JP2004536349A - 自己位置合せ式オプティカルマイクロメカニカルデバイスパッケージ - Google Patents
自己位置合せ式オプティカルマイクロメカニカルデバイスパッケージ Download PDFInfo
- Publication number
- JP2004536349A JP2004536349A JP2003515448A JP2003515448A JP2004536349A JP 2004536349 A JP2004536349 A JP 2004536349A JP 2003515448 A JP2003515448 A JP 2003515448A JP 2003515448 A JP2003515448 A JP 2003515448A JP 2004536349 A JP2004536349 A JP 2004536349A
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- JP
- Japan
- Prior art keywords
- die
- optical
- package
- package frame
- reference surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 174
- 230000007246 mechanism Effects 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims description 30
- 239000013307 optical fiber Substances 0.000 claims description 19
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 238000004806 packaging method and process Methods 0.000 claims description 10
- 239000008393 encapsulating agent Substances 0.000 claims description 7
- 230000008878 coupling Effects 0.000 claims description 5
- 238000010168 coupling process Methods 0.000 claims description 5
- 238000005859 coupling reaction Methods 0.000 claims description 5
- 238000004891 communication Methods 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 description 12
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 8
- 229920005591 polysilicon Polymers 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 7
- 239000000919 ceramic Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 5
- 239000000835 fiber Substances 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000011160 research Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 230000010287 polarization Effects 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 229910001092 metal group alloy Inorganic materials 0.000 description 2
- 238000005459 micromachining Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 208000005647 Mumps Diseases 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
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- 239000002991 molded plastic Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 208000010805 mumps infectious disease Diseases 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000037074 physically active Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/007—Interconnections between the MEMS and external electrical signals
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Optical Couplings Of Light Guides (AREA)
- Led Device Packages (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Micromachines (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/911,951 US6771859B2 (en) | 2001-07-24 | 2001-07-24 | Self-aligning optical micro-mechanical device package |
| PCT/US2002/019170 WO2003010087A2 (en) | 2001-07-24 | 2002-06-11 | Self-aligning optical micro-mechanical device package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004536349A true JP2004536349A (ja) | 2004-12-02 |
| JP2004536349A5 JP2004536349A5 (enExample) | 2006-01-05 |
Family
ID=25431153
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003515448A Withdrawn JP2004536349A (ja) | 2001-07-24 | 2002-06-11 | 自己位置合せ式オプティカルマイクロメカニカルデバイスパッケージ |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6771859B2 (enExample) |
| EP (1) | EP1409399A2 (enExample) |
| JP (1) | JP2004536349A (enExample) |
| AU (1) | AU2002315205A1 (enExample) |
| TW (1) | TWI222955B (enExample) |
| WO (1) | WO2003010087A2 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008528301A (ja) * | 2005-01-11 | 2008-07-31 | ローズマウント インコーポレイテッド | 温度変化に対して改良された反応を有するｍｅｍｓパッケージ |
| JP2010517064A (ja) * | 2007-01-18 | 2010-05-20 | フラウンホーファー−ゲゼルシャフト ツル フェルデルング デル アンゲヴァンテン フォルシュング エー ファウ | モバイル使用事例において使用されるマイクロマシニング型のかつ光マイクロマシニング型の構成素子に用いられるパッケージ |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6798954B2 (en) | 2001-07-24 | 2004-09-28 | 3M Innovative Properties Company | Packaged optical micro-mechanical device |
| US6834154B2 (en) | 2001-07-24 | 2004-12-21 | 3M Innovative Properties Co. | Tooling fixture for packaged optical micro-mechanical devices |
| DE60238232D1 (de) * | 2001-07-27 | 2010-12-23 | Nippon Telegraph & Telephone | Vorrichtung zur Kompensation der Polarisationsmodendispersion mit optischen XOR-Schaltung |
| DE10152137A1 (de) * | 2001-10-23 | 2003-05-08 | Trw Automotive Electron & Comp | Elektronikmodul und Verfahren zu seiner Herstellung |
| US6660564B2 (en) * | 2002-01-25 | 2003-12-09 | Sony Corporation | Wafer-level through-wafer packaging process for MEMS and MEMS package produced thereby |
| US20050208132A1 (en) * | 2002-07-29 | 2005-09-22 | Gayatri Sathyan | Methods and dosage forms for reducing side effects of benzisozazole derivatives |
