TW583231B - Porous para-oriented aromatic polyamide film, method of producing same, and prepreg - Google Patents
Porous para-oriented aromatic polyamide film, method of producing same, and prepreg Download PDFInfo
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- TW583231B TW583231B TW091105692A TW91105692A TW583231B TW 583231 B TW583231 B TW 583231B TW 091105692 A TW091105692 A TW 091105692A TW 91105692 A TW91105692 A TW 91105692A TW 583231 B TW583231 B TW 583231B
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- Prior art keywords
- para
- aromatic
- film
- weight
- resin
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- 229920003235 aromatic polyamide Polymers 0.000 title claims abstract description 33
- 239000004760 aramid Substances 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 title claims description 23
- 239000000463 material Substances 0.000 claims abstract description 32
- 239000010419 fine particle Substances 0.000 claims abstract description 21
- 229920006015 heat resistant resin Polymers 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 125000003118 aryl group Chemical class 0.000 claims description 61
- 229920000768 polyamine Polymers 0.000 claims description 38
- 239000012528 membrane Substances 0.000 claims description 27
- 229920005989 resin Polymers 0.000 claims description 26
- 239000011347 resin Substances 0.000 claims description 26
- 239000002904 solvent Substances 0.000 claims description 22
- 229920002098 polyfluorene Polymers 0.000 claims description 16
- -1 Poly (2-Chlorylbenzyl Chemical group 0.000 claims description 15
- 229920005992 thermoplastic resin Polymers 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 229920000642 polymer Polymers 0.000 claims description 12
- 229920001187 thermosetting polymer Polymers 0.000 claims description 11
- 229920000962 poly(amidoamine) Polymers 0.000 claims description 8
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 5
- 150000001412 amines Chemical class 0.000 claims description 5
- 239000004202 carbamide Substances 0.000 claims description 5
- 238000006467 substitution reaction Methods 0.000 claims description 5
- 241000208140 Acer Species 0.000 claims description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 4
- 229910001510 metal chloride Inorganic materials 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 3
- 229920001577 copolymer Polymers 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000005077 polysulfide Substances 0.000 claims description 3
- 229920001021 polysulfide Polymers 0.000 claims description 3
- 150000008117 polysulfides Polymers 0.000 claims description 3
- 239000002689 soil Substances 0.000 claims description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 2
- 238000009313 farming Methods 0.000 claims description 2
- 229920000515 polycarbonate Polymers 0.000 claims description 2
- 239000004417 polycarbonate Substances 0.000 claims description 2
- 229920000728 polyester Polymers 0.000 claims description 2
- 229920001955 polyphenylene ether Polymers 0.000 claims description 2
- KDCGOANMDULRCW-UHFFFAOYSA-N 7H-purine Chemical compound N1=CNC2=NC=NC2=C1 KDCGOANMDULRCW-UHFFFAOYSA-N 0.000 claims 2
- 239000004721 Polyphenylene oxide Substances 0.000 claims 2
- 125000006187 phenyl benzyl group Chemical group 0.000 claims 2
- 229920000570 polyether Polymers 0.000 claims 2
- 239000004641 Diallyl-phthalate Substances 0.000 claims 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims 1
- 125000006615 aromatic heterocyclic group Chemical group 0.000 claims 1
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 claims 1
- 125000006267 biphenyl group Chemical group 0.000 claims 1
- 239000004643 cyanate ester Substances 0.000 claims 1
- 150000002466 imines Chemical class 0.000 claims 1
- 229920001643 poly(ether ketone) Polymers 0.000 claims 1
- 229920006337 unsaturated polyester resin Polymers 0.000 claims 1
- 239000000243 solution Substances 0.000 description 28
- 239000011248 coating agent Substances 0.000 description 15
- 238000000576 coating method Methods 0.000 description 15
- 239000007789 gas Substances 0.000 description 12
- 239000000203 mixture Substances 0.000 description 12
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 10
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 10
- 239000002966 varnish Substances 0.000 description 10
- 229920002799 BoPET Polymers 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 7
- 229910052757 nitrogen Inorganic materials 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 6
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical group CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 6
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- 238000006068 polycondensation reaction Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 5
- 150000001342 alkaline earth metals Chemical class 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 239000011148 porous material Substances 0.000 description 5
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 4
- 239000000835 fiber Substances 0.000 description 4
- 229920003366 poly(p-phenylene terephthalamide) Polymers 0.000 description 4
- KZNICNPSHKQLFF-UHFFFAOYSA-N succinimide Chemical compound O=C1CCC(=O)N1 KZNICNPSHKQLFF-UHFFFAOYSA-N 0.000 description 4
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- 241001674048 Phthiraptera Species 0.000 description 3
- 229920000561 Twaron Polymers 0.000 description 3
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- 229910052783 alkali metal Inorganic materials 0.000 description 3
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- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 2
- DBAKFASWICGISY-DASCVMRKSA-N Dexchlorpheniramine maleate Chemical compound OC(=O)\C=C/C(O)=O.C1([C@H](CCN(C)C)C=2N=CC=CC=2)=CC=C(Cl)C=C1 DBAKFASWICGISY-DASCVMRKSA-N 0.000 description 2
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- URLKBWYHVLBVBO-UHFFFAOYSA-N Para-Xylene Chemical group CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 2
- 239000000292 calcium oxide Substances 0.000 description 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
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- 239000003292 glue Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
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- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
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- KXCVRJMSLWDHNJ-UHFFFAOYSA-N 1-(9H-fluoren-1-yl)pyrrolidin-2-one Chemical compound C1(=CC=CC=2C3=CC=CC=C3CC12)N1C(CCC1)=O KXCVRJMSLWDHNJ-UHFFFAOYSA-N 0.000 description 1
