TWD203479S - 基板處理裝置用入口蓋 - Google Patents

基板處理裝置用入口蓋 Download PDF

Info

Publication number
TWD203479S
TWD203479S TW108303245F TW108303245F TWD203479S TW D203479 S TWD203479 S TW D203479S TW 108303245 F TW108303245 F TW 108303245F TW 108303245 F TW108303245 F TW 108303245F TW D203479 S TWD203479 S TW D203479S
Authority
TW
Taiwan
Prior art keywords
substrate processing
processing device
design
inlet
cover
Prior art date
Application number
TW108303245F
Other languages
English (en)
Chinese (zh)
Inventor
加賀谷徹
江端慎也
Original Assignee
日商國際電氣股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商國際電氣股份有限公司 filed Critical 日商國際電氣股份有限公司
Publication of TWD203479S publication Critical patent/TWD203479S/zh

Links

Images

TW108303245F 2018-12-06 2019-05-31 基板處理裝置用入口蓋 TWD203479S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-026606 2018-12-06
JPD2018-26606F JP1638504S (enExample) 2018-12-06 2018-12-06

Publications (1)

Publication Number Publication Date
TWD203479S true TWD203479S (zh) 2020-03-21

Family

ID=67474416

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108303245F TWD203479S (zh) 2018-12-06 2019-05-31 基板處理裝置用入口蓋

Country Status (3)

Country Link
US (1) USD925481S1 (enExample)
JP (1) JP1638504S (enExample)
TW (1) TWD203479S (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD225034S (zh) 2021-03-15 2023-05-01 日商國際電氣股份有限公司 基板處理裝置用遮蔽具

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12553133B2 (en) 2022-08-04 2026-02-17 Applied Materials Inc. Substrate handling system, method, and apparatus
USD1064005S1 (en) * 2022-08-04 2025-02-25 Applied Materials, Inc. Grounding ring of a process kit for semiconductor substrate processing
USD1069863S1 (en) 2022-08-04 2025-04-08 Applied Materials, Inc. Deposition ring of a process kit for semiconductor substrate processing

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD658692S1 (en) 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
TWD190344S (zh) 2017-01-31 2018-05-11 日立全球先端科技股份有限公司 Shield ring for plasma processing unit

