5645〇8 A7 五、發明說明（1 ) 發明背景 1 ·發明之技術領域 (請先閱讀背面之注意事項再填寫本頁) 本發明大致有關於一種用來測試半導 燒板，更特別是關於-種欲承受預燒測試的半導體； =皮安裝在其上之預燒板，及關於一種用以使用此預 燒板而測試一個半導體元件的方法。 在用以製造一個半導體元件的處理中，一個預燒 測試被執行以便找出半導體可能的缺點。預燒測試是 一個加速測試以找出一個半導體固有的缺點及可能的 $陷。在預燒測試裡，一個欲測試的半導體元件被設 定執行預定的操作。因&，半導體元件的電極應做成 電力連接。為了電力連接該半導體元件，該半導體元 件被安裝在預燒板上。亦即，一個根據預定測試模式 的電壓經由一個在預燒板所提供的電路而被提供給半 導體元件的電極。 2·相關技藝說明 經濟部智慧財產局員工消費合作社印製 大體上，在一個傳統的預燒測試裡，多數半導體 元件安裝在單一的預燒板上因此多數的半導體元件被 同時測試。第1圖是一個用來做預燒測試的傳統預燒 板之透視圖。如第1圖所示，該傳統的預燒板10包含 一個基板12及多數安裝在基板12上的1C插座14。一個 欲測試的半導體元件被容納在每一個1C插座14裡，被 容納在每個1C插座14中的半導體元件的電極被連接到 每個1C插座14的各自導線端14a。 -4- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 564508 A7 發明說明（2 ) 因為每一個I C插座1 4具有相同的結構，所以為了 方便起見現將描述其中一個1C插座14 ^在容納一個半 導體元件的1C插座14之上部是由一個蓋子i4b所覆 蓋。該蓋子14b由一個諸如環扣的鎖緊構件固定在IC 插座14。此外’ I c插座14的導線端14a被個別地插入 在基板12裡所形成的通孔i2a，且其被焊接至形成在 基板12上的電極圖案。所以，IC插座14的導線端 是經由形成在基板12上的電路圖案18而電性連接到基 板12之各自的輸入端子16。於是，根據一個預定的預 燒波形之電壓能從該輸入端子1β經由1C插座14輸入半 導體元件。 近年來’半導體元件已被小型化，且所謂的球格 柵陣列（BGA)封裝1C的使用已被增加。此外，具有各 種節距的球形電極及各種數目的球形電極之BGA封裝 1C已被發展。因此，能安裝各種型式的各種BGA封裝Ic 之IC插座已被製造。然而，對於ic插座的高準確度是 需要的’因為連接一個半導體元件至ic插座的準破度 直接影響該預燒測試結果的準確度。此外，因為1(:插 座14包含許多組成部分，諸如一個主體、蓋子14b、 環扣及導線端14a，所以IC插座14的結構是複雜的。 因此’ 1C插座14具有高製造成本。於是，具有多數貴 的1C插座14之預燒板1〇是非常昂貴的。 此外，每次當發展一個具有不同數目電極或不同 節距電極的新的BGA封裝IC20時，必須生產一個具有 i度適用中國國家標準（CNS)A4規格（210 X 297公f ) — — — — — — — — 1 — — — — --------β ίιιιιιι„ (請先閱讀背面之注意事項再填寫本頁) 564508 經濟部智慧財產局員工消費合作社印製 ΚΙ 五、發明說明（3 ) 新的1C插座之預燒板。此增加花費在預燒測試上的全 部成本。再者，如電極節距變為較小時，該ic插座本 身的生產變得較困難。 發明之概要說明 本發明的一個一般目的是提供一個改良的及有用 的預燒板以及一個用以測試一個半導體元件的方法， 在此半導體元件裡以上所指出的問題被消除。 本發明的一個更特定的目的是提供一個不昂貴的 預燒板，其能裝設一個半導體元件，該半導體元件具 有諸如以小的節距排列的球形電極的突出電極。 為了達到以上指出的目的，根據本發明的一態樣 提供一個預燒板，其用來做半導體元件（具有多數突 出電極在其底面）的預燒測試，該預燒板包含·· 一個基板； 與基板一體形成的導引部，該導引部導引半導體 元件，以便將該半導體元件定位在基板一個預定的位 置上；及 多數在基板裡所提供的傳導墊，因此當半導體元 件被置放在預定的位置時，每一個傳導墊接觸各自的 一個突出電極。 根據本發明，傳導墊在預燒板的基板裡形成，以 便於與半導體元件的突出電極成為電性連接，且導引 部也在基板裡形成，以便把半導體元件導引至一個準 確的位置。所以，不用提供一個如在傳統的預燒板裡 --------訂--------- (請先閱讀背面之注意事項再填寫本頁) 564508 經濟部智慧財產局員工消費合作社印製 A7 b/ 五、發明說明（4 ) 之1C插座，該半導體元件就能被安裝在預燒板上。在 傳統的預燒板裡所使用的1C插座是昂責的，且因此根 據本發明的預燒板能縮藏成本而生產。此外，因為傳 導墊及導引部是由一個半導體製造技術所形成，所以 根據本發明的預燒板能被生產，使得一個具有以非常 小節距排列的突出電極半導體元件可被安裝於其上。 在本發明裡，該導引部可為一個在預燒板的基板 裡形成的向外形成導引凹處，因此一個半導體元件的 向外形成部與該向外形成導引凹處相配合。導引部可 能包括一個電極導引凹處，因此該半導體元件的突出 電極配合於其内。那些凹處能由一個傳統的半導體製 造技術在基板裡容易地形成。 此外，在傳導墊形成於其中的基板之一部分能從 向外形成導引凹處或電極導引凹處被形成的基板的一 部分各別地生產出。基板的這些部分被互相固定，以 便生產出預燒板。於是，本發明的預燒板能由一個簡 單的製造技術製造出。此外，基板的這些部分的每一 個可被普遍地使用在各種具有相同向外形成部或相同 電極排列之半導體元件。 再者，在本發明裡，導引部可能是多數形成在基 板上的球狀突出部，因此當半導體元件被設置在導引 部裡時，每一個球狀突出部被置於半導體元件的突出 電極之間。於是，不需加工基板就能形成導引部=如 此縮減預燒板的製造成本。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） .----I ---II--I I ---I----t --------- (請先閱讀背面之注意事項再填寫本頁) 564508 A7 五、發明說明（5 ) 此外’根據本發明的預燒板可包括料構件 從個別的傳導墊延伸至預燒板的背面。因此 由 (請先閲讀背面之注意事項再填寫本頁) ，背部側面以探針接觸該傳導構件而達成電性: 母一個傳導墊。或者，多數 1穿/同可被&供取代傳導 構件，因此探針能直接地接觸半導體元件之突出電 極。 "、此外，根據本發明的另一態樣提供、一個用以測試 半導體元件的方法，其利用上述根據本發明的預燒 板。根據此方法，半導體元件被定置在基板的導引部， 因此半導體元件之突出電極面向於在基板裡形成的傳 導墊。該置於導引部的半導體元件被固定在基板上。 接著’在半導體元件被安裝在其上的預燒板被放於一 個預燒測試裝置裡，以便執行預定的預燒測試。 圖式之簡要說明 第1圖是一個傳統的預燒板之透視圖； 第2圖是一個根據本發明的第一實施例預燒板之一 部分透視圖； 第3圖是一個根據本發明的第一實施例預燒板之一 部分剖面圖； 經濟部智慧財產局員工消費合作社印製 第4圖是一個根據本發明的第二實施例預燒板之一 部分透視圖； 第5圖是一個根據本發明的第二實施例預燒板之一 部分剖面圖； 第6圖是一個根據本發明的第三實施例預燒板之一 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 5645〇8 A75645〇8 A7 V. Description of the invention (1) Background of the invention 1 Technical field of the invention (please read the precautions on the back before filling this page) The present invention relates generally to a method for testing semi-conducting burned plates, and more particularly about A semiconductor to be subjected to a burn-in test; a burn-in board on which the skin is mounted, and a method for testing a semiconductor element using the burn-in board. In the process used to make a semiconductor element, a burn-in test is performed to find possible defects in the semiconductor. The burn-in test is an accelerated test to find out the inherent shortcomings of a semiconductor and the possible traps. In the burn-in test, a semiconductor device to be tested is set to perform a predetermined operation. Because of this, the electrodes of the semiconductor element should be electrically connected. In order to electrically connect the semiconductor element, the semiconductor element is mounted on a burn-in board. That is, a voltage according to a predetermined test pattern is supplied to an electrode of a semiconductor element via a circuit provided on a burn-in board. 2. Description of related skills Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs In general, in a traditional burn-in test, most semiconductor components are installed on a single burn-in board, so most semiconductor components are tested simultaneously. Figure 1 is a perspective view of a conventional burn-in board used for burn-in testing. As shown in FIG. 1, the conventional burn-in board 10 includes a base plate 12 and a plurality of 1C sockets 14 mounted on the base plate 12. A semiconductor element to be tested is housed in each 1C socket 14, and an electrode of the semiconductor element housed in each 1C socket 14 is connected to a respective lead end 14a of each 1C socket 14. -4- This paper size applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 564508 A7 Description of the invention (2) Since each IC socket 14 has the same structure, it will now be described for the sake of convenience A 1C socket 14 is covered by a cover i4b above the 1C socket 14 that houses a semiconductor element. The cover 14b is fixed to the IC socket 14 by a locking member such as a ring buckle. In addition, the lead end 14a of the 'I c socket 14 is individually inserted into a through hole i2a formed in the substrate 12, and it is soldered to an electrode pattern formed on the substrate 12. Therefore, the lead terminals of the IC socket 14 are electrically connected to the respective input terminals 16 of the substrate 12 via the circuit pattern 18 formed on the substrate 12. Thus, a semiconductor element can be inputted from the input terminal 1? Via the 1C socket 14 based on a voltage of a predetermined burn-in waveform. In recent years' semiconductor devices have been miniaturized, and the use of so-called ball grid array (BGA) packages 1C has increased. In addition, BGA packages 1C having spherical electrodes of various pitches and various numbers of spherical electrodes have been developed. Therefore, IC sockets capable of mounting various types of various BGA package ICs have been manufactured. However, high accuracy for the IC socket is needed because the accuracy of connecting a semiconductor device to the IC socket directly affects the accuracy of the burn-in test result. In addition, the structure of the IC socket 14 is complicated because the 1 (: socket 14 includes many components such as a main body, a cover 14b, a buckle, and a wire terminal 14a. Therefore, the 1C socket 14 has a high manufacturing cost. Therefore, it has Most expensive burn-in boards 10 of 1C socket 14 are very expensive. In addition, each time when developing a new BGA package IC20 with a different number of electrodes or different pitch electrodes, it is necessary to produce a product with a degree of i applicable to China Standard (CNS) A4 specification (210 X 297 male f) — — — — — — — — — 1 — — — — -------- β ίιιιιι „(Please read the precautions on the back before filling this page) 564508 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs KI V. Invention Description (3) New burn-in board for 1C socket. This increases the total cost of burn-in test. Furthermore, if the electrode pitch becomes Production of the IC socket itself became more difficult in a few hours. SUMMARY OF THE INVENTION A general object of the present invention is to provide an improved and useful burn-in board and a device for testing a semiconductor device. The above-mentioned problems are eliminated in this semiconductor