TWD180288S - 電漿處理裝置用上腔室 - Google Patents
電漿處理裝置用上腔室Info
- Publication number
- TWD180288S TWD180288S TW104305548D01F TW104305548D01F TWD180288S TW D180288 S TWD180288 S TW D180288S TW 104305548D01 F TW104305548D01 F TW 104305548D01F TW 104305548D01 F TW104305548D01 F TW 104305548D01F TW D180288 S TWD180288 S TW D180288S
- Authority
- TW
- Taiwan
- Prior art keywords
- design
- upper chamber
- difference
- original design
- processing device
- Prior art date
Links
- 238000009832 plasma treatment Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000004381 surface treatment Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 abstract 1
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2016-4151F JP1564934S (ko) | 2016-02-26 | 2016-02-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
TWD180288S true TWD180288S (zh) | 2016-12-21 |
Family
ID=57406451
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104305548D01F TWD180288S (zh) | 2016-02-26 | 2016-04-29 | 電漿處理裝置用上腔室 |
Country Status (3)
Country | Link |
---|---|
US (1) | USD812578S1 (ko) |
JP (1) | JP1564934S (ko) |
TW (1) | TWD180288S (ko) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD858468S1 (en) | 2018-03-16 | 2019-09-03 | Applied Materials, Inc. | Collimator for a physical vapor deposition chamber |
USD875054S1 (en) | 2017-04-28 | 2020-02-11 | Applied Materials, Inc. | Plasma connector liner |
USD875055S1 (en) | 2017-04-28 | 2020-02-11 | Applied Materials, Inc. | Plasma connector liner |
USD937329S1 (en) | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
USD997111S1 (en) | 2021-12-15 | 2023-08-29 | Applied Materials, Inc. | Collimator for use in a physical vapor deposition (PVD) chamber |
USD998575S1 (en) | 2020-04-07 | 2023-09-12 | Applied Materials, Inc. | Collimator for use in a physical vapor deposition (PVD) chamber |
USD1009816S1 (en) | 2021-08-29 | 2024-01-02 | Applied Materials, Inc. | Collimator for a physical vapor deposition chamber |
USD1038901S1 (en) | 2022-01-12 | 2024-08-13 | Applied Materials, Inc. | Collimator for a physical vapor deposition chamber |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD826300S1 (en) * | 2016-09-30 | 2018-08-21 | Oerlikon Metco Ag, Wohlen | Rotably mounted thermal plasma burner for thermalspraying |
JP1611626S (ko) * | 2017-01-20 | 2018-08-20 | ||
USD842259S1 (en) * | 2017-04-28 | 2019-03-05 | Applied Materials, Inc. | Plasma chamber liner |
USD838681S1 (en) * | 2017-04-28 | 2019-01-22 | Applied Materials, Inc. | Plasma chamber liner |
USD875053S1 (en) * | 2017-04-28 | 2020-02-11 | Applied Materials, Inc. | Plasma connector liner |
USD818447S1 (en) * | 2017-04-28 | 2018-05-22 | Applied Materials, Inc. | Plasma feedthrough flange |
USD837754S1 (en) * | 2017-04-28 | 2019-01-08 | Applied Materials, Inc. | Plasma chamber liner |
JP1638504S (ko) * | 2018-12-06 | 2019-08-05 | ||
JP1646366S (ko) * | 2019-03-19 | 2019-11-25 | ||
USD913979S1 (en) * | 2019-08-28 | 2021-03-23 | Applied Materials, Inc. | Inner shield for a substrate processing chamber |
USD931241S1 (en) * | 2019-08-28 | 2021-09-21 | Applied Materials, Inc. | Lower shield for a substrate processing chamber |
US12100577B2 (en) | 2019-08-28 | 2024-09-24 | Applied Materials, Inc. | High conductance inner shield for process chamber |
USD1042373S1 (en) * | 2022-03-18 | 2024-09-17 | Applied Materials, Inc. | Sliding ring for an interlocking process kit for a substrate processing chamber |
