TW565899B - Substrate for mounting electronic component, and method of removing warpage from substrate for mounting electronic component - Google Patents

Abstract

To provide a substrate for mounting an electronic component and a method of removing warpage from the substrate for mounting an electronic component, which easily and effectively remove warpage along the longitudinal direction of the substrate. A substrate for mounting an electronic component includes at least a film-like insulating base material and a wiring pattern formed on one side of the insulating base material. A bonding layer for mounting an electronic component and a protective film 20 adhering to the bonding layer are layered on the other side of the insulating base material. A plurality of slits 22 extending along the width direction are formed in the protective film 20 to be arranged along the longitudinal direction.

Description

565899 V. Description of the invention (1) The technical field to which the invention belongs ^-The present invention relates to the method of removing electronic parts used in mounting electronic parts = a method of removing the substrate for mounting electronic parts. CSP (Chip Size Package), BGA (BaU Grid Array: Ball Grid Array Package), \ 咄 以 (# -Bal 1 Grid Array ·· //-Ball Grid Array Package Jealousy), FC (Flip Chip: flip chip), QFP (Quad Flatpac ^ ackage: Four-sided corner surface-mount package) have approximately the same size of the electronics assembly (hereinafter, only referred to as "electronic parts" "Board for mounting") and a method for removing warpage of a printed circuit board for electronic parts. With the development of the electronics industry, the demand for printed circuit boards used to install electronic components such as Ic (Integrated Circuit), LSI (Large Integrated Circuit), etc. is rapidly increasing, and due to the demand for electronic equipment As a method for mounting such electronic components, TAB tape (tape automated bonding), T-BGA tape, and ASIC tape (special application) IC f (applicatin specific specific integrated circuit tape)) and so on. Especially as electronic parts become thinner, thinner and smaller, so that electronic parts can be mounted at a higher density, the reliability of electronic parts must be improved. Therefore, the size corresponding to the size of the mounting parts: The use of external connection terminals such as CSP, BGA, //-BGA, etc. on the substrate is increasing. And such an electronic component mounting substrate has a circuit pattern and a solder resist layer on the surface of the final film such as polyimide, and it accumulates on the back =, f, for women

C: \ 2D-C0DE \ 9l-ll \ 91119944.ptd Page 5 565899 V. Description of the invention (2) The adhesive layer for the electronic parts and the protective film for the adhesive layer. Problems to be Solved by the Invention However, in such a substrate for mounting electronic components, the protective film is attached to the substrate for mounting electronic components in a heated state while being given tension, and the protective film itself may Thermal shrinkage is a problem because the protective film surface of the insulating film is warped so as to become concave throughout the longitudinal direction. If such warping occurs, adverse effects will be caused in the mounting steps of the IC and the like, and further, problems such as disconnection of the wiring pattern formed on the insulating film will cause defective products, which is serious. problem. The present invention has been made in view of these circumstances, and it is an object of the present invention to provide a substrate for electronic component mounting and a method for removing warpage of a substrate for electronic component mounting which can easily and effectively remove warpage in a long direction. Means for solving the problem A first aspect of the present invention for solving the above-mentioned problem is a substrate for mounting electronic parts, which is provided with at least a thin-film insulating substrate and a substrate provided on a surface of the insulating substrate. In the circuit pattern, an adhesive layer for mounting electronic components and a protective film for the adhesive layer are provided on the back surface layer of the insulating substrate; the protective film is characterized in that a plurality of lines are arranged side by side along the longitudinal direction on the protective film. Cuts extending in the direction. In this first aspect, the curved surface in the long direction can be effectively removed by the cut portion. The second aspect of the present invention is the electronic component mounting substrate of the first aspect, in which the above-mentioned notch portions are each formed in such a manner that a portion in the width direction becomes a discontinuous discontinuous portion. Settings.