element. A more specific object of the present invention is to provide an inexpensive burn-in board capable of mounting a semiconductor element having a structure such as In order to achieve the above-mentioned object, according to one aspect of the present invention, a burn-in board is provided, which is used for burn-in test of a semiconductor element (having most of the protruding electrodes on its bottom surface). The burn-in board includes a substrate; a guide integrally formed with the substrate, which guides the semiconductor element so that the semiconductor element is positioned at a predetermined position on the substrate; and most of the conduction provided in the substrate Therefore, when the semiconductor element is placed in a predetermined position, each conductive pad contacts a respective protruding electrode. According to the present invention, the conductive pad is formed in the substrate of the burn-in board so as to become a protruding electrode of the semiconductor element. Electrically connected, and the guide is also formed in the substrate to guide the semiconductor element to an accurate position So, don't provide one as in the traditional burn-in board -------- Order --------- (Please read the notes on the back before filling this page) 564508 Intellectual Property of the Ministry of Economic Affairs A7 b / printed by the Bureau ’s Consumer Cooperative, V. Invention Description (4) 1C socket, the semiconductor component can be installed on the burn-in board. The 1C socket used in the traditional burn-in board is extremely responsible, Therefore, the burn-in board according to the present invention can be produced at a reduced cost. In addition, since the conductive pad and the guide portion are formed by a semiconductor manufacturing technology, the burn-in board according to the present invention can be produced, so that Very small pitch aligned protruding electrode semiconductor elements can be mounted thereon. In the present invention, the guide portion may be an outwardly formed guide recess formed in the substrate of the burn-in board, so an outwardly formed portion of a semiconductor element cooperates with the outwardly formed guide recess. The guide may include an electrode guide recess so that the protruding electrode of the semiconductor element fits therein. Those recesses can be easily formed in the substrate by a conventional semiconductor manufacturing technology. In addition, a part of the substrate in which the conductive pad is formed can be separately produced from a portion where the guide recess or the electrode guide recess is formed outward. These parts of the substrate are fixed to each other to produce a burn-in board. Thus, the burn-in board of the present invention can be manufactured by a simple manufacturing technique. In addition, each of these portions of the substrate can be commonly used in various semiconductor elements having the same outwardly formed portion or the same electrode arrangement. Furthermore, in the present invention, the guide portion may be a ball-shaped protrusion formed on the substrate, so when the semiconductor element is provided in the guide portion, each ball-shaped protrusion is placed on the protrusion of the semiconductor element. Between the electrodes. Therefore, the guide portion can be formed without processing the substrate = thus reducing the manufacturing cost of the burn-in board. This paper size applies to China National Standard (CNS) A4 specification (210 X 297 mm) .---- I --- II--II --- I ---- t --------- (Please read the precautions on the back before filling this page) 564508 A7 V. Description of the invention (5) In addition, the burn-in board according to the present invention may include a material member extending from an individual conductive pad to the back of the burn-in board. Therefore (please read the precautions on the back before filling out this page), the back side contacts the conductive member with a probe to achieve electrical properties: a conductive pad. Alternatively, most of the electrodes can be replaced by the & supply, so the probe can directly contact the protruding electrode of the semiconductor element. " Further, according to another aspect of the present invention, there is provided a method for testing a semiconductor element, which utilizes the burn-in board according to the present invention described above. According to this method, the semiconductor element is positioned on the guide portion of the substrate, so that the protruding electrode of the semiconductor element faces the conductive pad formed in the substrate. The semiconductor element placed on the guide portion is fixed on a substrate. Then, the burn-in board on which the semiconductor element is mounted is placed in a burn-in test device so as to perform a predetermined burn-in test. Brief Description of the Drawings Fig. 1 is a perspective view of a conventional burn-in plate; Fig. 2 is a perspective view of a part of a burn-in plate according to a first embodiment of the present invention; A partial cross-sectional view of a burn-in board according to an embodiment; printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs; FIG. 4 is a partial perspective view of a burn-in board according to a second embodiment of the present invention; and FIG. 5 is a view according to the present invention. A partial cross-sectional view of a second embodiment of the burn-in plate; FIG. 6 is one of the third embodiment of the burn-in plate according to the present invention. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm). 5645〇8 A7
五、發明說明（6 ) 部分透視圖； 第7圖是一個根據本發明的第三實施例預燒板之一 部分剖面圖； 第8圖是一個根據本發明的第四實施例預燒板之一 部分剖面圖； 第9圖是一個用以解釋根據本發明第四實施例預燒 板的分層結構之圖解；5. Description of the invention (6) Partial perspective view; Figure 7 is a partial cross-sectional view of a burn-in plate according to a third embodiment of the present invention; Figure 8 is a part of a burn-in plate according to a fourth embodiment of the present invention Fig. 9 is a diagram for explaining a layered structure of a burn-in board according to a fourth embodiment of the present invention;
B 第10圖是一個用以解釋根據本發明安裝BGA封裝IC 至根據本發明之一個預燒板上的操作之圖解； 第11圖是一個根據本發明的第五實施例預燒板之 一部分透視圖； 第12圖是一個根據本發明的第五實施例預燒板之 一部分剖面圖； 第13圖是一個根據本發明的第六實施例預燒板之 一部分剖面圖； g 第14圖是一個根據本發明的第七實施例預燒板之 一部分透視圖； 第15圖是一個根據本發明的第七實施例預燒板之 一部分剖面圖； 第1 6圖是一個根據本發明的第八實施例預燒板之 一部分剖面圖； 第17圖是一個根據本發明的第九實施例預燒板之 一部分透視圖‘； 第18圖是一個根據本發明的第九實施例預燒板之 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -------------05^--- (請先閱讀背面之注意事項再填寫本頁) ί 言 Γ 564508 Α7 Β7 經濟部智慧財產局員工消費合作社印製 五、發明說明（7 ) 一部分剖面圖’ 第19圖是一個根據本發明的第十實施例預燒板之 一部分剖面圖； 第20圖是一個根據本發明的第十一實施例預燒板 之一部分透視圖； 第21圖是一個根據本發明的第十一實施例預燒板 之一部分剖面圖； 第22圖是一個根據本發明的第十二實施例預燒板 之一部分分解透視圖；及 第2 3圖是^一個根據本發明的第十三實施例之預燒 板的分解透視圖。 較佳實施例之詳細描述 現將參考第2及3圖描述根據本發明的第一實施例 之預燒板。 第2圖是形成在根據本發明第一實施例之預燒板3〇 裡的封裝1C安裝部分之透視圖。第3圖是第2圖所示之 封襞1C安裝部分之剖面圖。多數BGA封裝IC20能被安 裝在根據本發明第一實施例之預燒板3〇上。第2圖顯 示BGA封裝IC20之一被安裝在其上的部分。應注意的 是除了預燒板30的封裝1C安裝部分以外的部分之結構 是相同於傳統預燒板1 〇的結構，且其描述將會被省 略。 如第2圖所示，一個iC插座不是被安裝在預燒板3〇 上’而是根據本實施例，BGA封裝IC20能直接地被安 ____ ·_ -10- 本紙張尺度適用標準（CNS)AIi^7iFx 297公il- i 4 --------------------訂--------- (請先閱讀背面之注意事項再填寫本頁) 5645〇8 齊 慧 材 ί % 員 X 消 費 合 S 社 印 製 A7 _ Β7 五、發明說明（8 ) 裝在預燒板30的基板32上。該基板32是由一個典型的 電路板材料之環氧玻璃材料所製成。一個導引凹處34 是在基板32裡形成因此bga封裝IC20與導引凹處34呈 配合狀態。亦即，導引凹處34藉由導引一個BGA封裝 IC20之向外形成部而定位BGA封裝IC2〇在一個預定的 位置上。多數球形導引凹處36在該導引凹處34的底面 形成。此外’一個傳導墊38在每一個球形導引凹處36 響 的底面形成。 球形導引凹處36被形成在一個對應於每個在bga封 裝IC20上形成之球形電極（突出電極）22的位置。球形 導引凹處36的直徑稍微大於每一個球形電極22的直 徑。因此，每一個球形電極裝配於個別的一個球形導 引凹處36中’呈BGA封裝IC20與導引凹處34配合的狀 態。在此狀態下，每一個球形電極22接觸被形成在各 自的一個球形導引凹處36底面上的傳導墊38。 鲁 傳導塾38透過一個形成在基板32上的電路圖案而 電性連接至一個預燒板3〇的輸入端子（沒有顯示於圖 中）°此外，一個推壓板40被置放在BGA封裝IC20上， 其被容納在導引凹處34裡。推壓板4〇藉由諸如環扣42 的固定工具而與基板32嚙合。因此，BGA封裝IC20被 維持在導引凹處34中。亦即，每一個球形電極22被維 持與各自的一個傳導墊38接觸。因此，具有預定圖案 的預燒測試電壓能從該電性連接至傳導墊38的輸入端 子提供給該BGA封裝IC20。