TWD198931S - Part of the holding pad for substrate transportation - Google Patents

Part of the holding pad for substrate transportation

Info

Publication number
TWD198931S
TWD198931S TW107305935F TW107305935F TWD198931S TW D198931 S TWD198931 S TW D198931S TW 107305935 F TW107305935 F TW 107305935F TW 107305935 F TW107305935 F TW 107305935F TW D198931 S TWD198931 S TW D198931S
Authority
TW
Taiwan
Prior art keywords
substrate
design
article
case
holding
Prior art date
Application number
TW107305935F
Other languages
Chinese (zh)
Inventor
Toru Tokimatu
Akihiro Teramoto
Original Assignee
日商東京威力科創股份有限&#x5
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東京威力科創股份有限&#x5, Tokyo Electron Ltd filed Critical 日商東京威力科創股份有限&#x5
Publication of TWD198931S publication Critical patent/TWD198931S/en

Links

Abstract

【物品用途】;本設計的物品是在半導體製造裝置中,配置在搬運半導體晶圓之類的基板用的搬運支臂上來使用的保持墊。本物品,係如「使用狀態之參考圖」所示,為配置在搬運支臂的基板保持部,抵接於所搬運的基板之邊緣部而予以吸附保持,當搬運支臂動作時,可防止基板從保持位置偏移或脫落。本物品,係由橡膠之類的柔軟素材所製成,正面部為略圓錐狀,在其底部設置具有縫隙的環狀凸部。藉此,本物品,係如「使用狀態之參考剖面圖」所示,能夠使略圓錐狀部沿著基板面撓曲變形,將環狀凸部抵接在基板而予以吸附保持,也能確實地保持住反翹撓曲的基板。;【設計說明】;圖式所揭露之虛線部分,為本案不主張設計之部分;圖式中一點鏈線所圍繞者,係界定本案所欲主張之範圍,該一點鏈線本身為本案不主張設計之部分。;「參考立體圖」中,施以薄墨的部分係為用來表現主張設計之部分。[Use of article] The article of this design is a holding pad used in semiconductor manufacturing equipment, placed on a transfer arm for carrying substrates such as semiconductor wafers. This article, as shown in the "Reference Picture of Used Conditions", is a substrate holding part arranged on the conveyance arm. It is in contact with the edge of the substrate being conveyed and is adsorbed and held. When the conveyance arm moves, it can prevent The base plate is displaced or detached from the holding position. This item is made of soft material such as rubber. The front part is slightly conical, and the bottom part is provided with an annular convex part with a gap. As a result, this article, as shown in the "Reference cross-sectional view of the use state", can bend and deform the slightly conical portion along the substrate surface, and can make the annular convex portion contact the substrate to absorb and hold it, and can also reliably Ground to hold anti-warp deflection of the substrate. ;[Design Description];The dotted line part disclosed in the drawing is the part of the design that is not claimed in this case; the one-point chain line in the drawing is surrounded by the scope of the intended claim in this case, and the one-point chain line itself is not claimed in this case part of the design. ;In the "reference three-dimensional drawing", the part with thin ink is used to express the proposed design.

TW107305935F 2018-04-20 2018-10-08 Part of the holding pad for substrate transportation TWD198931S (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2018-8792F JP1625995S (en) 2018-04-20 2018-04-20

Publications (1)

Publication Number Publication Date
TWD198931S true TWD198931S (en) 2019-08-01

Family

ID=65519211

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107305935F TWD198931S (en) 2018-04-20 2018-10-08 Part of the holding pad for substrate transportation

Country Status (3)

Country Link
US (1) USD909603S1 (en)
JP (1) JP1625995S (en)
TW (1) TWD198931S (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD973609S1 (en) 2020-04-22 2022-12-27 Applied Materials, Inc. Upper shield with showerhead for a process chamber

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1705915S (en) * 2021-07-09 2022-01-25
JP1705916S (en) * 2021-07-09 2022-01-25

