KR20070101389A - Interposer - Google Patents

Abstract

[PROBLEMS] To provide an interposer capable of connecting electrodes of an electronic part with simple structure without requiring formation of a through hole. [MEANS FOR SOLVING PROBLEMS] Elastic contacts (20A, 20B) are formed in an elastic contact formation area A while contacts (14A, 14B) are formed in a contact formation area B on a substrate sheet (12). The substrate sheet (12) is folded at the portion between the two types of contacts in a folding area C along an outer shape of a spacer (11). The connection between the elastic contact (20A) and the contact (14A) and the connection between the elastic contact (20B) and the contact (14B) are made by connection lines formed on the substrate sheet (12). Accordingly, when the interposer (10) is mounted on a mounting unit (31) of a device body (30) and an electronic part (40) is mounted thereon before closing the cover, it is possible to connect the electrodes (32, 33) of the device body (30) to the electrodes (41, 42) of the electronic part (40), respectively. Thus, it is possible to connect electrodes of the electronic part with a simple structure without forming a through hole.

Description

Relay board {INTERPOSER}

BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a relay substrate formed between, for example, electrodes of oppositely disposed electronic components, and to secure an electrical connection between both electrodes, and particularly to a relay substrate that can be easily manufactured with a simple configuration. It is about.

In recent years, with the increase in the performance and performance of semiconductor integrated circuits (ICs), the number of input / output pins of IC packages (hereinafter, referred to as "packages") where semiconductor bare chips are sealed tends to increase year by year. For example, it has begun to emerge that the pin number exceeds 1000.

For this purpose, the type of the input / output pins is changed from a method of taking out from both sides or four sides of the conventional package to a method of taking out from the entire bottom surface of the package. For example, BGA (Ball Grid Array; BACKGROUND OF THE INVENTION A semiconductor device called a Chip Size Package (CSP) having a large number of pin terminals, such as a land grid array (LGA), has been developed.

The input / output pins such as the BGA are arranged in a matrix shape (also referred to as a grid shape or a substrate scale shape) on the bottom surface of the CSP. The connection between such a BGA on the package side and an electrode formed on a circuit board such as a motherboard on the device main body side is performed using an IC socket as shown in Patent Document 1, for example.

The IC socket shown in patent document 1 has many through-holes (through-holes) formed in the matrix form in the bottom face of an IC mounting part, The contact which is elastically supported in the inside of each through-hole so that it can advance and retract by a spring body. A sleeve with a probe is formed. The sleeve is electrically connected to an electrode formed on the circuit substrate.

When the package is mounted in the IC socket in the positioned state, each BGA of the package is pressed against the tip of each contact probe. At this time, since the contact portion of each of the contact probes is in contact with each electrode on the circuit board side, the contact between each BGA on the package side and each electrode on the circuit board side is interposed between the spring body in the sleeve and the contact portion of the contact probe. It is electrically connected.

In this respect, the IC socket functions as a relay substrate (interposer) for electrically connecting the respective BGAs on the package side and the electrodes on the circuit board side.

Patent Document 1: Japanese Unexamined Patent Publication No. 2002-357622

However, in the said patent document 1, there exists a problem that a large number of through-holes need to be positioned with high precision in the bottom face of an IC mounting part, and it needs to open.

In addition, since the contact probe needs to be formed in the through hole so as to be able to advance and retract with the spring body, the socket structure is complicated and there is also a problem that the IC mounting portion is enlarged.

In addition, since it is necessary to secure a space for fixing the socket on the circuit board, it is difficult to miniaturize the circuit board, that is, the device main body itself. In addition, when trying to increase the number of parts mounted on the circuit board, there is a problem that the space interferes with this.