應注意的是除了使用環扣42 ---I---I----- · I I I----訂--------- (請先閱讀背面之注音？事項再填寫本頁} -11- 564508 A7 ___B7 _____ 五、發明說明（9 ) 的方法以外的各種方法可能被用來做推壓板40的接 合。 (請先閱讀背面之注咅？事項再填寫本頁) 如上所述的，在本實施例中，導引凹處34及球形 導引凹處36直接形成於預燒板30的基板32。因此，BGA 封裝IC20不需使用一個在傳統預燒板中的1C插座就能 被安裝在預燒板30上。基板32能利用電路板的傳統製 造技術而以低成本容易地製造出。此外，因為導引凹 處36及傳導墊38能由一個電路板製造技術生產，所以 導引凹處36及傳導墊38能在高準確度下被生產。因 此，預燒板3 0能處理一個具有呈小間距排列的電極之 BGA封裝1C。 應注意的是在該導引凹處34及該BGA封裝1C之間的 配合準確度較好是比該球形導引凹處36及該球形電極 22之間的配合準確度更寬鬆。較佳的是該導引凹處34 的深度被設定，以便在該BGA封裝IC20被導引凹處34 導引至大略的位置之後，該BGA封裝IC20被導引至一 個準確的位置。 經濟部智慧財產局員工消費合作社印製 現將參考第4及5圖描述本發明的第二實施例。第4 圖是一個根據本發明第二實施例預燒板30A的一部分 透視圖。第5圖是一個根據本發明第二實施例預燒板 30A的一部分剖面圖。在第4及5圖中，相同於第2及3 圖所顯示的部分之部分被給予相同的參考數字，且其 描述將會被省略。B FIG. 10 is a diagram for explaining the operation of mounting a BGA package IC to a burn-in board according to the present invention; FIG. 11 is a perspective view of a part of a burn-in board according to a fifth embodiment of the present invention Figure 12 is a partial cross-sectional view of a burn-in plate according to a fifth embodiment of the present invention; Figure 13 is a partial cross-sectional view of a burn-in plate according to a sixth embodiment of the present invention; g Figure 14 is a A partial perspective view of a burn-in plate according to a seventh embodiment of the present invention; FIG. 15 is a partial cross-sectional view of a burn-in plate according to a seventh embodiment of the present invention; FIG. 16 is an eighth embodiment of the burn-in board according to the present invention Fig. 17 is a partial perspective view of a burn-in board according to a ninth embodiment of the present invention; Fig. 18 is a paper of a burn-in board according to a ninth embodiment of the present invention; Standards are applicable to China National Standard (CNS) A4 specifications (210 X 297 mm) ------------- 05 ^ --- (Please read the precautions on the back before filling this page) ί 言Γ 564508 Α7 Β7 Employee Consumption of Intellectual Property Bureau, Ministry of Economic Affairs (5) Partial cross-sectional view of the invention description (7) Figure 19 is a partial cross-sectional view of a burn-in plate according to a tenth embodiment of the present invention; Figure 20 is an eleventh embodiment according to the present invention A perspective view of a part of a burn-in plate; FIG. 21 is a partial cross-sectional view of a burn-in plate according to an eleventh embodiment of the present invention; FIG. 22 is a partial exploded view of a burn-in plate according to a twelfth embodiment of the present invention A perspective view; and FIGS. 23 are exploded perspective views of a burn-in plate according to a thirteenth embodiment of the present invention. Detailed Description of the Preferred Embodiment A burn-in plate according to a first embodiment of the present invention will now be described with reference to Figs. FIG. 2 is a perspective view of a mounting portion of a package 1C formed in a burn-in board 30 according to the first embodiment of the present invention. Fig. 3 is a sectional view of the mounting portion of the seal 1C shown in Fig. 2. Most BGA package ICs 20 can be mounted on the burn-in board 30 according to the first embodiment of the present invention. Fig. 2 shows a portion on which one of the BGA package ICs 20 is mounted. It should be noted that the structure of the parts other than the package 1C mounting portion of the burn-in board 30 is the same as that of the conventional burn-in board 10, and its description will be omitted. As shown in Figure 2, an iC socket is not installed on the burn-in board 30, but according to this embodiment, the BGA package IC20 can be directly installed ____ · _ -10- This paper standard applies to the standard (CNS ) AIi ^ 7iFx 297 male il- i 4 -------------------- Order --------- (Please read the precautions on the back before filling (This page) 5645〇8 Qi Huicai %% X Consumer He S printed A7 _ Β7 V. Description of the invention (8) It is mounted on the base plate 32 of the burn-in board 30. The substrate 32 is made of a glass epoxy material which is a typical circuit board material. A guide recess 34 is formed in the substrate 32 so that the bga package IC 20 and the guide recess 34 are in a mated state. That is, the guide recess 34 positions the BGA package IC 20 at a predetermined position by guiding an outwardly formed portion of a BGA package IC 20. A plurality of spherical guide recesses 36 are formed on the bottom surface of the guide recess 34. In addition, a conductive pad 38 is formed on the bottom surface of each spherical guide recess 36. The spherical guide recess 36 is formed at a position corresponding to each of the spherical electrodes (protruding electrodes) 22 formed on the bga package IC 20. The diameter of the spherical guide recess 36 is slightly larger than the diameter of each spherical electrode 22. Therefore, each spherical electrode is assembled in an individual spherical guide recess 36 'in a state where the BGA package IC 20 and the guide recess 34 are fitted. In this state, each spherical electrode 22 contacts a conductive pad 38 formed on the bottom surface of a respective spherical guide recess 36. Lu conductive 塾 38 is electrically connected to the input terminal of a burn-in board 30 through a circuit pattern formed on the substrate 32 (not shown). In addition, a push plate 40 is placed on the BGA package IC20 It is accommodated in the guide recess 34. The pressing plate 40 is engaged with the base plate 32 by a fixing tool such as a ring buckle 42. Therefore, the BGA package IC 20 is maintained in the guide recess 34. That is, each spherical electrode 22 is maintained in contact with a respective one of the conductive pads 38. Therefore, a burn-in test voltage having a predetermined pattern can be supplied from the input terminal electrically connected to the conductive pad 38 to the BGA package IC 20. It should be noted that in addition to using the ring buckle 42 --- I --- I ----- II I ---- Order --------- (Please read the note on the back? Matters before filling This page} -11- 564508 A7 ___B7 _____ V. Various methods other than the method of the invention description (9) may be used to join the push plate 40. (Please read the note on the back first? Matters before filling this page) As above As mentioned, in this embodiment, the guide recess 34 and the spherical guide recess 36 are directly formed on the substrate 32 of the burn-in board 30. Therefore, the BGA package IC 20 does not need to use a 1C in a conventional burn-in board. The socket can be mounted on the burn-in board 30. The substrate 32 can be easily manufactured at a low cost using the conventional manufacturing technology of the circuit board. In addition, since the guide recess 36 and the conductive pad 38 can be manufactured by one circuit board Production, so the guide recess 36 and the conductive pad 38 can be produced with high accuracy. Therefore, the burn-in board 30 can process a BGA package 1C with electrodes arranged in a small pitch. It should be noted that The accuracy of the fit between the recess 34 and the BGA package 1C is better than that between the spherical guide recess 36 and the spherical electrode 22 The fitting accuracy is more loose. It is preferable that the depth of the guide recess 34 is set so that after the BGA package IC 20 is guided to the approximate position by the guide recess 34, the BGA package IC 20 is guided to An accurate location. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs will now describe a second embodiment of the present invention with reference to Figures 4 and 5. Figure 4 is a portion of a burn-in plate 30A according to a second embodiment of the present invention Perspective view. Fig. 5 is a partial cross-sectional view of a burn-in plate 30A according to a second embodiment of the present invention. In Figs. 4 and 5, the same parts as those shown in Figs. 2 and 3 are given the same reference. Numbers and their descriptions will be omitted.