C: \ 2D-CODE \ 9Ml \ 91119944.ptd Page 6 565899 5. Description of the invention (3) In this second aspect, when the protective film is peeled off, the protective film will not become scattered, It can simplify the workability of the installation steps of electronic parts. A third aspect of the present invention is the electronic component mounting substrate in the first or second aspect, wherein the notch portion is provided so as to leave at least both ends in the width direction. In this third aspect, when the protective film is peeled off, the protective film does not become scattered, and the workability of the electronic component mounting operation procedure can be simplified. The fourth aspect of the present invention is the electronic component mounting substrate according to any one of the first to third aspects, wherein the notch portion is provided so as to penetrate deep into the adhesive layer through the protective film. In this fourth aspect, the warpage in the longitudinal direction of the electronic component mounting substrate can be removed more effectively. A fifth aspect of the present invention is a method for removing warpage of a substrate for mounting electronic parts, which is provided with at least a thin film-shaped insulating substrate, and a circuit pattern provided on a surface of the insulating substrate. The back surface layer of the base material includes an adhesive layer for mounting electronic components and a substrate for mounting electronic components for a protective film of the adhesive layer, to remove warpage; it is characterized in that the protective film A plurality of cutout portions are provided side by side in a width direction. In this fifth aspect, the surface curvature in the longitudinal direction of the electronic component mounting substrate can be effectively removed. The sixth aspect of the present invention, the fifth aspect of the substrate for mounting electronic parts

C: \ 2D-CODE \ 9Ml \ 91119944.ptd Page 7 565899 V. Description of the invention (4) The method of removing the curved line is to cut the above-mentioned notch so that it has a part in the width direction that becomes discontinuous. Discontinued. In this sixth aspect, the workability of the steps of mounting the electronic parts can be simplified. A seventh aspect of the present invention is a method for removing warpage of a substrate for mounting electronic parts according to the fifth or sixth aspect, wherein the notch portion is provided so as to leave at least both ends in the width direction. In this seventh aspect, the workability of the steps of mounting the electronic parts can be simplified. An eighth aspect of the present invention is a method for removing warpage of an electronic component mounting substrate according to any one of the fifth to seventh aspects, wherein the notch portion penetrates the protective film to a portion of the adhesive layer. Serving. In this eighth aspect, the warpage in the longitudinal direction of the electronic component mounting substrate can be effectively removed. The ninth aspect of the present invention is a method for removing warpage of a substrate for mounting electronic parts according to any one of the fifth to eighth aspects, and by providing the above-mentioned notch portion, the entire surface of the protective film can be removed. Warpage in the longitudinal direction of the concave surface is removed. In this ninth aspect, the warpage in the longitudinal direction of the electronic component mounting substrate can be removed, and the operation of the mounting step can be performed efficiently. Embodiments of the Invention Hereinafter, the method for removing warpage of the electronic component mounting substrate and the electronic component mounting substrate of the present invention will be described in detail. A plan view and a cross-sectional view of a substrate for mounting electronic components according to an embodiment of the present invention are shown in FIGS. 1 and 2.