By the way, since the pitch spacing between electrodes of a semiconductor bare chip is narrower than the pitch spacing between electrodes of the IC package which sealed this, the rewiring technique which connects to the electrode of the said IC package in the state which extended the distance between electrodes of a semiconductor bare chip is need. However, in the related art, since the structure of the electrodes is rearranged by using the technique of the multilayer substrate, there is a problem of complicated process and increase of manufacturing cost.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems, and an object thereof is to provide a relay substrate which enables electrical connection between electrodes of an electronic component with a simple and easy configuration.

Moreover, an object of this invention is to provide the relay board which can connect the many electrode which mutually opposes, without forming a through hole.

In addition, an object of the present invention is to provide a relay substrate which enables easy electrical connection between electrodes having different pitch intervals.

The present invention has a substrate having a region folded back at the center in the width direction, and a plurality of contacts formed on the surface of the substrate and divided into one end side and the other end side in the width direction,

At least one contact point on the one end side and the other end side is formed of an elastic contact, and a contact between the contact point formed on the one end side and the contact point formed on the other end side is connected by a conductive connecting line.

In the above, the base material is preferably folded outward in the folded region in a state in which the surface where the contact is exposed is facing outward, and a spacer is formed between the back surfaces of the base materials facing each other. Do.

Moreover, it is preferable that the said spacer is formed with the insulating material or the material which has electroconductivity.

In the present invention, the contact substrate located on one surface side and the contact located on the other surface side are electrically connected without forming a through hole in the relay substrate. Since it can be formed integrally with the said contact, manufacture is easy and manufacturing cost can be reduced further.

Moreover, the board thickness dimension of a relay board can be adjusted freely only by selecting a spacer. Therefore, it can be set as the small thin relay board 10. FIG.

Moreover, this invention is a base material provided with the area | region which was folded back in the center of the width direction, the some contact formed by being divided into the one end side and the other end side of the said width direction in the surface of this base material, and the said one end side formed A spacer formed between a conductive connecting line connecting between the contact point and the contact point formed on the other end side, and the back surface of the base material that is folded outwardly in the folded area in a state in which the contact surface is exposed outward; A relay substrate having, wherein the spacer is formed of a soft material which can be elastically deformed.

In the said invention, since a spacer elastically deforms, it can be set as the relay substrate which has an elastic contact as a whole.

In the above, for example, the arrangement order of the contacts formed on the one end side and the arrangement order of the contacts formed on the other end side can be the same order.

Moreover, the pitch dimension between the contact formed in the said one end side, and the pitch dimension between the contact formed in the said other end side can also be set as the structure formed in a different dimension.

In the above means, the rewiring in the IC package can be easily and inexpensively.

Moreover, the said base material is formed from the flexible sheet, It is the relay substrate in any one of Claims 1-6 characterized by the above-mentioned.

In the above means, the relay substrate can be easily formed from one base sheet.

In the above, the elastic contact formed on the base material is a spiral contact extending in a spiral shape from the winding start end formed on the base on the outer circumferential side toward the winding end on the center side, in which case the spiral contact is wound from the winding start end. It is preferable that it is a mountain shape which protrudes three-dimensionally toward the terminal.

In this invention, since it is not necessary to form a through hole in a board | substrate, it can be set as a simple and easy relay board | substrate. Moreover, by changing a spacer, the plate | board thickness dimension of a relay board can be adjusted freely. For this reason, it is easy to provide a thin relay substrate.

In addition, since the pitch dimension can be adjusted simply by changing the distance between the contacts formed on the relay substrate, the IC package can be easily rewired.

1A is an external perspective view of a relay substrate as an embodiment of the present invention seen in one direction.

1B is an external perspective view of the relay substrate viewed from the reverse side.

2 is an exploded perspective view of the relay substrate.

3 is a perspective view showing a spiral contact as an example of an elastic contact.

4 is a cross-sectional view taken along line 4-4 of FIG. 1A while showing an example of use of the relay substrate.

