TW575576B - Purification of methylsilanes - Google Patents
Purification of methylsilanes Download PDFInfo
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- TW575576B TW575576B TW90123149A TW90123149A TW575576B TW 575576 B TW575576 B TW 575576B TW 90123149 A TW90123149 A TW 90123149A TW 90123149 A TW90123149 A TW 90123149A TW 575576 B TW575576 B TW 575576B
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- UIUXUFNYAYAMOE-UHFFFAOYSA-N methylsilane Chemical class [SiH3]C UIUXUFNYAYAMOE-UHFFFAOYSA-N 0.000 title claims description 22
- 238000000746 purification Methods 0.000 title description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 19
- 238000001179 sorption measurement Methods 0.000 claims description 18
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 12
- 229910052757 nitrogen Inorganic materials 0.000 claims description 12
- 239000012535 impurity Substances 0.000 claims description 10
- 239000001307 helium Substances 0.000 claims description 8
- 229910052734 helium Inorganic materials 0.000 claims description 8
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 8
- 239000003463 adsorbent Substances 0.000 claims description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 5
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 5
- 239000001569 carbon dioxide Substances 0.000 claims description 5
- 239000001257 hydrogen Substances 0.000 claims description 5
- 229910052739 hydrogen Inorganic materials 0.000 claims description 5
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims description 5
- 239000001301 oxygen Substances 0.000 claims description 5
- 229910052760 oxygen Inorganic materials 0.000 claims description 5
- 229910000077 silane Inorganic materials 0.000 claims description 5
- 239000004575 stone Substances 0.000 claims description 5
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 4
- 229910021536 Zeolite Inorganic materials 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical compound Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 claims description 3
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 claims description 3
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 claims description 3
- 239000000391 magnesium silicate Substances 0.000 claims description 3
- 229910052919 magnesium silicate Inorganic materials 0.000 claims description 3
- 235000019792 magnesium silicate Nutrition 0.000 claims description 3
- 239000002808 molecular sieve Substances 0.000 claims description 3
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 claims description 3
- 239000010457 zeolite Substances 0.000 claims description 3
- 239000005046 Chlorosilane Substances 0.000 claims description 2
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- 239000000499 gel Substances 0.000 claims description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims 4
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 239000000741 silica gel Substances 0.000 claims 1
- 229910002027 silica gel Inorganic materials 0.000 claims 1
- 239000002893 slag Substances 0.000 claims 1
- 239000007789 gas Substances 0.000 description 7
- 229910001220 stainless steel Inorganic materials 0.000 description 7
- 239000010935 stainless steel Substances 0.000 description 7