在本實施例中，基板32被分為各別生產的墊板32A -12- 本紙張尺度$用中國國家標準（CNS)A4規格（21() x 297公爱） 一 " " 564508 A7 B7 五、發明說明（10 ) (請先閱讀背面之注意事項再填寫本頁) 及向外形成導引板32C。傳導墊38形成於墊板32A上。 導引凹處34在向外形成導引板32C裡形成。預燒板30A 並未設有第一實施例所提供之球形導引凹處36。亦 即，BGA封裝IC20的定位是由導引凹處34單獨執行。 因此，在本實施例中，在導引凹處34及BGA封裝IC20 的向外形成部之間的配合應是比在第一次實施例中的 還緊密。 § 墊板32A及向外形成導引板32C被各別地生產，且 以黏合膠互相固定在一起。因此，若具有不同電極排 列或不同電極數目的BGA封裝1C，該向外形成導引板 32C能共同地使用於此種BGA封裝1C。亦即，一個具有 不同電極結構的BGA封裝1C能藉由只生產對應於具有 不同電極結構的BGA封裝1C的墊板32A而被安裝。於 是，預燒板的製造成本能被縮減。 因此，藉由使墊板32A及向外形成導引板32C互相 固定在一起（使用諸如嫘絲的固定構件），不同的墊板 B 能被固定在相同的向外形成導引板32C上，因此預燒 板可被改變成用於一個不同的BGA封裝1C。 瘦齊郎智慧財產局員工消費合作社印製 應注意的是在本實施例及下述的實施例中’ B G A封 裝IC20能由推壓板40及在第3圖所示的環扣42固定， 且其在圖中的說明被省略。 現將參考第6及7圖描述本發明的第三實施例。第6 圖是一個根據本發明的第三實施例預燒板30B的一部 分透視圖。第7圖是根據本發明的第三實施例預燒板 -13- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 564508 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（11 ) 3(^的一部分剖面圖。在第6及7圖中，相同於第2及3 圖中所顯示的部分之部分被給予相同的參考數字，且 其描述將會被省略。 在本實施例中，基板32被分為互相各別生產的墊 板32A及電極導引板32B。傳導墊38是在墊板32A上形 成。球形導引凹處36是在電極導引板32B中形成。在 本實施例中，上述第一實施例中所提供的導引凹處未 被提供。亦即，BGA封裝IC20的定置是由球形導引凹 處3 6所執行。 墊板32Α及電極導引板32Β是各別地被生產，且由 黏合膠使其互相固定。因此，若有不同向外形成部或 不同尺寸的BGA封裝IC時，只要球形電極的排列是相 同的’該預燒板3 Ο Β就能普遍地被使用。此外，若具 有相同排列的球形電極2 2但不同數目的球形電極2 2之 BGA封裝1C，預燒板30Β能由生產電極導引板32Β以改 變墊板32Α而普遍地被使用，以便使其配合於具有大 數目的球形電極22之BGA封裝1C。因此，能在低成本 下製造出預燒板30Β。 現將參考第8圖描述本發明的第四實施例。第8圖 是一個根據本發明的第四實施例預燒板30C的一部份 透視圖。在第8圖中，相同於第2及3圖所顯示的部分 之部分被給予相同的參考數字，且其描述將會被省 略0 在本實施例裡’基板3 2被分為互相各別被生產的 -14- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） --------------------訂------— (請先閱讀背面之注意事項再填寫本頁) 5645〇8 A7 ___B7__ 五、發明說明（12 ) (請先閲讀背面之注意事項再填寫本頁) 墊板32A、電極導引板32B及向外形成導引板32C。傳 導墊38在墊板32A上形成。球形導引凹處36在電極導 引板32B裡形成。導引凹處在向外形成導引板32C裡形 成。亦即，除了基板3 2是由組裝各別被生產的墊板 32A、電極導引板32B、向外形成導引板32C所產生的 之外’根據本貫施例的預燒板3 〇 c具有如根據上述第 一實施例預燒板之相同結構。因此，根據本實施例的 預燒板30C具有上述第二及第三實施例兩者的效果。 於是，根據本實施例的預燒板3〇C能在低成本下被生 產’且其此夠處理一個具有呈小間距排列的電極之Bga 封裝1C。 經 濟 部 智 慧 財 產 局 員 工 消 費 合 作 社 印 製 第9圖是一個用以更詳細解釋預燒板3〇c之剖面 圖。如第9圖所示，預燒板32的墊板32A被分為三層， 以便形成電路圖案，用以電性連接每一個傳導塾38至 預燒板30C的輸入端子。該電路圖案在此三層的每一 層上形成，且每一層的電路圖案由貫穿孔46所連接。 藉由提供貫穿孔及提供電鍍在每一個貫穿孔内部表面 上’用以電性連接在分層電路板的上、下層之間的電 路圖案之方法在此技藝中是已知的，且其描述將會被 省略。此外，一個貫穿孔46在與每一個傳導墊38垂直 的方向延伸，因此每一個傳導墊38被連接到在一個欲 得的分層上形成之電路圖案。如以上的描述，塾板32 的電路圖案不只被用來連接每一個傳導墊38與預燒板 3 0C的輸入端子，並且被用來形成驅動電路的一部分 -15· 本紙張尺>^適用中國國家標準（CNS)A4規格（210 X 297公釐） 564508 經濟部智慧財產局員工消費合作社印製 A7 五、發明說明（l3 ) (例如電阻器及電容器），該驅動電路驅動被安裝在預 燒板30C上的BGA封裝IC20。 第10圖是一個用以解釋一個根據本發明的第一及 第四實施例而安裝BGA封裝IC2〇至預燒板的操作之圖 解。首先，如第10(a)圖所示，BGA封裝1(：2〇被輸送到 預燒板上BGA封裝IC20欲安裝在其上的部分的正上方 位置。因為具有幾乎和BGA封裝IC20相同尺寸之導引 凹處34形成於BGA封裝IC20欲安裝在其上的部分，所 以BGA封裝IC20欲安裝在其上的部分能容易辨別。隨 後’如第10(b)圖所示，BGA封裝IC20被插入導引凹處 34。此時，BGA封裝IC20的向外形部成鬆動地配合於 導引凹處34中，所以BGA封裝IC20的初步定位被完成。 在這情況裡，BGA封裝IC20的球形電極22沒有完全地 配合於各自的球形導引凹處36。當BGA封裝IC20更進 一步的向下移動時，每一個球形電極22接觸個別的一 個把傳導墊38，其形成於球形導引凹處36的底部（如 第10 (c)圖所示）。之後，如第3圖所示，推壓板40被 置放在BGA封裝IC20上，且BGA封裝IC20由環扣42固定 在基板32上。 如上所述的，在第一及第四實施例中，一個初步 定位是由使用一個BGA封裝IC20的向外形成部所完 成’且之後一個精確定位是利用球形電極22的向外形 成部所完成。因此，該BGA封裝IC20能被容易地導入 準確的位置。 -16· 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） f ♦ — — — — — — · 11--!-訂· — — —--11 (請先閱讀背面之注意事項再填寫本頁) 564508 A7 B7 五、發明說明（14 ) (請先閱讀背面之注意事項再填寫本頁) 現將參考第11及12圖描述本發明的第五實施例。 第11圖是一個根據本發明的第五實施例預燒板3〇D之 一部分透視圖。第1 2圖是一個根據本發明的第五實施 例預燒板30D之一部分剖面圖。在第丨丨及12圖中，相 同於第6及7圖所示的部分之部分被給予相同的參考數 字，且其描述將會被省略。 根據本實施例的預燒板30D具有如根據第三實施例 § 的預燒板30B之相同結構，除了其球形導引凹處⑽是 由球形導引凹處48所取代。亦即，每個導引各自的一 個球形電極22的球形導引凹處36是由具有一般矩形的 球形導引凹處48所取代。球形導引凹處48容納所有被 k供給BGA封裝IC20之球形電極22。亦即，球形導引 凹處48的形狀大致等同於一個位於最外位置上由球形 電極2 2所界定的形狀。 在本實施例裡，基板32 ,相似於在第γ圖裡所示的 & 第三實施例，被分為墊板32Α及電極導引板32Β。傳導 經—部智慧財產局員工消費合作社印製 塾38在塾板32Α上形成《球形導引凹處48在電極導引 板32Α裡形成。在本實施例裡，第一實施例的導引凹 處34不被提供。因此，BGA封裝IC20的定位是由球形 導引凹處48所單獨完成。 墊板32Α及電極導引板32Β是各別被生產的，且其 被諸如勒合膠的固定構件所互相固定。因此，假如Bga 封裝IC的最外部球形電極的排列是相同的，預燒板可 共同用於具有不同的向外形成部或不同尺寸的BGA封 -17- 本紙張尺度賴巾國國家標準（CNS)A4規格（210 X 297公爱） 564508 A7 B7 五、發明說明（I5 ) 裝IC2 0。於是，根據本實施例的預燒板能在低成本下 被製造出。 (請先閱讀背面之注意事項再填寫本頁) 第1 3圖是一個根據本發明的第六實施例預燒板之 一部分剖面圖。在第13圖中，如同在第8圖所顯示的 部分之部分被給予相同的參考數字，且其描述將會被 省略。 如第13圖所示，根據本實施例的預燒板3〇E具有一 個結構，其中該向外形成導引板32C根據上述第五實 施例而加至預燒板30D。因此，BGA封裝IC20首先由向 外形成導引板32C的向外形成導引凹處34所導引，且 隨後由球形導引凹處48導引至一個準確的位置。 現將參考第14及15描述本發明的第七次實施例。 第14圖是一個根據本發明的第七實施例預燒板3〇F之 一部分透視圖。第1 5圖是一個根據本發明的第七實施 例預燒板30F之一部分剖面圖。在第14及15圖裡，如 同在第2及3圖所顯示的部分之部分被給予相同的參考 數字，且其描述將被省略。 經濟部智慧財產局員工消費合作社印製 根據本實施例的預燒板30F包含該設有多數定位球 50在其上的墊板32A。每一個定位球50具有一個比每 個BGA封裝IC20的球形電極22的高度小之高度（直 徑）。該定位球被裝設在傳導墊38之間（被形成在墊板 32A上）。 在本實施例裡，如在第1 5圖所示，每一個定位球5 〇 的尺寸是被決定的，因此當BGA封裝IC20被安裝在墊 -18 - 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 564508 A7 B7 五、發明說明（1δ ) (請先閱讀背面之注意事項再填寫本頁) 板32A上時，每一個定位球50能被定置在BGA封裝IC20 的球形電極22之間。因此，BGA封裝IC20的球形電極22 能被準確地定位在墊板3 2 A的傳導墊3 8上。每個定位 球50能由在一個焊球上塗一層絕緣保護層而產生。或 者，每一個定位球5 0可為一個具有絕緣特性的球，諸 如塑膠球或橡膠球，其是由黏合膠而固定在墊板32 a 上在傳導墊38之間。 Φ 根據本實施例，因為預燒板30F唯由墊板32A—層 所構成，所以預燒板的製造成本能被縮減。應注意的 是雖然定位球5 0是提供於每個傳導墊3 8之間的空間 裡，但是幾個定位球50就可能足夠使該BGA封裝IC20 定。 第16圖是一個根據本發明第八實施例預燒板之一 部分剖面圖。在第16圖裡，如同在第15及8圖所示的 部分之部分被給予相同的參考數字，且其描述將被省 略0 經t部智慧財產局員工消費合作社印製 如在第16圖所示的，根據本實施例的預燒板3〇G具 有一個結構，其中該向外形成傳導板32C根據上述第 七實施例而加入預燒板30F。因此，該BGA封裝IC20首 先是由向外形成導引板32C的向外形成導引凹處34所 導引’且隨後由定位球5 0導引至一個準確的位置。 現將參考第17及18圖描述本發明的第九實施例。 第1 7圖是一個根據本發明的第九實施例預燒板3〇11之 一部分透視圖。第1 8圖是一個根據本發明的第九實施 -19- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 564508 A7 B7 五、發明說明（17 ) 例預燒板30H之一部分剖面圖。在第17及18圖裡，如 同在第2及3圖所示的部分之部分被給予相同的參考數 字，且其描述將被省略。 一個根據本實施例的預燒板3〇H之結構基本上與根 據第七實施例（在第4及5圖所示）的預燒板3〇A之結構 是相同的。亦即，該預燒板30H的基板32包含墊板32A 及向外形成導引板32C。傳導墊38被形成在墊板32A 上°導引凹處34被形成在向外形成導引板32C裡。在 上述結構中，該預燒板30H設有傳導構件52，如第18 圖所示，其在墊板32A的背面及個別的傳導墊38之間 延伸。傳導構件52在一對一的基準上被提供給傳導塾 38。每一個傳導構件52的一端被接到個別的一個傳導 塾38 ’且每一個傳導構件52的相對端被曝露在墊板38 的背面上，該背面對應於基板32的背面。因此，每一 個被曝露在基板32背面之傳導構件52被電性連接至個 別的一個傳導墊38。於是，一個欲得的球形電極22的 電位能藉由使探針54接觸該傳導構件52之一而被測量 出’該傳導構件5 2被電性連接至與欲得的一個球形電 極22連接之傳導墊38。 現將參考第1 9圖描述本發明的第十實施例。第19 圖是一個根據本發明的第十實施例預燒板301之一部 分剖面圖。在第19圖裡，如同在第18圖所示的部分之 部分被給予相同的參考數字，且其描述將被省略。 一個根據本實施例的預燒板3 01之結構基本上與根 -20- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) -ϋ ·1 ϋ «ϋ n ϋ 1· ·ϋ n nIn this embodiment, the base plate 32 is divided into individual production pads 32A -12- This paper size is in accordance with Chinese National Standard (CNS) A4 specifications (21 () x 297 public love)-"564508 A7 B7 V. Description of the invention (10) (Please read the notes on the back before filling this page) and form the guide plate 32C outwards. The conductive pad 38 is formed on the pad 32A. The guide recess 34 is formed in an outwardly formed guide plate 32C. The burn-in plate 30A is not provided with the spherical guide recess 36 provided in the first embodiment. That is, the positioning of the BGA package IC 20 is performed individually by the guide recess 34. Therefore, in this embodiment, the cooperation between the guide recess 34 and the outwardly formed portion of the BGA package IC 20 should be tighter than that in the first embodiment. § The backing plate 32A and the outwardly forming guide plate 32C are produced separately, and are fixed to each other with an adhesive. Therefore, if the BGA package 1C has a different electrode arrangement or a different number of electrodes, the outwardly formed guide plate 32C can be commonly used in such a BGA package 1C. That is, a BGA package 1C having a different electrode structure can be mounted by producing only a pad 32A corresponding to the BGA package 1C having a different electrode structure. Therefore, the manufacturing cost of the burn-in board can be reduced. Therefore, by fixing the backing plate 32A and the outwardly forming guide plate 32C to each other (using a fixing member such as a reed wire), different backing plates B can be fixed to the same outwardly forming guide plate 32C, Therefore the burn-in board can be changed for a different BGA package 1C. Shou Qilang Intellectual Property Bureau employee consumer cooperative printing should note that in this embodiment and the following embodiments, 'BGA package IC20 can be fixed by the push plate 40 and the ring buckle 42 shown in Figure 3, and its The description in the figure is omitted. A third embodiment of the present invention will now be described with reference to Figs. 6 and 7. Fig. 6 is a partial perspective view of a burn-in plate 30B according to a third embodiment of the present invention. Fig. 7 is the burn-in board according to the third embodiment of the present invention. 