JP1638504S - - Google Patents

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Publication number
JP1638504S
JP1638504S JPD2018-26606F JP2018026606F JP1638504S JP 1638504 S JP1638504 S JP 1638504S JP 2018026606 F JP2018026606 F JP 2018026606F JP 1638504 S JP1638504 S JP 1638504S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2018-26606F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2018-26606F priority Critical patent/JP1638504S/ja
Priority to TW108303245F priority patent/TWD203479S/zh
Priority to US29/693,715 priority patent/USD925481S1/en
Application granted granted Critical
Publication of JP1638504S publication Critical patent/JP1638504S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2018-26606F 2018-12-06 2018-12-06 Active JP1638504S (enExample)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JPD2018-26606F JP1638504S (enExample) 2018-12-06 2018-12-06
TW108303245F TWD203479S (zh) 2018-12-06 2019-05-31 基板處理裝置用入口蓋
US29/693,715 USD925481S1 (en) 2018-12-06 2019-06-04 Inlet liner for substrate processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2018-26606F JP1638504S (enExample) 2018-12-06 2018-12-06

Publications (1)

Publication Number Publication Date
JP1638504S true JP1638504S (enExample) 2019-08-05

Family

ID=67474416

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2018-26606F Active JP1638504S (enExample) 2018-12-06 2018-12-06

Country Status (3)

Country Link
US (1) USD925481S1 (enExample)
JP (1) JP1638504S (enExample)
TW (1) TWD203479S (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1700778S (ja) 2021-03-15 2021-11-29 基板処理装置用遮蔽具
US12553133B2 (en) 2022-08-04 2026-02-17 Applied Materials Inc. Substrate handling system, method, and apparatus
USD1069863S1 (en) 2022-08-04 2025-04-08 Applied Materials, Inc. Deposition ring of a process kit for semiconductor substrate processing
USD1064005S1 (en) * 2022-08-04 2025-02-25 Applied Materials, Inc. Grounding ring of a process kit for semiconductor substrate processing

Family Cites Families (39)

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US5641375A (en) * 1994-08-15 1997-06-24 Applied Materials, Inc. Plasma etching reactor with surface protection means against erosion of walls
USD404369S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Manifold cover for use in a semiconductor wafer heat processing apparatus
US6258170B1 (en) * 1997-09-11 2001-07-10 Applied Materials, Inc. Vaporization and deposition apparatus
US6170429B1 (en) * 1998-09-30 2001-01-09 Lam Research Corporation Chamber liner for semiconductor process chambers
US6234219B1 (en) * 1999-05-25 2001-05-22 Micron Technology, Inc. Liner for use in processing chamber
US20020069970A1 (en) * 2000-03-07 2002-06-13 Applied Materials, Inc. Temperature controlled semiconductor processing chamber liner
US7011039B1 (en) * 2000-07-07 2006-03-14 Applied Materials, Inc. Multi-purpose processing chamber with removable chamber liner
US6613587B1 (en) * 2002-04-11 2003-09-02 Micron Technology, Inc. Method of replacing at least a portion of a semiconductor substrate deposition chamber liner
US20040069223A1 (en) * 2002-10-10 2004-04-15 Taiwan Semiconductor Manufacturing Co., Ltd. Wall liner and slot liner for process chamber
AU2003300375A1 (en) * 2002-10-11 2004-05-04 Semplastics, L.L.C. Retaining ring for use on a carrier of a polishing apparatus
USD491963S1 (en) * 2002-11-20 2004-06-22 Tokyo Electron Limited Inner wall shield for a process chamber for manufacturing semiconductors
US6911093B2 (en) * 2003-06-02 2005-06-28 Lsi Logic Corporation Lid liner for chemical vapor deposition chamber
US20050150452A1 (en) * 2004-01-14 2005-07-14 Soovo Sen Process kit design for deposition chamber
TWD121115S1 (zh) * 2005-03-30 2008-01-21 東京威力科創股份有限公司 遮護環
USD559993S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
US8617672B2 (en) * 2005-07-13 2013-12-31 Applied Materials, Inc. Localized surface annealing of components for substrate processing chambers
USD557425S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
US20070113783A1 (en) * 2005-11-19 2007-05-24 Applied Materials, Inc. Band shield for substrate processing chamber
US7987814B2 (en) * 2008-04-07 2011-08-02 Applied Materials, Inc. Lower liner with integrated flow equalizer and improved conductance
US8298046B2 (en) * 2009-10-21 2012-10-30 SPM Technology, Inc. Retaining rings
USD655258S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Side wall for reactor for manufacturing semiconductor
USD655262S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Side wall for reactor for manufacturing semiconductor
USD658693S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD658691S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD658692S1 (en) 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD716239S1 (en) * 2013-11-06 2014-10-28 Applied Materials, Inc. Upper chamber liner
USD717746S1 (en) * 2013-11-06 2014-11-18 Applied Materials, Inc. Lower chamber liner
USD716240S1 (en) * 2013-11-07 2014-10-28 Applied Materials, Inc. Lower chamber liner
USD711331S1 (en) * 2013-11-07 2014-08-19 Applied Materials, Inc. Upper chamber liner
WO2015146362A1 (ja) 2014-03-26 2015-10-01 株式会社日立国際電気 基板処理装置、半導体装置の製造方法および炉口部カバー
JP1551512S (enExample) * 2015-06-12 2016-06-13
JP1546801S (enExample) * 2015-06-12 2016-03-28
JP1546799S (enExample) * 2015-06-12 2016-03-28
JP1564934S (enExample) * 2016-02-26 2016-12-05
JP1584146S (enExample) 2017-01-31 2017-08-21
USD842259S1 (en) * 2017-04-28 2019-03-05 Applied Materials, Inc. Plasma chamber liner
USD837754S1 (en) * 2017-04-28 2019-01-08 Applied Materials, Inc. Plasma chamber liner
USD838681S1 (en) * 2017-04-28 2019-01-22 Applied Materials, Inc. Plasma chamber liner
JP1598442S (enExample) 2017-08-09 2018-02-26

Also Published As

Publication number Publication date
TWD203479S (zh) 2020-03-21
USD925481S1 (en) 2021-07-20

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