C: \ 2D-CODB \ 9Ml \ 91119944.ptd Page 8 565899 ——— ^ ― ^ · ***** · V. Description of the invention (5) One site ΐΓΛΙ 'substrate for electronic component mounting 1G, "Number A continuous monument is formed on a band-shaped insulating film! on. This insulating film J is continuous in width and has chain-gear holes 2 and 4 for conveyance with spacers and constant intervals. The two sides are conveyed down. ’The electronic components are mounted, and Nongyi has a substrate 1 for mounting each electronic component. Cut off for the unit. In the width direction of the insulating film 1, there are provided two electronic component mounting substrates for mounting such electronic component mounting substrates. J G 土 1 〇 〇 The size of the electronic component insulation base = mounting and connection terminals on the side And the external connection terminal 14 is used to set a cut 15 of the circuit pattern 12 and the electrical position. 7 1 卞 Connect the component side connection terminals 13 and external connection terminals with 5 丨 wire bonding] 4 1 2 is covered with a solder resist layer I 6 "" λ Shangong; Zi Yingfang; a terminal hole is formed in the solder resist layer 16 of the external connection terminal 14] 7. < The resistance is Tan tin ball, which can be connected to the outer ring through the solder ball; Holes can be made through Fangfu Yaotian II and other substrates with solder balls. Μ Externally connected electronic components are used here as an insulating film. (Insulating substrate ⑴ and chemical resistance And heat-resistant materials: there are flexible materials, including poly-fermentation, poly-fermented amines, poly-imide = fully aromatic polyurea, which is the material skeleton of ^ bayan membrane 1. Second, with double-benzyl: Industrial production (stock)) is preferred. Also, 125 to 25 ~ 75 _ is preferred. It is 25, which is a line pattern 12 provided on the surface of 矣 & of the insulating film 1, and the component-side connection terminal C: \ 2D-C0DE \ 91-ll \ 9lll9944.ptd Page 9 V. Description of the invention (6) and external connection end ^ The body pattern is patterned and shaped:? It is usually made of steel or aluminum The thickness of the conductor box should be formed by repeated heating. Conduction is used as the conductor to sing 'two mouths A6: 7 ?:', preferably 8 ~ 35. M: The amount is also electrolytic copper ;: In addition, the second example is on the right of etching characteristics, operability, etc., plus application example 2. Polyfluorene :: Widely placed conductive foil on L ', and the “wide” formed by the conductive amine film. The driver ’s body can be made into polycondensate by baking: Ϊ: = the conductor 导电, which can be processed by photolithography, terminal 14. Case f] 2, the component-side connection terminal 13 and the external connection material are coated to make the photoresist formed by the second coating, and the photoresist is used as 1 | the cover * first and the shirt, and the patterning is performed) Remove the Λ '^ etching solution and chemically dissolve it (pattern of the conductor is patterned. Dissolve and remove the resist with an alkaline solution, etc., and apply the conductive test coating solder mask material to the field.疋 patterning process to form a solder resist layer: 未经 without solder resist layer! 6 Covered circuit pattern 丨 2, Yuan 13 J External connection terminal 14, usually applied with electroless plating 1 terminal 笪 1, Examples include tin plating, solder plating, gold plating, and nickel. For this purpose, zinc is selected by the method of mounting the electronic parts. For example, when plating is used to connect wires, nickel-gold is used. Electroplating is preferred. The material used to form the solder resist layer 16 is, for example, a slab material. 565899 V. Description of the invention (7) ------ Can be negative / positive, Anyone having the properties of ordinary photoresistance and conductive foils may be used. For example, it may be an acrylate type Resins, especially photosensitive resins such as epoxy acrylate resins, with photopolymerization initiator added. Examples of epoxy acrylate resins include bisphenol A type, acrylate resin, and phenolic epoxy acrylate resin. , Bisphenol A epoxy methacrylate resin, phenolic epoxy methacrylate resin, etc. As the solder resist layer 16, it can be applied only to the necessary area by screen printing technology and then applied. Its heat-curing general solder resist coating liquid. On the opposite side (back surface) of the insulating film provided with the circuit pattern 12, the component-side connection terminal 13, the external connection terminal 14, and the solder resist layer 16 as described above! The back surface) is provided with an adhesive layer 19 for temporarily fixing the mounted electronic parts, and a protective film 20 attached to the adhesive layer 丨 9. The adhesive layer 19 is preferably formed by using a thermosetting and elastic adhesive. The adhesive layer 19 can be formed by directly coating the back surface of the insulating film, or by using an adhesive tape. In addition, the adhesive layer 9 does not need to be provided in the entire area where the electronic parts are installed, but may be provided in only a part of the area. Fig. 3 shows an example of a method of bonding the protective film 20 to the back surface of the insulating film. As shown in FIG. 3, this side ④ 'uses an adhesive tape with protective films 20 and 20a laminated on both sides of the adhesive layer 19, and is attached to the insulating film} The protective film is laminated with the adhesive layer 19 on the side 2 〇 method. Specifically, as shown in FIG. 3, the protective film 2 0a of the adhesive tape 21, which was rolled out from the unwinding roller 30, was peeled off through the guide 31. Next, the adhesive layer 19 and the protective film 20, which have been peeled off from the protective film 20a, and the transported insulating film 'are passed through the heat-pressing roller 32 on the protective film 20 side and the house a on the one side of the insulating film 1.