13- This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm). V. Description of the invention (11) Partial sectional view of 3 (^. In Figs. 6 and 7, parts that are the same as those shown in Figs. 2 and 3 are given the same reference numerals, and descriptions thereof will be given. In this embodiment, the substrate 32 is divided into a pad 32A and an electrode guide plate 32B produced separately from each other. A conductive pad 38 is formed on the pad 32A. A spherical guide recess 36 is formed on the electrode guide. It is formed in the plate 32B. In this embodiment, the guide recess provided in the above-mentioned first embodiment is not provided. That is, the positioning of the BGA package IC 20 is performed by the spherical guide recess 36. The shim 32A and electrode guide plate 32B are produced separately and fixed to each other by an adhesive. Therefore, if there are different BGA package ICs with different outward forming portions or different sizes, as long as the arrangement of the spherical electrodes is the same ' The burn-in plate 3 〇 Β can be generally used. In addition, if BGA packages 1C having the same arrangement of spherical electrodes 22 but different numbers of spherical electrodes 22, and the burn-in plate 30B can be generally used by producing the electrode guide plate 32B to change the backing plate 32A, so as to fit it with A BGA package 1C of a large number of spherical electrodes 22. Therefore, a burn-in board 30B can be manufactured at a low cost. A fourth embodiment of the present invention will now be described with reference to FIG. 8. FIG. A partial perspective view of the burn-in plate 30C of the fourth embodiment. In FIG. 8, parts that are the same as those shown in FIGS. 2 and 3 are given the same reference numerals, and descriptions thereof will be omitted. In the example, the 'substrate 3 2' is divided into -14 which are produced separately from each other.-This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ------------ -------- Order -------- (Please read the precautions on the back before filling this page) 5645〇8 A7 ___B7__ 5. Description of the invention (12) (Please read the precautions on the back before (Fill in this page) Pad 32A, electrode guide 32B, and outwardly formed guide 32C. Conductive pad 38 is formed on pad 32A. Spherical The guide recesses 36 are formed in the electrode guide plate 32B. The guide recesses are formed in the outward guide plate 32C. That is, in addition to the substrate 32, the pad 32A and the electrode guide are separately produced by assembling The plate 32B and the outside generated by forming the guide plate 32C outwardly 'The burn-in plate 3 c according to the present embodiment has the same structure as the burn-in plate according to the first embodiment described above. Therefore, according to the present embodiment, The burn-in plate 30C has the effects of both the above-mentioned second and third embodiments. Therefore, the burn-in plate 30C according to this embodiment can be produced at a low cost, and it is sufficient to handle one with a small pitch arrangement. The electrodes of the Bga package are 1C. Printed by the Consumer Affairs Agency of the Intellectual Property Bureau of the Ministry of Economic Affairs. Figure 9 is a cross-sectional view for explaining the burn-in board 30c in more detail. As shown in FIG. 9, the pad 32A of the burn-in board 32 is divided into three layers to form a circuit pattern for electrically connecting each of the conductive pads 38 to the input terminals of the burn-in board 30C. The circuit pattern is formed on each of the three layers, and the circuit pattern of each layer is connected by the through hole 46. A method for electrically connecting circuit patterns between upper and lower layers of a layered circuit board by providing through holes and providing plating on the inner surface of each through hole is known in the art, and its description Will be omitted. Further, a through-hole 46 extends in a direction perpendicular to each of the conductive pads 38, so that each of the conductive pads 38 is connected to a circuit pattern formed on a desired layer. As described above, the circuit pattern of the fascia board 32 is not only used to connect each of the conductive pads 38 to the input terminals of the burn-in board 3 0C, and is also used to form a part of the driving circuit. -15 · This paper rule > China National Standard (CNS) A4 specification (210 X 297 mm) 564508 Printed by A7 of the Intellectual Property Bureau of the Ministry of Economic Affairs, Consumer Cooperatives V. Invention Description (l3) (such as resistors and capacitors). BGA package IC20 on board 30C. Fig. 10 is a diagram for explaining an operation of mounting a BGA package IC 20 to a burn-in board according to the first and fourth embodiments of the present invention. First, as shown in FIG. 10 (a), the BGA package 1 (: 2〇 is transported to the portion directly above the portion on which the BGA package IC20 is to be mounted. Because it has almost the same size as the BGA package IC20 The guide recess 34 is formed at the portion where the BGA package IC20 is to be mounted, so the portion where the BGA package IC20 is to be mounted can be easily identified. Subsequently, as shown in FIG. 10 (b), the BGA package IC20 is Insert the guide recess 34. At this time, the outward shape of the BGA package IC20 fits loosely into the guide recess 34, so the preliminary positioning of the BGA package IC20 is completed. In this case, the spherical electrode of the BGA package IC20 22 does not completely fit into the respective spherical guide recesses 36. When the BGA package IC 20 moves further down, each spherical electrode 22 contacts a separate one of the conductive pads 38, which are formed in the spherical guide recesses 36 (As shown in FIG. 10 (c)). Then, as shown in FIG. 3, the push plate 40 is placed on the BGA package IC20, and the BGA package IC20 is fixed on the substrate 32 by the ring buckle 42. As above As mentioned, in the first and fourth embodiments, a preliminary positioning This is done by using an outward forming portion of a BGA package IC20 'and then a precise positioning is done using an outward forming portion of the ball electrode 22. Therefore, the BGA package IC20 can be easily introduced into an accurate position. -16 · This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) f ♦ — — — — — — · 11-!-Order · — —-11 Fill out this page) 564508 A7 B7 V. Description of the invention (14) (Please read the notes on the back before filling out this page) The fifth embodiment of the present invention will now be described with reference to Figures 11 and 12. Figure 11 is based on A partial perspective view of a burn-in plate 30D according to a fifth embodiment of the present invention. Figure 12 is a partial cross-sectional view of a burn-in plate 30D according to a fifth embodiment of the present invention. In FIGS. Parts that are the same as those shown in FIGS. 6 and 7 are given the same reference numerals, and descriptions thereof will be omitted. The burn-in plate 30D according to this embodiment has a burn-in plate 30B according to the third embodiment § The same structure, except that its spherical guide recess is It is replaced by a spherical guide recess 48. That is, each spherical guide recess 36 of each spherical electrode 22 is replaced by a spherical guide recess 48 having a generally rectangular shape. 