TWD198930S - Part of the holding pad for substrate transportation - Google Patents

Part of the holding pad for substrate transportation

Info

Publication number
TWD198930S
TWD198930S TW107305727F TW107305727F TWD198930S TW D198930 S TWD198930 S TW D198930S TW 107305727 F TW107305727 F TW 107305727F TW 107305727 F TW107305727 F TW 107305727F TW D198930 S TWD198930 S TW D198930S
Authority
TW
Taiwan
Prior art keywords
article
substrate
design
annular portion
case
Prior art date
Application number
TW107305727F
Other languages
Chinese (zh)
Inventor
Toru Tokimatu
Akihiro Teramoto
Original Assignee
日商東京威力科創股份有限公司
Tokyo Electron Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東京威力科創股份有限公司, Tokyo Electron Limited filed Critical 日商東京威力科創股份有限公司
Publication of TWD198930S publication Critical patent/TWD198930S/en

Links

Abstract

【物品用途】;本設計的物品是在半導體製造裝置中，配置在搬運半導體晶圓之類的基板用的搬運支臂上來使用的保持墊。本物品，係如「使用狀態之參考圖」所示，為配置在搬運支臂的基板保持部，抵接於所搬運的基板之邊緣部而予以吸附保持，當搬運支臂動作時，可防止基板從保持位置偏移或脫落。本物品，係在正面側的圓環狀部具備突起部，並且使圓環狀部的上端至下端距離加大。藉此，本物品，於使用時，能夠減少與吸引保持的基板之接觸面，且加大圓環狀部的內部之空間，可防止本物品蓄積基板的熱能，可抑制搬運支臂或後來所搬運的基板之高溫化。;【設計說明】;圖式所揭露之虛線部分，為本案不主張設計之部分；圖式中一點鏈線所圍繞者，係界定本案所欲主張之範圍，該一點鏈線本身為本案不主張設計之部分。[Use of article]; The article of this design is a holding pad used in semiconductor manufacturing equipment, placed on a transport arm for transporting substrates such as semiconductor wafers. This article, as shown in the "Reference Picture of Used Conditions", is a substrate holding part arranged on the conveyance arm. It is in contact with the edge of the conveyed substrate to adsorb and hold it. When the conveyance arm moves, it can prevent The base plate is displaced or detached from the holding position. In this article, the annular portion attached to the front side is provided with a protruding portion, and the distance from the upper end to the lower end of the annular portion is increased. Thereby, when this article is in use, it can reduce the contact surface with the suction-held substrate, and increase the space inside the annular portion, which can prevent the article from accumulating the heat energy of the substrate, and can inhibit the transportation arm or subsequent transportation. The temperature of the substrate increases. ;[Design explanation];The dotted line part disclosed in the drawing is the part of the design that is not claimed in this case; the one-point chain line in the drawing is surrounded by the scope of the intended claim in this case, and the one-point chain line itself is not claimed in this case part of the design.

TW107305727F 2018-04-20 2018-09-26 Part of the holding pad for substrate transportation TWD198930S (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2018-8791F JP1625994S (en) 2018-04-20 2018-04-20

Publications (1)

Publication Number Publication Date
TWD198930S true TWD198930S (en) 2019-08-01

Family

ID=65519221

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107305727F TWD198930S (en) 2018-04-20 2018-09-26 Part of the holding pad for substrate transportation

Country Status (3)

Country Link
US (1) USD922609S1 (en)
JP (1) JP1625994S (en)
TW (1) TWD198930S (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD973609S1 (en) 2020-04-22 2022-12-27 Applied Materials, Inc. Upper shield with showerhead for a process chamber
US12080522B2 (en) 2020-04-22 2024-09-03 Applied Materials, Inc. Preclean chamber upper shield with showerhead
US12100577B2 (en) 2019-08-28 2024-09-24 Applied Materials, Inc. High conductance inner shield for process chamber

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USD1025681S1 (en) * 2020-12-08 2024-05-07 Darin Lee Mays Table part
JP1705915S (en) * 2021-07-09 2022-01-25
JP1705916S (en) * 2021-07-09 2022-01-25

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12100577B2 (en) 2019-08-28 2024-09-24 Applied Materials, Inc. High conductance inner shield for process chamber
USD973609S1 (en) 2020-04-22 2022-12-27 Applied Materials, Inc. Upper shield with showerhead for a process chamber
US12080522B2 (en) 2020-04-22 2024-09-03 Applied Materials, Inc. Preclean chamber upper shield with showerhead

Also Published As

Publication number Publication date
USD922609S1 (en) 2021-06-15
JP1625994S (en) 2019-03-04

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