565899 V. Description of the invention (8) The roller 33 sandwiches it, and at the same time has a predetermined tension, and at a fixed temperature, 21, f 濩 f20 is assigned to this, and the protective film 20 is separated by 20 The pressure-sensitive adhesive layer 19 is pressed ”, and is wound by a winding roller 34. At this time, the back of the edge film 1 is driven from the soil into the heat-sealing roller 3 2 and is called Sidayi Conveyor. The direction of rotation is to make the nip roller 33: turn in the direction of rotation. This is for the purpose of forming a tension to the opposite side of the line 2;: = the predetermined tension in the opposite direction. Since the protective film 20 is in a heating state given a predetermined tension, it is thermocompression bonded to the surface 1 of the insulating film i via the adhesive layer 19, so if it is left in this state, the protective film 2 is placed. It shrinks in the direction of "the protective surface of the electronic component mounting substrate 1G meets" and warps in the longitudinal direction. Therefore, in this embodiment, as shown in FIG. The notch portions 2 2 are provided at predetermined intervals in the longitudinal direction. FIG. 4 shows the protective film surface of the electronic component mounting substrate of this embodiment: “” In a plan view, FIG. 5 is a cross-sectional view of a heavy part of the electronic component mounting substrate according to this embodiment. As shown in FIG. 4, the adhesive layer 1 attached to the back surface of the electronic component mounting substrate 10 is attached. The protective film 2 of 9 is provided with a plurality of notch portions 2 2 extending in the width direction side by side at a certain interval throughout the long direction. This can release the stress caused by the thermal contraction of the protective film 20 and can Reduce the warpage in the entire direction. The shape, number, and length of the notch portion 22 are not particularly limited, as long as it can release the stress caused by the thermal contraction of the protective film 20.

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-----_ Description of the invention (9) -------- There is no limitation on the method of forming the cut portion 22, and cutting may be performed. From the point of view of punching, or through a cutting knife, the notch 22 is spread across the width of the protective film 20, which is better. In the present known form, the quantification of the professional person is quantified, and it is considered that the protective film 2 is peeled. Author: However, by leaving even the ends of: to remove the warp throughout the long direction. In addition, the shape ^ may also be equal to: the space between the two ends in the width direction of the protective film 20 is left at both widths 2 = the protection film 20 is not caused by the cut portion 22 in the width direction. limited. It is determined that there is no particular limitation on the length of the interval 22 ′ in the lengthwise direction. The interval length can be effectively removed if the length of the electronic component mounting substrate 10 can be effectively removed. In addition, the size of the ^ song interval does not have to be the same, and it can also be set as a knife:; 2 phase length. j J is also different in the interval of the hook knife. A As shown in FIG. 5, the cut portion 2 2 is set to penetrate the protective film 2 in the thickness direction of the electronic component 2 = 0. The reason for the penetration into the adhesive layer 19 is that the stress generated in the longitudinal direction of the protective film 20 that causes the longitudinal direction of the electronic component mounting substrate 10 to be curved can be reliably ensured. The depth is particularly limited as long as it does not penetrate into the insulating film 1. For example, it can be set to penetrate only the protective film 20, & the tooth protection film 20 and the adhesive layer 19. Of course, it is also self-evident that the notch portion ′ may be provided so that the protective film 20 is not completely penetrated but is only deeply protected. Ning Zhi