48 accommodates all the spherical electrodes 22 supplied to the BGA package IC 20. That is, the shape of the spherical guide recess 48 is substantially equal to the shape defined by the spherical electrode 22 at the outermost position. In this embodiment, The substrate 32 is similar to the & third embodiment shown in Fig. Γ, and is divided into a backing plate 32A and an electrode guide plate 32B. Conducted by the Ministry of Intellectual Property Bureau, printed by the Consumer Cooperative Cooperative. 塾 38 is formed on the cymbal plate 32A. A spherical guide recess 48 is formed in the electrode guide plate 32A. In this embodiment, the guide recess 34 of the first embodiment is not provided. Therefore, the positioning of the BGA package IC 20 is performed by the spherical guide recess 48 alone. The backing plate 32A and the electrode guide plate 32B are produced separately, and they are fixed to each other by a fixing member such as a glue. Therefore, if the arrangement of the outermost spherical electrodes of the Bga package IC is the same, the burn-in board can be used together for BGA packages with different outward forming parts or different sizes. ) A4 specification (210 X 297 public love) 564508 A7 B7 5. Description of the invention (I5) Install IC2 0. Therefore, the burn-in board according to this embodiment can be manufactured at a low cost. (Please read the precautions on the back before filling out this page.) Figure 13 is a sectional view of a part of a burn-in board according to a sixth embodiment of the present invention. In Fig. 13, the same reference numerals are given to the parts as shown in Fig. 8, and descriptions thereof will be omitted. As shown in Fig. 13, the burn-in plate 30E according to the present embodiment has a structure in which the outwardly formed guide plate 32C is added to the burn-in plate 30D according to the fifth embodiment described above. Therefore, the BGA package IC 20 is first guided by the outwardly formed guide recesses 34 forming the guide plate 32C outwards, and then guided by the spherical guide recesses 48 to an accurate position. A seventh embodiment of the present invention will now be described with reference to the 14th and 15th. Fig. 14 is a perspective view of a part of a burn-in plate 30F according to a seventh embodiment of the present invention. Fig. 15 is a partial sectional view of a burn-in plate 30F according to a seventh embodiment of the present invention. In Figures 14 and 15, the same reference numerals are given to the same parts as those shown in Figures 2 and 3, and descriptions thereof will be omitted. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs The burn-in plate 30F according to this embodiment includes the pad 32A provided with a plurality of positioning balls 50 thereon. Each positioning ball 50 has a height (diameter) smaller than the height of the spherical electrode 22 of each BGA package IC 20. The positioning ball is installed between the conductive pads 38 (formed on the pad 32A). In this example, as shown in Figure 15, the size of each positioning ball 50 is determined, so when the BGA package IC20 is installed on the mat-18-this paper size applies the Chinese National Standard (CNS) A4 specifications (210 X 297 mm) 564508 A7 B7 V. Description of the invention (1δ) (Please read the precautions on the back before filling out this page) When the board 32A, each positioning ball 50 can be fixed on the BGA package IC20 Between the spherical electrodes 22. Therefore, the spherical electrode 22 of the BGA package IC 20 can be accurately positioned on the conductive pad 38 of the pad 3 2 A. Each positioning ball 50 can be produced by coating a solder ball with an insulating protective layer. Alternatively, each of the positioning balls 50 may be a ball having insulation characteristics, such as a plastic ball or a rubber ball, which is fixed on the pad 32a between the conductive pads 38 by an adhesive. Φ According to the present embodiment, since the burn-in plate 30F is composed of only the backing plate 32A-layer, the manufacturing cost of the burn-in plate can be reduced. It should be noted that although the positioning balls 50 are provided in the space between each of the conductive pads 38, several positioning balls 50 may be enough to make the BGA package IC20 fixed. Fig. 16 is a partial sectional view of a burn-in plate according to an eighth embodiment of the present invention. In Fig. 16, the same reference numerals are given as in the parts shown in Figs. 15 and 8, and descriptions thereof will be omitted. 0 Printed by the Intellectual Property Bureau employee consumer cooperative as shown in Fig. 16 As shown, the burn-in plate 30G according to this embodiment has a structure in which the conductive plate 32C formed outward is added to the burn-in plate 30F according to the seventh embodiment described above. Therefore, the BGA package IC 20 is first guided by the outwardly formed guide recess 34 forming the guide plate 32C outwardly, and then guided by the positioning ball 50 to an accurate position. A ninth embodiment of the present invention will now be described with reference to Figs. 17 and 18. Fig. 17 is a perspective view of a part of a burn-in plate 3101 according to a ninth embodiment of the present invention. Figure 18 is a ninth implementation according to the present invention. -19- This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 564508 A7 B7 5. Description of the invention (17) Example burn-in plate 30H Partial sectional view. In Figs. 17 and 18, the same reference numerals are given to the same parts as those shown in Figs. 2 and 3, and descriptions thereof will be omitted. The structure of a burn-in plate 30H according to this embodiment is basically the same as that of the burn-in plate 30A according to the seventh embodiment (shown in Figs. 4 and 5). That is, the substrate 32 of the burn-in plate 30H includes a pad plate 32A and a guide plate 32C formed outward. A conductive pad 38 is formed on the pad 32A. A guide recess 34 is formed in an outwardly formed guide plate 32C. In the above structure, the burn-in plate 30H is provided with a conductive member 52, as shown in Fig. 18, which extends between the back surface of the pad 32A and the individual conductive pads 38. The conductive member 52 is provided to the conductive roller 38 on a one-to-one basis. One end of each conductive member 52 is connected to an individual one of the conductive pads 38 'and the opposite end of each conductive member 52 is exposed on the back surface of the pad 38, which back surface corresponds to the back surface of the substrate 32. Therefore, each of the conductive members 52 exposed on the back surface of the substrate 32 is electrically connected to a separate one of the conductive pads 38. Then, the potential of a desired spherical electrode 22 can be measured by bringing the probe 54 into contact with one of the conductive members 52. 'The conductive member 52 is electrically connected to a desired spherical electrode 22' Conductive pad 38. A tenth embodiment of the present invention will now be described with reference to Figs. Fig. 19 is a partial sectional view of a burn-in plate 301 according to a tenth embodiment of the present invention. In FIG. 19, the same reference numerals are given to portions as those shown in FIG. 18, and descriptions thereof will be omitted. The structure of a burn-in board 3 01 according to this embodiment is basically the same as the root -20- This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) Page) -ϋ · 1 ϋ «ϋ n ϋ 1 · · ϋ nn