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- FZZMTSNZRBFGGU-UHFFFAOYSA-N 2-chloro-7-fluoroquinazolin-4-amine Chemical compound FC1=CC=C2C(N)=NC(Cl)=NC2=C1 FZZMTSNZRBFGGU-UHFFFAOYSA-N 0.000 description 1
- QGNGOGOOPUYKMC-UHFFFAOYSA-N 4-hydroxy-6-methylaniline Chemical compound CC1=CC(O)=CC=C1N QGNGOGOOPUYKMC-UHFFFAOYSA-N 0.000 description 1
- 241000220479 Acacia Species 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 235000010643 Leucaena leucocephala Nutrition 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000003723 Smelting Methods 0.000 description 1
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- 206010052428 Wound Diseases 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- SXEHKFHPFVVDIR-UHFFFAOYSA-N [4-(4-hydrazinylphenyl)phenyl]hydrazine Chemical compound C1=CC(NN)=CC=C1C1=CC=C(NN)C=C1 SXEHKFHPFVVDIR-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
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- 230000001476 alcoholic effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
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- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
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- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 210000003608 fece Anatomy 0.000 description 1
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- 125000000524 functional group Chemical group 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 150000007857 hydrazones Chemical class 0.000 description 1
- 229910052743 krypton Inorganic materials 0.000 description 1
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 150000002632 lipids Chemical class 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000004292 methyl p-hydroxybenzoate Substances 0.000 description 1
- 229960002216 methylparaben Drugs 0.000 description 1
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- VMGAPWLDMVPYIA-HIDZBRGKSA-N n'-amino-n-iminomethanimidamide Chemical compound N\N=C\N=N VMGAPWLDMVPYIA-HIDZBRGKSA-N 0.000 description 1
- HHALWABTBJDXOH-UHFFFAOYSA-N n-[[4-(aminomethyl)phenyl]methyl]aniline Chemical compound C1=CC(CN)=CC=C1CNC1=CC=CC=C1 HHALWABTBJDXOH-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
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- 238000007254 oxidation reaction Methods 0.000 description 1
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- 230000000704 physical effect Effects 0.000 description 1
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- 239000002952 polymeric resin Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
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- BOLDJAUMGUJJKM-LSDHHAIUSA-N renifolin D Natural products CC(=C)[C@@H]1Cc2c(O)c(O)ccc2[C@H]1CC(=O)c3ccc(O)cc3O BOLDJAUMGUJJKM-LSDHHAIUSA-N 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/0061—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof characterized by the use of several polymeric components
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/28—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof by elimination of a liquid phase from a macromolecular composition or article, e.g. drying of coagulum
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
- C08L77/08—Polyamides derived from polyamines and polycarboxylic acids from polyamines and polymerised unsaturated fatty acids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
