TWD243689S - 半導體製造裝置用處理管 - Google Patents

半導體製造裝置用處理管

Info

Publication number
TWD243689S
TWD243689S TW113306107F TW113306107F TWD243689S TW D243689 S TWD243689 S TW D243689S TW 113306107 F TW113306107 F TW 113306107F TW 113306107 F TW113306107 F TW 113306107F TW D243689 S TWD243689 S TW D243689S
Authority
TW
Taiwan
Prior art keywords
semiconductor manufacturing
manufacturing devices
tube
processing tubes
processing
Prior art date
Application number
TW113306107F
Other languages
English (en)
Chinese (zh)
Inventor
神田達輝
山本哲夫
Original Assignee
日商國際電氣股份有限公司 (日本)
日商國際電氣股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商國際電氣股份有限公司 (日本), 日商國際電氣股份有限公司 filed Critical 日商國際電氣股份有限公司 (日本)
Publication of TWD243689S publication Critical patent/TWD243689S/zh

Links

TW113306107F 2024-06-14 2024-11-20 半導體製造裝置用處理管 TWD243689S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2024-012086 2024-01-30
JP2024012086F JP1782473S (oth) 2024-06-14 2024-06-14

Publications (1)

Publication Number Publication Date
TWD243689S true TWD243689S (zh) 2026-04-01

Family

ID=93058186

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113306107F TWD243689S (zh) 2024-06-14 2024-11-20 半導體製造裝置用處理管

Country Status (2)

Country Link
JP (1) JP1782473S (oth)
TW (1) TWD243689S (oth)

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD405062S (en) 1997-08-20 1999-02-02 Tokyo Electron Ltd. Processing tube for use in a semiconductor wafer heat processing apparatus
USD405431S (en) 1997-08-20 1999-02-09 Tokyo Electron Ltd. Tube for use in a semiconductor wafer heat processing apparatus
USD405429S (en) 1997-01-31 1999-02-09 Tokyo Electron Limited Processing tube for use in a semiconductor wafer heat processing apparatus
USD406113S (en) 1997-01-31 1999-02-23 Tokyo Electron Limited Processing tube for use in a semiconductor wafer heat processing apparatus
USD518884S1 (en) 2002-11-22 2006-04-11 Tokyo Electron Limited Heating tube for semiconductor-making furnace
CN300748574S (zh) 2006-10-12 2008-02-20 东京毅力科创株式会社 半导体制造用处理管
TWD125600S1 (zh) 2006-10-12 2008-10-21 東京威力科創股份有限公司 半導體製造用加工處理管
TWD125601S (zh) 2007-05-08 2008-10-21 東京威力科創股份有限公司 半導體製造用加工處理管
TW201203426A (en) 2010-04-23 2012-01-16 Hitachi Int Electric Inc Substrate processing apparatus and method of manufacturing semiconductor device
USD778458S1 (en) 2015-02-23 2017-02-07 Hitachi Kokusai Electric Inc. Reaction tube
USD842824S1 (en) 2017-08-09 2019-03-12 Kokusai Electric Corporation Reaction tube
USD931823S1 (en) 2020-01-29 2021-09-28 Kokusai Electric Corporation Reaction tube
USD986826S1 (en) 2020-03-10 2023-05-23 Kokusai Electric Corporation Reaction tube

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD405429S (en) 1997-01-31 1999-02-09 Tokyo Electron Limited Processing tube for use in a semiconductor wafer heat processing apparatus
USD406113S (en) 1997-01-31 1999-02-23 Tokyo Electron Limited Processing tube for use in a semiconductor wafer heat processing apparatus
USD405062S (en) 1997-08-20 1999-02-02 Tokyo Electron Ltd. Processing tube for use in a semiconductor wafer heat processing apparatus
USD405431S (en) 1997-08-20 1999-02-09 Tokyo Electron Ltd. Tube for use in a semiconductor wafer heat processing apparatus
USD518884S1 (en) 2002-11-22 2006-04-11 Tokyo Electron Limited Heating tube for semiconductor-making furnace
CN300837612S (zh) 2006-09-12 2008-10-08 东京毅力科创株式会社 半导体制造用处理管
CN300748574S (zh) 2006-10-12 2008-02-20 东京毅力科创株式会社 半导体制造用处理管
TWD125600S1 (zh) 2006-10-12 2008-10-21 東京威力科創股份有限公司 半導體製造用加工處理管
TWD125601S (zh) 2007-05-08 2008-10-21 東京威力科創股份有限公司 半導體製造用加工處理管
TW201203426A (en) 2010-04-23 2012-01-16 Hitachi Int Electric Inc Substrate processing apparatus and method of manufacturing semiconductor device
TWI575629B (zh) 2010-04-23 2017-03-21 日立國際電氣股份有限公司 基板處理裝置、半導體裝置的製造方法及淨化方法
USD778458S1 (en) 2015-02-23 2017-02-07 Hitachi Kokusai Electric Inc. Reaction tube
USD842824S1 (en) 2017-08-09 2019-03-12 Kokusai Electric Corporation Reaction tube
USD931823S1 (en) 2020-01-29 2021-09-28 Kokusai Electric Corporation Reaction tube
USD986826S1 (en) 2020-03-10 2023-05-23 Kokusai Electric Corporation Reaction tube

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Publication number Publication date
JP1782473S (oth) 2024-10-17

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