Sr. 經濟部智慧財產局員工消費合作社印製 564508 Α7 Β7 五、發明說明（is ) (請先閲讀背面之注意事項再填寫本頁) 據第九實施例的預燒板30H(第18圖所示）之結構是相 同的。亦即，該預燒板301的基板32包含墊板32A及向 外形成導引板32C。該傳導墊38被形成在墊板32A上。 該導引凹處34被形成在向外形成導引板32C裡。此外， 該預燒板30H設有傳導構件52，其在該墊板32A的背面 及該個別的傳導墊38之間延伸。在本實施例裡，一個 探針導引板56被提供在該墊板32A的背面上。 Φ 該探測導引板56由黏劑固定在該墊板32A上。該探 測導引板5 6設有多數探測導入孔5 8在對應於傳導構件 5 2的位置上。每一個探測導入孔5 8是一個具有比探針 54的直徑大的内徑之貫穿孔。因此，該探針54能容易 地被31導至連接於該傳導墊38之一的傳導構件52，且 該傳導墊38的電壓藉由將該探針54插入個別的一個探 測導入孔58而測量出。此外，該探針54被防止錯誤的 接觸於一個相鄰於欲被接觸的傳導構件5 2的傳導構件 52 〇 m 經t部智慧財產局員工消费合作社印製 現將參考第20及21圖描述本發明的第十一實施 例。第20圖是一個根據本發明的第十一實施例預燒板 3 0 J之一部分透視圖。第21圖是一個根據本發明的第 Η 實施例的預燒板3 0 J之一部分剖面圖。在第2 〇及21 圖裡，如同在第2及3圖所示的部份之部分被給予相同 的參考數字，且其描述將被省略。 根據本實施例的預燒板3 0 J之結構基本上與根據第 二實施例（在第4及5圖所示）的預燒板3〇Α之結構相 -21- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 5645〇8 A7 B7 五、發明說明（I9 ) (請先閱讀背面之注意事項再填寫本頁) 同。亦即，該預燒板30 J的基板32包含墊板32A及向外 形成導引板32C。傳導墊38形成於墊板32A上。導引凹 處34形成於向外形成導引板32(>在上述結構裡，該 預燒板30J設有探測導引孔60，其在墊板3以的背面及 個別的傳導墊38(如第21圖所示）之間延伸。該探測導 引孔60以一對一的基準被提供給傳導墊38。每一個探 測導引孔60的一端開口實質上是在個別的一個傳導墊 38的中心，及探測導引孔6〇的另一端開口是在該墊板 3 2A的背面（其是該基板32的背面）。因此，該探針54 能藉由插入探針54至對應於欲得的電極之一的探測導 引孔6 0而直接接觸欲得的球形電極。亦即，一個欲得 的球形電極之電壓能被直接測量。 現將參考第22圖描述本發明的第十二實施例。第22 圖是一個根據本發明的第十二實施例的預燒板3〇K之 分解透視圖。在本實施例裡，該預燒板3〇κ具有一個 分層結構’且該分層由螺絲互相固定在一起。本實施 例如典型地使用根據第三實施例之預燒板3〇Β的結 構。 經濟部智慧財產局員工消費合作社印製 如第22圖所示，根據本實施例的預燒板3〇κ包含墊 板32Α及電極導引板32Β。該BGA封裝IC20(沒有在圖裡 顯示）被安裝在電極導引板32B上。因此，該推壓板70 被提供至電極導引板32B的每一部分。推壓板70的一 面相對於該電極導引板36的表面被旋轉地支撐。一個 環扣72被提供至該推壓板7〇，使得該環扣72與被形成 — -22-本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐) 經t部智慧財產局員工消費合作社印製 564508 A7 -------------- B7 五、發明說明（2〇 ) 在電極導引板32B上的嚙合部分74相嚙合。在旋轉該 ，學板70而打開球形導引凹處％之後，該bga封裝a別 就被安裝在球形導引凹處36上。在該BGA封裝IC20的 球形電極22被配合在球形導引凹處36裡之後，該推壓 板7〇被置放在BGA封裝IC20上，然後該環扣72與該嚙 合部分74相嚙合。 在本實施例裡，多數螺孔62被形成在每一個墊板Sr. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 564508 Α7 Β7 V. Description of the invention (is) (Please read the precautions on the back before filling this page) According to the ninth embodiment, the burn-in plate 30H (see Figure 18) The structure is the same. That is, the substrate 32 of the burn-in plate 301 includes a pad 32A and a guide plate 32C formed outward. The conductive pad 38 is formed on a pad 32A. The guide recess 34 is formed in an outwardly formed guide plate 32C. In addition, the burn-in plate 30H is provided with a conductive member 52 that extends between the back surface of the pad 32A and the individual conductive pad 38. In the present embodiment, a probe guide plate 56 is provided on the back surface of the backing plate 32A. Φ The detection guide plate 56 is fixed to the pad 32A by an adhesive. The detection guide plate 56 is provided with a plurality of detection introduction holes 5 8 at positions corresponding to the conductive members 52. Each of the probe introduction holes 58 is a through hole having an inner diameter larger than that of the probe 54. Therefore, the probe 54 can be easily guided 31 to a conductive member 52 connected to one of the conductive pads 38, and the voltage of the conductive pad 38 is measured by inserting the probe 54 into an individual probe introduction hole 58 Out. In addition, the probe 54 is prevented from erroneously contacting a conductive member 52 2 adjacent to the conductive member 5 2 to be contacted. It is printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of T. Now it will be described with reference to Figures 20 and 21. An eleventh embodiment of the present invention. Fig. 20 is a partial perspective view of a burn-in plate 30J according to an eleventh embodiment of the present invention. Fig. 21 is a partial cross-sectional view of a burn-in plate 30J according to a Ηth embodiment of the present invention. In Figures 20 and 21, the same reference numerals are given to the parts as shown in Figures 2 and 3, and descriptions thereof will be omitted. The structure of the burn-in plate 3 0 J according to this embodiment is basically the same as that of the burn-in plate 3 OA according to the second embodiment (shown in FIGS. 4 and 5). Standard (CNS) A4 specifications (210 X 297 mm) 5645〇8 A7 B7 V. Description of invention (I9) (Please read the precautions on the back before filling this page) Same. That is, the substrate 32 of the burn-in plate 30J includes a pad plate 32A and a guide plate 32C formed outward. The conductive pad 38 is formed on the pad 32A. The guide recess 34 is formed to form a guide plate 32 outwards (> In the above-mentioned structure, the burn-in plate 30J is provided with a detection guide hole 60 on the back surface of the pad 3 and an individual conductive pad 38 ( As shown in FIG. 21), the detection guide holes 60 are provided to the conductive pads 38 on a one-to-one basis. One end of each detection guide hole 60 is substantially an individual conductive pad 38 And the other end of the detection guide hole 60 is at the back of the pad 32A (which is the back of the substrate 32). Therefore, the probe 54 can be inserted into the probe The detection guide hole 60 of one of the obtained electrodes directly contacts the desired spherical electrode. That is, the voltage of a desired spherical electrode can be directly measured. The twelfth embodiment of the present invention will now be described with reference to FIG. 22. Embodiment 22. Fig. 22 is an exploded perspective view of a burn-in plate 30K according to a twelfth embodiment of the present invention. In this embodiment, the burn-in plate 30K has a layered structure, and the The layers are fixed to each other by screws. This embodiment typically uses the burn-in according to the third embodiment The structure of 30B. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs as shown in FIG. (Not shown in the figure) is mounted on the electrode guide plate 32B. Therefore, the pressing plate 70 is provided to each part of the electrode guide plate 32B. One side of the pressing plate 70 is opposed to the surface of the electrode guide plate 36. Rotatingly supported. A ring 72 is provided to the pressing plate 70, so that the ring 72 is formed with-22-This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm). Printed by the Consumers' Cooperative of the Ministry of Intellectual Property Bureau 564508 A7 -------------- B7 V. Description of the invention (20) The engaging portion 74 on the electrode guide plate 32B is engaged. After the board 70 is opened and the spherical guide recess is opened, the bga package a is mounted on the spherical guide recess 36. The spherical electrode 22 of the BGA package IC 20 is fitted in the spherical guide recess 36. After that, the pressing plate 70 is placed on the BGA package IC20, and then the ring 72 is engaged with the 74 min engaged. In this embodiment, the majority of each screw hole 62 is formed in a plate
