TW565899B - Substrate for mounting electronic component, and method of removing warpage from substrate for mounting electronic component - Google Patents

Substrate for mounting electronic component, and method of removing warpage from substrate for mounting electronic component Download PDF

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Publication number
TW565899B
TW565899B TW91119944A TW91119944A TW565899B TW 565899 B TW565899 B TW 565899B TW 91119944 A TW91119944 A TW 91119944A TW 91119944 A TW91119944 A TW 91119944A TW 565899 B TW565899 B TW 565899B
Authority
TW
Taiwan
Prior art keywords
substrate
protective film
electronic component
adhesive layer
scope
Prior art date
Application number
TW91119944A
Other languages
English (en)
Chinese (zh)
Inventor
Hiroaki Kurihara
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Application granted granted Critical
Publication of TW565899B publication Critical patent/TW565899B/zh

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Structure Of Printed Boards (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
TW91119944A 2001-09-10 2002-09-02 Substrate for mounting electronic component, and method of removing warpage from substrate for mounting electronic component TW565899B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001274225A JP3827201B2 (ja) 2001-09-10 2001-09-10 電子部品実装用基板及び電子部品実装用基板の製造方法

Publications (1)

Publication Number Publication Date
TW565899B true TW565899B (en) 2003-12-11

Family

ID=19099306

Family Applications (1)

Application Number Title Priority Date Filing Date
TW91119944A TW565899B (en) 2001-09-10 2002-09-02 Substrate for mounting electronic component, and method of removing warpage from substrate for mounting electronic component

Country Status (3)

Country Link
JP (1) JP3827201B2 (ko)
KR (1) KR20030022703A (ko)
TW (1) TW565899B (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003282649A (ja) * 2002-03-27 2003-10-03 Shindo Denshi Kogyo Kk テープキャリアおよびその製造方法、テープキャリアへの電子部品の実装方法、ならびにテープキャリアパッケージの製造方法
KR101070905B1 (ko) 2004-08-21 2011-10-06 삼성테크윈 주식회사 반도체 패키지용 기판모재 및 이로부터 형성된 단위기판
JP5502647B2 (ja) * 2010-08-06 2014-05-28 日東電工株式会社 配線回路基板集合体シートおよびその製造方法
JP6791531B2 (ja) * 2016-04-27 2020-11-25 住友電工プリントサーキット株式会社 フレキシブルプリント配線板

Also Published As

Publication number Publication date
KR20030022703A (ko) 2003-03-17
JP2003086732A (ja) 2003-03-20
JP3827201B2 (ja) 2006-09-27

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GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees