TW540260B - Substrate for mounting electronic component - Google Patents

Abstract

To provide a substrate for mounting an electronic component, which substrate has improved dimensional stability against moisture absorption and heating. A substrate 10 for mounting an electronic component includes an insulating base material 11; and a wiring pattern 12, formed on one side of the insulating base material 11, having a terminal portion for external connection. Separately from the wiring pattern 12, a metal pattern 16 is provided at least in the vicinity of the terminal portion.

Description

540260 V. Description of the invention (l) · ----- [Technical field to which the invention belongs]

The present invention relates to a substrate for mounting electronic components for mounting electronic components and a method for manufacturing a substrate for mounting sub-components, and particularly relates to csp (Chip Size Package), BGA (Ball Grid Array, BaU)

Grid Array), # -bga (# -Solder ball grid array, #Grid

Array), FC (Flip Chip), QFp (Quad Flat Package), TAB (Tape Automated Bonding), COF (Chip Direct Mounting Film 'Chip 〇n

Film) and other electronic component mounting substrates (hereinafter referred to simply as "electronic component mounting substrates"). [Leading technology] Although the demand for printed wiring boards for mounting electronic components such as 1C (Integrated Circuit) and LSI (Large-Scale Integrated Circuit) has increased rapidly with the development of the electronics industry, it is required to reduce the size and weight of electronic equipment. High-functionality. Recently, the installation methods of some electronic parts adopt TAB tape, T_BGA tape and AS K: (dedicated integrated circuit) tape. In particular, with the thinning and thinning of electronic devices, in order to install electronic parts at higher density and improve the reliability of electronic parts, the external connection terminals are arranged on a substrate whose size roughly corresponds to the size of the installed electronic parts. For example, csp, BGA, #_BGa temples are used more frequently. The film carrier for mounting electronic components into this electronic component mounting substrate is manufactured by ▼ 如-人. That is, first, for example, attach a copper foil to an insulating film such as polyimide, apply a photoresist to the surface of the copper box, and expose parts other than the wiring pattern that forms the photoresist to remove the exposure. Photoresist. borrow

540260

In addition, although the above COF is heated from the surface of the insulating film to form a eutectic of gold and tin under the condition of 1C installation, there is a problem that the heating temperature is relatively high from 300 to 500 ° C. Therefore, due to the thermal expansion of the insulating film caused by heating, gaps in the pattern of the inner leads will occur, and deformation will occur due to the deformation of the host lines caused by the heating and softening of the inner side of the inner leads. Pattern deviations cause problems such as poor connection to the IC. The present invention has been made in view of these circumstances, and an object thereof is to provide a board for mounting electronic parts that improves dimensional stability under moisture absorption or heating. [Means to solve the problem]

91118812.ptd Page 6 540260 V. Description of the invention (3) The first aspect of the present invention which solves the aforementioned problem is a substrate for mounting electronic parts, which is provided with an insulating base material and is formed on one surface of the insulating base material. A wiring pattern for connecting an external terminal portion is characterized by having a metal pattern independent of the front wiring pattern at least in the vicinity of the terminal portion. This first aspect improves the dimensional stability at least near the terminals by using a metal pattern independent of the wiring pattern. The second aspect of the present invention is the electronic component mounting substrate according to the first aspect, wherein the metal pattern has an inner surface pattern provided on the inner surface of the insulating substrate provided on the opposite side of the surface where the wiring pattern is provided. This second aspect reduces the dimensional change by the inner surface pattern located on the inner surface, especially the dimensional change caused by the moisture absorption of the insulating substrate. The third aspect of the present invention is the electronic component mounting substrate according to the second aspect, wherein the inner surface pattern is provided on the inner surface of the insulating base material and in the vicinity of the terminal portion. This third aspect is reduced by the inner surface pattern, especially the size change near the terminal portion. The fourth aspect of the present invention is the substrate for mounting electronic parts as in the second aspect, wherein the inner surface pattern is provided on the entire inner surface of the insulating substrate. This fourth aspect reduces the overall dimensional change by the internal pattern. The fifth aspect of the present invention is the electronic component mounting substrate according to any one of the second to fourth aspects, wherein the inner surface pattern is provided on the insulating base material without an adhesive. Because this fifth aspect directly sets the inner surface pattern on the insulating substrate,