| US7212698B2 (en) * | 2004-02-10 | 2007-05-01 | International Business Machines Corporation | Circuit board integrated optical coupling elements |
| US7283699B2 (en) * | 2004-09-30 | 2007-10-16 | Intel Corporation | Optical package |
| KR100645622B1 (ko) * | 2004-12-01 | 2006-11-15 | 삼성전기주식회사 | 광변조기 모듈 패키지 |
| US7755610B2 (en) * | 2005-02-01 | 2010-07-13 | Industrial Technology Research Institute | Writing device for bistable material with improved flexible material alignment features |
| US8837159B1 (en) * | 2009-10-28 | 2014-09-16 | Amazon Technologies, Inc. | Low-profile circuit board assembly |
| US9500808B2 (en) * | 2012-05-09 | 2016-11-22 | The Boeing Company | Ruggedized photonic crystal sensor packaging |
| TWI498987B (zh) * | 2013-03-14 | 2015-09-01 | King Yuan Electronics Co Ltd | 偵測裝置 |
| GB2583450B (en) | 2019-04-01 | 2023-04-12 | Huber Suhner Polatis Ltd | Method and apparatus for suction alignment |
Family Cites Families (58)
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| US4119363A (en) | 1976-03-18 | 1978-10-10 | Bell Telephone Laboratories Incorporated | Package for optical devices including optical fiber-to-metal hermetic seal |
| US4186995A (en) | 1978-03-30 | 1980-02-05 | Amp Incorporated | Light device, lens, and fiber optic package |
| US4347655A (en) | 1978-09-28 | 1982-09-07 | Optical Information Systems, Inc. | Mounting arrangement for semiconductor optoelectronic devices |
| EP0010352A1 (en) | 1978-10-16 | 1980-04-30 | Motorola, Inc. | Opto-electrical semiconductor device |
| US4346294A (en) | 1979-07-05 | 1982-08-24 | Burr-Brown Research Corp. | Low profile optical coupling to planar-mounted optoelectronic device |
| US4413881A (en) | 1979-07-26 | 1983-11-08 | Northern Telecom Limited | Optical fiber hermetic seal |
| US4399541A (en) | 1981-02-17 | 1983-08-16 | Northern Telecom Limited | Light emitting device package having combined heater/cooler |
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| US4438338A (en) | 1981-11-05 | 1984-03-20 | Burr-Brown Research Corporation | Low profile optical coupling for an optoelectronic module |
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| US4932745A (en) * | 1989-07-25 | 1990-06-12 | At&T Bell Laboratories | Radiation switching arrangement with moving deflecting element |
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| JPH07249798A (ja) * | 1994-03-09 | 1995-09-26 | Fujitsu Ltd | 光部品固定装置及びその製造方法 |
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| FR2738432B1 (fr) | 1995-09-01 | 1997-09-26 | Hamel Andre | Composant optique adapte a la surveillance d'une liaison multilongueur d'onde et multiplexeur a insertion-extraction utilisant ce composant, application aux reseaux optiques |
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| JP2001296486A (ja) | 2000-04-13 | 2001-10-26 | Sumitomo Osaka Cement Co Ltd | マトリクス光スイッチ |
| IL155675A0 (en) | 2000-10-31 | 2003-11-23 | 3M Innovative Properties Co | Mems-based wavelength equalizer |
| US20020113281A1 (en) | 2000-12-19 | 2002-08-22 | Cunningham Shawn Jay | MEMS device having an actuator with curved electrodes |
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-
2001
- 2001-07-24 US US09/911,951 patent/US6771859B2/en not_active Expired - Fee Related
-
2002
- 2002-06-11 JP JP2003515448A patent/JP2004536349A/ja not_active Withdrawn
- 2002-06-11 WO PCT/US2002/019170 patent/WO2003010087A2/en not_active Ceased
- 2002-06-11 EP EP02742152A patent/EP1409399A2/en not_active Withdrawn
- 2002-06-11 AU AU2002315205A patent/AU2002315205A1/en not_active Abandoned
- 2002-07-02 TW TW091114628A patent/TWI222955B/zh active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008528301A (ja) * | 2005-01-11 | 2008-07-31 | ローズマウント インコーポレイテッド | 温度変化に対して改良された反応を有するｍｅｍｓパッケージ |
| JP2010517064A (ja) * | 2007-01-18 | 2010-05-20 | フラウンホーファー−ゲゼルシャフト ツル フェルデルング デル アンゲヴァンテン フォルシュング エー ファウ | モバイル使用事例において使用されるマイクロマシニング型のかつ光マイクロマシニング型の構成素子に用いられるパッケージ |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI222955B (en) | 2004-11-01 |
| US20030021541A1 (en) | 2003-01-30 |
| WO2003010087A3 (en) | 2003-10-09 |
| WO2003010087A2 (en) | 2003-02-06 |
| AU2002315205A1 (en) | 2003-02-17 |
| US6771859B2 (en) | 2004-08-03 |
| EP1409399A2 (en) | 2004-04-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20050524 |
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| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20050524 |
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| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20061114 |