• 32A及電極導引板32B裡。該墊板32A及電極導引板32B 被螺絲64互相固定在一起。該螺絲64被插入墊板“A 及電極導引板32B之各自的螺孔62内，且其被旋進該 底板66(被置放在墊板32的背面上）的螺孔62内。 如上所述，在本實施例裡，因為該墊板32A及電極 導引板32B由螺絲64互相固定在一起，所以該墊板32A 及電極導引板32B能容易地由旋出及移出該螺絲64而 分開。該墊板38設有用以電性連接該傳導墊38至該輸 入端子16之電路圖案，及設有一個用以驅動安裝在預 > 燒板30K上的BGA封裝IC20之驅動電路的一部分。可有 一個該電路模式及電阻器及電容器需被改變的情況， 以便處理各種型式的IC。在如此情況裡，該電極導引 板32B可由只改變該墊板32A而共同地被使用。因此， 當具有相同電極22排列之電極22的規格改變時，不需 重新生產整個預燒板30K。亦即，只有墊板32A被改變。 因此，該預燒板30K的整體製造成本就能被縮減。 應注意的是雖然根據本實施例的螺絲固定結構被 -23- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） --------------裝--------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 564508 經濟部智慧財產局員工消費合作社印製 A7 B7___ 五、發明說明（21 ) 應用於包含墊板32A及電極導引板32B之基板上，但該 螺絲固定結構能被應用於任何其他具有分層結構的預 燒板之實施例。 現將參考第23圖描述本發明的第十三實施例。第23 圖是一個根據本發明的第十三實施例的預燒板3扎之 分解透視圖。在本實施例裡，該預燒板3〇l具有一個 分層結構’且由螺絲使該分層被互相固定在其内。本 實施例使用上述第四實施例（在第8圖顯示）之分層結 構。然而，每個墊板32A及電極導引板32B被分為多數 小的板子，以便每個小板具有對應單一 BGA封裝20的 尺寸。每個小板是由螺絲安裝在向外形成導引板32C 上。 更特定地說，如第23圖所示，多數導引凹處34被 &供在該向外形成導引板32C裡，因此多數BGA封裝 IC (沒有在圖裡顯示）能被安裝在向外形成導引板3 2 c 上®該對應於墊板32A的小板及該對應於電極板32β的 小板被連接到每個向外形成導引板32C的安裝部分。 藉由螺絲80及底座板82，使該對應於墊板32A的小板 及該對應電極板32B的小板被固定在向外形成導引板 32C上，以相同於第22圖所示的第十二實施例之方式。 因此，具有相同向外形成但不同設備或數目的球形電 極之BGA封裝ICs能被安裝在相同預燒板3〇l上。 藉由與墊片84接觸（如在第23圖所示之擴大面圈 所顯示）的連接端子86、被形成在對應於電極導引板 -24- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱) " " - (請先閲讀背面之注意事項再填寫本頁) --4^^ -----丨丨丨訂·—I----線泰 564508 A7 _____ B7 五、發明說明（22 ) 32B的小板上之連接端子86、及被形成在向外形成導 引板32C上的塾片84，其能達成在向外形成導引板32C 及對應於電極導引板32B的小板之間的電性連接。同 樣地，藉由與墊片84接觸（如在第23圖所示之擴大面 圖所顯示）的連接端子86、該被形成在對應於電極導 引板32B的小板上之連接端子86、及被形成在墊板84 上的塾片84 ’其能達成在對應於電極導引板32B的小 • 板及對應墊板3 2 A的小板之間的電性連接。 應注意的是在本實施例裡，被分為小板且由螺絲 固疋在其内之板中的結構被應用至基板32，其包含墊 板32A、電極導引板32B '及向外形成導引板32C。然 而’被分為小板且由螺絲固定在其内之板中的結構能 應用至其他根據上述實施例之預燒板。 本發明不被限制在特定揭露的實施例，且其變化 及修改可在不需背離本發明的範圍做出。 本申請案是基於1 999年4月30日申請之曰本優先申 請案第1 1 -1 250 1 1號，其整個内容被合併於本文中作 為參考。 --— II--------------訂----丨 ---- (請先閱讀背面之注意事項再填寫本頁) 經A部智慧財產局員工消費合作社印製 -25- 564508 A7 B7 五、發明說明（23 ) 經濟部智慧財產局員工消費合作社印製 元件標號對照轰 10 預燒板 12 基板 12a 貫穿子L 14 1C插座 14a 導線端 16 輸入端子 18 電路圖案 20 BGA封裝1C 22 球形電極 30、 30A-30L預燒板 32 基板 32A墊板 32B 電極導引板 32C 向外形成導引板 34 導引凹處 36 球形導引凹處 38 傳導墊 40 推壓板 42 環扣 46 貫穿孔 48 球形導引凹處 50 定位球 52 傳導構件 54 探針 56 探針導引板 58 探針插入孔 60 探針導引孔 62 螺孔 64 螺絲 66 底座板 68 螺孔 70 推壓板 72 環扣 74 嚙合部 80 螺絲 82 底座板 84 墊片 86 連接端 -26- ------------41^--------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）• Inside 32A and electrode guide plate 32B. The pad plate 32A and the electrode guide plate 32B are fixed to each other by screws 64. The screws 64 are inserted into the respective screw holes 62 of the pad plate A and the electrode guide plate 32B, and they are screwed into the screw holes 62 of the base plate 66 (placed on the back surface of the pad plate 32). As above As mentioned above, in this embodiment, since the pad 32A and the electrode guide plate 32B are fixed to each other by a screw 64, the pad 32A and the electrode guide plate 32B can be easily unscrewed and removed by the screw 64. The pad 38 is provided with a circuit pattern for electrically connecting the conductive pad 38 to the input terminal 16 and a driver circuit for driving a BGA package IC20 mounted on a pre-burned board 30K. There may be a case where the circuit mode and resistors and capacitors need to be changed in order to handle various types of ICs. In this case, the electrode guide plate 32B may be used collectively by changing only the pad plate 32A. Therefore, when the specifications of the electrodes 22 having the same electrode 22 arrangement are changed, it is not necessary to re-produce the entire burn-in plate 30K. That is, only the pad 32A is changed. Therefore, the overall manufacturing cost of the burn-in plate 30K can be reduced. It should be noted that although according to this The screw fixing structure of the embodiment is -23- This paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 mm) -------------- install ------ --Order --------- line (please read the notes on the back before filling out this page) 564508 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7___ V. Description of the invention (21) Applicable to include pads The plate 32A and the electrode guide plate 32B are on the substrate, but the screw fixing structure can be applied to any other embodiment of the burn-in plate having a layered structure. A thirteenth embodiment of the present invention will now be described with reference to FIG. 23 Fig. 23 is an exploded perspective view of a burn-in plate 3 in accordance with a thirteenth embodiment of the present invention. In this embodiment, the burn-in plate 301 has a layered structure, and the screw The layers are fixed to each other. This embodiment uses the layered structure of the fourth embodiment (shown in FIG. 8). However, each of the pads 32A and the electrode guide plate 32B is divided into a plurality of small plates. So that each small board has the size corresponding to a single BGA package 20. Each small board is mounted outwards by screws to form a guide board More specifically, as shown in FIG. 23, most of the guide recesses 34 are provided in the outwardly formed guide plate 32C, so most BGA package ICs (not shown in the figure) can be used. Mounted on the outwardly forming guide plate 3 2 c ® The small plate corresponding to the backing plate 32A and the small plate corresponding to the electrode plate 32 β are connected to each of the mounting portions forming the outwardly guiding plate 32C. The screws 80 and the base plate 82 fix the small plate corresponding to the pad plate 32A and the small plate corresponding to the electrode plate 32B to the outwardly formed guide plate 32C, which is the same as the twelfth one shown in FIG. 22 Examples of the way. Therefore, BGA packaged ICs with the same outwardly formed but different devices or numbers of spherical electrodes can be mounted on the same burn-in board 301. The connection terminals 86, which are in contact with the spacer 84 (as shown by the enlarged bezel shown in FIG. 23), are formed in correspondence with the electrode guide plate-24. This paper size applies the Chinese National Standard (CNS) A4 Specifications (210 X 297 public love) " "-(Please read the precautions on the back before filling in this page) --4 ^^ ----- 丨 丨 丨 Order · —I ---- line Thai 564508 A7 _____ B7 V. Description of the invention (22) The connection terminal 86 on the small plate of 32B and the cymbal 84 formed on the outwardly formed guide plate 32C, which can achieve the outwardly formed guide plate 32C and corresponding Electrical connection between the small plates of the electrode guide plate 32B. Similarly, the connection terminals 86 which are in contact with the spacer 84 (as shown in the enlarged plan view shown in FIG. 23), the connection terminals 86 formed on the small plate corresponding to the electrode guide plate 32B, And the cymbal 84 'formed on the pad 84 can achieve electrical connection between the small plate corresponding to the electrode guide plate 32B and the small plate corresponding to the pad 3 2 A. It should be noted that in this embodiment, the structure divided into small plates and fixed in the plate by screws is applied to the substrate 32, which includes a pad plate 32A, an electrode guide plate 32B ', and an outward formation Guide plate 32C. However, the structure which is divided into small plates and fixed in the plate by screws can be applied to other burn-in plates according to the above embodiment. The present invention is not limited to the specifically disclosed embodiments, and variations and modifications can be made without departing from the scope of the present invention. This application is based on the Japanese Priority Application No. 1 1 -1 250 1 1 filed on April 30, 999, the entire contents of which are incorporated herein by reference. --- II -------------- Order ---- 丨 ---- (Please read the precautions on the back before filling out this page) Printed -25- 564508 A7 B7 V. Description of the invention (23) The printed components of the Intellectual Property Bureau of the Ministry of Economic Affairs, Consumer Cooperatives, printed components, reference numbers, 10 burn-in board, 12 substrate, 12a through sub-L, 14 1C socket, 14a, wire ends, 16 input terminals, 18 circuits Pattern 20 BGA package 1C 22 Spherical electrode 30, 30A-30L burn-in plate 32 substrate 32A pad 32B electrode guide plate 32C forming a guide plate 34 guide recess 36 spherical guide recess 38 conductive pad 40 pressing plate 42 Ring buckle 46 Through hole 48 Spherical guide recess 50 Positioning ball 52 Conducting member 54 Probe 56 Probe guide plate 58 Probe insertion hole 60 Probe guide hole 62 Screw hole 64 Screw 66 Base plate 68 Screw hole 70 Push plate 72 Ring buckle 74 Engagement part 80 Screw 82 Base plate 84 Spacer 86 Connection end -26 ------------- 41 ^ -------- Order ----- ---- Line (Please read the precautions on the back before filling this page) This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)