91118812.ptd Page 7 540260 V. Description of the invention (4) Do not reduce the dimensional change caused by the moisture absorption of the insulating substrate. The sixth aspect of the present invention is an electronic component mounting substrate according to any one of the first to fifth aspects, wherein the metal pattern has a dummy pattern provided on a surface of the insulating substrate provided with the wiring pattern. type. This sixth aspect reduces the dimensional change by a dummy pattern. A seventh aspect of the present invention is the electronic component mounting substrate according to the sixth aspect, wherein the dummy pattern is provided on the inner side of the inner lead of the terminal constituting the terminal connected to the electronic component. This seventh aspect reduces the dimensional change near the inner leads by the dummy pattern, especially the dimensional change caused by heating during the installation of electronic parts. The eighth aspect of the present invention is the electronic component mounting substrate according to the seventh aspect, wherein the dummy pattern is provided on the inner side of the inner lead substantially in its entirety. This eighth aspect prevents deformation of the insulating base material inside the inner lead. A ninth aspect of the present invention is the electronic component mounting substrate according to the seventh aspect, wherein the dummy pattern is only near the inner lead and is arranged in a side-by-side direction of the inner lead. This ninth aspect reduces the deviation between the inner leads by a dummy pattern. The tenth aspect of the present invention is an electronic component mounting substrate according to any one of the first to ninth aspects, wherein the electronic component mounting substrate is a COF substrate without a device hole. This tenth aspect prevents dimensional changes caused by heating during the mounting of electronic parts. The eleventh aspect of the present invention is a substrate for mounting electronic parts as in the second or third aspect, wherein a device hole is formed in the aforementioned insulating base material, and a peripheral edge of the device hole is formed.

91118812.ptd Page 8 540260 5. The description of the invention (5) sets the aforementioned inner surface pattern. This 11th aspect prevents the deviation of the inner lead provided near the device hole by the inner surface pattern. The twelfth aspect of the present invention is the electronic component mounting substrate according to any one of the first to eleventh aspects, wherein the wiring pattern is provided on the insulating base material without an adhesive. In this twelfth aspect, the wiring pattern is formed by electroplating, or the insulating base material is formed on the conductive body constituting the wiring pattern by casting. [Embodiments of the invention] Hereinafter, the present invention will be described based on the embodiments. (Embodiment 1) Figure 1 shows a schematic plan and cross-section of a substrate for mounting electronic components according to Embodiment 1 of the present invention. As shown in FIG. 1, a plurality of substrates 10 for mounting electronic parts are continuously formed on the band-shaped insulating film 1. This insulating film 1 has two sprocket tooth holes 2 for transfer at predetermined intervals on two sides in the width direction. Generally, electronic components are mounted while being transferred, and each electronic component mounting substrate 10 is cut after the electronic components are mounted. . This electronic component mounting substrate 10 is provided with a wiring pattern 12 and an inner lead 1 3 and an outer lead 1 4 on a surface of an insulating substrate 11 having a size substantially corresponding to the size of the mounted electronic component. Outside the solder mask layer 15 An inner surface pattern 16 made of a patterned metal layer is provided on the inner surface side of the insulating base material 11.

