USD842259S1 - Plasma chamber liner - Google Patents

Plasma chamber liner Download PDF

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Publication number
USD842259S1
USD842259S1 US29/602,207 US201729602207F USD842259S US D842259 S1 USD842259 S1 US D842259S1 US 201729602207 F US201729602207 F US 201729602207F US D842259 S USD842259 S US D842259S
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United States
Prior art keywords
plasma chamber
chamber liner
liner
view
plasma
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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US29/602,207
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English (en)
Inventor
Eric Kihara Shono
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Applied Materials Inc
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Applied Materials Inc
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Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to US29/602,207 priority Critical patent/USD842259S1/en
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SHONO, ERIC KIHARA
Priority to TW106306241F priority patent/TWD192021S/zh
Priority to JPD2017-24106F priority patent/JP1615030S/ja
Application granted granted Critical
Publication of USD842259S1 publication Critical patent/USD842259S1/en
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US29/602,207 2017-04-28 2017-04-28 Plasma chamber liner Active USD842259S1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US29/602,207 USD842259S1 (en) 2017-04-28 2017-04-28 Plasma chamber liner
TW106306241F TWD192021S (zh) 2017-04-28 2017-10-25 電漿腔室襯墊
JPD2017-24106F JP1615030S (enrdf_load_stackoverflow) 2017-04-28 2017-10-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/602,207 USD842259S1 (en) 2017-04-28 2017-04-28 Plasma chamber liner

Publications (1)

Publication Number Publication Date
USD842259S1 true USD842259S1 (en) 2019-03-05

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ID=63682182

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/602,207 Active USD842259S1 (en) 2017-04-28 2017-04-28 Plasma chamber liner

Country Status (3)

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US (1) USD842259S1 (enrdf_load_stackoverflow)
JP (1) JP1615030S (enrdf_load_stackoverflow)
TW (1) TWD192021S (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD875053S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875054S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875055S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD882536S1 (en) * 2017-04-28 2020-04-28 Applied Materials, Inc. Plasma source liner
USD901405S1 (en) * 2017-03-28 2020-11-10 Rohm Co., Ltd. Semiconductor device
USD925481S1 (en) * 2018-12-06 2021-07-20 Kokusai Electric Corporation Inlet liner for substrate processing apparatus
USD941787S1 (en) * 2020-03-03 2022-01-25 Applied Materials, Inc. Substrate transfer blade

Citations (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5964947A (en) * 1996-07-12 1999-10-12 Applied Materials, Inc. Removable pumping channel liners within a chemical vapor deposition chamber
US6277237B1 (en) * 1998-09-30 2001-08-21 Lam Research Corporation Chamber liner for semiconductor process chambers
US20010054381A1 (en) * 1998-12-14 2001-12-27 Salvador P Umotoy High temperature chemical vapor deposition chamber
US6374871B2 (en) * 1999-05-25 2002-04-23 Micron Technology, Inc. Liner for use in processing chamber
US20020069970A1 (en) * 2000-03-07 2002-06-13 Applied Materials, Inc. Temperature controlled semiconductor processing chamber liner
US20040033385A1 (en) * 2001-06-25 2004-02-19 Kaushal Tony S. Erosion-resistant components for plasma process chambers
US20040206309A1 (en) * 2003-04-17 2004-10-21 Applied Materials, Inc. Apparatus and method to confine plasma and reduce flow resistance in a plasma reactor
US20050224180A1 (en) * 2004-04-08 2005-10-13 Applied Materials, Inc. Apparatus for controlling gas flow in a semiconductor substrate processing chamber
US20050229849A1 (en) * 2004-02-13 2005-10-20 Applied Materials, Inc. High productivity plasma processing chamber
US7011039B1 (en) * 2000-07-07 2006-03-14 Applied Materials, Inc. Multi-purpose processing chamber with removable chamber liner
USD583838S1 (en) 2007-09-19 2008-12-30 Riley Power, Inc. Grinding chamber side liner
US20090188625A1 (en) * 2008-01-28 2009-07-30 Carducci James D Etching chamber having flow equalizer and lower liner
USD658693S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD658692S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD658691S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD678228S1 (en) * 2011-03-30 2013-03-19 Tokyo Electron Limited Chamber block
USD699692S1 (en) * 2012-01-19 2014-02-18 Applied Materials, Inc. Upper liner
US20140116366A1 (en) 2011-04-21 2014-05-01 Eaton Corporation Pivot foot for deactivating rocker arm
US8858754B2 (en) * 2010-05-25 2014-10-14 Tokyo Electron Limited Plasma processing apparatus
USD716240S1 (en) * 2013-11-07 2014-10-28 Applied Materials, Inc. Lower chamber liner
USD716239S1 (en) * 2013-11-06 2014-10-28 Applied Materials, Inc. Upper chamber liner
US20140322897A1 (en) 2013-04-30 2014-10-30 Applied Materials, Inc. Flow controlled liner having spatially distributed gas passages
USD717746S1 (en) * 2013-11-06 2014-11-18 Applied Materials, Inc. Lower chamber liner
US8980005B2 (en) 2011-03-22 2015-03-17 Applied Materials, Inc. Liner assembly for chemical vapor deposition chamber
USD802545S1 (en) * 2015-06-12 2017-11-14 Hitachi High-Technologies Corporation Lower chamber for a plasma processing apparatus
USD804436S1 (en) * 2015-06-12 2017-12-05 Hitachi High-Technologies Corporation Upper chamber for a plasma processing apparatus
USD812578S1 (en) * 2016-02-26 2018-03-13 Hitachi High-Technologies Corporation Upper chamber for a plasma processing apparatus