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Description
583231 五、發明說明(1) [本發明之背景] [本發明之領域] 士吁疋有關於一種多孔對位取代之芳族聚醯胺膜、 由該膜製造之預浸材及印刷電路板用之基板。 [相關技術之揭示] 外近電子裝置領域中,對高速訊號處理及高功能數 2化^為求已逐漸增加。使用對位芳族聚醯胺(下文中有 位芳族聚酿胺")媒之積層膜具有質輕及低線性 膨脹係數之特徵,且該積層膜在此領域之應用已在發展 中 〇 然而媒具有低•度因而不易對其進行處理以用於 钍μ ^ 的方法為藉由添加由耐熱性樹脂所組成之黏 、、、口刎以加強對位芳族聚醯胺膜之韌性。例如, JP-Α_10-338762揭露^一插a古+工上紅 維及/或漿狀物之多孔=性㈣所組成之短纖 族聚醯胺。夕孔對位取代之芳族聚酿胺膜’例如芳 因此=要!ϊΐί抗撕裂傳播性(其為勃性指數)仍小, 因此極而要具有大的抗撕裂傳播性的膜。 膜,= 供一種多孔對位取代之芳族聚酿胺 :胺特徵脹係數之對位芳族聚 製造該膜、以熱塑性樹脂及/或熱固性樹脂(下===一種 稱為樹脂)浸潰該膜而得之預浸材以 有時簡 印刷電路板用之基板的方法。 -預次材製造
583231 五、發明說明(2) 本發明人經廣泛地研究 一種多孔對位取代之芳族聚 性樹脂所組成之細微粒子並 維持例如質輕及低線性熱膨 下,該多孔對位取代之芳族 性,因而完成本發明。 [發明概述] 以解決上述之問題,結果發現 酿胺臈,其含有特定量由耐熱 具有特定線性熱膨脹係數,於 服係數之對位芳族聚醯胺特徵 聚酿胺膜具有大的抗撕裂傳播 即,本發明是有關於[丨]一種含有1〇至4〇〇重量份之由 耐熱性樹脂所組成之細微粒子(以100重量份之對位取代之 芳族\醯胺计)之多孔對位取代之芳族聚醯胺膜,其於2 0 0 至3〇〇°C下具有〜50x 10-6/°C至+50X ΐο-vt:之線性熱膨脹 本發明亦是關於[2] —種多孔對位取代之芳族聚醯胺 膜[1 ]之製造方法,其中該方法包括下列步驟(a)至(c) ·· 步驟(a)’自含有〇;1至1〇重量%具固有黏度1〇至 t 8d 1 /g之對位取代之芳族聚醢胺、1至丨〇重量%之鹼金屬 ^化物或驗土金屬氣化物以及10至40 0重量份由耐熱性樹 脂所組成之細微粒子(以1 〇 〇重量份之該聚醯胺計)於極性 酿胺溶劑或極性尿素溶劑中之溶液形成膜狀材料; 步驟(b)’自步驟(a)所得之膜狀材料沉積對位取代之 芳族聚酿胺;以及 $驟(c) ’將步驟(b)所得具有沉澱之對位取代之芳族 聚酿胺=膜狀材料浸潰於水溶液或醇溶液中,洗提溶劑及 驗金屬氯化物或鹼土金屬氣化物,然後乾燥以獲得多孔對
313508.ptd 第6頁 583231 五、發明說明(3) 位取代之芳族聚醯胺膜。 本發明亦是關於[3 ] —種以熱塑性樹脂及/或熱固性樹 脂浸潰該多孔對位取代之芳族聚醯胺膜[1 ]而得之預浸 材。 本發明進一步是關於[4] 一種使用該預浸材[3]而得之 印刷電路板用之基板。 [本發明之詳細說明] 本發明對位取代之芳族聚醢胺係經由對位取代之芳族 二胺與對位取代之芳族二羧醯画之聚縮合反應而得,實質
上係由其中醯胺鍵係連結於芳環之對位位置或芳環經取代 之相當位置(例如取代位置以相反方向同軸或平行延伸, 如4,4 伸聯苯基、1,5 -伸萘基及2,6 -伸萘基)之重複單 元所組成。 ^ 其特定實例為具有對位取代或相當之取代結構之對4 芳族聚醯胺,例如聚(對伸苯基對苯二甲醯胺)、聚(對苯 :醢胺),、聚(4, 4,-苯醯替苯胺對苯二甲醯胺)、聚(對巧 本土、’4 伸聯本基二竣醢胺)、聚(對伸笨基—2 6 -伸苯 氯,伸苯基對苯二甲酿胺)或對伸 1
一丰一氣對伸苯基二胺/對苯二甲醯氣之共聚物 \ 一乂 ,亦可使用具有酚式羥基作為末端官能美之4 位芳族聚醯胺。 不MS此暴之n t f酚式羥基作為末端官能 含有末端羥基之對办你成4 M h I酿思指 > ^ „ 對位取代之芳族聚醯胺,其中,邺於弋仏 有之末端官能基為羥基。誃 /、中,4伤或所 Μ 3有末知經基之對位取代之芳
313508.ptd 第7頁 583231 五、發明說明⑷ —— 族聚醯胺,典型地為具有部份或所有之分子鏈端係結合至 具有羥f ^芳族化合物的對位取代之芳族聚醯胺。 、,本發明之膜所使用由耐熱性樹脂所組成之細微粒子 =均粒度通常為5 〇 〇 # m或更小,從膜之均勻性觀點而言, 較佳為2〇M 111或更小,更佳為150// m或更小,特佳為&〇’ # m或更小。本發明可利用雷射散射法測量細微粒子 均粒度。 卞 本發明之膜所使用由耐熱性樹脂所組成之細微 縱橫比通常小於50。 卞之 用於本發明之膜之耐熱性樹脂為在低於2 3 〇艺, 低於250C之溫度下不會熔解之樹脂。 本發明耐熱性樹脂之特定實例包含芳族聚醯胺, 上述之對位芳族聚醯胺,其典型地以聚(對伸苯基對 曱醯胺)及聚對苯甲醯胺等;芳族聚酯(例如聚對苯甲酸一 =、聚對★伸笨基對苯二甲酸醋及聚伸乙基對苯二甲酸酯 荨),及方族雜環聚合物(例如聚對伸苯基苯 =基雙嗜嗤)等為代表。其t,較佳為芳族聚醯胺“ f別^,宜使用聚(對伸苯基對苯二甲酿胺 多孔膜具有優異的親和性。 7 口具對 $發明之膜中,上述細微粒子之量為10至400重 伤,較佳為30至250重量份,更佳為5〇至15〇 = 重量份之對位取代之芳族聚酿胺計)。若不在 内’:膜之抗撕裂傳播性不足。但當超出 ,範圍 位取代之芳族聚醯胺及細微粒子之溶液黏度增加太多有:: 313508.ptd 第8頁 583231 五、發明說明(5) 致不易自溶液形成膜狀材料。 本lx明之膜通常係由對位方族聚酿胺之原纖維所製 成,由顯微鏡觀之,具有不織布形式。即,多孔對位取代 之芳族聚醯胺膜通常具有一種結構,其中直徑1 於1 z/m之由對位芳族聚醢胺所製成之原纖維以網狀或不 織布形式並以層之形式層壓。 本發明之膜通常係由原纖維所組成且具有許多個空 隙,而空隙百分比通常係自3 0至9 5 % ,較佳為3 5至9 〇 % 。 當空隙百分比小於30%時,該結構可能在實質上不是多 孔’且藉由溶解下述之熱塑性樹脂及/或熱固性樹脂於溶 劑中而製得之清漆之浸潰量有不足的傾向。另一方面,當 超過95%時,多孔膜有低強度的傾向而導致處理困難。^ 發明多孔對位取代之芳族聚醯胺膜於2 〇 〇至3 〇 〇 〇c下之線性 熱膨脹係數(在平面方向)為—50x 1〇-6/。(:至+5〇>( 1〇6/^, 較2為-25x 10-Vt:至+25x 10_Vt:。低的線性熱膨脹係數 值意謂沿著平面方向具有優異之尺寸安定性。本發明之膜 所使用之耐熱性樹脂之線性熱膨脹係數並無特別限制。但 為了控制本發明之膜於2 〇 〇至3 0 0 °C下之線性熱膨脹係數為 - 5 0 X 1 0 6/ C至+ 5 0 X 1 〇 _6/ °c,較佳之耐熱性樹脂於2 〇 〇至 3〇〇°C下具有-50x l〇_V°C至+50x 10_V°C之線性熱膨脹係 本發明可根據需要而包含各種添加劑,例如,可將具 有低介電常數及高抗水性之物質(例如聚四氟乙烯等)以針 狀、微細粒子、平板等之形式置於多孔膜之表面上或内部
313508.ptd 第9頁 583231 五、發明說明(6) 以降低介電常數及水吸收係數。 等亦可有效地增加強化的效果。卜’添加氧化紹短纖維 本發明之膜的厚度並無特別限制 # m,更佳為20至1〇〇 " m。當一較佳為10至150 縐而使得處理變得困難。當膜厚 ;"m時’則易起 失積層本;:”徵之傾"如1:=時度則有喪 U)至(:)予ίίί位取代之芳族聚酿胺膜可利用下列步驟 2- ^ ί ^ I ^ 1 · 〇" 氯化物或鹼土金屬氣化物 10重之鹼金屬 π所植赤夕* ^ 至400重量份由耐熱性樹 : = 子(以100重量份之該聚醯胺計)於極性 性尿素溶劑中之溶液形成膜狀材料; 芳族及驟(a)所得之膜狀材料沉積對位取代之 聚醯ί m將料二二)::=沉殿之對位取代之芳族 驗金屬氣化物或或酵溶液中,洗提溶劑及 位取代之芳族聚酿胺i 然後乾燥以獲得多孔對 孔對=525:步驟(d) ’步驟(d)係將步驟(c)所得之多 孔對位取代之方族聚醮 制線性壓力(…上^膜:;"觀磨。輥磨法為例如在控 所需性質之膜。下’使用壓延輥進行輥磨以獲得具有 將於下文進一步詳述各步驟。