91118812.ptd Page 9 540260 V. Description of the invention (6) At least the inner lead 13 and the outer lead 1 4 which are not covered by the solder resist 15 are provided with a power ore on the conductor foil forming the entire wiring pattern 12 Floor. It has chemical resistance and heat resistance when 廑 = flexible. 、, bar, miso M 1 (insulating base 11). The materials of this insulating film are listed below: I, polyester, polyamide, polyimide, etc., especially the aromatic polyimide with the king of biphenyl & y > Co., Ltd.) is preferred. Moreover, the thickness of the insulating film is V—Yu / Secondary production 5 to 1 2 5 // m (micron), preferably 2 5 to 7 5 // m 〇 And, the mouth is on the surface of the thin film 1 The wiring pattern 丨 2 The pattern of the conductor pig slice generally formed by borrowing. Therefore, copper or copper, and the connection layer A at π # μ live on the moon, even if the white film is waiting for Tong 2: Binding 'i' can pass through the adhesive layer, which can be crimped by 敎, ^ or It is formed by electroplating. The thickness of the conductor foil is preferably 5 to 35 " m. The conductor collar piece is made of steel V2, which can be used to form an insulating film 1 by casting method. ; 料 = 先; = f, rri treatment constitutes absolutely on-chip formation. Cheng Ya & Amex resin composition on the conductor foil nickel surface pattern 16 of course also borrows the metal pig 'for example how steel force theory does not: v white sheet shape < but it does not have to be a good conductor Er Lu, Er " A dimensional change that depends on humidity occurs, so the dimensional change that occurs due to moisture absorption due to no material can occur. Reduce the insulating base ψT t ^ As mentioned in the article, I also look forward to reducing the ruler's thermal expansion coefficient +4: 2: ground 'using a thermal expansion coefficient smaller than the insulating base: u :, avoiding the situation, although the thermal expansion coefficient of Umbrella amine is 15 to 251) 1) 1]] /. 〇 之 ， 。. Example of spear king degree, not 540260 V. Description of the invention (7) --------- Over, copper is 16Ppm / ° C, aluminum is 23ppm / ° C 'nickel is 13ppm / t This can be according to the polyimide used Choose the type. Even if this kind of metal foil is also laminated directly on the insulating film, the adhesive layer is formed by thermocompression bonding, etc., or the materials or precursors that make up the insulating film can be further processed by electro-mineralization / transmission. For example, ^, the precursor resin composition is formed on the conductor foil forming the wiring pattern, and the amine needs to be dried, and then the metal layer is laminated. Thereafter, the heat treatment is performed in the case of direct lamination or lamination via a cast layer. They can be laminated from either side, or at the same time. In addition, in the case where the conductor foil is formed by electroplating = it is a box piece, both of them can be electroplated at one time, and of course, it can also be individually controlled. Moreover, although the thickness of the metal foil constituting the inner surface pattern 16 is not specified, the same thickness as the conductor foil of the wiring pattern 2 and the sound limit M can be used, and the conductor foils provided on the surface of the insulating film 1 The sheet and the metal 羯 f are changed from the photo-micro-etching pattern to the wiring pattern 2 and the inner surface pattern 6. The photoresist material coating, which is coated with photoresist material coating solution Xing Cheng, is patterned by exposure and development through a photomask, and the patterned photoresist material is used as a shield. The photoresist is removed by dissolving (etching treatment), and then dissolving and removing the photoresist, thereby shaping the conductive foil and the gold foil. At the same time, the photomicro-engraving method can be performed on both sides at the same time, or on one side. In the case of deduction, it can be performed on either side first. , And the surface is formed by applying a solder resist coating liquid on the patterned conductive box sheet, and performing a predetermined pattern to form a solder resist layer 15.

For example, regardless of the nature of the material and the acid ester, the special photosensitive dendritic epoxy resin, etc. And, to make the material coating liquid. Photoresist is a positive protective material, not a fat-adding material, dilute acid, acrylic-based solder resist, hardened solder material, or negative homogeneous foil with photopolymer. Epoxy resin and ester resin 15 can be used. Generally, the material is used to form solder resist 15. It ’s a material with general photoresistance. For example, its initiator is equal to epoxy acrylate and acrylic acid resin. It can be aging type epoxy propylene glycol resin, and aldehyde-type epoxy methacrylic acid. Type or UV (ultraviolet) hardening type photoresistive solder | The insecticide is bisphenol A, bisphenol A ester resin such as acrylic resin, etc. The shape of the inner surface of the solder resist material is not particularly limited. The shape of the inner surface is not particularly limited. It is provided to reduce the dimensional change along the parallel direction of the terminal portions of the inner lead 13 and the outer lead 14 and the like. Therefore, in order to reduce the dimensional change in the juxtaposition direction of the terminal portions, it is preferable to form a pattern extending in the juxtaposition direction. The inner surface pattern 16 of FIG. 1 (b) is formed on the sides of the sprocket tooth holes 2 in the width direction, and is substantially comprehensive. Corresponds to the part where the inner lead 丨 3 and the outer lead 丨 4 are provided. These inner surface patterns 16, 16A to 16C reduce the dimensional change caused by the moisture absorption of the insulating substrate 11, prevent the accumulated deviation between the inner lead 13 and the outer lead 14, and further improve the bending resistance. Also, especially the inner surface pattern 16A can also be used to crimp and install the electronic parts while heating the electronic parts; [3] The effect of preventing thermal deformation of the insulating substrate.