- 238000002955 isolation Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 239000000523 sample Substances 0.000 description 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 235000011089 carbon dioxide Nutrition 0.000 description 2
- NEHMKBQYUWJMIP-UHFFFAOYSA-N chloromethane Chemical compound ClC NEHMKBQYUWJMIP-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004821 distillation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- -1 silylmethylene compounds Chemical class 0.000 description 2
- NWLGCJLMUWJWRC-UHFFFAOYSA-N CC.O=C=O Chemical compound CC.O=C=O NWLGCJLMUWJWRC-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- MAKHEZDWXTXCPD-UHFFFAOYSA-N [Re]C Chemical compound [Re]C MAKHEZDWXTXCPD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000008280 chlorinated hydrocarbons Chemical class 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- UBHZUDXTHNMNLD-UHFFFAOYSA-N dimethylsilane Chemical compound C[SiH2]C UBHZUDXTHNMNLD-UHFFFAOYSA-N 0.000 description 1
- PZPGRFITIJYNEJ-UHFFFAOYSA-N disilane Chemical compound [SiH3][SiH3] PZPGRFITIJYNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 235000019441 ethanol Nutrition 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229940050176 methyl chloride Drugs 0.000 description 1
- NCWQJOGVLLNWEO-UHFFFAOYSA-N methylsilicon Chemical compound [Si]C NCWQJOGVLLNWEO-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 229920000548 poly(silane) polymer Polymers 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010189 synthetic method Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/20—Purification, separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/02—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography
- B01D53/04—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography with stationary adsorbents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J20/00—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof
- B01J20/02—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material
- B01J20/10—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material comprising silica or silicate
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0803—Compounds with Si-C or Si-Si linkages
- C07F7/0805—Compounds with Si-C or Si-Si linkages comprising only Si, C or H atoms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2253/00—Adsorbents used in seperation treatment of gases and vapours
- B01D2253/10—Inorganic adsorbents
- B01D2253/106—Silica or silicates
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Inorganic Chemistry (AREA)
- Silicon Compounds (AREA)
- Separation Of Gases By Adsorption (AREA)
Description
575576 A7 B7 五、發明説明(1 ) 發明領域 本發明係關於一種純化甲基矽烷之方法。更特定言之, 本發明係透過低溫吸附技術,以提供純化且冷凝之甲基矽 燒氣體。 發明背景 於半導體工業中,有機矽氣體係用以作爲塗膜及薄膜, 尤其是甲基矽烷。製造甲基矽烷之典型製程係稱爲’’直接 製程π。此爲甲基氯化物與矽於銅催化劑存在下之反應。 然而,來自反應器之流出物仍爲甲基矽烷與高沸點物質之 混合物,其中該高沸點物質諸如爲二矽烷、聚矽烷、矽基 亞甲基化物及其類似物。此流出物之後須經蒸餾,以分離 甲基矽烷與其他存在之矽烷。 另外,此等合成方法亦導致產生烯烴性及氯化烴。此等 個別種類會使前述蒸餾製程產生分離問題,以及產生關於 所得產物顏色及穩定性之問題。 於典型之甲基矽烷氣體試樣中,可能發現多種雜質,此 點會干擾甲基矽烷於半導體製造及加工上之使用。此等雜 質例如包括氫、氮、氦、氧、甲燒、乙燒、二氧化碳、秒 烷、氯基矽烷及二甲基矽烷。 申請人等已發現,相較於諸如蒸餾之製程,使用低溫吸 附製程可更佳地移除雜質,特別是氣基矽烷及二氧化碳。 發明概述 本發明係提供一種純化甲基矽烷之方法。