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5641375A (en) * 1994-08-15 1997-06-24 Applied Materials, Inc. Plasma etching reactor with surface protection means against erosion of walls
USD404369S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Manifold cover for use in a semiconductor wafer heat processing apparatus
US6258170B1 (en) * 1997-09-11 2001-07-10 Applied Materials, Inc. Vaporization and deposition apparatus
US6170429B1 (en) * 1998-09-30 2001-01-09 Lam Research Corporation Chamber liner for semiconductor process chambers
US6234219B1 (en) * 1999-05-25 2001-05-22 Micron Technology, Inc. Liner for use in processing chamber
US20020069970A1 (en) * 2000-03-07 2002-06-13 Applied Materials, Inc. Temperature controlled semiconductor processing chamber liner
US7011039B1 (en) * 2000-07-07 2006-03-14 Applied Materials, Inc. Multi-purpose processing chamber with removable chamber liner
US6613587B1 (en) * 2002-04-11 2003-09-02 Micron Technology, Inc. Method of replacing at least a portion of a semiconductor substrate deposition chamber liner
US20040069223A1 (en) * 2002-10-10 2004-04-15 Taiwan Semiconductor Manufacturing Co., Ltd. Wall liner and slot liner for process chamber
WO2004033152A1 (en) * 2002-10-11 2004-04-22 Semplastics, L.L.C. Retaining ring for use on a carrier of a polishing apparatus
USD491963S1 (en) * 2002-11-20 2004-06-22 Tokyo Electron Limited Inner wall shield for a process chamber for manufacturing semiconductors
US6911093B2 (en) * 2003-06-02 2005-06-28 Lsi Logic Corporation Lid liner for chemical vapor deposition chamber
US20050150452A1 (en) * 2004-01-14 2005-07-14 Soovo Sen Process kit design for deposition chamber
TWD121115S1 (zh) * 2005-03-30 2008-01-21 東京威力科創股份有限公司 遮護環
USD559993S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
US8617672B2 (en) * 2005-07-13 2013-12-31 Applied Materials, Inc. Localized surface annealing of components for substrate processing chambers
USD557425S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
US20070113783A1 (en) * 2005-11-19 2007-05-24 Applied Materials, Inc. Band shield for substrate processing chamber
US7987814B2 (en) * 2008-04-07 2011-08-02 Applied Materials, Inc. Lower liner with integrated flow equalizer and improved conductance
US8298046B2 (en) * 2009-10-21 2012-10-30 SPM Technology, Inc. Retaining rings
USD655262S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Side wall for reactor for manufacturing semiconductor
USD655258S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Side wall for reactor for manufacturing semiconductor
USD658691S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD658693S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD716239S1 (en) * 2013-11-06 2014-10-28 Applied Materials, Inc. Upper chamber liner
USD717746S1 (en) * 2013-11-06 2014-11-18 Applied Materials, Inc. Lower chamber liner
USD711331S1 (en) * 2013-11-07 2014-08-19 Applied Materials, Inc. Upper chamber liner
USD716240S1 (en) * 2013-11-07 2014-10-28 Applied Materials, Inc. Lower chamber liner
CN105981140B (zh) 2014-03-26 2018-08-31 株式会社日立国际电气 衬底处理装置以及半导体器件的制造方法
JP1546801S (enExample) * 2015-06-12 2016-03-28
JP1546799S (enExample) * 2015-06-12 2016-03-28
JP1551512S (enExample) * 2015-06-12 2016-06-13
JP1564934S (enExample) * 2016-02-26 2016-12-05
USD842259S1 (en) * 2017-04-28 2019-03-05 Applied Materials, Inc. Plasma chamber liner
USD838681S1 (en) * 2017-04-28 2019-01-22 Applied Materials, Inc. Plasma chamber liner
USD837754S1 (en) * 2017-04-28 2019-01-08 Applied Materials, Inc. Plasma chamber liner
JP1598442S (enExample) 2017-08-09 2018-02-26

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD658692S1 (en) 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
TWD190344S (zh) 2017-01-31 2018-05-11 日立全球先端科技股份有限公司 Shield ring for plasma processing unit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD225034S (zh) 2021-03-15 2023-05-01 日商國際電氣股份有限公司 基板處理裝置用遮蔽具

Also Published As

Publication number Publication date
USD925481S1 (en) 2021-07-20
JP1638504S (enExample) 2019-08-05

Similar Documents

Publication Publication Date Title
TWD203479S (zh) 基板處理裝置用入口蓋
TWD210892S (zh) 用於基板處理腔室的沉積環
TWD207742S (zh) 用於基材處理室的處理遮罩件
TWD210894S (zh) 用於基材處理室的處理遮罩件
TWD217667S (zh) 鼻管組合之部分
TWD216287S (zh) 電子裝置之蓋
MX2019002775A (es) Soporte de vacío con junta de falda extensible.
TWD192691S (zh) 真空吸塵器（五十二）
TWD226457S (zh) 呼吸治療系統流體收集器之封蓋之部分
TWD192693S (zh) 真空吸塵器（五十四）
TWD211225S (zh) 排氣管
TWD192689S (zh) 真空吸塵器（四十二）
MY172257A (en) Non-contact transfer hand
TWD192472S (zh) 真空吸塵器之部件（五）
TWD192695S (zh) 真空吸塵器（五十六）
TWD203179S (zh) 扳手之部分
TWD208387S (zh) 半導體製造裝置用反應管之內管
TWD192469S (zh) 真空吸塵器（四十六）
TWD192688S (zh) 真空吸塵器（四十）
TWD204358S (zh) 瓶套
TWD192466S (zh) 真空吸塵器（十）
TWD202152S (zh) 風扇機
TWD192697S (zh) 真空吸塵器（五十八）
TWD217672S (zh) 鼻管
TWD192696S (zh) 真空吸塵器（五十七）