91118812.ptd Page 12 540260 V. Description of the invention (9) Fig. 3 shows an example of a manufacturing process of the above-mentioned electronic component mounting substrate. As shown in Fig. 3 (a), on both sides of the insulating film i, Nie 2, 1-2 * electric body layer! 2 〇 and the formation of the φ pattern i 6 of the metal layer / 1 曰 2 (ΓΛ film \ As shown in Figure 3 (b), through punching, etc., through the conductor layer hole 2 can, Γ edge 溥 film 1 And the metal layer 160 to form a sprocket tooth hole 2. This chain: teeth 2 7 are punched from either side. Second, as shown in FIG. 3 (c), the metal layer 16 is patterned using a jealous method, Take it as the inside view ㈣. And the area where the wiring pattern 12 is formed on the conductor layer 120 = the coating solution of the last name material to form a coating of light-resistant silver material 20 (refer to Figure 3-When " V can also use positive Anti-light surname material. As shown in the figure, two positioning pins are inserted into the sprocket tooth hole 2 for positioning, and then protected into a picture / light. Development, thereby patterning the photo-resistant material coating, 崠 a; (!) Photoresist pattern 22 for all wiring patterns. Secondly, for layout: ^ Γ layer is further dissolved and removed with alkali solution, etc., to form wiring pattern 22, as shown in Figure 3 (a). For the wiring diagram u, as shown in FIG. 3 (g), 'For example, using screen printing to form a g-type hindering type.' Although the pattern of the metal layer can be reversed when the metal layer is patterned, it can also be the same as the United States. # = In the above 5 examples, the electronic component safety base 1 provided with an internal pattern is not limited to the above-mentioned base plate, but may also be a device hole. Figure 4 shows an example of an electronic component mounting substrate with a device hole. 540260

As shown, the electronic component mounting substrate 10A has a device hole 17, and a peripheral portion on the inner surface side of the device hole 17 has an inner surface pattern 1 60 extending along the juxtaposed direction of the inner lead 3, and in addition to the above, The examples are the same, and the parts showing the same effect are marked with the same component numbers, and repeated descriptions are omitted. (Embodiment 2) Fig. 5 shows a plan view of an electronic component mounting substrate according to Embodiment 2 and a sectional view showing a state in which the electronic components are mounted thereon. As shown in FIG. 5, the electronic component mounting substrate 3 is provided with a wiring pattern 3 2 extending in a quadrilateral direction on an insulating substrate 3 j. The wiring pattern 3 2 has inner leads 33 for mounting electronic components such as c and connection to the outside. Outside wiring 34. Here, a dummy pattern 38 is formed inside the inner lead 33 independently of the wiring pattern 32. The dummy pattern 38 is a pattern of the conductor layer constituting the wiring pattern 32, and is electrically independent of the pattern formed outside the wiring pattern 32. Of course, after patterning the wiring pattern 32, a part may be formed by using other materials. Since the materials and manufacturing methods of the insulating base material 31 and the wiring pattern 32 are basically the same as those of the above-mentioned embodiment, repeated description is omitted. In addition, the wiring pattern 32 and the dummy pattern 38 may be formed of the same material as the wiring pattern 12 of the above embodiment. In addition, when the dummy pattern 3 8 is formed and it is different from the wiring pattern 32, it may be used. It is formed of the same material as the inner surface of the embodiment i. Stomach \ A tin plating layer is formed on at least the inner lead 33 of the electronic component mounting substrate 30. As shown in FIG. 5 (b), the gold bump 41 of the IC40 is bonded to the inner lead 33. *

