TWD192021S - 電漿腔室襯墊 - Google Patents
電漿腔室襯墊Info
- Publication number
- TWD192021S TWD192021S TW106306241F TW106306241F TWD192021S TW D192021 S TWD192021 S TW D192021S TW 106306241 F TW106306241 F TW 106306241F TW 106306241 F TW106306241 F TW 106306241F TW D192021 S TWD192021 S TW D192021S
- Authority
- TW
- Taiwan
- Prior art keywords
- view
- plasma chamber
- section
- chamber liner
- drawn based
- Prior art date
Links
- 230000000007 visual effect Effects 0.000 abstract description 2
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/602,207 | 2017-04-28 | ||
US29/602,207 USD842259S1 (en) | 2017-04-28 | 2017-04-28 | Plasma chamber liner |
Publications (1)
Publication Number | Publication Date |
---|---|
TWD192021S true TWD192021S (zh) | 2018-08-01 |
Family
ID=63682182
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW106306241F TWD192021S (zh) | 2017-04-28 | 2017-10-25 | 電漿腔室襯墊 |
Country Status (3)
Country | Link |
---|---|
US (1) | USD842259S1 (enrdf_load_stackoverflow) |
JP (1) | JP1615030S (enrdf_load_stackoverflow) |
TW (1) | TWD192021S (enrdf_load_stackoverflow) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP1593817S (enrdf_load_stackoverflow) * | 2017-03-28 | 2017-12-25 | ||
USD875055S1 (en) * | 2017-04-28 | 2020-02-11 | Applied Materials, Inc. | Plasma connector liner |
USD882536S1 (en) * | 2017-04-28 | 2020-04-28 | Applied Materials, Inc. | Plasma source liner |
USD875054S1 (en) * | 2017-04-28 | 2020-02-11 | Applied Materials, Inc. | Plasma connector liner |
USD875053S1 (en) * | 2017-04-28 | 2020-02-11 | Applied Materials, Inc. | Plasma connector liner |
JP1638504S (enrdf_load_stackoverflow) * | 2018-12-06 | 2019-08-05 | ||
USD941787S1 (en) * | 2020-03-03 | 2022-01-25 | Applied Materials, Inc. | Substrate transfer blade |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD583838S1 (en) | 2007-09-19 | 2008-12-30 | Riley Power, Inc. | Grinding chamber side liner |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5846332A (en) * | 1996-07-12 | 1998-12-08 | Applied Materials, Inc. | Thermally floating pedestal collar in a chemical vapor deposition chamber |
US6170429B1 (en) * | 1998-09-30 | 2001-01-09 | Lam Research Corporation | Chamber liner for semiconductor process chambers |
US6364954B2 (en) * | 1998-12-14 | 2002-04-02 | Applied Materials, Inc. | High temperature chemical vapor deposition chamber |
US6234219B1 (en) * | 1999-05-25 | 2001-05-22 | Micron Technology, Inc. | Liner for use in processing chamber |
US20020069970A1 (en) * | 2000-03-07 | 2002-06-13 | Applied Materials, Inc. | Temperature controlled semiconductor processing chamber liner |
US7011039B1 (en) * | 2000-07-07 | 2006-03-14 | Applied Materials, Inc. | Multi-purpose processing chamber with removable chamber liner |
US7670688B2 (en) * | 2001-06-25 | 2010-03-02 | Applied Materials, Inc. | Erosion-resistant components for plasma process chambers |
US7972467B2 (en) * | 2003-04-17 | 2011-07-05 | Applied Materials Inc. | Apparatus and method to confine plasma and reduce flow resistance in a plasma reactor |
US20050229849A1 (en) * | 2004-02-13 | 2005-10-20 | Applied Materials, Inc. | High productivity plasma processing chamber |
US8236105B2 (en) * | 2004-04-08 | 2012-08-07 | Applied Materials, Inc. | Apparatus for controlling gas flow in a semiconductor substrate processing chamber |
US20090188625A1 (en) * | 2008-01-28 | 2009-07-30 | Carducci James D | Etching chamber having flow equalizer and lower liner |
JP5567392B2 (ja) * | 2010-05-25 | 2014-08-06 | 東京エレクトロン株式会社 | プラズマ処理装置 |
JP5837178B2 (ja) | 2011-03-22 | 2015-12-24 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 化学気相堆積チャンバ用のライナアセンブリ |
USD658691S1 (en) * | 2011-03-30 | 2012-05-01 | Tokyo Electron Limited | Liner for plasma processing apparatus |
USD658693S1 (en) * | 2011-03-30 | 2012-05-01 | Tokyo Electron Limited | Liner for plasma processing apparatus |
USD658692S1 (en) * | 2011-03-30 | 2012-05-01 | Tokyo Electron Limited | Liner for plasma processing apparatus |
USD678228S1 (en) * | 2011-03-30 | 2013-03-19 | Tokyo Electron Limited | Chamber block |
US8627796B2 (en) | 2011-04-21 | 2014-01-14 | Eaton Corporation | Pivot foot for deactivating rocker arm |
USD699692S1 (en) * | 2012-01-19 | 2014-02-18 | Applied Materials, Inc. | Upper liner |
CN107833848B (zh) | 2013-04-30 | 2021-12-07 | 应用材料公司 | 具有空间分布的气体通道的气流控制衬垫 |
USD716239S1 (en) * | 2013-11-06 | 2014-10-28 | Applied Materials, Inc. | Upper chamber liner |
USD717746S1 (en) * | 2013-11-06 | 2014-11-18 | Applied Materials, Inc. | Lower chamber liner |
USD716240S1 (en) * | 2013-11-07 | 2014-10-28 | Applied Materials, Inc. | Lower chamber liner |
JP1546799S (enrdf_load_stackoverflow) * | 2015-06-12 | 2016-03-28 | ||
JP1546801S (enrdf_load_stackoverflow) * | 2015-06-12 | 2016-03-28 | ||
JP1564934S (enrdf_load_stackoverflow) * | 2016-02-26 | 2016-12-05 |
-
2017
- 2017-04-28 US US29/602,207 patent/USD842259S1/en active Active
- 2017-10-25 TW TW106306241F patent/TWD192021S/zh unknown
- 2017-10-30 JP JPD2017-24106F patent/JP1615030S/ja active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD583838S1 (en) | 2007-09-19 | 2008-12-30 | Riley Power, Inc. | Grinding chamber side liner |
Also Published As
Publication number | Publication date |
---|---|
USD842259S1 (en) | 2019-03-05 |
JP1615030S (enrdf_load_stackoverflow) | 2018-10-01 |
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