TW561178B - Thermosetting resin compositions - Google Patents

Thermosetting resin compositions Download PDF

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Publication number
TW561178B
TW561178B TW087100682A TW87100682A TW561178B TW 561178 B TW561178 B TW 561178B TW 087100682 A TW087100682 A TW 087100682A TW 87100682 A TW87100682 A TW 87100682A TW 561178 B TW561178 B TW 561178B
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Taiwan
Prior art keywords
composition
epoxy resin
weight
meth
semiconductor device
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TW087100682A
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Chinese (zh)
Inventor
Kazutoshi Iida
Jon Wigham
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Loctite Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/315—Compounds containing carbon-to-nitrogen triple bonds
    • C08K5/3155—Dicyandiamide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0016—Plasticisers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/101—Esters; Ether-esters of monocarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)

Abstract

The present invention provides a thermosetting resin composition useful as an underfilling sealing resin which enables a semiconductor device, such as a CSP/BGA assembly which includes a semiconductor chip mounted on a carrier substrate, to be securely connected to a circuit board by short-time heat curing and with good productivity, which demonstrates excellent heat shock properties (or thermal cycle properties), and permits the CSP/BGA assembly to be easily removed from the circuit board in the event of semiconductor device or connection failure.

Description

經濟部中央標準局員工消費合作社印製 561178 A7 B7 五、發明説明（1 ) 發明背景 發明範圍 本發明描述封裝樹脂組合物，它適用於在電路板上裝上 半導體裝置，如大型晶片或晶片組（"CSPs")、球格陣列組 (”BGAsn )等等，每種裝置均是在基質上含有半導體晶片， 如大型整合積體電路（"LSI")。 相關科技之簡單説明 近幾年來，小型電子設備，如攝影機整合的錄放影機 ("VTRs")和手攜式電話的流行，使得LSI裝置的大小必須被 降低。這些大小降低的結果，使得CSPs和BGAs比裸的晶片 更常用來降低組件的大小。此類CSPs和BGAs改進了電子裝 置的性質並能維持它們許多的操作特性，且用來保護半導 體之裸的晶片，如LSIs，和使測試變得更爲容易。 通常，該CSP/BGA組件是使用焊接等方法連接至電路板 上的電導體上。然而，當所形成的CSP/ BGA/電路板結構暴 露至熱循環時，電路板和CSP/ BGA之間之焊接的可靠性經 常受到懷疑。最近，在CSP/ BGA組件被安裝到電路板上後 ，CSP/BGA組件與電路板之間的空隙通常用封裝樹脂來充 填（通常稱爲封裝）以便釋出熱循環所產生的應力，而改進 熱衝擊的性質和加強結構的可靠性。 然而，由於熱固性樹脂被典型的用作封裝材料，若在 CSP/BGA組件安裝到電路板上後產生故障時，在沒有破壞 或完全捨棄結構之下極難更換CSP/ BGA組件。 並且’將裸的晶片安裝到電路板上的技術大體上類似於 -4- 本纸張尺度適用中國國家標準（CNS ) 210X297公釐） (請先閱讀背面之注意事項再填寫本頁) 訂 561178 A7 B7 經濟部中央標準局員工消費合作社印製 五、發明説明（2 將CSP/BGA組件安裝到電路板上的技術。此類技術之一揭 示於日本專利號碼102343/93，這包含使用一種光可硬化的 枯著劑將裸晶片固定並接到電路板上的安裝方法，而在故 I5早時’該裸晶片即由那裡被取下。然而，這技術僅限於那 些光可由背面透過的透明基質（如玻璃）所形成的電路板上 ’且所形成的結構顯不出不良的熱衝擊性質。 曰本專利號碼69280/ 94揭示一種使用能在預設的溫度下 硬化的樹脂將裸晶片固定和連接到基質的方法。若故障時 ，可在比預設溫度較高的溫度下將樹脂軟化而將該裸晶片 由基質上取下。然而，它未揭露特定的樹脂，且未揭露處 理留在基質上之樹脂的方法。