91118812.ptd Page 14 540260

V. Description of the invention (π) In the case where the IC40 is installed as shown in FIG. 6, the IC40 is placed on the heating stage 51, and the inner lead 33 is superposed on the hump 41, and the heating device 5 2 is self-insulated. The substrate 31 is heated and pressure-bonded to form a tin-gold eutectic between the inner lead 33 and the bump 41, and the two are bonded. The heating temperature at this time is 3,000 to 500 ° C. However, by setting a dummy pattern 38, thermal deformation of the insulating substrate 31 or positional deviation of the inner lead 33 caused by such heating can be prevented. . The dummy pattern 3 8 thus reduces the thermal deformation or dimensional change of the insulating substrate 31 due to heating, and prevents the cumulative deviation of the pitch of the inner leads 3 3.

Although the shape of the dummy pattern 38 is not particularly limited, it is particularly preferable to reduce the size of the dummy pattern 38 along the juxtaposed direction of the inner leads 33. Therefore, in order to reduce the dimensional change of the terminal part along the juxtaposed direction, it is preferable to form a pattern extending along the juxtaposed direction. As shown in FIG. 7, the juxtaposed direction along the inner lead 33 may be provided only near the inner lead. Extending strip-shaped dummy pattern 38a. Of course, as shown in FIG. 8, it can also be provided inside the inner lead 3 3 to form a dummy pattern 3 8 Β which is inclined regardless of the direction in which the inner lead 33 is arranged. In the case of setting the dummy pattern 3 8 Α in FIG. 7, although it is inferior to the dummy pattern 38 from the viewpoint of ensuring the flatness of the inner area of the inner lead, it can be easily sealed with resin. The effect of flowing into the inner area of the inner lead. Under the imaginary shape of Fig. 8 3 8 B, the same day can ensure the flatness of the inner area of the inner lead and the ease of flow of the sealing resin.

In any case, ’can prevent the positional deviation of the inner lead 33 caused by the heat caused by the heat of the material 31 during the installation of I c4 〇 = insulation. Of course, connecting to IC sub-components also has effects other than gold-tin eutectic, such as the same effect as in the case of wire bonding.

Page 540 260

It can also be applied to the electronic component mounting of the second embodiment in the same manner as the inner surface of the first embodiment. In this way, 骅 ^ on the other hand, set the individual effects like this inside, and further exert the multiplicative effect. Oral and dummy maps (Example 1) Secondly, according to the examples and comparative examples, a flat polymer was formed on the copper foil with a thickness of 12 / ζπ by casting method according to the examples and comparative examples ^ 亚 成 明 /

The resin composition layer is further laminated with a steel sheet with a thickness of 2 # m ~ i ^ preliminary process, and a polyimide having a thickness of 40 / ZΠ1 is sandwiched between copper and xenon g: a layer of heat is used to enrich the body. The double-sided copper foil is patterned by photo-micro-engraving method. The structure is shown in Figure 2. It is formed on an insulating base material made of polyurethane. Figure 2 ^ iHJ has a jiji type, and it has Inner-surface pattern for electronic component mounting US,,, θ (Comparative Example 1), and soil plate 0 Form a substrate for mounting the same component as in Example 1 except that the inner-surface pattern is not provided. Let (Test Example 1) measure the dimensional change of the inner leads along the juxtaposed direction on the individual electronic component mounting substrates of Example 1 and Comparative Example 1 under the conditions of 40% RH and 60% RH. 1 result. Then, the substrate was cut into a predetermined size, and the substrate was placed in a constant temperature and humidity tank at 25 ° C and 40% RH for 2 days, and the size at 40% RH was measured.