565899 V. Description of the Invention (-) Furthermore, the position where such a notch portion 22 is provided is not particularly limited. As shown in FIG. 6 to FIG. 8, by providing the notch portions 22A to 22C, electricity can be removed. ° = Long-term warpage of the substrate 10 for mounting. 6 to 8 are schematic plan views of ^ = other protective film surface of the electronic component mounting substrate of this embodiment =: For example, as shown in FIG. 6, it is provided so that both ends of the protective film 20 in the width direction are left, and a discontinuous discontinuous portion 23 is formed in the central portion of the protective film 20. The cut portion 2 2 Α may be used. Also, as shown in FIG. 7, it may be provided as having both ends of the protective film 20 in the width direction and having a discontinuous portion 23 of non-continuous% at the central portion of the protective film 20. , And the continuity of the two ends ^ provided in the width direction of the protective film 20 are provided, and the notch portions 2 2 B of the above two are alternately set. Further, as shown in FIG. 8, it is also possible to use a cut portion 22C formed by leaving a discontinuous discontinuous portion 23 only at the central portion of the protective film 20. The depth of the notch portion 2 2 A to 2 2C shown in FIGS. 6 to 8 is the same as the notch portion 2 2 described above, as long as the notch portion 2 2 A to 2 2 is provided. C. The protective film 20 may be cut without any limitation. In addition, the notch portions 22 and 22A to 22C of the present invention are not particularly limited in terms of their positions or lengths in the width direction, and whether they are continuous along the width direction, as long as the notch portions 2 2, 2 2 A ~ 2 2 C can be set plurally side by side at predetermined intervals throughout the long direction. In this manner, by providing the plurality of cut portions 2 2, 2 2A to 2 2C in the protective film 20 side by side, the warpage in the longitudinal direction of the electronic component mounting substrate 10 can be easily and effectively removed.

C: \ 2D-CODE \ 91-11 \ 91119944.ptd Page 14 565899 V. Description of the invention (11) (Experimental example) The following is a description of the experimental example of the electronic 跫 Du Rui donkey of the present invention. However, i ^ The method of removing the warpage of the soil plate is here, and the implementation of the test is limited to these. Used for: 75 # m thick insulation film 1 and acoustic surface mounting board for 5 pieces. The layer is provided with a circuit diagram with a thickness of 1 8 // m. The thickness is 1 2 # m and the adhesion is 25. Solder layer, and the thickness of the adhesive layer on the circuit pattern of J and the protective film on the adhesive layer; / by using a method of bonding tape as shown in Figure 3, The t film's back surface is implemented with an adhesive layer and the ice film scooped together: ^ The conditions for subtraction are set. In order to set the heating temperature of the protective film to 120 C, the tension applied to the protective film is set. H () g / frame ^ 48 attack. The warpage was measured for the electronic component mounting example (see Fig. 4) 'of the embodiment in which notch portions in the width direction of such protective films were left in the width direction. In addition, the notch portion is formed as a part that penetrates the protective film into the adhesive layer. In addition, in the measurement of the amount of funky music, the "front" was cut into a short rectangular shape having a length of 200 mm and a width of 48 mm. The results are shown in Table 1. The warpage amount (mm) refers to the south (mm) from the ^ S tube at both ends of the electronic component mounting substrate in the longitudinal direction when the circuit pattern side is placed on the substrate a. )To represent. For comparison, the flexure was measured in the same manner as in the example except that the cut portion was not provided.

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365899 V. Description of Invention (12) il

Invented by the rectangular side of the film, such as sub-zero edge mounting, the sigma effect of the component table ^ > can be installed by cutting a number of cuts extending in the protective width direction side by side across the length direction. It was confirmed that the surface curvature of the substrate was easily and effectively removed. Effect—t · Tormin β, ν.. W pieces + dreams, and the electronic component mounting substrate and electric protection according to the present invention ::: J :: Warping removal method * 'Since a plurality of useful substrates are arranged side by side, The cut-out portion extending in the rectangular shape can exert the effect that the electronic parts can be easily and effectively removed because of the lightness. Since the electronic bumper :: is securely installed at a predetermined position, the reliability of the sub-parts can also be improved. Number says m 1 Insulating film 2 Sprocket hole 10 Substrate for mounting electronic components 11 Insulating base material 12 Circuit pattern 13 Component-side connection terminal 14 External connection terminal 15 Notch 16 Solder mask

565899 V. Description of the invention (13) 17 Terminal hole 19 Adhesive layer 20 Protective film 21 Adhesive tape 2 2, 22A, 22B, 22C Notch