583231 五、發明說明(7) 操作ί 所製用造之對:芳族聚醯胺溶液可藉例如下述 金屬氯化物或鹼土 :屬氣Ρ 其:溶有⑴0重量%之鹼 溶液中,添加〇 94J0 qQi物之極性醯胺溶液或極性尿素 (以1 〇莫耳f+轮π f 4耳之對位取代之芳族二羧醯齒 二ίΠ 代之芳族二胺計),接著於,至㈣進 而製得對位芳族聚酿胺漠度為0. /0之對位方族聚醯胺溶液。 化物酿胺溶液中之驗金屬氣化物或驗土金屬氯 為至10重量% ’較佳為2至8重量… 位芳:麥疏屬或鹼土金屬之氣化物量少於1重量%時,對 位方族聚醯胺之溶解度變得不足,而當超過10 化物或驗土金屬氣化物不會溶於極:醯:容 1ΐ Γ 素溶劑中。對位芳族聚酿胺溶液中之驗金屬氣 金屬氣化物的量係由對位芳族聚醯胺(對位芳 矣聚醯中之醯胺基)之量所決定。即, 化物之量’每1.〇莫耳由聚縮合反應所 =1佳為0.5至6.0莫耳,更佳為"至“"成之當醯氣 解度ΐ ^ Ϊ0 · 5Λ耳時,所形成之對位芳族聚醯胺之溶 又于足,虽虱化物之量超過6.0莫耳時,若掛位关 族聚醯胺之量多,則對位芳族聚醯 · 可溶於溶劑之量。 妝之/合解度超過軋化物 對位芳族聚醯胺溶液中之對位芳族聚醯胺濃产通常為 二重Λ% ,較佳為1至10重量% ,更佳為U至4重量 /〇 。虽對位方族聚醯胺濃度低於〇 .丨重量% ,產率可能降 313508.ptd 第11頁 JOJZJ1 發明說明(8) -— ________ % 位 由 重 因而對工業不#。當對位芳族聚 妆,可因為對位芳族聚醯胺之沉胺/辰度超過〗〇重量 芳族聚醯胺溶液。以100重量份積而不能獲得穩定之對 耐熱性樹脂所組成之細微粒 ,位芳族聚醯胺計, 量份,較佳為30至250重量份,的体加量通常為10至400 步驟⑷之對位芳族聚酿 =50至15〇重量份。 8以/g’較佳K5至2 6 d =黏度通常在i.。至2. 固有黏度小於U0 “以時,不門之對位芳族聚醢胺。當 有黏度超過2.8 “〜時,不,足夠之膜強度。當固 溶液’且因對位芳族聚醯胺U =定之對位芳族聚醯胺 步驟(a)中之對位芳族t^儿積,而不易形成膜。 位取代之芳族二為-私之聚縮合反應所用之對 二氣-對伸苯基二胺、f 6_萃2 —乳-對伸苯基二胺、2,6-;、4,4, _二胺基笨酿替奈〜-胺、U-伸萘基二 專°可以單—種對位取代之=3, 4 '二胺基^苯基醚 合反應。 方族一胺或其混合物進行聚縮 步驟(a)中之對位芳族 位取代之芳族二 y -胺之氽縮合反應所用之對 ~4,4,-二叛醯氣 1\的對實^為對苯^甲酿氣、聯苯基 甲酿氣、2-甲基對笨二甲醜—甲酿鼠、2, 5-二氣對苯二 5~伸萘基二羧醯氣等。 =、2, 6 —伸萘基二綾醯氯及1, _或其混合物進行聚縮合反應一種對位取代之芳族二羧醯 步驟(a)中之對位芳族聚\° 、-胺之聚縮合反應係在極性
五、發明說明(9) ___ = ί極:生,素溶劑中進行。極性醯胺溶劑為N,r η;:?尿素溶劑為N,N,N,,N,-四甲基尿素等“ 又佳溶劑為N—甲基-2-吡咯烷酮。 寻其中 進、、☆ Γϊ ΐ (a)中,鹼金屬或鹼土金屬之氯化物係適用於描 不=二對位芳族聚醯胺之溶解度。其特定實例包含;9 、於,氣化鋰及氣化鈣。進一步,可加 ,但 氣η ΐ芳族聚醯胺溶液中以中和聚縮‘反應所生:J ί 實可減少由氫氣酸所d: 、丐、虱氧化鈣及碳酸鈣等。 氧化 步驟(a) _,當形成膜狀材料時,可將對位 私各液澆鑄於例如基材(例如 、鬏醯 膜例狀如材料之形式^彡成。μ二=:採Λ i=#寺 (例如棒塗)或自T-模擠壓至基材上等。㈣各種方法 成膜自Λ驟⑷中之對位芳族聚醯胺溶液中形 :膜:材枓之後,自膜狀材料沉積對 :形 胺。本發明較佳維持2(rc或更方族聚醯 kg乾燥空氣或更高之濕 :度/〇.〇"g水蒸氣 厚度之方向獲得均勻社 藉由該 >儿積法,可在沿著 寺間:長。在低於0·01 kg水 ::2 下,沉積之時間亦變長。 以祀屎二軋之濕度 步驟(C)中,將溶劑及鹼 物自步驟(b)中所得之膜狀i hi虱化物或鹼土金屬氣化 膜狀材料中移除。移除之方法,例 313508.ptd 第13頁 583231 五、發明說明(10)
=為將膜狀材料浸於水溶液或醇I 用將膜狀材;;移除時,亦可採 用於洗提溶劑或氯化物之溶液,較佳為水。 ί:移;::f溶劑及氯化物。水溶液則亦可使用水。 需之多:膜示:肩及氣化物之膜狀材料予以乾燥以製造所 知方ΐ :絡ΐ燥之方法未予以特別限制,可使用各種已 之中間體形式。 度奶夕孔膜之刖 本發明預浸材係藉將由耐熱性樹脂細微粒子 二孔對位取代之芳族聚醯胺膜以熱塑性樹埶 =予以浸潰而得。熱塑性樹脂未予以特 戈,二性 有熱塑性之樹脂。該熱塑性樹脂較佳具有15〇t <一古為八 嫁點:本發明預浸材主要係供印刷電路積層板,同 佳為對形成電路之材料顯示出足夠之黏著性者。埶 2 脂之實例可為至少一種選自聚喊楓、聚楓、聚鍵::树 聚硫醚楓(P〇iysulfide sulfone)、聚碳酸醋、聚亞 胺、聚醯胺醯亞胺及聚醚酮之熱塑性樹脂。此等可t 予以單獨使用或組合使用。 j週S地 另一方面,熱固性樹脂無特別限制,其實例、 一種選自環氧樹脂、雙馬來醯亞胺—三畊樹脂、聚醜亞乂 樹脂、苯二甲酸二旨、不飽和聚酯樹酯、氰酸醋樹醋 及芳基改質之聚伸苯基醚樹脂之熱固性樹脂。此者 地予以單獨使用或組合使用。 虽 313508.Ptd 第14頁
583231 五、發明說明(11) 熱塑性樹脂或熱固性樹脂(下 加量為樹脂/對位芳族聚醯胺的有θ寺間稱為樹脂)之添 7/3,較佳為3/7至7/3。當重 (重夏比)通常在1/9至 地浸入由對位芳族聚醯田 =於1/9,樹脂不能充分 面,當重量比超過"3,預Λ之之V生膜 而使其不適合作為積層板。 線拴熱膨脹係數增加, m .. m :述本發明熱塑性樹脂及埶固性樹ρ ·άτ #ι «ι 00 獨使用。《而,亦可於預浸材 ::,月曰可個別早 用該些樹脂。簡單之方法可單猶天=乂驟中一起或分開使 樹脂或作為組合物同時添加至製;° :生?脂或熱固性 步驟(a)之含有對位芳族聚醯胺之孔^位方族聚醯胺膜 之膜中睥ίίίΐ 孔對位芳族聚醯胺組成物 im::製造多孔對位芳族聚醢胺膜之後再以 …、塑树知予以浸潰之步驟。 4 A t發明預次材之形式為將耐熱性樹脂細微粒子及對位 =族4醢胺膜所組成之多孔膜以熱塑性樹脂及/或埶固性 枒脂予以浸潰之形式。通常為空隙被浸入之形式,即將具 有種結構之多孔膜以樹脂予以浸潰,該種結構為直徑i # m或小於1 " m由對位芳族聚醯胺所製成之原纖維以網狀 或不織布开^式並以層之形式層壓之結構。經由硬化本發明 預浸材所得之片於2 0 0至3〇(rc之線性熱膨脹係數(在平面 方向)6通常在-70X 10-6/1至+70χ ι〇-6/π之間,較佳在—35 X 1 〇 / C至+ 3 5 X 1 0 -V °C之間。如此小的線性熱膨脹係數 顯不A著平面方向具有優異之尺寸安定性,且為印刷電路
583231
積層板之最適宜性質 本發明中 以熱塑性樹脂及/或熱固性樹脂浸潰多孔
方法。例如,將含有本發明熱塑性 成物溶解於溶劑中以製備清漆,將 孔膜並以該清漆浸潰該膜,然後蒸 —因為線性熱膨脹係數小、機械強度優異及與金屬箔之 黏著性亦優異’所以可適合使用上述預浸材作為印刷電路 板或積層板用之基板。該印刷電路板及積層板用之基板可 藉由一般進行之方法(例如,〇611讣丨6^1^311之111(^ printed Wiring Board",1 986 年 6月,分冊)而製得。 即’使用本發明預浸材作為絕緣層,並與金屬箔製的導電 層進行層壓而製得印刷電路積層板。金屬箔可使用金、 銀、銅、鎳及鋁等之金屬。 [實施例] 下列實施例將詳細說明本發明實施例。該等僅作為實 例但非用以限制本發明。實施例及比較例中之試驗、評估 方法以及判斷標準示於下列。 (1)固有黏度 使用毛細管黏度計於3 0 °c,分別測定藉由溶解〇 · 5克 之對位芳族聚醯胺聚合物於1〇〇 ml之96至98%硫酸所製得 之/谷液,以及9 6至9 8 %硫酸之流動時間。然後根據下式, 由所測定之流動時間之比,計算固有黏度。