540260 V. Description of the invention (13) The board was placed in a constant temperature and humidity tank at 25 ° C and 60% RH and left for 2 days to measure the size L2 at 60% RH. Thereafter, the dimensional change rate was obtained from the following formula. [Number 1] Dimensional change rate (40% -60% RH) = α2 -1 ^) /: ^ [Table 1] 1 Dimensional change rate (40% -60% RH) Example 1 Oppm Comparative Example 1 490ppm In Comparative Example 1, a dimensional change equivalent to 490 ppm was observed, and even if the humidity increased, the electronic component mounting substrate of Example 1 did not show any dimensional change at all. In addition, if the dimensional change rate of Comparative Example 1 is determined by using a commercially available cast-type laminated film (product name: Asparex SC12-40-00-AE; Nippon Steel Chemical Co., Ltd.) for each 1 The moisture absorption change rate (humidity expansion coefficient) of% RH change is 34 ppm /% RH (34 X 10_6mm / (mm ·% RH)), which is converted to 20% when humidity change is 680 ppm. In contrast, the hygroscopic changes of commercially available polyurethane films (for example, product name ·· Ubex S; Ube Kosan Co., Ltd., product name: Kebudong EN, Donglei DuPont) The rates are 14ppm /% RH and 15ppm /% RH, respectively. In this regard, if the internal pattern is set, it is obvious that the dimensional change caused by moisture absorption can be fully prevented. (Examples 2 to 4) Using polyimide with a thickness of 40 / m as an insulating substrate, patterning the thickness of 丨 2 in copper% of the claws to match the mounted IC (outer diameter is 15 mm square) , Into a wiring pattern, forming the electronic parts Anmen equivalent to Figure 5, Figure 7 and Figure 8

540260 V. Description of the invention (14) Substrate. (Comparative Example 2) A substrate for mounting electronic parts was produced in the same manner as in Examples 2 to 4 except that a dummy circle was not provided. (Experimental example 2) In Fig. 6, examples 2 to 4 are compared with you. 7 According to the instructions, the IC40 is installed by heating and crimping with a heating pair of 45 ° t for 3 seconds, and the IC40 is installed due to the deformation of the peripheral area of the lead in the pattern position of the pair of inward leads that occurs on the meat = component women's substrate. Example 3: 3, Example 4 is Example 2: 〇 In the case of Comparative Example 2, a deformation # 7 occurs. m. On the other hand, Yubi's 'dimensional change in humidity of 40% RH and 60% RH strains == ^^' was obtained in the same direction as in Test Example 1 with the inner leads of the last name [Inventive effect], . fruit. As shown above, the M-type according to the present invention can provide the effect of improving the moisture absorption or the increase of the substrate for the 5-sided pattern and the dummy pattern. ”, Size electronic components installation [component number description] 11, sub-substrate mounting substrate, core edge substrate wiring pattern inner lead outer lead green solder resist 91118812.ptd page 18 540260

91118812.ptd Page 19 540260 Brief Description of Drawings Figs. 1 (a) and (b) are schematic plan and sectional views showing an example of a substrate for mounting electronic parts according to the first embodiment of the present invention. Figs. 2 (a) to (c) are schematic plan views and sectional views showing an example of a substrate for mounting electronic components according to the first embodiment of the present invention. 3 (a) to (g) are schematic cross-sectional views showing an example of a manufacturing process of a substrate for mounting electronic parts according to the first embodiment of the present invention. Fig. 4 is a schematic sectional view showing an example of a substrate for mounting electronic parts, which is a modification of the first embodiment of the present invention. Figs. 5 (a) and 5 (b) are a schematic plan view showing an example of a substrate for mounting electronic components according to the second embodiment of the present invention, and a cross-sectional view of the mounting IC. Fig. 6 is a diagram showing a state in which IC is mounted on a substrate for mounting electronic parts according to a second embodiment of the present invention. Fig. 7 is a schematic plan view showing an example of a substrate for mounting electronic parts, which is a modification of the second embodiment of the present invention. Fig. 8 is a schematic plan view showing an example of a substrate for mounting electronic parts, which is a modification of the second embodiment of the present invention.

