TW564508B - Burn-in board having a guide for accurately positioning a semiconductor device to be mounted thereon and a method for testing a semiconductor device - Google Patents

Burn-in board having a guide for accurately positioning a semiconductor device to be mounted thereon and a method for testing a semiconductor device Download PDF

Info

Publication number
TW564508B
TW564508B TW088114281A TW88114281A TW564508B TW 564508 B TW564508 B TW 564508B TW 088114281 A TW088114281 A TW 088114281A TW 88114281 A TW88114281 A TW 88114281A TW 564508 B TW564508 B TW 564508B
Authority
TW
Taiwan
Prior art keywords
board
burn
plate
guide
substrate
Prior art date
Application number
TW088114281A
Other languages
English (en)
Chinese (zh)
Inventor
Naoto Kobashi
Katsumi Kumazawa
Tomokazu Kitaoka
Hiroyuki Yoshioka
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of TW564508B publication Critical patent/TW564508B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2642—Testing semiconductor operation lifetime or reliability, e.g. by accelerated life tests
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
    • H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
    • H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Connecting Device With Holders (AREA)
TW088114281A 1999-04-30 1999-08-20 Burn-in board having a guide for accurately positioning a semiconductor device to be mounted thereon and a method for testing a semiconductor device TW564508B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11125011A JP2000314759A (ja) 1999-04-30 1999-04-30 バーンインボード及び半導体装置の試験方法

Publications (1)

Publication Number Publication Date
TW564508B true TW564508B (en) 2003-12-01

Family

ID=14899663

Family Applications (1)

Application Number Title Priority Date Filing Date
TW088114281A TW564508B (en) 1999-04-30 1999-08-20 Burn-in board having a guide for accurately positioning a semiconductor device to be mounted thereon and a method for testing a semiconductor device

Country Status (3)

Country Link
JP (1) JP2000314759A (ja)
KR (1) KR20000067769A (ja)
TW (1) TW564508B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105870074A (zh) * 2014-12-05 2016-08-17 矽品精密工业股份有限公司 电子封装件及其制法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI242852B (en) 2004-05-05 2005-11-01 Orient Semiconductor Elect Ltd Semiconductor package
CN100505250C (zh) * 2004-05-18 2009-06-24 华泰电子股份有限公司 半导体封装装置
WO2006038257A1 (ja) * 2004-09-30 2006-04-13 Renesas Technology Corp. 半導体装置の製造方法
JP5564304B2 (ja) * 2010-03-29 2014-07-30 株式会社エンプラス 電気部品用ソケット
KR20220003902A (ko) * 2020-07-02 2022-01-11 주식회사 케이엠더블유 솔더 기판 조립체

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105870074A (zh) * 2014-12-05 2016-08-17 矽品精密工业股份有限公司 电子封装件及其制法

Also Published As

Publication number Publication date
JP2000314759A (ja) 2000-11-14
KR20000067769A (ko) 2000-11-25

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