因此，此揭示的方法是極不完 整的。 曰本專利號碼77264/94指出，傳統上使用溶劑來除去電 路板上殘留的樹脂。然而，用溶劑來膨潤樹脂是很耗時的 程序，且經常用作溶劑之腐蝕性有機酸會降低電路板的可 非性。反之，孩專利揭露一種利用電磁輻射的照射來除去 殘留樹脂的方法。 曰本專利號碼251516/ 93亦揭示一種使用雙酚A型環氧樹 月曰（CV5183 或 CV5183S ;由 Matsushita Electric Industrial Co.，Printed by the Consumer Standards Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 561178 A7 B7 V. Description of the invention (1) Background of the invention The present invention describes a packaged resin composition suitable for mounting semiconductor devices such as large wafers or chip sets on circuit boards. (&Quot; CSPs "), ball grid array group ("BGAsn"), etc., each device contains a semiconductor wafer on the substrate, such as a large integrated integrated circuit (" LSI "). A brief description of related technologies in recent years Over the years, the popularity of small electronic devices, such as camera-integrated video recorders (" VTRs ") and hand-held phones, has reduced the size of LSI devices. As a result of these size reductions, CSPs and BGAs have become larger than bare chips More commonly used to reduce component size. Such CSPs and BGAs improve the properties of electronic devices and maintain many of their operating characteristics, and are used to protect bare semiconductor chips such as LSIs, and to make testing easier. Usually, the CSP / BGA component is connected to the electrical conductor on the circuit board by soldering or other methods. However, when the CSP / BGA / circuit board structure is formed, When exposed to thermal cycling, the reliability of soldering between the circuit board and the CSP / BGA is often questioned. Recently, after a CSP / BGA component is mounted on a circuit board, the gap between the CSP / BGA component and the circuit board is usually Filling with encapsulating resin (commonly referred to as encapsulation) in order to release the stress generated by thermal cycling, improve the properties of thermal shock and strengthen the reliability of the structure. However, since thermosetting resin is typically used as the encapsulating material, When a / BGA component is installed on a circuit board and a failure occurs, it is extremely difficult to replace the CSP / BGA component without destroying or completely abandoning the structure. And the technology of 'mounting a bare chip to a circuit board is roughly similar to -4- This paper size applies to the Chinese National Standard (CNS) 210X297 mm. (Please read the notes on the back before filling out this page.) Order 561178 A7 B7 Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention (2 CSP / BGA component mounting technology to a circuit board. One of such technologies is disclosed in