91118812.ptd Page 20

Claims (1)

540260 6. Application scope 1. A substrate for mounting electronic components, which is provided with an insulating base material and a wiring pattern formed on one surface of the insulating base material and has a terminal portion for connecting to the outside. The metal pattern is independent of the wiring pattern at least in the vicinity of the terminal portion. 2. For the electronic component mounting substrate according to item 1 of the scope of patent application, wherein the metal pattern has an inner surface pattern provided on the inner surface of the opposite side of the surface of the insulating substrate provided with the wiring pattern. 3. For the electronic component mounting substrate according to item 2 of the scope of patent application, wherein the inner surface pattern is provided in a region of the inner surface of the insulating base material corresponding to the terminal portion and its vicinity. 4. For the electronic component mounting substrate according to item 2 of the scope of patent application, wherein the aforementioned inner surface pattern is provided on the entire inner surface of the aforementioned insulating base material. 5. For the substrate for mounting electronic parts, as described in the second item of the patent application, wherein the aforementioned inner surface pattern is provided on the aforementioned insulating base material without an adhesive. 6. For the electronic component mounting substrate according to item 3 of the patent application scope, wherein the aforementioned inner surface pattern is provided on the aforementioned insulating base material without an adhesive. 7. For the electronic component mounting substrate according to item 4 of the patent application scope, wherein the aforementioned inner surface pattern is provided on the aforementioned insulating base material without an adhesive. 8. For the electronic component mounting substrate according to item 1 of the scope of patent application, wherein the metal pattern has a dummy pattern provided on a surface of the insulating substrate provided with the wiring pattern. 9. For the electronic component mounting substrate according to item 2 of the patent application scope, wherein the metal pattern has a wiring pattern provided on the insulating base material 91118812.ptd Page 21 540260 VI. The dummy pattern of the surface of the scope of patent application. 10. The electronic component mounting substrate according to item 3 of the scope of patent application, wherein the metal pattern has a dummy pattern provided on a surface of the insulating substrate provided with the wiring pattern. 1 1. The electronic component mounting substrate according to item 4 of the scope of patent application, wherein the metal pattern has a dummy pattern provided on a surface of the insulating base material provided with the wiring pattern. 1 2. The substrate for mounting electronic parts according to item 5 of the scope of patent application, wherein the metal pattern has a dummy pattern provided on a surface of the insulating substrate provided with the wiring pattern. 1 3. The electronic component mounting substrate according to item 6 of the patent application scope, wherein the metal pattern has a dummy pattern provided on a surface of the insulating base material provided with the wiring pattern. 1 4. The electronic component mounting substrate according to item 7 of the scope of the patent application, wherein the metal pattern has a dummy pattern provided on a surface of the insulating substrate provided with the wiring pattern. 1 5. The electronic component mounting substrate according to item 8 of the scope of the patent application, wherein the dummy pattern is provided on an inner side of an inner lead constituting a terminal connected to the electronic component in the terminal portion. 1 6. The substrate for mounting electronic parts according to item 15 of the scope of patent application, wherein the dummy pattern is provided substantially on the inside of the inner lead. 1 7. The electronic component mounting substrate according to item 15 of the scope of patent application, wherein the dummy pattern is provided only in the vicinity of the inner lead in a direction parallel to the inner lead. 91118812.ptd Page 22 540260 6. Scope of patent application 1 8. The electronic component mounting substrate according to any one of items 1 to 17 of the patent application scope, wherein the electronic component mounting substrate is a C0F without a device hole. Substrate. 1 9. The electronic component mounting substrate according to item 2 or 3 of the scope of patent application, wherein a device hole is formed in the aforementioned insulating base material, and the aforementioned inner surface pattern is provided on a peripheral edge portion of the device hole. 20. The substrate for mounting electronic parts according to any one of claims 1 to 17, wherein the wiring pattern is provided on the insulating base material without an adhesive. 2 1. The electronic component mounting substrate according to item 18 of the scope of patent application, wherein the wiring pattern is provided on the insulating base material without an adhesive. 2 2. The electronic component mounting substrate according to item 19 of the scope of patent application, wherein the wiring pattern is provided on the insulating base material without an adhesive. 91118812.ptd Page 23