該方法提供下 述步驟:供給含雜質之甲基矽燒來源;將該甲基石夕燒導向 -4- 本紙張尺度適用中國國家標準(CNS) Α4規格(210X297公釐) 575576 A7 B7 五、發明説明(2 ) 用以吸附及脱氣之吸附容器;以及將經純化之甲基矽烷導 向收集容器。 該吸附容器係含適當之吸附劑如矽酸鎂,且係維持於約 -4 0 °C之溫度下。 於甲基矽烷中所發現之典型雜質爲氫、氮、氦、氧、甲 院、乙燒、二氧化碳、石夕燒、氣基石夕燒及二甲基石夕燒。 圖式簡單説明 圖1爲用以純化甲基石夕燒之系統之概略示意圖。 發明詳述 圖1爲純化系統1 0之整體概略示意圖。容器1 2包含待純 化之甲基矽烷。一般而言,其爲圓筒及閥之排置,係接繫 至管線1 3,並經由1 3連接至隔離閥1 4。 係由谷器1 5將氛供應至該系統。氦可爲任一等級,可對 沖洗系統產生有效助益即可,例如等級6。一般而言,容 器1 5爲圓筒及調節閥,其係經由管線1 6連接至入口閥 1 7 °管線1 8及1 9分別使閥1 7及1 4連接至閥2 0,其爲吸 附單元22之入口閥。 入口閥2 0係經由管線2 1接繫至吸附單元2 2。該管線可 直接連接至吸附單元,或可於連接至該單元,以螺旋方式 纏繞該單元。吸附單元22 —般係由不鏽鋼所製成,且包 含適s之吸附劑。代表性之例示包括矽酸鎂(化學 公司市售之Florosil)、鋁氧、寥凝膠、分子篩、及沸石, 但並不限定於此等。係藉由容器24,使吸附單元維持於 約-2 0 C至約-4 0 C炙溫度下,較佳爲_ 4 〇χ:之溫度。該 -5- 575576 A7 B7 五、發明説明 谷器一般爲可容納液態氮之不鏽鋼眞空絕熱瓶。 官線2 8係將具出口隔離閥2 6之吸附單元連接至管線 3 1 ’其係接繫至壓力表3 〇。經純化之甲基矽烷係經由管 線2 8移動至管線3 1、再至隔離閥3 2其係連接至甲基矽烷 接收單元35。此單元一般爲可含氣體之圓筒。該接收單 兀係於可容納液態氮之不鏽鋼容器3 3中。該接收單元一 般係維持於約-17〇°C至約-190°C之溫度下,較佳爲約490 C之溫度。 官線2 8係經由閥4 〇而另外連接至管線3 9,並另外連接 至管線3 6。管線3 6係與電容壓力計眞空儀表。經由高度 眞空隔離閥3 7,管線3 9係延伸至管線3 8,其係接繫至眞 立系統4 1。該眞空系統爲渦輪分子眞空泵/隔膜襯墊泵系 統,其係經由管線4 2排氣。 管線2 8另外連接至眞空細腰管隔離閥3 4,其係導向眞 空細腰管5 4,其係使用經由管線5 2所傳送之氮氣。管線 5 0係將洗務系統連接至細腰管。 一般而言,此系統之構成材料係可操縱且可成形,並可 耐受該系統所經歷之稍大溫度變化。此材料可爲不鏽鋼, 但亦可有部分爲玻璃。 於本發明之一具體實例中,係首先確認以上所述及圖i 所示系統之眞空完善度。於步驟1中,關閉所有的閥14、 17、20、26、30、32、34、4~0及37,啓動眞空系統, 且使其運轉3 0分鐘。於步驟2中,係開啓閥37,且發動電 容壓力計儀表43。於步驟3中,係使該儀表暖機3〇分鐘。 -6 - 本紙張尺度適用中國國家標準(CNS) Α4規格(210 χ 297公釐) 575576 A7 B7 五、發明説明
裝 於步驟4中,甲基矽烷之來源圓筒i 2之閥係關閉,而接 繫至歧管閥.14。於步驟5中,氦圓筒1 5之閥係關閉,而接 繫至閥1 7。於步驟6中,接收圓筒3 5係接繫至歧管間 3 2,且開啓該圓筒。於3 〇分鐘後,係藉由開啓閥$ 〇、 2 6、2 0、1 7及1 9,並保持閥3 4於關閉狀態,以進行步 驟7。步驟8係使歧管系統排空,以達穩定之壓力讀値。 於步驟9中,係關閉閥37,並檢查壓力計儀表43之洩漏情 形。最後於步驟1 0中,係以等級6之氦沖洗整個系統i 〇共 1 0次至達到1〇〇 psig,維持於此壓力下達3 〇分鐘,繼而進 行眞空排空,以達低壓之穩定讀値。 一旦該系統之沖洗及排空狀況符合要求,則可開始純化 程序。首先,於不鏽鋼細腰管中,使用德利蒙尼 (delimonene ) /乾冰浴,以使來源圓筒! 2冷卻至-4〇 t。其 次,於不鏽鋼細腰管2 4中,以德利蒙尼(delimonene ) /乾 冰浴,使吸收容器2 2冷卻至-4 0 Ό。然後,使用不鏽鋼細 腰管3 3中之液態氮,以使接收圓筒3 5冷卻至-19〇°C。係 使用熱電偶及儀表進行所有之溫度測量,彼等並未圖示於 圖1中。 於步驟4中,係藉由開啓閥1 4、4 0及3 7,並保持來源 圓筒1 2與閥1 7及3 4於關閉狀態,以確保歧管系統之眞空 完善度。其次,係關閉閥4 0及3 7,並以於3 0測量之壓 力,緩緩開啓該來源圓筒。 - 若液態氮沸騰,表示氣體係自來源圓筒流經吸附容器, 而集中於接收圓筒中。於沸騰結束後,係自來源圓筒移出 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) 575576 A7 B7
五、發明説明(5 冷卻浴,並升溫該圓筒至室溫。然後, 來源圓筒,直到不再觀臾到央、、 σ,、以熱槍加溫 止。 Τ再觀察到來源圓筒中有液態氮潍騰爲 於此階段中,純化轉移係已完 3 2,移去至氮細腰管之管哼, 立丁 7車。關閉閥 段g I s、.泉,關閉來源圓 34,以使歧管經由管線5G排放至絲器。—旦來 升溫至室溫,則關閉閥32,並移出該來源圓筒,並:: 分析。·然後可如前所述,沖洗並排空整個系统。 、 對一市售之甲基㈣試樣料上述程序。經由氣能 術測量法,測定購得之試樣具有如幻所示之下述”曰: 含量(ppm、 50 0.70 <0.5 0.13 0.96 1.92 <0.5 6.5 成份 氫 氮 氬及氧 甲烷 乙烷 二氧化碳 矽烷 氯基碎燒 二曱基矽烷 — 於運轉該純化方法一次後,甲-基矽烷試樣係具有如表工工 所示之下述污染物量: -8 - 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐)
Claims (1)
- 575576 第〇9〇123丨49號專利申請案92. ι as 中文申請專利範圍替換本(92年9月)CS ^、申請專科||圍 公告本 1· 一種移除甲基矽烷中雜質之方法,其係包含下述步驟: 供給含雜質之甲基矽烷來源;將該甲基矽烷加入吸附單 元,以及將經純化之甲基石夕燒^收集於收集單元中。 2·根據申請專利範圍第1項之方法,其中該吸附單元係含 一吸附劑’其係選自碎酸錢、氧、碎凝膠、分子篩、 及沸石所成之群。 3.根據申請專利範圍第1項之方法,其中該雜質係選自 氫、氮、氦、氧、甲烷、乙烷、二氧化碳、矽烷、氯基 碎坑及二甲基石夕燒所成之群。 4·根據申請專利範圍第1項之方法,其中該甲基矽烷來源 及該吸附單元係於-40°C之溫度下。 5·根據申請專利範圍第1項之方法,其中該收集單元係於 -170°C至-190°C之溫度下。 6· —種純化甲基矽烷之方法,其係包含將含雜質之甲基硬 烷加入含吸附劑之吸附單元中。 7·根據申請專利範圍第6項之方法,其中該吸附劑係選自 矽酸鎂、鋁氧、矽凝膠、分子篩、及沸石所組之群。 8·根據申請專利範圍第6項之方法,其中該雜質係選自 氫、氮、氦、氧、甲烷、乙烷、二氧化碳、矽烷、氯基 矽烷及二f基矽烷所成之群。 9. 根據申請專利範圍第6項之方法,其中該吸附單元係於 -20°C至-40°C之溫度下。 10. 根據申請專利範圍第6項之方法,其中係於引入該甲基 矽烷前,以氦氣沖洗該吸附單元。 本紙張尺度適用中國國家標準(CNS) A4规格(21〇X 297公釐)
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US20050054211A1 (en) * | 2003-09-04 | 2005-03-10 | Mindi Xu | Purification of silicon-containing materials |