Japanese Patent No. 102343/93, which involves the use of a photo-hardenable desiccant to fix bare wafers. It is connected to the mounting method of the circuit board. In the early I5, the bare chip was removed there. However, this technology is limited to the circuit board formed by a transparent substrate (such as glass) where light can pass through the back surface. And the resulting structure does not exhibit poor thermal shock properties. Japanese Patent No. 69280/94 discloses a method for fixing and attaching a bare wafer to a substrate using a resin that can harden at a preset temperature. In the event of failure The resin can be softened at a higher temperature than the preset temperature to remove the bare wafer from the substrate. However, it does not disclose specific resins, and it does not disclose methods for treating resins left on the substrate. Therefore, the method disclosed is extremely incomplete. Japanese Patent No. 77264/94 states that solvents have traditionally been used to remove resin remaining on circuit boards. However, swelling the resin with a solvent is a time-consuming process, and corrosive organic acids often used as solvents can reduce the non-reliability of circuit boards. In contrast, the U.S. Patent discloses a method for removing residual resin by irradiation with electromagnetic radiation. Japanese Patent No. 251151/93 also discloses the use of a bisphenol A type epoxy tree (CV5183 or CV5183S; by Matsushita Electric Industrial Co.,

Ltd.所製造）i安裝方法。然而，該揭示的拆卸方法不能很 奋易的拆下晶片，硬化步驟在高溫下耗時過長，且此方法 通常導至不良的生產力。 因此，必須要有能提供良好的生產力和熱衝擊性質的封 裝材料’且使所用的基質立即可加工並容易分離。 210X297公釐「 -------：---衣-- (請先閲讀背面之注意事項再填寫本頁} 、一1Τ 五、發明説明（3 ) 發明概述 本發明提供一種熱固性樹脂組合物，它是種很有用的封 裝樹脂，可將基質上安裝有半導體晶片的半導體裝置，如 CSP/BGA組件牢固地接到電路板上，且其熱硬化時間短和 生產力良好，這具有極佳的熱衝擊性質（或熱循環性質）， 且若半導體裝置連接失敗時，可使csp/BGA組件很容易地 由電路板上取下來。 用作電氣連接的半導體裝置和電路板之間的封裝劑之熱 硬化樹脂組合物含有約100份重的環氧樹脂，約3至钓⑹份 重的硬化劑’和約1至約90份重的增塑劑。 雖然本發明足熱固性樹脂組合物在相當低的溫度下於短 時間内可被硬化，然而硬化的反應產物具有極佳的熱衝擊 ^質，且在加熱的情況下可很容易地用力將其分開。這即 是利用本發明之熱固性樹脂組合物之硬化的反應產物而附 著在電路板等物上面的半導體裝置，可由加熱該反應產物 ，用溶劑將其膨潤，或在加熱的情況下用溶劑將其膨脹， 而很容易地拆卸下來。 利用本發明之熱固性樹脂組合物可將半導體裝置，如 CSP/BGA組件，牢固地接到電路板上，且其硬化時間短和 生產力很好，這具有極佳的熱衝擊性質(或熱循環性質卜 2且，若半導體裝置故障時，可很容易地拆卸下來。這使 得半導體裝置或電路板可以再用，因而改進生產的產量並 降低生產成本。 在讀過"本發明之詳細説明"後，本發明的效益和優點將 -6- 本紙張尺度適 561178 A7 B7 五、發明説明（5 水甘油醚。 用於本發明的增塑劑是具有相當低的揮發性之增塑劑， 其特徵爲滞點至少約130 °C且可降低硬化之樹脂反應產物 的Tg。最好是使用當樹脂硬化時能使微細相分離的增塑劑 材料°备這些材料在此處被稱爲增塑劑時，它們不必產生 一般增塑劑所具有的功能。 此類增塑劑的例子包括（甲基）丙烯酸酯，和芳香族或脂 肪族酯。 本發明内用作增塑劑之（甲基）丙烯酸酯包括單官能（甲 基）丙烯鉍酯，如直鏈或支鏈的脂肪醇之（甲基）丙烯酸酯 、具有方香烴取代基的脂肪醇之（甲基）丙烯酸酯、脂環醇 之（甲基）丙烯酸酯、含有羥基之烷基（甲基）丙烯酸酯、和 羥基脂防胺之（甲基）丙缔酸醋；和多官能（甲基）丙烯酸醋 ，如多7G醇之（甲基）丙缔酸酯和多元環氧化合物之（甲基） 丙#酸@旨。 