313508.ptd 第16頁 583231 五、發明說明(13) 固有黏度=ln(T/Tj/C [單位:dl/g] 士其中T及T。分別代表對位芳族聚醯胺之硫酸溶液之流 動%間以及硫酸之流動時間,及^代表對位芳族聚醯胺之 硫酸溶液中對位芳族聚醯胺之濃度(g/dl )。 (2 )空隙百分比 將多孔膜切成方形(邊長·· L,公分),然後測量重量 (w ·克)及厚度(D :公分)。利用a 1 c h i m e d e s法測定以p ((g/cm3))表示之真實比重,並根據下式計算空隙百分比 (體積% )。 空隙百分比(體積。/。)= 100 —l〇〇(W/ p )/(L2xD) (3 )拉伸試驗 使用Dumbbel 1公司所製之啞鈴形切割機自多孔膜、預 浸材或由硬化該預浸材所得之片沖壓試片,然後使用 instron通用拉伸試驗機( 43 0 1型,Instron日本公司所製) 依據J I S K - 7 1 2 7測定拉伸強度。 (4 )銅箔之剝離強度 依據JIS-C648 1予以測定。 (5 )線性熱膨脹係數 使用Seiko Denshi Κ·Κ·所製之熱分析裝置TMA 120依 據ASTM D6 9 6進行測定,並根據下式計算。將測定前未經 回火之測定試片在裝置中一次加熱至3 0 0 °C,然後再進行 測定而得測定值結果。 α 1 = Δ L/Lo. Δ Τ 其中
313508.ptd 第17頁 583231 五、發明說明(14) α 1 :線性熱膨脹係數(/ °C ) △L:試片改變之長度 L。:測試前之試片長度 △ T :溫度差(°C ) (6 )抗撕裂傳播性 藉由Dumbbell公司所製且應用JISK-7128-1991C法(直 角撕裂法)之租鋒形切割機自多孔膜沖壓試片。然後使用 instron通用拉伸試驗機(4301型,Instron日本公司所製) 依據JIS K-7128-1991C法進行拉伸試驗’且計算自初始撕 裂至斷裂之平均應力。 (7)縱橫比 利用掃描式電子顯微鏡對細微粒子拍照,測量該些細 微粒子之長軸與短軸,並將平均長轴除以平均短軸而得縱 橫比。 實施例1 1)含末端羥基之聚(對伸苯基對苯二甲醯胺)之合成 使用備有攪拌葉片、溫度計、氮氣注入管及粉末添加 口之3升可分離式之燒瓶進行含末端羥基之聚(對伸笨基對 苯二甲醢胺)(下文簡稱為含末端羥基之PPTA)之合成反& 、 應。該燒瓶充份乾燥後,於其中置入2220克之N -曱基—2 -吡咯烷酮(下文簡稱為NMP )、2 0 0 °C乾燥2小時之1 4 9 · 2克之 氣化鈣,接著將混合物加熱至1 〇 〇 。將氣化鈣完全溶解 後,使溫度回至室溫,然後添加6 7. 2克之對伸苯基二胺 (下文簡稱為PPD)及6_7克之4 -胺基間甲酚(下文稱為
313508.ptd 第18頁 583231 五、發明說明(15) ί 使該^等完全溶解。在溶液維持於20士 2°C時,將 、、之對笨—甲醯氣(下文簡稱為TPC)分成十份,約每 刀#里添加:人。然後在溶液維持於2 〇 ± 2 °C時,將溶液熟 化1小%,再減壓攪拌溶液3 〇分鐘以除去氣泡。所得聚合 物溶液(聚合物膠漿)顯示光學各向異性。取出部分之溶液 作為樣品,且於水中再沉澱,取出得到之聚合物。測量所 得含末端羥基之PPTA之固有黏度,其為198 dl/g。 2)多孔對位芳族聚醯胺膜之製造及線性膨脹係數 自上述1)之聚合物溶液製造包括含末端羥基之ρρτ A及 耐熱性樹脂細微粒子之多孔膜。即,將原料稱重,並置入 備有授拌葉片、溫度計、氮氣注入管及液體添加口之5〇〇 毫升可分離式之燒瓶中。然後添加1〇〇克上述丨)之聚合物 溶液(包含6克含末端羥基之ppTA),並於氮氣流下攪拌該 混合物。然後添加2 0 0克之NMP稀釋,其後添加1. 41克氧化 鈣以中和由聚縮合反應所生成之氫氣酸副產物,及以丨〇 0 〇 網目之鐵絲網過濾。然後,稱重6克具有平均粒度為7 7 // m 及縱橫比為 7(Twaron TW-5011,Nippon Aramid Κ·Κ·所 製)之芳族聚醯胺細微粒子,並添加至燒瓶中,且攪拌混 合物120分鐘。使膠漿通過毫微米器(nanomizer)三次以充 分分散芳族聚醯胺細微粒子,然後減壓下去泡沫以得到塗 布用膠漿。根據下述程序自如此獲得之膠漿製造多孔膜。 將厚度100//Π1之PET膜放置在厚度mm之玻璃平板上,
再將直徑25 mm之不鏽塗布棒平行地放置在PET膜上,使其 與PET膜間之間隙為0· 7 mm。在進料塗布用膠漿時’將PET
313508.ptd 第19頁 583231 五、發明說明(16) 膜轉動並平,移動。以PET膜之形式塗布該膠漿。將該膜 在60 C之大氣及40%之濕度下靜置,以沉澱ppTA。在保持 其完整性下,將1〇〇 iPET膜及經沉積之芳族聚醯胺塗 布膜浸在離子交換水中,在流動之離子交換水中洗滌丨2 Q ^鉍。洗滌後PET膜被移除,僅有芳族聚醯胺塗布膜夾在 芳族聚醯胺氈中,將其推進直徑1〇〇〇mm之熱鼓中並於12q C乾燥5分鐘,以製造多孔膜。使用直徑15〇mm由金屬輥及 橡膠輥所組成之壓延輥以20kg/cm之線性壓力輥磨該膜。 所得多孔膜之厚度為53 // m,且空隙百分比為52% 。於2〇〇 至3 0 0 C之線性熱膨脹係數為-2 0 X 1 〇 -V °C。抗撕裂傳播性 為85g/mm及抗拉強度為2 kgf/mm2。 3)預浸材、印刷電路板及積層板用之基板之製造 (1)清漆之製備 將溶劑(甲基乙基酮,下文簡稱為MEK)添加至下述組 成物之混合物中。於備有回流橡膠管之3 0 0 m 1錐形甑中, 並在磁挽拌器挽拌下’將該混合物加熱回流9 〇分鐘而獲得 清漆。 清漆化合餌成物:(重量份) 主劑:素米環氧(Sumiepoxy) LDX-4120(住有化學股 份有限公司製造)100·〇 硬化劑: >氰二醯胺(DICY,東京 Kasei Κ_Κ·製 造)2· 7 觸媒:2-中基—4 -乙基咪嗤(Shikoku化學公司製 造)0· 2
583231 五、發明說明(17) (2 )預浸材之製造 將2)中製得之多孔膜切割成60mm寬度,在30 kg/cm之 線性壓力下以壓延輥輥磨而得3 5 // m之膜厚。將(1 )製得之 清漆塗布於該多孔膜二表面上。將該多孔膜夾在氟膜中 (商標名:Toyofron 50F,Toray工業公司製造)而使溶劑 於清漆浸潰期間不蒸發,且進一步可進行擠壓以使清漆分 佈均勻。1 0分鐘之後,以清漆均勻地浸潰多孔膜,然後攜 至玻璃布(產品名:YES-2101 ’ Nippon Sheet Glass Fiber K_ Κ·)上,於150 °C加熱3分鐘以去除溶劑,將環氧 樹脂半固化而製得預浸材。 (3)預浸材單體之硬化及銅箔積層板之硬化及物理性質測 定 將上述4 )中之預浸材置於隔離器之4 5 // m間隙中,並 以鐵氟龍(Te f 1 on )片夾住,然後於1 6 0 °C加壓硬化。再以 厚度1 2 // m之銅箔夾住該預浸材,然後於1 6 0 加壓硬 化。預浸材單體經硬化之材料之線性熱膨脹係數為丨9χ 106/C。銅、冶剝離強度為ι·〇 kg/cm。 實施例2 以實施例1中之2)之相同方法製造多孔對位芳族聚醯 胺膜’但於2)中使用3 · 〇克之芳族聚醯胺細微粒子,且塗 布棒與PET膜間之間隙為〇· 8min。所得多孔膜之厚度為49 // m及空隙百分比為61% 。於2〇〇至3〇(rc之線性熱膨脹係 數為-2 0x 1 0_V°C。抗撕裂傳播性為7〇g/mm及抗拉強度為3 kgf/mm2。所得多孔膜經目視觀察為均勻膜。以實例1中3)
