TWD175795S - 導線框 - Google Patents

導線框

Info

Publication number
TWD175795S
TWD175795S TW104305867F TW104305867F TWD175795S TW D175795 S TWD175795 S TW D175795S TW 104305867 F TW104305867 F TW 104305867F TW 104305867 F TW104305867 F TW 104305867F TW D175795 S TWD175795 S TW D175795S
Authority
TW
Taiwan
Prior art keywords
lead frame
design
view
article
symmetrical
Prior art date
Application number
TW104305867F
Other languages
English (en)
Chinese (zh)
Inventor
Atsushi Takeshita
Original Assignee
東芝股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東芝股份有限公司 filed Critical 東芝股份有限公司
Publication of TWD175795S publication Critical patent/TWD175795S/zh

Links

TW104305867F 2015-04-20 2015-10-20 導線框 TWD175795S (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2015-8835F JP1537979S (enrdf_load_stackoverflow) 2015-04-20 2015-04-20

Publications (1)

Publication Number Publication Date
TWD175795S true TWD175795S (zh) 2016-05-21

Family

ID=54549587

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104305867F TWD175795S (zh) 2015-04-20 2015-10-20 導線框

Country Status (3)

Country Link
US (1) USD803799S1 (enrdf_load_stackoverflow)
JP (1) JP1537979S (enrdf_load_stackoverflow)
TW (1) TWD175795S (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD892763S1 (en) * 2018-09-07 2020-08-11 Shenzhen Grandsun Electronic Co., Ltd. Earphone
JP1678672S (enrdf_load_stackoverflow) * 2019-11-07 2021-02-08

Family Cites Families (38)

* Cited by examiner, † Cited by third party
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JP3711776B2 (ja) * 1999-02-09 2005-11-02 松下電器産業株式会社 固体電解コンデンサの製造方法およびその製造装置
US6486538B1 (en) * 1999-05-27 2002-11-26 Infineon Technologies Ag Chip carrier having ventilation channels
USD465207S1 (en) * 2001-06-08 2002-11-05 Gem Services, Inc. Leadframe matrix for a surface mount package
USD485243S1 (en) * 2002-10-22 2004-01-13 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484858S1 (en) * 2002-11-15 2004-01-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484103S1 (en) * 2002-11-15 2003-12-23 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD492266S1 (en) * 2002-11-15 2004-06-29 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD483336S1 (en) * 2002-11-15 2003-12-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484104S1 (en) 2002-11-25 2003-12-23 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD483337S1 (en) * 2002-11-25 2003-12-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD491900S1 (en) * 2002-12-17 2004-06-22 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD485244S1 (en) * 2002-12-17 2004-01-13 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD494939S1 (en) * 2002-12-17 2004-08-24 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD486802S1 (en) * 2002-12-17 2004-02-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD513608S1 (en) * 2003-01-03 2006-01-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD505122S1 (en) * 2003-01-03 2005-05-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD488136S1 (en) * 2003-01-03 2004-04-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD487431S1 (en) * 2003-01-03 2004-03-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD485808S1 (en) * 2003-01-03 2004-01-27 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD505121S1 (en) * 2003-01-03 2005-05-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD487432S1 (en) 2003-02-07 2004-03-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484859S1 (en) * 2003-02-07 2004-01-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD588080S1 (en) * 2007-09-26 2009-03-10 Gem Services, Inc. 2021-8J matrix leadframe
USD588557S1 (en) * 2007-10-02 2009-03-17 Gem Services, Inc. 4040-28J matrix leadframe
JP5634033B2 (ja) * 2008-08-29 2014-12-03 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 樹脂封止型半導体装置とその製造方法
CN102169864B (zh) * 2010-02-26 2015-06-17 飞思卡尔半导体公司 引线框架片材
JP5762078B2 (ja) * 2011-03-28 2015-08-12 新光電気工業株式会社 リードフレーム
JP5875848B2 (ja) * 2011-12-16 2016-03-02 株式会社東芝 フォトカプラの製造方法及びフォトカプラ用リードフレームシート
US8884414B2 (en) * 2013-01-09 2014-11-11 Texas Instruments Incorporated Integrated circuit module with dual leadframe
US9748164B2 (en) * 2013-03-05 2017-08-29 Nichia Corporation Semiconductor device
JP6499387B2 (ja) * 2013-03-05 2019-04-10 日亜化学工業株式会社 リードフレーム及び発光装置
US9171766B2 (en) * 2013-05-03 2015-10-27 Infineon Technologies Ag Lead frame strips with support members
JP6603982B2 (ja) * 2013-07-31 2019-11-13 日亜化学工業株式会社 リードフレーム、樹脂付きリードフレーム、樹脂パッケージ、発光装置及び樹脂パッケージの製造方法
US9263419B2 (en) * 2013-08-30 2016-02-16 Infineon Technologies Ag Lead frame strips with electrical isolation of die paddles
US9252063B2 (en) * 2014-07-07 2016-02-02 Infineon Technologies Ag Extended contact area for leadframe strip testing
US9337130B2 (en) * 2014-07-28 2016-05-10 Texas Instruments Incorporated Leadframe strip and leadframes
JP6573356B2 (ja) * 2015-01-22 2019-09-11 大口マテリアル株式会社 リードフレーム

Also Published As

Publication number Publication date
JP1537979S (enrdf_load_stackoverflow) 2015-11-16
USD803799S1 (en) 2017-11-28

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