經濟部中央標準局員工消費合作社印製 在本發明内用作增塑劑之直鏈或支鏈脂肪醇之（甲基）丙 烯酸醋包括那些具有約4至約i 6個碳原子的§旨，如(；基) 丙晞酸正丁 3旨、（甲基）丙缔酸異丁 @旨、（甲基）㈣酸第土三 丁醋、（甲基)丙晞酸·2-乙基己醋、（甲基)丙埽酸正辛醋 、（曱基）丙埽酸異癸醋、（曱基）丙晞酸十二燒醋曰 丙晞酸三彡醋、（曱基）丙晞酸四癸醋和（曱基）两缔土丄 坑醋。具有芳香烴取代基的脂肪醇之(甲基)丙埽酸… 具有-個芳香基取代基且具有由！至約8個❹ 之（甲基）丙缔酸醋，如（甲基）丙晞酸苯甲自旨。'、、知肪醇 -8 _ 5張尺度適用中11¾標準（CNS ) Μ祕公酱- ^ I -- (請先閱讀背面之注意事項再填寫本頁)Ltd.) i installation method. However, the disclosed disassembly method cannot easily remove the wafer, the hardening step takes too long at high temperatures, and this method often leads to poor productivity. Therefore, it is necessary to have a packaging material ' that provides good productivity and thermal shock properties and that the substrate used is immediately processable and easily separated. 210X297mm "-------: --- clothing-(Please read the precautions on the back before filling out this page} 、 1Τ Ⅴ. Description of the invention (3) Summary of the invention The present invention provides a thermosetting resin combination It is a very useful packaging resin. It can firmly connect semiconductor devices with semiconductor wafers mounted on the substrate, such as CSP / BGA components, firmly connected to the circuit board. It has short heat curing time and good productivity, which is excellent. Thermal shock properties (or thermal cycling properties), and if the semiconductor device connection fails, the csp / BGA component can be easily removed from the circuit board. An encapsulant between the semiconductor device and the circuit board for electrical connection The thermosetting resin composition contains about 100 parts by weight of an epoxy resin, about 3 to about 1 part by weight of a hardener ', and about 1 to about 90 parts by weight of a plasticizer. Although the present invention is substantially equivalent in thermosetting resin composition, It can be hardened in a short time at a low temperature, but the hardened reaction product has excellent thermal shock properties and can be easily separated by force when heated. This is the use of the thermosetting resin of the present invention combination A semiconductor device attached to a circuit board or the like by a hardened reaction product can be easily disassembled by heating the reaction product, swelling it with a solvent, or expanding it with a solvent under heating. The thermosetting resin composition of the present invention can firmly connect a semiconductor device, such as a CSP / BGA component, to a circuit board, and has a short curing time and good productivity, which has excellent thermal shock properties (or thermal cycling properties). 