Patent Citations (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5964947A (en) * 1996-07-12 1999-10-12 Applied Materials, Inc. Removable pumping channel liners within a chemical vapor deposition chamber
US6277237B1 (en) * 1998-09-30 2001-08-21 Lam Research Corporation Chamber liner for semiconductor process chambers
US20010054381A1 (en) * 1998-12-14 2001-12-27 Salvador P Umotoy High temperature chemical vapor deposition chamber
US6374871B2 (en) * 1999-05-25 2002-04-23 Micron Technology, Inc. Liner for use in processing chamber
US20020069970A1 (en) * 2000-03-07 2002-06-13 Applied Materials, Inc. Temperature controlled semiconductor processing chamber liner
US7011039B1 (en) * 2000-07-07 2006-03-14 Applied Materials, Inc. Multi-purpose processing chamber with removable chamber liner
US20040033385A1 (en) * 2001-06-25 2004-02-19 Kaushal Tony S. Erosion-resistant components for plasma process chambers
US20040206309A1 (en) * 2003-04-17 2004-10-21 Applied Materials, Inc. Apparatus and method to confine plasma and reduce flow resistance in a plasma reactor
US20050229849A1 (en) * 2004-02-13 2005-10-20 Applied Materials, Inc. High productivity plasma processing chamber
US20050224180A1 (en) * 2004-04-08 2005-10-13 Applied Materials, Inc. Apparatus for controlling gas flow in a semiconductor substrate processing chamber
USD583838S1 (en) 2007-09-19 2008-12-30 Riley Power, Inc. Grinding chamber side liner
US20090188625A1 (en) * 2008-01-28 2009-07-30 Carducci James D Etching chamber having flow equalizer and lower liner
US8858754B2 (en) * 2010-05-25 2014-10-14 Tokyo Electron Limited Plasma processing apparatus
US8980005B2 (en) 2011-03-22 2015-03-17 Applied Materials, Inc. Liner assembly for chemical vapor deposition chamber
USD658691S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD678228S1 (en) * 2011-03-30 2013-03-19 Tokyo Electron Limited Chamber block
USD658693S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD658692S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
US20140116366A1 (en) 2011-04-21 2014-05-01 Eaton Corporation Pivot foot for deactivating rocker arm
USD699692S1 (en) * 2012-01-19 2014-02-18 Applied Materials, Inc. Upper liner
US20140322897A1 (en) 2013-04-30 2014-10-30 Applied Materials, Inc. Flow controlled liner having spatially distributed gas passages
USD717746S1 (en) * 2013-11-06 2014-11-18 Applied Materials, Inc. Lower chamber liner
USD716239S1 (en) * 2013-11-06 2014-10-28 Applied Materials, Inc. Upper chamber liner
USD716240S1 (en) * 2013-11-07 2014-10-28 Applied Materials, Inc. Lower chamber liner
USD802545S1 (en) * 2015-06-12 2017-11-14 Hitachi High-Technologies Corporation Lower chamber for a plasma processing apparatus
USD804436S1 (en) * 2015-06-12 2017-12-05 Hitachi High-Technologies Corporation Upper chamber for a plasma processing apparatus
USD812578S1 (en) * 2016-02-26 2018-03-13 Hitachi High-Technologies Corporation Upper chamber for a plasma processing apparatus

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
Japanese Office Action for Application No. JP 2017-024106 dated Apr. 10, 2018.
Japanese Office Action for Application No. JP 2017-024107 dated Apr. 10, 2018.
Search Report for Taiwan Design Application No. 106306241 dated Jun. 6, 2018.

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD901405S1 (en) * 2017-03-28 2020-11-10 Rohm Co., Ltd. Semiconductor device
USD875053S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875054S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875055S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD882536S1 (en) * 2017-04-28 2020-04-28 Applied Materials, Inc. Plasma source liner
USD925481S1 (en) * 2018-12-06 2021-07-20 Kokusai Electric Corporation Inlet liner for substrate processing apparatus
USD941787S1 (en) * 2020-03-03 2022-01-25 Applied Materials, Inc. Substrate transfer blade

Also Published As

Publication number Publication date
JP1615030S (enrdf_load_stackoverflow) 2018-10-01
TWD192021S (zh) 2018-08-01

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