TW561178B - Thermosetting resin compositions - Google Patents

Thermosetting resin compositions Download PDF

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Publication number
TW561178B
TW561178B TW087100682A TW87100682A TW561178B TW 561178 B TW561178 B TW 561178B TW 087100682 A TW087100682 A TW 087100682A TW 87100682 A TW87100682 A TW 87100682A TW 561178 B TW561178 B TW 561178B
Authority
TW
Taiwan
Prior art keywords
composition
epoxy resin
weight
meth
semiconductor device
Prior art date
Application number
TW087100682A
Other languages
English (en)
Chinese (zh)
Inventor
Kazutoshi Iida
Jon Wigham
Original Assignee
Loctite Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Loctite Corp filed Critical Loctite Corp
Application granted granted Critical
Publication of TW561178B publication Critical patent/TW561178B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/315—Compounds containing carbon-to-nitrogen triple bonds
    • C08K5/3155—Dicyandiamide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0016—Plasticisers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/101—Esters; Ether-esters of monocarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
TW087100682A 1997-01-17 1998-01-17 Thermosetting resin compositions TW561178B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP00657197A JP3613367B2 (ja) 1997-01-17 1997-01-17 熱硬化性樹脂組成物

Publications (1)

Publication Number Publication Date
TW561178B true TW561178B (en) 2003-11-11

Family

ID=11642033

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087100682A TW561178B (en) 1997-01-17 1998-01-17 Thermosetting resin compositions

Country Status (9)

Country Link
EP (1) EP0953008A4 (id)
JP (1) JP3613367B2 (id)
KR (1) KR100554323B1 (id)
CN (1) CN1243526A (id)
BR (1) BR9806743A (id)
ID (1) ID22238A (id)
MY (1) MY118700A (id)
TW (1) TW561178B (id)
WO (1) WO1998031738A1 (id)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100612805B1 (ko) * 1999-02-18 2006-08-18 가부시끼가이샤 쓰리본드 에폭시 수지 조성물
ATE315886T1 (de) 1999-07-08 2006-02-15 Sunstar Engineering Inc Unterfüllmaterial für halbleitergehäuse
US6255500B1 (en) 2000-01-21 2001-07-03 Loctite Corporation Process for the epoxidation of diene esters
US20050288458A1 (en) 2002-07-29 2005-12-29 Klemarczyk Philip T Reworkable thermosetting resin composition
US7012120B2 (en) 2000-03-31 2006-03-14 Henkel Corporation Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent
JP4609617B2 (ja) * 2000-08-01 2011-01-12 日本電気株式会社 半導体装置の実装方法及び実装構造体
US6627683B1 (en) 2000-09-05 2003-09-30 Henkel Loctite Corporation Reworkable thermosetting resin compositions and compounds useful therein
US7108920B1 (en) 2000-09-15 2006-09-19 Henkel Corporation Reworkable compositions incorporating episulfide resins
WO2002028849A1 (en) * 2000-10-04 2002-04-11 Henkel Loctite Corporation Reworkable epoxidized 1-(cyclo)alkenyl ether/polycarboxylic acid product
WO2002058108A2 (en) 2000-11-14 2002-07-25 Henkel Loctite Corporation Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith
TW574739B (en) * 2001-02-14 2004-02-01 Nitto Denko Corp Thermosetting resin composition and semiconductor device using the same
JP5280597B2 (ja) * 2001-03-30 2013-09-04 サンスター技研株式会社 一液加熱硬化型エポキシ樹脂組成物および半導体実装用アンダーフィル材
JP3566680B2 (ja) * 2001-09-11 2004-09-15 富士通株式会社 半導体装置の製造方法
US6916890B1 (en) 2001-10-09 2005-07-12 Henkel Corporation Thermally reworkable epoxy resins and compositions based thereon
US6887737B1 (en) 2001-12-13 2005-05-03 Henkel Corporation Epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, and reworkable thermosetting resin compositions formulated therefrom
US7242082B2 (en) 2002-02-07 2007-07-10 Irvine Sensors Corp. Stackable layer containing ball grid array package
AU2003261429A1 (en) * 2003-08-08 2005-03-07 Irvine Sensors Corporation Stackable layers containing ball grid array packages
JP5175431B2 (ja) * 2005-09-16 2013-04-03 日本電気株式会社 半導体装置のリペア方法
JP2007258207A (ja) * 2006-03-20 2007-10-04 Three M Innovative Properties Co バンプ付きチップもしくはパッケージの実装方法
US8128203B2 (en) 2006-04-28 2012-03-06 Telecom Italia S.P.A. Ink-jet printhead and manufacturing method thereof
WO2007142654A1 (en) * 2006-06-09 2007-12-13 Advanced Applied Adhesives Reworkable compositions and methods for use thereof
US7714426B1 (en) 2007-07-07 2010-05-11 Keith Gann Ball grid array package format layers and structure
WO2009147828A1 (ja) 2008-06-05 2009-12-10 住友ベークライト株式会社 半導体装置の製造方法および半導体装置
WO2010050185A1 (ja) 2008-10-27 2010-05-06 パナソニック株式会社 半導体の実装構造体およびその製造方法
CN103172306A (zh) * 2013-04-08 2013-06-26 天津大学 一种水弹性模型材料及其制备方法
KR102340799B1 (ko) * 2018-09-20 2021-12-16 주식회사 엘지화학 금속 박막 코팅용 열경화성 수지 조성물, 이를 이용한 수지 코팅 금속 박막 및 금속박 적층판
KR102092649B1 (ko) * 2018-11-07 2020-03-24 (주)티에이치엔 방열 및 방사 기능이 구비된 전자 기기 패키징 장치 제조방법
DE102020127468A1 (de) 2020-10-19 2022-04-21 Werner H. Salewski Multifunktionale Epoxyd-Systeme
DE102022120396A1 (de) 2022-08-12 2024-02-15 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Verwendung einer härtbaren und wiederlösbaren Masse zur Herstellung eines Bauteils, und Masse dafür

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JPS5463199A (en) * 1977-10-31 1979-05-21 Mitsui Petrochem Ind Ltd Curable composition for elastomers
SU990781A1 (ru) * 1979-12-06 1983-01-23 Предприятие П/Я В-8657 Маркировочна спиртобензостойка краска
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US4866108A (en) * 1988-01-19 1989-09-12 Hughes Aircraft Company Flexible epoxy adhesive blend
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JP3543902B2 (ja) * 1997-01-17 2004-07-21 ヘンケル ロックタイト コーポレイション 半導体装置の実装構造および実装方法

Also Published As

Publication number Publication date
MY118700A (en) 2005-01-31
KR20000070203A (ko) 2000-11-25
KR100554323B1 (ko) 2006-02-24
WO1998031738A1 (en) 1998-07-23
BR9806743A (pt) 2000-02-29
EP0953008A4 (en) 2000-05-03
CN1243526A (zh) 2000-02-02
EP0953008A1 (en) 1999-11-03
ID22238A (id) 1999-09-23
JPH10204259A (ja) 1998-08-04
JP3613367B2 (ja) 2005-01-26

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MM4A Annulment or lapse of patent due to non-payment of fees