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD453000S1 (en) * 2000-05-11 2002-01-22 Yugenkaisha Shinjo Seisakusho Clinch nut
USD451374S1 (en) * 2000-05-18 2001-12-04 Yugenkaisha Shinjo Seisakusho Clinch nut
USD463968S1 (en) * 2001-02-08 2002-10-08 Emhart Llc Deadbolt
USD559994S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD560284S1 (en) * 2005-03-30 2008-01-22 Tokyo Electron Limited Cover ring
USD559993S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD642676S1 (en) * 2006-10-27 2011-08-02 Resmed Motor Technologies Inc Flexible motor sleeve
JP4982608B2 (en) * 2007-05-02 2012-07-25 プレシジョン・メディカル・デバイスズ・エルエルシー Non-pneumatic tourniquet device
USD679013S1 (en) * 2008-05-02 2013-03-26 Precision Medical Devices, Llc Non-pneumatic tourniquet device
USD635246S1 (en) * 2010-03-26 2011-03-29 Oriel Therapeutics, Inc. Dose disk for dry powder inhalers
US20110259457A1 (en) * 2010-04-23 2011-10-27 Wen-Tsung Lin Joint Structure for Controlling Water Flow
USD736261S1 (en) * 2012-11-29 2015-08-11 Cummins Inc. Shroud
USD705438S1 (en) * 2013-03-14 2014-05-20 Charles River Laboratories, Inc. Base
USD738491S1 (en) * 2013-11-08 2015-09-08 Medline Industries, Inc. Guide wire bowl
USD738935S1 (en) * 2014-07-15 2015-09-15 Henry C. Chu Cap for air compressor
USD755038S1 (en) * 2014-08-13 2016-05-03 Luke Bolton Multi-fit cover plate
TWD168721S (en) * 2014-10-09 2015-07-01 台灣福興工業股份有限公司 Escutcheon
JP1579613S (en) * 2017-01-25 2017-06-19
USD867576S1 (en) * 2017-05-24 2019-11-19 Christina Hewitt Cap for medical breathing apparatuses
USD878548S1 (en) * 2018-11-16 2020-03-17 Brandi Lane Side indent nasal airway

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD973609S1 (en) 2020-04-22 2022-12-27 Applied Materials, Inc. Upper shield with showerhead for a process chamber

Also Published As

Publication number Publication date
JP1625995S (en) 2019-03-04
USD909603S1 (en) 2021-02-02

Similar Documents

Publication Publication Date Title
TWD198931S (en) Part of the holding pad for substrate transportation
TWD198930S (en) Part of the holding pad for substrate transportation
TW200636905A (en) Suction device, polishing device, semiconductor device and manufacturing method of semiconductor device
TWI665146B (en) Non-contact transferring device and non-contact suction plate
TWD191199S (en) Part of the vacuum injection pad
EP2600402A4 (en) Semiconductor device
TWD197827S (en) Elastic film for semiconductor wafer polishing
SG11201808291YA (en) Semiconductor processing sheet
SG11201909803PA (en) Electronic component mounting apparatus
TW201836954A (en) Silicon chip holding device, silicon chip conveying device, silicon chip delivery system and conveying method
CN107403744A (en) Base board delivery device
JP6172997B2 (en) Plate-shaped material transfer device
JP2018029152A (en) Holding table
PH12020500495A1 (en) Sheet for suction fixing
JP2014203967A (en) Chuck table
TWD180128S (en) sealing ring part
JP2011151233A (en) Transfer mechanism
TWI666722B (en) Conveyor and large conveyer, conveying method and conveyer unit
TW201613020A (en) Semiconductor process carrier
TWD225908S (en) Holding Pads for Substrate Transfer
TWD193203S (en) Elastic film for semiconductor surface polishing
KR20190061521A (en) Vacuum pad structure of anti soil coating
KR20140061591A (en) Vacuum pad and noncontact feed apparatus using it
TW201612083A (en) Substrate housing container and retainer
TWD225909S (en) Holding Pads for Substrate Transfer