23 Discontinuity section 30 Unwinding roller 31 Guide roller 32 Hot-pressing roller 33 Pressing roller 34 Winding roller C: \ 2D-mDE \ 9Ml \ 91119944.ptd Page 17 565899 Brief description of the drawing Figure 1 shows the invention A schematic plan view of an electronic component mounting substrate according to an embodiment. Fig. 2 is a schematic cross-sectional view showing a substrate for mounting electronic components according to an embodiment of the present invention. Fig. 3 is a schematic configuration diagram showing an example of a method for bonding a protective film according to an embodiment of the present invention. Fig. 4 is a schematic plan view showing a protective film surface of an electronic component mounting substrate according to an embodiment of the present invention. Fig. 5 is a schematic cross-sectional view showing an important part of an electronic component mounting substrate according to an embodiment of the present invention. Fig. 6 is a schematic plan view showing another example of the protective film surface of the electronic component mounting substrate according to the embodiment of the present invention. FIG. 7 is a schematic plan view showing another example of a protective film surface of an electronic component mounting substrate according to an embodiment of the present invention. Fig. 8 is a schematic plan view showing another example of a protective film surface of an electronic component mounting substrate according to an embodiment of the present invention.

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Claims (1)

565899 VI. Scope of patent application 1. A substrate for mounting electronic parts, which is provided with at least a thin film-shaped insulating substrate, a circuit pattern provided on the surface of the insulating substrate, and electrons on the back surface layer of the insulating substrate. The adhesive layer for component mounting and the protective film of the adhesive layer are characterized in that a plurality of cuts extending in the width direction are arranged side by side on the protective film. 2. For the electronic component mounting substrate of the first patent application scope, in which the above-mentioned notch portions are each provided in such a manner that a part in the width direction becomes a discontinuous portion that is not continuous. 3. For the electronic component mounting substrate of the first patent application scope, wherein the above-mentioned notch portion is provided so as to leave at least both ends in the width direction. 4. For the substrate for mounting electronic parts as described in the scope of patent application No. 2, wherein the notch portion is provided so as to leave at least both ends in the width direction. 5. The electronic component mounting substrate according to any one of claims 1 to 4, wherein the notch portion is provided so as to penetrate the protective film to a portion of the adhesive layer. 6. —A method for removing warpage of a substrate for mounting electronic components, comprising laminating a thin film-shaped insulating substrate and a circuit pattern provided on a surface of the insulating substrate, and laminating the surface of the insulating substrate. An electronic component mounting substrate having an adhesive layer for mounting electronic components and a protective film for the adhesive layer for removing warpage; and is characterized in that a plurality of side-by-side components are arranged on the protective film in a long direction. Wide width C: \ 2D-CODE \ 9Ml \ 91 119944.ptd Page 19 565899 6. The scope of the patent application extends to the notch. 7. For the method for removing warpage of a substrate for mounting electronic parts, as set forth in the scope of application for patent No. 6, the above-mentioned notch portion is provided so that a part in the width direction becomes a discontinuous discontinuous portion. . 8. The method for removing warpage of a substrate for mounting electronic parts according to item 6 of the scope of patent application, wherein the notch portion is provided so as to leave at least both ends in the width direction. 9. The method for removing Zhao Qu of a substrate for mounting electronic parts according to item 7 of the scope of patent application, wherein the above-mentioned notch portion is provided so as to leave at least both ends in the width direction. 10. The method for removing warpage of a substrate for mounting electronic parts according to item 6 of the scope of the patent application, wherein the notch portion penetrates the protective film to a portion of the adhesive layer. 1 1. The method for removing surface curvature of a substrate for mounting electronic parts according to item 7 of the scope of the patent application, wherein the notch portion penetrates the protective film to a portion of the adhesive layer. 1 2. The method for removing warpage of a substrate for mounting electronic parts according to item 8 of the scope of patent application, wherein the notch portion penetrates the protective film to a portion of the adhesive layer. 1 3. The method for removing warpage of a substrate for mounting electronic parts according to item 9 of the scope of patent application, wherein the notch portion penetrates the protective film to a part of the adhesive layer. 1 4. The method for removing warpage of a substrate for mounting electronic parts according to any one of claims 6 to 13 of the scope of application for a patent, by providing the above-mentioned cut portion, C: \ 2D-CODE \ 91-m91119944.ptd Page 20 565899 C: \ 2D-CODE \ 9Ml \ 91119944.ptd Page 21