USD803799S1 - Lead frame - Google Patents

Lead frame Download PDF

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Publication number
USD803799S1
USD803799S1 US29/543,043 US201529543043F USD803799S US D803799 S1 USD803799 S1 US D803799S1 US 201529543043 F US201529543043 F US 201529543043F US D803799 S USD803799 S US D803799S
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US
United States
Prior art keywords
lead frame
taken along
along line
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end view
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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US29/543,043
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English (en)
Inventor
Atsushi Takeshita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Toshiba Electronic Devices and Storage Corp
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Toshiba Corp
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Assigned to KABUSHIKI KAISHA TOSHIBA reassignment KABUSHIKI KAISHA TOSHIBA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TAKESHITA, ATSUSHI
Application granted granted Critical
Publication of USD803799S1 publication Critical patent/USD803799S1/en
Assigned to TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION reassignment TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KABUSHIKI KAISHA TOSHIBA
Assigned to TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION, KABUSHIKI KAISHA TOSHIBA reassignment TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
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US29/543,043 2015-04-20 2015-10-20 Lead frame Active USD803799S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-008835 2015-04-20
JPD2015-8835F JP1537979S (enrdf_load_stackoverflow) 2015-04-20 2015-04-20

Publications (1)

Publication Number Publication Date
USD803799S1 true USD803799S1 (en) 2017-11-28

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ID=54549587

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/543,043 Active USD803799S1 (en) 2015-04-20 2015-10-20 Lead frame

Country Status (3)

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US (1) USD803799S1 (enrdf_load_stackoverflow)
JP (1) JP1537979S (enrdf_load_stackoverflow)
TW (1) TWD175795S (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD892763S1 (en) * 2018-09-07 2020-08-11 Shenzhen Grandsun Electronic Co., Ltd. Earphone
USD956705S1 (en) * 2019-11-07 2022-07-05 Lam Research Corporation Cooling plate for a semiconductor processing apparatus

Citations (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6316821B1 (en) * 1998-09-28 2001-11-13 Cypress Semiconductor Corporation High density lead frames and methods for plastic injection molding
US6409775B1 (en) * 1999-02-09 2002-06-25 Matsushita Electric Industrial Co., Ltd. Method of molding a plurality of solid electrolytic capacitors on a metal lead frame
USD465207S1 (en) * 2001-06-08 2002-11-05 Gem Services, Inc. Leadframe matrix for a surface mount package
US6486538B1 (en) * 1999-05-27 2002-11-26 Infineon Technologies Ag Chip carrier having ventilation channels
USD483336S1 (en) * 2002-11-15 2003-12-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD483337S1 (en) * 2002-11-25 2003-12-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484103S1 (en) * 2002-11-15 2003-12-23 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484104S1 (en) 2002-11-25 2003-12-23 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484859S1 (en) * 2003-02-07 2004-01-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484858S1 (en) * 2002-11-15 2004-01-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD485244S1 (en) * 2002-12-17 2004-01-13 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD485243S1 (en) * 2002-10-22 2004-01-13 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD485808S1 (en) * 2003-01-03 2004-01-27 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD486802S1 (en) * 2002-12-17 2004-02-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD487432S1 (en) 2003-02-07 2004-03-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD487431S1 (en) * 2003-01-03 2004-03-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD488136S1 (en) * 2003-01-03 2004-04-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD491900S1 (en) * 2002-12-17 2004-06-22 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD492266S1 (en) * 2002-11-15 2004-06-29 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD494939S1 (en) * 2002-12-17 2004-08-24 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD505121S1 (en) * 2003-01-03 2005-05-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD505122S1 (en) * 2003-01-03 2005-05-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD513608S1 (en) * 2003-01-03 2006-01-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD588080S1 (en) * 2007-09-26 2009-03-10 Gem Services, Inc. 2021-8J matrix leadframe
USD588557S1 (en) * 2007-10-02 2009-03-17 Gem Services, Inc. 4040-28J matrix leadframe
US20100052125A1 (en) * 2008-08-29 2010-03-04 Sanyo Electric Co., Ltd. Resin sealing type semiconductor device and method of manufacturing the same, and lead frame
US20110212341A1 (en) * 2010-02-26 2011-09-01 Freescale Semiconductor, Inc. Lead frame sheet
US20120248588A1 (en) * 2011-03-28 2012-10-04 Shinko Electric Industries Co., Ltd. Lead frame
JP2013128007A (ja) * 2011-12-16 2013-06-27 Toshiba Corp フォトカプラの製造方法及びフォトカプラ用リードフレームシート
US20140191381A1 (en) * 2013-01-09 2014-07-10 Texas Instruments Incorporated Integrated circuit module with dual leadframe
US20140252401A1 (en) * 2013-03-05 2014-09-11 Nichia Corporation Lead frame and light emitting device
US20140252574A1 (en) * 2013-03-05 2014-09-11 Nichia Corporation Lead frame and semiconductor device
US20140327004A1 (en) * 2013-05-03 2014-11-06 Infineon Technologies Ag Lead Frame Strips with Support Members
US20150064849A1 (en) * 2013-08-30 2015-03-05 Infineon Technologies Ag Lead Frame Strips with Electrical Isolation of Die Paddles
US20160005663A1 (en) * 2014-07-07 2016-01-07 Infineon Technologies Ag Extended contact area for leadframe strip testing
US20160027721A1 (en) * 2014-07-28 2016-01-28 Texas Instruments Incorporated Leadframe Strip And Leadframes
US20160218051A1 (en) * 2015-01-22 2016-07-28 Sh Materials Co., Ltd. Lead frame
US9607934B2 (en) * 2013-07-31 2017-03-28 Nichia Corporation Lead frame, lead frame with resin attached thereto, resin package, light emitting device, and method for manufacturing resin package

Patent Citations (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6316821B1 (en) * 1998-09-28 2001-11-13 Cypress Semiconductor Corporation High density lead frames and methods for plastic injection molding
US6409775B1 (en) * 1999-02-09 2002-06-25 Matsushita Electric Industrial Co., Ltd. Method of molding a plurality of solid electrolytic capacitors on a metal lead frame
US6486538B1 (en) * 1999-05-27 2002-11-26 Infineon Technologies Ag Chip carrier having ventilation channels
USD465207S1 (en) * 2001-06-08 2002-11-05 Gem Services, Inc. Leadframe matrix for a surface mount package
USD485243S1 (en) * 2002-10-22 2004-01-13 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD492266S1 (en) * 2002-11-15 2004-06-29 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484858S1 (en) * 2002-11-15 2004-01-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD483336S1 (en) * 2002-11-15 2003-12-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484103S1 (en) * 2002-11-15 2003-12-23 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484104S1 (en) 2002-11-25 2003-12-23 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD483337S1 (en) * 2002-11-25 2003-12-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD491900S1 (en) * 2002-12-17 2004-06-22 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD494939S1 (en) * 2002-12-17 2004-08-24 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD485244S1 (en) * 2002-12-17 2004-01-13 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD486802S1 (en) * 2002-12-17 2004-02-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD485808S1 (en) * 2003-01-03 2004-01-27 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD488136S1 (en) * 2003-01-03 2004-04-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD487431S1 (en) * 2003-01-03 2004-03-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD505122S1 (en) * 2003-01-03 2005-05-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD513608S1 (en) * 2003-01-03 2006-01-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD505121S1 (en) * 2003-01-03 2005-05-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD487432S1 (en) 2003-02-07 2004-03-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484859S1 (en) * 2003-02-07 2004-01-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD588080S1 (en) * 2007-09-26 2009-03-10 Gem Services, Inc. 2021-8J matrix leadframe
USD588557S1 (en) * 2007-10-02 2009-03-17 Gem Services, Inc. 4040-28J matrix leadframe
US20100052125A1 (en) * 2008-08-29 2010-03-04 Sanyo Electric Co., Ltd. Resin sealing type semiconductor device and method of manufacturing the same, and lead frame
US20110212341A1 (en) * 2010-02-26 2011-09-01 Freescale Semiconductor, Inc. Lead frame sheet
US20120248588A1 (en) * 2011-03-28 2012-10-04 Shinko Electric Industries Co., Ltd. Lead frame
JP2013128007A (ja) * 2011-12-16 2013-06-27 Toshiba Corp フォトカプラの製造方法及びフォトカプラ用リードフレームシート
US20140191381A1 (en) * 2013-01-09 2014-07-10 Texas Instruments Incorporated Integrated circuit module with dual leadframe
US20140252401A1 (en) * 2013-03-05 2014-09-11 Nichia Corporation Lead frame and light emitting device
US20140252574A1 (en) * 2013-03-05 2014-09-11 Nichia Corporation Lead frame and semiconductor device
US20140327004A1 (en) * 2013-05-03 2014-11-06 Infineon Technologies Ag Lead Frame Strips with Support Members
US9607934B2 (en) * 2013-07-31 2017-03-28 Nichia Corporation Lead frame, lead frame with resin attached thereto, resin package, light emitting device, and method for manufacturing resin package
US20150064849A1 (en) * 2013-08-30 2015-03-05 Infineon Technologies Ag Lead Frame Strips with Electrical Isolation of Die Paddles
US20160005663A1 (en) * 2014-07-07 2016-01-07 Infineon Technologies Ag Extended contact area for leadframe strip testing
US20160027721A1 (en) * 2014-07-28 2016-01-28 Texas Instruments Incorporated Leadframe Strip And Leadframes
US20160218051A1 (en) * 2015-01-22 2016-07-28 Sh Materials Co., Ltd. Lead frame

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Excel Cell Electronic Co., dated Dec. 29, 2014, [online], [site visited Mar. 31, 2017]. Available from Internet, <URL:http://www.ece.com.tw/product.php>. *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD892763S1 (en) * 2018-09-07 2020-08-11 Shenzhen Grandsun Electronic Co., Ltd. Earphone
USD956705S1 (en) * 2019-11-07 2022-07-05 Lam Research Corporation Cooling plate for a semiconductor processing apparatus

Also Published As

Publication number Publication date
TWD175795S (zh) 2016-05-21
JP1537979S (enrdf_load_stackoverflow) 2015-11-16

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