<Explanation of symbols for main parts of drawing>

10: relay substrate 11: spacer (expected)

11a: curved surface 12: base sheet

12a: hole

14A, 14B: Normal Contact

15a, 15b: connecting line (pattern line)

20A, 20B: elastic contact (contact)

21: Spiral Contact 21a: Donation

21b: elastic deformation portion 21b1: winding start

21b2: winding end 30: device body

31: loading part 32, 33: electrode

34: storage area 36: connection means

40: electronic component 41, 42: electrode part

A: elastic contact forming area

B: contact forming area

C: folded area

W1: Distance between electrodes between elastic contacts (pitch dimension)

W2: distance between electrodes between normal contacts (pitch dimensions)

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an external perspective view showing a relay board as an embodiment of the present invention, and when Fig. 1A is viewed from one direction, Fig. 1B is viewed from a reverse direction. The exploded perspective view of the relay board shown, FIG. 3 is a perspective view which shows the spiral contact as an example of an elastic contact, FIG. 4 is sectional drawing in the 4-4 line | wire of FIG. 1A, showing the example of use of a relay board.

As shown to FIG. 1A, B, the relay board 10 has the bar shape extended linearly toward the Y1 and Y2 direction shown. The relay substrate 10 has a spacer 11 that functions as a base and a base sheet (base material) 12 attached to the surface of the spacer 11.

The said spacer 11 is formed in the bar shape, and the arc-shaped curved surface 11a is formed in at least one side surface of the width X direction. As a material for forming the spacer 11, for example, an insulating hard substrate (glass epoxy), a conductive metal material, or a soft material that can be elastically deformed, such as natural rubber, synthetic rubber, elastomer, or the like, You can choose a material that suits your purpose. Moreover, in this embodiment, it is formed of an insulating hard board | substrate.

It is preferable that the said base material sheet 12 is thin hair which has insulation and flexibility, such as a polyimide sheet, for example. On the surface of the base sheet 12, a plurality of regularly arranged contacts are formed.

On one surface 10A of the relay substrate 10 shown in FIG. 1A, a plurality of elastic contacts (contacts) 20A and 20B are arranged in two rows toward the Y direction. As shown in FIG. 2, one elastic contact 20A is shown along the imaginary line Ya which is located in the outer surface (X1 side) of the width direction (X direction) on the surface of the said base material sheet 12 further. It is arranged in the Y direction at predetermined intervals L, and the other elastic contact 20B is parallel to the said interval L along the imaginary line Yb located in the inner side (X2 side) similarly. As shown in Fig. 1A, a predetermined inter-electrode distance (pitch dimension) W1 is formed between the imaginary line Ya and the imaginary line Yb, and the elastic contacts 20A are adjacent to each other in the X direction. And elastic contact 20B form a pair. Moreover, the area | region in which the said elastic contact 20A, 20B is formed is an elastic contact formation area | region A. As shown in FIG.

In addition, on the other surface 1OB of the relay substrate 10 shown in FIG. 1B, a plurality of contacts 14A and 14B arranged in two rows in the Y direction are formed. The plurality of contacts 14A and 14B shown in FIG. 2 are normal contacts (fixed contacts protruding in a convex shape) other than the elastic contacts 20A and 20B, and the elastic contacts on the base sheet 12 ( 20A, 20B) is formed on the same surface as the surface in which it is formed. As shown to FIG. 1B, one contact 14A is said Y in the Y direction shown along the imaginary line Yc located in the outer side (X2 side) of the width direction (X direction) of the said base material sheet 12 The other contact point 14B is provided in the space | interval L, and the other contact point 14B is provided in the said space | interval L along the imaginary line Yd located in the inside (X1 side). A predetermined inter-electrode distance (pitch dimension) W2 (≥ W1> 0) is also formed between the imaginary line Yc and the imaginary line Yd, and the contact 14A and the contact 14B are adjacent to each other in the X direction. ) Is paired. In addition, the area | region in which the said contact 14A, 14B is formed is a contact formation area B. FIG.