2 Moreover, if the semiconductor device fails, it can be easily disassembled. This allows the semiconductor device or circuit board to be reused, thereby improving the production yield and reducing the production cost. After reading "Detailed Description of the Invention", The benefits and advantages of the present invention will be -6- this paper is suitable for 561178 A7 B7 V. Description of the invention (5 glyceryl ether. The plasticizer used in the present invention is a plasticizer with relatively low volatility, which is characterized by The hysteresis point is at least about 130 ° C and can reduce the Tg of the hardened resin reaction product. It is best to use plasticizer materials that can separate fine phases when the resin is hardened. When materials are referred to herein as plasticizers, they do not have to produce the functions that typical plasticizers have. Examples of such plasticizers include (meth) acrylates, and aromatic or aliphatic esters. Within the invention (Meth) acrylates used as plasticizers include monofunctional (meth) propylene bismuth esters, such as (meth) acrylates of straight or branched chain fatty alcohols, and fatty alcohols with aquatic hydrocarbon substituents. (Meth) acrylates, (meth) acrylates of alicyclic alcohols, hydroxy-containing alkyl (meth) acrylates, and (meth) acrylic acid esters of hydroxyaliphatic amines; and polyfunctional (formaldehyde) Base) acrylic vinegar, such as (meth) acrylic acid esters of poly 7G alcohols and (meth) propane #acids of polyepoxides. Purposes printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs for use in the present invention (Meth) acrylic acid esters of linear or branched chain fatty alcohols of plasticizers include those having about 4 to about 6 carbon atoms, such as (; yl) n-butylpropionate, (methyl ) Isobutyric acid @ Purpose, Dimethyltributyrate ((methyl) acetate), (2-methyl) propionate · 2- Hexanoic acid, n-octyl (methyl) propionate, isodecyl propionate, dodecyl propionate, tris (propionyl) propionate, tris (propionyl) propionate Tetradecanoate acetic acid and (amidyl) two-associated soil pit vinegar. (Meth) propanoic acid of fatty alcohols with aromatic hydrocarbon substituents ... Has-one aromatic substituent and has To about 8 ❹ of (meth) acrylic acid vinegar, such as benzyl (meth) propionate. '、, Zhifaol -8 _ 5 scales are applicable to 11¾ standard (CNS) M secret sauce-^ I-(Please read the precautions on the back before filling this page)

、1T 561178 A7 B7 五、 發明説明（6) 經濟部中央標準局員工消費合作社印製 在本發明内用作增塑劑之脂環醇之（甲基）丙烯酸酯包括 (甲基）丙烯酸環己酯和（曱基）丙烯酸異宿酯。 在本發明内用作增塑劑之含有羥基之烷基（甲基）丙埽酸 酯包括（甲基）丙烯酸羥乙酯、（甲基）丙晞酸羥丙酯和（甲 基）丙烯酸-3 -苯氧基-2 -羥丙酯。 在本發明内有用之羥基脂肪胺之（甲基）丙烯酸酯包括以 NRiR2R3表示的胺之（甲基）丙烯酸酯，其中Rl、y和反3爲 獨1的氫、貌基、藉燒基或氫_多（氧烯）基，且至少有〜 個R1、R2和R3爲羥烷基或氫-多（氧烯）基。 