313508.ptd 第21頁 583231 五、發明說明(18) 之方法獲得預浸材。單獨預浸材經硬化之材料之線性熱膨 脹係數為1 9 X 1 〇 -6/。 比較你L1 於實施例1之2 )中使用〇. 6克之芳族聚醯胺漿狀物 (Twaron TW- 1 0 9 7,Nippon Aramid Κ· K·製造,縱橫比為 1〇〇),發現塗布用膠漿之黏度增加。雖然在棒與ρΕτ膜間 之間隙為1. 1 mm的情形下進行塗布,但由於缺乏流動性而 無法獲得塗膜層。 以實施例1中之2)之相同方法製造多孔對位芳族聚醯 膜,但使用0.3克之芳族聚醯胺漿狀物(Twar〇n TW- 1 0 9 7,NiPP0n Aramid κ. κ.製造), =隙為丨及不進行輥磨。然而,於ppTf之與冗積二1 沉積壓縮作用而使塗層膜破裂。自冑良部分取樣的 夕孔膜之厚度為5U m ’且空隙百分比為62% 。於至 :二之線性熱膨脹係數為—20x 1〇_6/t。抗撕裂傳播性為 g/mm。所得多孔膜經目視觀察為均句膜。以實施例^ 3 )之方法獲得預浸材。單猶箱、、* # ^ 早獨預次材經硬化之材料之線性熱 略脹係數為1 9 X 1 0 -6/ °C。 ⑴)之相同方法製造多孔對位芳
Ur吏芳族聚酿胺細微粒子,塗布棒與PET膜間之 = ί = Γ及不進:輥磨。然而於PPTA之沉積程序中由 、儿積壓縮作用而使塗層膜破裂。從優良部分取樣的多孔
313508.ptd 第22頁 583231 五、發明說明(19)
膜之厚度為45/zm,且空隙百分比為41% 。於200至300 °C 之線性熱膨脹係數為-2Ox 10。抗撕裂傳播性為10 g/mm,且抗拉強度為8kgf/mm2。所得多孔膜經目視觀察為 均勻膜。以實施例1中3 )之方法獲得預浸材。單獨預浸材 &硬化之材料之線性熱膨脹係數為1 9x 1 0_6/°C。 現 '於實施例1之2)使用3 〇克之芳族聚酿胺細微粒子’發 隙Ϊ布用膠漿之黏度增加。雖然在塗布棒與PET膜間之間 獲得0塗L =的情形下進行塗布,但由於缺乏流動性而無法 示出供T種多孔對位取代之芳族聚醯胺膜,其顯 之性質。、> 几撕裂傳播性,並具有f輕及低線性膨脹係數 使用ί預ί;適Γ乍為預浸材。進一,,本發明提供-種 &馆/¾材之印刷電路板用之基板。
583231 圖式簡單說明 本案無圖示 313508.ptd 第24頁 1·^ 4,雖1卿1ί 公告本 7丄年昝月2丄曰 修正 案號:91105692 頰別: -二----—- -—Vik, ^iLny,.t ^°s<y〇z
發明專利說明書 583231 _ 中文 多孔對位取代之芳族聚醯胺膜與製造該膜之方法以及預浸材 、 發明名稱 英文 POROUS PARA-ORIENTED AROMATIC POLYAMIDE FILM, METHOD OF PRODUCING SAME, AND PREPREG 姓名 (中文) 1. 篠原泰雄 2. 南橋^ 二 發明人 姓名 (英文) 1. YASU0 SHINOHARA 2. TSUT0MU TAKAHASHI 國籍 1·曰本2.曰本 住、居所 L月+國荠城縣新治郡新治村大畑1510-144 1510-144,Ohbatake, Nnhari~mura, Niihari-gun, Ibaraki, JAPAN 2 ^本國茨城縣筑波郡谷和原村絹之台5—2-6 5-2-6,Kinunodai, Yawara-mura, Tsukuba-gun, Ibaraki, JAPAN 姓名 1.住友化學工業股份有限公司 姓名 (名稱) C英文) 1.SUMITOMO CHEMICAL COMPANY LTD. 三 申請人 國署""" _ —----- Γ曰本 ~— 住、居所 (事務所) 1. j本國大阪市中央區北濱4丁目5番33號5一33,Kitahama 4-chome, Chuo-ku, Osaka, JAPAN 代表人 姓名 (中文) 1.米倉弘昌 代表人 姓名 (英文) 1.HIR0MASA YONEKURA
313508修正版.ptc 第1頁 2003. 04. 24. 001
Claims (1)
- ^^231 ^^231修正 曰 申請專利藏® 1二^m^iizzzzinr ^ 夂二-- 位=夕孔對位取代之芳族聚酸胺膜’以10 0重量份之對 自r ^ ^芳族聚醯胺計,該膜含有1 0至4 0 0重量份由選 群2芳知聚醯胺、芳族聚酯及芳族雜環聚合物而成的 下呈之耐熱性樹脂所組成之細微粒子且於2 0 0至3 0 (TC 數具有—5〇X 10,°C至+50x ΙΟ-Vt:之線性熱膨脹係 ^申1專利範圍第丨項之多孔對位取代之芳族聚醯胺 笈中,該對位取代之芳族聚醯胺為聚(對伸笨基 胺$ Γ酿胺)、聚(對苯甲醯胺)、聚(4, 4,-笨醯替土笨 酿胺甲酿胺)、聚(對伸笨基_4,4,—伸聯笨基二幾 〜對伸笑^對伸笨基—2,6—伸萘基二羧醯胺)、聚(2-氯 伸絮发基對笨二甲酸胺)或對伸苯基二胺/2, 6〜二氣對 I ί ί二胺i對笨二甲醯氣之共聚物。 膜,^ ί利範圍第1項之多孔對位取代之芳族聚醯胺 _ ^生’空隙百分比為30至95% 〇 中 L & 士申凊專利範圍第1項之多孔對位取代之矣# 聚醯胺獏之 f八之方族 (c): 万法,其中’該方法包括下列步驟(a)至 2.8cU/g<H’自含有0.1至10重量%具固有黏度1.0至 金屬氣化物取之芳族聚醯胺、1至1〇重量%之驗 熱性樹脂所^ Ϊ金屬氣化物以及10至40 0重量份由耐 計)於極性二Ϊ之細微粒子(以100重量份之該聚醯胺 狀材料;®"胺溶劑或極性尿素溶劑中之溶液形成膜313508修正版.ptc 2003. 04. 24. 025 583231 _案號91105692 年¥月7^日 修正_ 六、申請專利範圍 步驟(b ),自步驟(a )所得之該膜狀材料沉積對位 取代之芳族聚醯胺;以及 步驟(c ),將步驟(b )所得具有沉澱之對位取代之 芳族聚醯胺之膜狀材料浸潰於水溶液或醇溶液中,洗 提溶劑及驗金屬氯化物或驗土金屬氯化物,然後乾燥 以獲得多孔對位取代之芳族聚醯胺膜。 5. —種預浸材,其係以熱塑性樹脂及/或熱固性樹脂浸潰 如申請專利範圍第1項之多孔對位取代之芳族聚醯胺膜 而得。 6. 如申請專利範圍第5項之預浸材,其中,該熱塑性樹脂 為聚醚楓、聚楓、聚醚醯亞胺、聚硫醚楓、聚碳酸 酯、聚醯亞胺、聚醯胺醯亞胺或聚醚酮。 7. 如申請專利範圍第5項之預浸材,其中,該熱固性樹脂 為環氧樹脂、雙馬來醯亞胺-三畊樹脂、聚醯亞胺樹 月旨、苯二曱酸二烯丙酯、不飽和聚酯樹酯、氰酸酯樹 酯或芳基改質之聚伸苯基醚樹脂。 8. 如申請專利範圍第5項之預浸材,其係用以製備印刷電 路板用之基板者。313508修正版.ptc 第2頁 2003. 04. 24. 026
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TW583231B true TW583231B (en) | 2004-04-11 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW091105692A TW583231B (en) | 2001-03-30 | 2002-03-25 | Porous para-oriented aromatic polyamide film, method of producing same, and prepreg |
Country Status (7)
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US (1) | US6642282B2 (zh) |
EP (1) | EP1245621B1 (zh) |