As shown to FIG. 1A, B and FIG. 2, the elastic contact 20A located in the outer side of the said elastic contact formation area A, and the contact 14A located in the outer side of the said contact formation area B are an example. For example, an elastic contact 20B connected by a thin-film connecting line (pattern line) 15a formed of a conductive material such as gold, silver, or copper, and similarly located inside the elastic contact forming region A. And the contact point 14B located inside the contact forming region B are connected by a thin-film connecting line (pattern line) 15b.

The elastic contacts 20A and 20B shown in the present embodiment are spiral contacts 21 and 21 having a spiral shape or a spiral shape, for example. As shown in FIG. 3, the hole 12a, 12a which penetrates the said base material sheet 12 is formed in the position where the said spiral contact 21, 21 on the base material sheet 12 should be formed. . In the vicinity of the holes 12a and 12a, bar bases 21a and 21a are formed by extending from the connection lines 15a and 15b.

The base 21a is formed with an elastic deformation portion 21b extending in a spiral or vortex toward the center of the hole 12a. The said elastic deformation part 21b is the winding start end 21b1 at the said base 21a side, and the front end is the winding end 21b2.

As shown in FIG. 3, the spiral contact 21 projects gradually in the Z1 direction as shown from the winding start end 21b1 toward the winding end 21b2 side, and has a mountain shape or a convex shape as a whole. . The spiral contact 21 is cantilevered with respect to the base 21a in a state in which the elastic deformation portion 21b can elastically deform in the direction Z1 as the supporting point of the winding start end 21b1 side. For this reason, the elastic deformation part 21b is in the state which can be elastically deformed in the Z1 and Z2 direction as a whole.

The elastic contacts 20A, 20B, the contacts 14A, 14B, and the connecting lines 15a, 15b made of the spiral contact 21 are all formed on one surface (surface) of the base sheet 12. Can be. For this reason, it can be integrally formed by using techniques, such as a plating process or the etching process with respect to metal foil, for example. For this reason, it can manufacture easily and easily, and can make manufacturing cost low.

Next, the assembly method of the said relay board 10 is demonstrated.

As shown in FIG. 3, it is formed in the position of the center of the width direction (X direction) of the said base material sheet 12, ie, the said elastic contact formation area | region A formed in the one end X1 side, and the other end X2 side. Between the said contact formation area B, the area | region C bent back is formed.

The relay substrate 10 is directed outward in the folded region C in a state in which the surface of the substrate sheet 12 as described above (the side where the contacts 20A, 14A, etc. are exposed) is outward. Fold and fold back.

Then, the spacer 11 is interposed between the rear surfaces of the base sheet 12 (between the rear surface of the elastic contact forming region A and the rear surface of the contact forming region B), and the spacer 11 is bonded using an adhesive. The back surface of the base sheet 12 is adhesively fixed to the surface of the substrate). At this time, it is as shown to FIG. 1A, B by interposing between the back surface of the said base material sheet 12 in the state which made the curved surface 11a of the said spacer 11 oppose the back surface of the said back-folded area | region C. The relay substrate 10 can be used. In this way, when the folded region C is bonded along the curved surface 11a, it is possible to prevent problems such as disconnection from occurring in the connecting lines 15a and 15b.

The relay substrate 10 shown in the above-described embodiment secures electrical connection with an electrode of an electronic component, and includes, for example, an electrode formed on the apparatus main body side and a memory in a state in which the apparatus main body can be detachably detached from the apparatus main body. In order to connect the electrodes exposed on the surface of the card as contact electrodes or by arranging and arranging a plurality of relay boards 10, the contact electrodes are connected to electrodes such as BGA and LGA disposed on the bottom of the IC package. It is available.

Here, the use example using the said relay board 10 is demonstrated.

In the use example shown in FIG. 4, the said relay board 10 is loaded in the recessed loading part 31 formed in the apparatus main body 30, such as a mobile telephone. On the bottom face 31a of the charging section 31, a plurality of electrodes 32, 33 facing the plurality of contacts 14A, 14B are formed, and the contacts 14A, 14B of the relay substrate 10 are provided. And the electrodes 32 and 33 of the charging section 31 are fixed in a conductive state via a connecting means 36 such as solder or a conductive adhesive.