其它將定的例子包括N，N，-二烷基取代的二單烷醇胺之 (曱基）丙烯酸酯，如（曱基）丙烯酸-N，n，-二甲基胺乙酯和 (甲基）丙烯酸-N，N，_二乙基胺乙酯；N-烷基取代的二烷 醇胺之單或二（甲基）丙烯酸酯，如（曱基）丙烯酸-N -乙基 N’-幾乙基胺乙酯和二（甲基）丙烯酸乙基二羥乙基胺騎； 二燒醇胺之（甲基）丙烯酸酯，如（甲基）丙烯酸三乙醇胺騎 、二（甲基）丙烯酸三乙醇胺酯和三（甲基）丙烯酸三乙醇胺 酉曰’（甲基）丙歸故燒醇胺g旨之混合物而這通常被稱作內缔 酸胺寡聚合物；和氫-多（氧烯）之（甲基）丙烯酸酯，如 (CH3)2N-(CH2CH2〇)2H 之（甲基）丙烯酸酯、ch3n[、 (ch2ch2o)2h]2之單或二（甲基）丙烯酸酯、和 (CH2CH2〇)2H]3之單、二或三（甲基）丙烯酸酯。 較佳的增塑劑包括式（H0R4)3_xN[R40C0C(R5)=CH2]x之化 合物，其中R4爲具有約2至約1 2個碳原子之烯基，或、 (OR )m 其中 R6 爲-CH2CH2-或-CH2CH(CH3)-且 m 爲 1 至 6 的整 -9- 本紙張尺度適用中國國家標隼（CNS ) A4規格（210X 297公釐） C請先閲讀背面之注意事頊再填寫本頁j ^衣1T 561178 A7 B7 V. Description of the invention (6) The (meth) acrylic acid esters of alicyclic alcohols used as plasticizers in the present invention, including cyclohexyl (meth) acrylate, printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs Esters and (fluorenyl) acrylic esters. Hydroxyl-containing alkyl (meth) propionates used as plasticizers in the present invention include hydroxyethyl (meth) acrylate, hydroxypropyl (meth) propionate, and (meth) acrylic acid- 3-phenoxy-2-hydroxypropyl ester. (Meth) acrylates of hydroxy fatty amines useful in the present invention include (meth) acrylates of amines represented by NRaR2R3, where R1, y, and trans3 are unique hydrogen, ammonium, alkynyl, or Hydrogen_poly (oxyalkylene) groups, and at least ~ R1, R2, and R3 are hydroxyalkyl or hydrogen-poly (oxyalkylene) groups. Other examples to be identified include (fluorenyl) acrylates of N, N, -dialkyl-substituted dimonoalkanolamines, such as (fluorenyl) -N, n, -dimethylamine ethyl acrylate and (methyl (Meth) acrylic acid-N, N, -diethylamine ethyl ester; N-alkyl-substituted dialkanolamine mono- or di (meth) acrylates, such as (fluorenyl) acrylic acid-N-ethyl N ' -Ethylaminoethylamine and ethyldihydroxyethylamine di (meth) acrylate; (meth) acrylates of diethanolamine, such as triethanolamine (meth) acrylate, di (meth) A mixture of triethanolamine acrylate and triethanolamine tri (meth) acrylate, which is called ((meth) propargyl alcohol amine) and this is often referred to as an endomer amine oligomer; and hydrogen-poly (oxygen) (Meth) acrylates of olefins, such as (meth) acrylates of (CH3) 2N- (CH2CH2〇) 2H, mono or di (meth) acrylates of ch3n [, (ch2ch2o) 2h] 2, and (CH2CH2〇) 2H] 3 mono, di or tri (meth) acrylate. Preferred plasticizers include compounds of the formula (H0R4) 3_xN [R40C0C (R5) = CH2] x, where R4 is an alkenyl group having about 2 to about 12 carbon atoms, or (OR) m where R6 is -CH2CH2- or -CH2CH (CH3)-and m is a whole number from 1 to 6-9- This paper size applies to China National Standard (CNS) A4 (210X 297 mm) C Please read the precautions on the back first Fill in this page j ^ 衣

、^T, ^ T