USD1042374S1 (en) * | 2022-03-18 | 2024-09-17 | Applied Materials, Inc. | Support pipe for an interlocking process kit for a substrate processing chamber |
USD1008967S1 (en) * | 2022-05-16 | 2023-12-26 | Japan Aviation Electronics Industry, Limited | Collar for connector |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4153907A (en) * | 1977-05-17 | 1979-05-08 | Vactec, Incorporated | Photovoltaic cell with junction-free essentially-linear connections to its contacts |
USD274836S (en) * | 1982-12-02 | 1984-07-24 | Smith Edward J | Space heater assembly |
US5641375A (en) * | 1994-08-15 | 1997-06-24 | Applied Materials, Inc. | Plasma etching reactor with surface protection means against erosion of walls |
USD404369S (en) * | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Manifold cover for use in a semiconductor wafer heat processing apparatus |
US6623609B2 (en) * | 1999-07-12 | 2003-09-23 | Semitool, Inc. | Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same |
USD448729S1 (en) * | 1999-12-14 | 2001-10-02 | Mitsubishi Denki Kabushiki Kaisha | Stator of AC generator for vehicles |
JP4470274B2 (ja) * | 2000-04-26 | 2010-06-02 | 東京エレクトロン株式会社 | 熱処理装置 |
US20040069223A1 (en) * | 2002-10-10 | 2004-04-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wall liner and slot liner for process chamber |
USD491963S1 (en) * | 2002-11-20 | 2004-06-22 | Tokyo Electron Limited | Inner wall shield for a process chamber for manufacturing semiconductors |
US9677188B2 (en) * | 2009-06-17 | 2017-06-13 | Novellus Systems, Inc. | Electrofill vacuum plating cell |
TWI502617B (zh) * | 2010-07-21 | 2015-10-01 | 應用材料股份有限公司 | 用於調整電偏斜的方法、電漿處理裝置與襯管組件 |
WO2013148890A1 (en) * | 2012-03-28 | 2013-10-03 | Novellus Systems, Inc. | Methods and apparatuses for cleaning electroplating substrate holders |
USD716240S1 (en) * | 2013-11-07 | 2014-10-28 | Applied Materials, Inc. | Lower chamber liner |
US10049862B2 (en) * | 2015-04-17 | 2018-08-14 | Lam Research Corporation | Chamber with vertical support stem for symmetric conductance and RF delivery |
-
2016
- 2016-02-26 JP JPD2016-4151F patent/JP1564934S/ja active Active
- 2016-04-29 TW TW104305548D01F patent/TWD180288S/zh unknown
- 2016-07-26 US US29/572,169 patent/USD812578S1/en active Active
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD875054S1 (en) | 2017-04-28 | 2020-02-11 | Applied Materials, Inc. | Plasma connector liner |
USD875055S1 (en) | 2017-04-28 | 2020-02-11 | Applied Materials, Inc. | Plasma connector liner |
USD858468S1 (en) | 2018-03-16 | 2019-09-03 | Applied Materials, Inc. | Collimator for a physical vapor deposition chamber |
USD937329S1 (en) | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
USD998575S1 (en) | 2020-04-07 | 2023-09-12 | Applied Materials, Inc. | Collimator for use in a physical vapor deposition (PVD) chamber |
USD1009816S1 (en) | 2021-08-29 | 2024-01-02 | Applied Materials, Inc. | Collimator for a physical vapor deposition chamber |
USD997111S1 (en) | 2021-12-15 | 2023-08-29 | Applied Materials, Inc. | Collimator for use in a physical vapor deposition (PVD) chamber |
USD1038901S1 (en) | 2022-01-12 | 2024-08-13 | Applied Materials, Inc. | Collimator for a physical vapor deposition chamber |
Also Published As
Publication number | Publication date |
---|---|
JP1564934S (ko) | 2016-12-05 |
USD812578S1 (en) | 2018-03-13 |
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