DE102004030737A1 (de) * | 2004-06-25 | 2006-01-12 | Degussa Ag | Verfahren und Vorrichtung zur Extraktion von Stoffen aus silanmodifizierten Füllstoffen |
US7306652B2 (en) * | 2005-03-30 | 2007-12-11 | Parker-Hannifin Corporation | Siloxane removal process |
JP5861491B2 (ja) * | 2012-02-21 | 2016-02-16 | セントラル硝子株式会社 | トリメチルシランの精製方法 |
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US4099936A (en) * | 1976-12-16 | 1978-07-11 | Union Carbide Corporation | Process for the purification of silane |
IT1088820B (it) * | 1977-12-05 | 1985-06-10 | Smiel Spa | Processo di purificazione di clorosilani impiegabili nella preparazione di silicio per elettronica |
JPS59110697A (ja) | 1982-12-17 | 1984-06-26 | Shin Etsu Chem Co Ltd | メチルハイドロジエンシラン類の製造方法 |
US4554141A (en) * | 1984-05-14 | 1985-11-19 | Ethyl Corporation | Gas stream purification |
FR2622564B1 (fr) * | 1987-10-28 | 1990-02-02 | Rhone Poulenc Chimie | Procede de purification de silane |
US4774347A (en) | 1988-02-29 | 1988-09-27 | Dow Corning Corporation | Removal of chlorinated hydrocarbons from alkylsilanes |
DE3843313A1 (de) * | 1988-12-22 | 1990-06-28 | Wacker Chemitronic | Verfahren zur entfernung von gasfoermigen kontaminierenden, insbesondere dotierstoffverbindungen aus halogensilanverbindungen enthaltenden traegergasen |
US4985580A (en) | 1990-03-12 | 1991-01-15 | Dow Corning Corporation | Alkylation of silanes |
US5206004A (en) * | 1990-04-30 | 1993-04-27 | Ethyl Corporation | Silane compositions and process |
US5290342A (en) * | 1990-12-05 | 1994-03-01 | Ethyl Corporation | Silane compositions and process |
US5493043A (en) | 1995-05-15 | 1996-02-20 | Dow Corning Corporation | Method for redistribution and purification of methylsilanes |
US5493042A (en) | 1995-06-15 | 1996-02-20 | Dow Corning Corporation | Process for removing silanes from by-product stream |
US5916245A (en) * | 1996-05-20 | 1999-06-29 | Advanced Technology Materials, Inc. | High capacity gas storage and dispensing system |
JPH101483A (ja) | 1996-06-13 | 1998-01-06 | Dow Corning Asia Ltd | アリルシラン化合物の製造方法 |
JP3362632B2 (ja) * | 1997-03-26 | 2003-01-07 | 信越化学工業株式会社 | シラン類含有ガスの処理方法 |
US6027547A (en) * | 1997-05-16 | 2000-02-22 | Advanced Technology Materials, Inc. | Fluid storage and dispensing vessel with modified high surface area solid as fluid storage medium |
US5980608A (en) * | 1998-01-07 | 1999-11-09 | Advanced Technology Materials, Inc. | Throughflow gas storage and dispensing system |
JP3582983B2 (ja) * | 1998-04-21 | 2004-10-27 | 三井化学株式会社 | アルキルシラン類の精製方法 |
JP2000095784A (ja) * | 1998-09-25 | 2000-04-04 | Mitsui Chemicals Inc | メチルシランの精製方法 |
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- 2001-09-18 KR KR1020010057592A patent/KR20020022588A/ko not_active Application Discontinuation
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- 2001-09-19 JP JP2001284326A patent/JP2002179689A/ja active Pending
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JP2002179689A (ja) | 2002-06-26 |
EP1188759A3 (en) | 2003-12-10 |
SG106636A1 (en) | 2004-10-29 |
EP1188759A2 (en) | 2002-03-20 |
KR20020022588A (ko) | 2002-03-27 |
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