The upper portion of the charging unit 31 is, for example, a storage region 34 of an electronic component 40 such as a small memory card. As shown in FIG. 4, the electronic component 40 is attached to the storage region 34 in a state where the electrode portions 41 and 42 are faced downward. And when the said storage area | region 34 is closed by the lid | cover not shown, the electronic component 40 can be hold | maintained between the said storage area | region 34 and the said lid | cover body.

In the state where the electronic component 40 is held, since the electronic component 40 is pressurized by a predetermined pressing force F in the direction Z2 shown by the lid, the spiral contact of the relay board 10 is provided. The elastic contact 20A, 20B which consists of 21 contacts with the electrode parts 41 and 42 of the said electronic component 40, and is set in the state elastically deformed in the shrinking direction.

For this reason, the electrode parts 41 and 42 of the said electronic component 40 and the electrodes 32 and 33 of the side of the said apparatus main body 30 are elastic contact 20A, 20B, the connection line 15a, 15b, and Electrically conductive connection can be made via the contacts 14A and 14B.

In addition, the spiral contact 21 for forming the elastic contacts 20A, 20B used in the present embodiment has the protruding amount (height dimension from the base portion 21a to the winding start end 21b2) h, It can be set small compared with the conventional contact pin. In addition, the said spacer 11 can select the plate | board thickness dimension H freely at the time of manufacture. For this reason, by selecting the spacer 11 which consists of a thin plate | board thickness dimension H, it can be set as the thin relay board 10. FIG.

Moreover, the contact 14B formed in the outer side similarly below the elastic contact 20A formed in the outer side is corresponded, and the contact 14B formed inside in the same way below the elastic contact 20B formed in the inner side The arrangement in which this is located, that is, the arrangement order of the elastic contacts 20A and 20B formed on the one end (elastic contact forming region A) side and the contacts 14A and 14B formed on the other end (contact forming region B) side ) Is arranged so that the arrangement order is the same order. For this reason, the electrode parts 41 and 42 of the said electronic component 40 and the electrodes 32 and 33 by the side of the said apparatus main body 30 can be made to correspond, and each electrode is in a correct state, without ordering the position. Can be connected reliably.

In addition, when the relay board 10 is arranged in a plurality of sockets in the socket and connected to an electrode such as BGA or LGA disposed on the bottom surface of the IC package, the individual contact pressures of the spiral contacts 21 are small. In comparison with the case of using the conventional contact pins or the like, the IC package can be held at a very small pressing force (F). Alternatively, in the case where the IC package is applied and held with a large pressing force F as in the prior art, the load (contact pressure due to the elastic contacts 20A and 20B) acting on the individual electrodes of the IC package can be reduced. Can be.

In the relay substrate 10, the inter-electrode distance W1 on the elastic contact formation region A side and the inter-electrode distance W2 on the contact formation region B side have different dimensions, that is, an elastic contact. The distance W2 between the electrodes on the contact forming region B side is wider than the distance W1 between the electrodes on the forming region A side. For this reason, for example, when the relay substrate 10 is used for connection between a bare chip having a narrow distance between electrodes and an electrode on the package side holding the same, the distance between electrodes between the bare chips W1 is determined by the package side. Widening with the wide distance W2 between electrodes, that is, rewiring can be easily performed. Moreover, since it is not necessary to use the technique of a multilayer board like conventionally, it can redistribute with a simple structure.

For example, even if a problem arises in one relay board 10, only the corresponding relay board 10 needs to be replaced, and it is not necessary to replace the entire socket. For this reason, the repair process can be simplified and the repair cost can be reduced.

In the said embodiment, although demonstrated using the relay board 10 arrange | positioned in 2 rows in the longitudinal direction as the number of elastic contacts and the number of contacts, respectively, this invention is not limited to this, An elastic contact and a contact are each comprised of 1 row. It may be sufficient and the structure of three or more rows may be sufficient.