JP (1) | JP2002293979A (zh) |
KR (1) | KR100863143B1 (zh) |
CA (1) | CA2379454A1 (zh) |
DE (1) | DE60214268T2 (zh) |
TW (1) | TW583231B (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4287622B2 (ja) * | 2002-06-28 | 2009-07-01 | デュポン帝人アドバンスドペーパー株式会社 | コーティングセパレータ、その製造方法およびそれを用いた電気電子部品 |
JP4377911B2 (ja) * | 2004-04-16 | 2009-12-02 | 三菱製紙株式会社 | 電気化学素子用セパレータ |
US20060019110A1 (en) * | 2004-06-30 | 2006-01-26 | Sumitomo Chemical Company, Limited | Films |
JP4971655B2 (ja) * | 2006-03-22 | 2012-07-11 | 帝人テクノプロダクツ株式会社 | メタ型全芳香族ポリアミド溶液の製造法 |
CA2683482A1 (en) * | 2007-04-05 | 2008-10-16 | Teijin Aramid B.V. | Foam of polymers |
JP2017098239A (ja) * | 2015-11-13 | 2017-06-01 | 住友化学株式会社 | 非水電解液二次電池のセパレータ用の多孔質層、非水電解液二次電池用積層セパレータ |
CN109148790A (zh) * | 2017-06-28 | 2019-01-04 | 微宏动力系统(湖州)有限公司 | 一种多孔隔膜、制备方法及锂电池 |
CN109161161A (zh) * | 2018-08-10 | 2019-01-08 | 江苏恒神股份有限公司 | 一种高韧性非热压罐固化预浸料的生产工艺 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100212121B1 (ko) * | 1991-07-02 | 1999-08-02 | 미리암 디. 메코너헤이 | 피브리드 중점제 |
MX9204769A (es) | 1991-08-20 | 1993-02-01 | Du Pont | Material compuesto para empaquetaduras y proceso para su fabricacion. |
JPH05327148A (ja) | 1992-05-23 | 1993-12-10 | Toshiba Chem Corp | プリント回路用積層板 |
US5314742A (en) | 1993-03-31 | 1994-05-24 | E. I. Du Pont De Nemours And Company | Resin impregnated laminate for wiring board applications |
EP0645950B1 (en) | 1993-09-21 | 1998-09-02 | Matsushita Electric Industrial Co., Ltd. | Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same |
JP3665383B2 (ja) | 1995-05-12 | 2005-06-29 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 樹脂組成物 |
TW381105B (en) | 1995-07-18 | 2000-02-01 | Sumitomo Chemical Co | Para-oriented aromatic polyamide porous film |
EP0768334B1 (en) | 1995-10-16 | 2004-02-18 | Sumitomo Chemical Company Limited | Prepreg, process for producing the same and printed circuit substrate using the same |
JPH10338809A (ja) * | 1997-04-08 | 1998-12-22 | Sumitomo Chem Co Ltd | 低誘電率樹脂とパラ配向芳香族ポリアミドとからなる複合フィルム、そのプリプレグおよびそれらの用途 |
TW515812B (en) | 1997-04-08 | 2003-01-01 | Sumitomo Chemical Co | Composite film made from low dielectric constant resin and para-oriented aromatic polyamide |
JP4051744B2 (ja) * | 1997-04-08 | 2008-02-27 | 住友化学株式会社 | 多孔質パラ配向芳香族ポリアミドフィルム、そのプリプレグならびにプリプレグを使用するプリント回路用基材およびプリント回路用積層板 |
JP3787447B2 (ja) * | 1998-12-18 | 2006-06-21 | 株式会社カネカ | 生分解性を有する発泡性樹脂組成物 |
-
2001
- 2001-03-30 JP JP2001100622A patent/JP2002293979A/ja active Pending
-
2002
- 2002-03-25 US US10/103,886 patent/US6642282B2/en not_active Expired - Fee Related
- 2002-03-25 TW TW091105692A patent/TW583231B/zh not_active IP Right Cessation
- 2002-03-27 CA CA002379454A patent/CA2379454A1/en not_active Abandoned
- 2002-03-27 KR KR1020020016773A patent/KR100863143B1/ko not_active IP Right Cessation
- 2002-03-28 EP EP02007263A patent/EP1245621B1/en not_active Expired - Fee Related
- 2002-03-28 DE DE60214268T patent/DE60214268T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1245621A1 (en) | 2002-10-02 |
US6642282B2 (en) | 2003-11-04 |
EP1245621B1 (en) | 2006-08-30 |
CA2379454A1 (en) | 2002-09-30 |
US20020156140A1 (en) | 2002-10-24 |
KR100863143B1 (ko) | 2008-10-14 |
JP2002293979A (ja) | 2002-10-09 |
DE60214268T2 (de) | 2007-08-30 |
DE60214268D1 (de) | 2006-10-12 |
KR20020077155A (ko) | 2002-10-11 |
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