
- Taiwan
- Prior art keywords
- optical
- wafer
- reference plane
- frame
- scope
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 120
- 230000007246 mechanism Effects 0.000 claims abstract description 32
- 235000012431 wafers Nutrition 0.000 claims description 78
- 238000004806 packaging method and process Methods 0.000 claims description 46
- 238000012545 processing Methods 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 18
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 239000003566 sealing material Substances 0.000 claims description 7
- 239000013078 crystal Substances 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims 1
- 238000005538 encapsulation Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 9
- 239000013307 optical fiber Substances 0.000 description 13
- 239000002184 metal Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000010410 layer Substances 0.000 description 9
- 239000000835 fiber Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 239000000919 ceramic Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000004033 plastic Substances 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 229920005591 polysilicon Polymers 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000004100 electronic packaging Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 229910001092 metal group alloy Inorganic materials 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- DJHGAFSJWGLOIV-UHFFFAOYSA-K Arsenate3- Chemical compound [O-][As]([O-])([O-])=O DJHGAFSJWGLOIV-UHFFFAOYSA-K 0.000 description 1
- 241000283690 Bos taurus Species 0.000 description 1
- 208000005647 Mumps Diseases 0.000 description 1
- 206010052428 Wound Diseases 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 229940000489 arsenate Drugs 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003517 fume Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000003864 humus Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 208000010805 mumps infectious disease Diseases 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 230000026676 system process Effects 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/007—Interconnections between the MEMS and external electrical signals
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Optical Couplings Of Light Guides (AREA)
- Led Device Packages (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Micromachines (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/911,951 US6771859B2 (en) | 2001-07-24 | 2001-07-24 | Self-aligning optical micro-mechanical device package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWI222955B true TWI222955B (en) | 2004-11-01 |
Family
ID=25431153
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW091114628A TWI222955B (en) | 2001-07-24 | 2002-07-02 | Self-aligning optical micro-mechanical device package |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6771859B2 (enExample) |
| EP (1) | EP1409399A2 (enExample) |
| JP (1) | JP2004536349A (enExample) |
| AU (1) | AU2002315205A1 (enExample) |
| TW (1) | TWI222955B (enExample) |
| WO (1) | WO2003010087A2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI498987B (zh) * | 2013-03-14 | 2015-09-01 | King Yuan Electronics Co Ltd | 偵測裝置 |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6798954B2 (en) | 2001-07-24 | 2004-09-28 | 3M Innovative Properties Company | Packaged optical micro-mechanical device |
| US6834154B2 (en) | 2001-07-24 | 2004-12-21 | 3M Innovative Properties Co. | Tooling fixture for packaged optical micro-mechanical devices |
| DE60238232D1 (de) * | 2001-07-27 | 2010-12-23 | Nippon Telegraph & Telephone | Vorrichtung zur Kompensation der Polarisationsmodendispersion mit optischen XOR-Schaltung |
| DE10152137A1 (de) * | 2001-10-23 | 2003-05-08 | Trw Automotive Electron & Comp | Elektronikmodul und Verfahren zu seiner Herstellung |
| US6660564B2 (en) * | 2002-01-25 | 2003-12-09 | Sony Corporation | Wafer-level through-wafer packaging process for MEMS and MEMS package produced thereby |
| US20050208132A1 (en) * | 2002-07-29 | 2005-09-22 | Gayatri Sathyan | Methods and dosage forms for reducing side effects of benzisozazole derivatives |
| US7212698B2 (en) * | 2004-02-10 | 2007-05-01 | International Business Machines Corporation | Circuit board integrated optical coupling elements |
| US7283699B2 (en) * | 2004-09-30 | 2007-10-16 | Intel Corporation | Optical package |
| KR100645622B1 (ko) * | 2004-12-01 | 2006-11-15 | 삼성전기주식회사 | 광변조기 모듈 패키지 |
| US7642628B2 (en) * | 2005-01-11 | 2010-01-05 | Rosemount Inc. | MEMS packaging with improved reaction to temperature changes |
| US7755610B2 (en) * | 2005-02-01 | 2010-07-13 | Industrial Technology Research Institute | Writing device for bistable material with improved flexible material alignment features |
| DE102007002725A1 (de) * | 2007-01-18 | 2008-07-31 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Gehäuse für in mobilen Anwendungen eingesetzte mikromechanische und mikrooptische Bauelemente |
| US8837159B1 (en) * | 2009-10-28 | 2014-09-16 | Amazon Technologies, Inc. | Low-profile circuit board assembly |
| US9500808B2 (en) * | 2012-05-09 | 2016-11-22 | The Boeing Company | Ruggedized photonic crystal sensor packaging |
| GB2583450B (en) | 2019-04-01 | 2023-04-12 | Huber Suhner Polatis Ltd | Method and apparatus for suction alignment |
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| US4119363A (en) | 1976-03-18 | 1978-10-10 | Bell Telephone Laboratories Incorporated | Package for optical devices including optical fiber-to-metal hermetic seal |
| US4186995A (en) | 1978-03-30 | 1980-02-05 | Amp Incorporated | Light device, lens, and fiber optic package |
| US4347655A (en) | 1978-09-28 | 1982-09-07 | Optical Information Systems, Inc. | Mounting arrangement for semiconductor optoelectronic devices |
| EP0010352A1 (en) | 1978-10-16 | 1980-04-30 | Motorola, Inc. | Opto-electrical semiconductor device |
| US4346294A (en) | 1979-07-05 | 1982-08-24 | Burr-Brown Research Corp. | Low profile optical coupling to planar-mounted optoelectronic device |
| US4413881A (en) | 1979-07-26 | 1983-11-08 | Northern Telecom Limited | Optical fiber hermetic seal |
| US4399541A (en) | 1981-02-17 | 1983-08-16 | Northern Telecom Limited | Light emitting device package having combined heater/cooler |
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-
2001
- 2001-07-24 US US09/911,951 patent/US6771859B2/en not_active Expired - Fee Related
-
2002
- 2002-06-11 JP JP2003515448A patent/JP2004536349A/ja not_active Withdrawn
- 2002-06-11 WO PCT/US2002/019170 patent/WO2003010087A2/en not_active Ceased
- 2002-06-11 EP EP02742152A patent/EP1409399A2/en not_active Withdrawn
- 2002-06-11 AU AU2002315205A patent/AU2002315205A1/en not_active Abandoned
- 2002-07-02 TW TW091114628A patent/TWI222955B/zh active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI498987B (zh) * | 2013-03-14 | 2015-09-01 | King Yuan Electronics Co Ltd | 偵測裝置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20030021541A1 (en) | 2003-01-30 |
| WO2003010087A3 (en) | 2003-10-09 |
| WO2003010087A2 (en) | 2003-02-06 |
| JP2004536349A (ja) | 2004-12-02 |
| AU2002315205A1 (en) | 2003-02-17 |
| US6771859B2 (en) | 2004-08-03 |
| EP1409399A2 (en) | 2004-04-21 |
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