Moreover, the structure of the thermal water from which the thermal water of an elastic contact and the thermal water of a contact differs may be sufficient. In other words, the contact between the elastic contact and the contact may not necessarily be one-to-one, and for example, two or more contacts may be connected to the connection line 15a or 15b with respect to one elastic contact.

Moreover, in the said embodiment, although the contact 14A, 14B was formed with the convex electrode, it demonstrated as a structure which is fixed with the solder etc. with respect to the electrode 32, 33 by the apparatus main body 30 side, However, this invention is It is not limited, The said contact 14A, 14B is an elastic contact which consists of said same spiral contact, and may be the structure connected with the electrode 32, 33 by the side of a device by pressure suppression.

In addition, in the said embodiment, although demonstrated using the spiral contact as one structure of the said elastic contact 20A, 20B, the said elastic contact 20A, 20B is not limited to a spiral contact, For example, It may be composed of an elastic contact made of a spring pin (contact pin), a stressed metal, a spiral spring, etc., which can be elastically deformed and the entire tip is curved in a substantially U shape. As the elastic contact, a spiral contact or a stressed metal as described above is preferable.

In addition, in the said embodiment, the said spacer 11 is called a hard board, and the contact located inside the said elastic contact formation area | region A is an elastic contact, and is located inside the said contact formation area B. In addition, in FIG. Although the case where the said contact is a normal contact 14A, 14B other than an elastic contact was demonstrated, when the said spacer 11 is formed with the member of the material which was excellent in elasticity, such as a cushion material, the said elastic contact formation area | region A ) And both of the contact forming regions B may be formed of ordinary contacts 14A and 14B other than the elastic contact. Moreover, also in this case, the aspect in which either the said elastic contact formation area | region A or the said contact formation area | region B is an elastic contact is not excluded.

Claims (9)

It has a base material provided with the area | region bent back at the center of the width direction, and the some contact formed by being divided in the surface of this base material into the one end side and the other end side of the said width direction, At least one contact point of the one end side and the other end side is formed of an elastic contact point, Each of the plurality of contacts formed on the one end side and each of the plurality of contacts formed on the other end side are connected in a one-to-one relationship with conductive connecting lines. The method of claim 1, The said base material is folded in the outward direction in the said bending area | region in the state which the surface which the said contact exposed is facing outward, and is bent, and the spacer is formed between the back surface of the said base material which mutually opposes. The method of claim 2, The relay substrate is formed of an insulating material or a conductive material. A base having a region folded back from the center in the width direction, a plurality of contacts formed on the surface of the base and divided into one end side and the other end side in the width direction, and each of the plurality of contacts formed on the one end side; And a conductive connecting line connecting each of the plurality of contacts formed on the other end side in a one-to-one relationship, and the base material folded and folded outward in the folded region in a state where the contact surface is exposed outward. Has a spacer formed between the back surfaces of the And the spacer is formed of a soft material which can be elastically deformed. The method according to any one of claims 1 to 4, In a form in which the base material is bent in a direction in which the one end side and the other end side are parallel, contacts formed on the one end side and contacts formed on the other end side connected to this contact point are the same as seen from the one end side. The relay board, which is located in order. The method of claim 5, A relay substrate, wherein the pitch dimension between the contacts formed on the one end side and the pitch dimension between the contacts formed on the other end side are formed in different dimensions. The method according to any one of claims 1 to 6, The said base material is formed from the flexible sheet, The relay board characterized by the above-mentioned. The method according to any one of claims 1 to 7, The relay contact formed in the base material is a relay substrate, characterized in that the spiral contact extending in a spiral shape from the winding start end formed on the base on the outer circumferential side toward the winding end on the center side. The method of claim 8, The spiral contact is a relay substrate, characterized in that the mountain shape projecting three-dimensionally from the winding end toward the winding end.

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