Jm 561178 A7 B7 五、發明説明（7 ) 數；R5爲氫或甲基；且χ爲1至3的整數。 夕元醚之（甲基）丙埽酸酯的例子包括乙二醇二（甲基）丙 烯酸§曰、一乙二醇二（甲基）丙烯酸酯、三乙二醇二（甲基） 丙烯酸g曰、四乙二醇二（甲基）丙烯酸酯、丨，3 -丁二醇二（ 甲基）丙烯酸酯和三羥甲基丙烷三（甲基）丙烯酸酯。多元 環氧化合物之（甲基）丙烯酸酯的例子包括雙酚A表氯烷反 應產物之二（甲基）丙烯酸酯。 在本發明内用作增塑劑之芳香族或脂肪族的醋包括芳香 狹的妖二烷基酯，即酞酸二（Ci _ Cl]烷基）醋，如酞酸 一甲酯、酞酸二乙酯、酞酸二正辛酯、酞酸二_ 2 _乙基己 酉曰和g太I辛基癸酯’脂肪族的一元酸酯，如油酸丁酯和甘 油一油酸酯；和脂肪族的二元酸酯，如己二酸二丁酯、己 一 g父二—2 —乙基己g旨、癸二酸二丁 酉旨和癸二酸 —2 —乙 (請先閲讀背面之注意事項再填寫本頁) 、?! 經濟部中央標準局員工消費合作社印製 基己酯。 在這些增塑劑中，以上式表示的氫-多（氧烯）胺或烷醇 胺之（甲基）丙烯酸酯、酞酸二（Ci _ Ci2烷基）酯、含有羥基 之烷基（甲基）丙烯酸酯、和脂環醇之（曱基）丙烯酸酯是最 佳的。 通常增塑劑成份的用量爲每100份重的環氧樹脂内有1至 約90份重的量。較佳的範圍爲樹脂重的5至5〇份重。 本發明之熱固性樹脂組合物可配成單成分組合物、其中 所有的原料混合在一起，或可配成雙成分組合物，其中1 環氧樹脂和硬化劑分開儲存且在使用前才加以混合。因此 ，本發明所用的硬化劑通常可爲單成分和雙成分環氧樹脂 -10- 本紙張尺度適用中國國家標準（CNS ) A4規格（210 X 297公楚） 561178 A7 B7 五、發明説明（8 ) 配方所用之任何的硬化劑。然而，本發明心之較佳_ 化劑包括胺化合物、咪唑化合物、變性的胺化合物和變性 的味峻化合物。 胺化合物的例子包括氰胍；脂肪族多元胺，如二乙三胺 、三乙四胺和二乙胺基丙胺；芳香族多元胺，如間二甲苯 二胺和二胺基二苯胺；脂環族多元胺，如異佛爾_二胺和 莖烯二胺；和多元胺。 味峻化合物的例子包括2_甲基味吐、2乙基甲基味 峻和2 -苯基咪。坐。 變性的胺化合物的例子包括將胺化合物加人環氧化合物 内所形成的環氧加成的多元胺，且變性的味峻化合㈣例 子包括將咪唑化合物加入環氧化物内所形成的咪唑加成物。 在這些硬化劑中，用於單成分環氧樹脂之潛藏的硬化劑 最佳，由修理性的觀點看來，基於硬化劑之總重最好使用 5至95%重量百分率之變性的胺結合”至5 %重量百分率的 氰胍。迥常硬化劑本身的用量爲每1〇〇份重的環氧樹脂内 有約3至約60份重的量。較佳的範圍爲樹脂重的$至4〇份重 經濟部中央標準局員工消費合作社印製 本各明t熱固性樹脂組合物最好含有前述的塑化劑和單 g此％氧树脂且其合起來的量爲約5至約4〇%重量百分率。 本⑤明足A固性樹脂組合物能滲透入電路板與半導體裝 K間的2隙。這些新的組合物至少在高谭下亦顯示出較 低的粘度，因此能滲透入那些空隙内。需愼選各種原料的 種類和比例來製備熱固性樹脂組合物，以便在25°C下的枯 了作成¥起的形狀。並且，爲了改進連接的可靠性和耐久 性：亡導體裝置與載體基質之間的空隙可用適當的樹脂來 加以在封。可用於本發明之半導體裝置包括CSPs和BGAs。 口對於本發明所用之電路板的種類並沒有特別的限制，且 了使用任何一般的電路板如玻璃補強環氧樹脂、 樹脂板。 其次，安裝方法敘述如下。首先，將焊錫乳液£卩到電路 板亡需要的位置上並適當地乾燥以趕出溶劑。然後，將半 導把裝置配合圖形裝到電路板上。此電路板通過—個逆流 火爐以溶融悍錫並將半導體裝置焊上。半導體裝置與電路 板之間的電氣連接並不限於焊錫乳液的使用，#亦可使用 谇錫球。另外，此連接亦可使用電導粘著劑或異方性導電 粘著训來達成。並且’焊錫乳液等亦可施加到電路板或半 導髂裝置上。爲了使將來的修理更爲容易，所用的焊錫、 電氣或異方性導電枯著劑的選擇必須注意其溶點、連結強 度等等。 在半導體裝置以此種方法電氣連接至電路板上後，所形 成的結構通常需作連續性測試等等。在通過此測試後，半 導體裝置即可用樹脂組合物加以固定。在此種方法中，若 失敗時’則在用樹脂组合物固定半導體裝置之前可較容易 的將它取下來。 然後’使用通當的設備如分配機將熱固性樹脂組合物施 加到半導體元件的周圍。當此組合物施加到半導體裝置上 時，它即經由毛細作用而滲入電路板與半導體裝置的載體 -13- 561178 A7 B7 五、發明説明（11 ) 基質之間的空隙内。 其次，熱固性樹脂組合物用熱加以硬化。在加熱的早期 ，熱固性樹脂組合物的粘度會大大地降低因而使其流動性 增加，以致於它能更容易地滲入電路板與半導體裝置之間 的空隙。並且，對電路板提供適當的排氣孔後，熱固性樹 脂組合物能完全地滲入電路板與半導體裝置之間的整個空 隙内。 施加之熱固性樹脂組合物的量需適當的調整以便能幾乎 完全地填滿電路滿與半導體之間的空隙。 當使用上述的熱固性樹脂組合物時，通常加熱至至 150 C並持續約5至20分鐘來加以硬化。因此，本發明可使 用相當低溫和短時間的硬化情況且可達到極佳的生產力。 圖1所示的安裝結構用此種方法來完成。其中在熱固性樹 脂組合物内使用（甲基）丙烯酸酯作爲增塑劑，並加入光聚 合反應起始劑，因而使熱固性樹脂組合物在熱硬化前可暫 時地暴露在光下硬化。 經濟部中央標準局員工消費合作社印製 在使用本發明之熱固性樹脂組合物的安裝程序中，在半 導體裝置依上述安裝到電路板上後，所形成的結構需測試 半導體裝置的特性、半導體裝置與電路板之間的連接、其 他的電氣性質、和封裝的狀況。若發現失敗時，可用下述 的方法來修理。 將失敗之半導體裝置的鄰近區域加熱至約19〇至約26〇t 並持％約10秒鐘至約1分鐘。雖然加熱的方法並沒有特別 的限制，但最好使用局部加熱。可以使用相當簡單的方法 ___ - 14- 本紙張尺度適财g gj家標準（CNS ) A视^ Q χ 297公董） (請先閱讀背面之注意事項再填寫本頁) 561178 五、發明説明（η) 成。 當故障被發現是在雷 思路板上時，可依上述相 除半導體裝置底部上％ 丨』的万法清 一 A 口性树脂組合物之硬化的反；a j物 之殘留物13和焊錫的β μ此 m物 勺\ ‘物15，而使半導骨#裝罢 用。 成干爷时衮置可以再使 本發明將以下过〔去μΈ座丨，Α , τ， 未限制的例子加以便進一步的說明。 例子 例1 复__固性樹脂組会妝 _熱固性樹脂組合物的製備是混合-種環氧樹脂(由85份 重雙紛Α型環氧樹脂、4份重的㈣清漆環氧樹脂、和⑴分 重的12至14個碳原子之烷基縮水甘油魅之混合物製備而成 的);3份重的氰胍和19份重的胺之環氧樹脂加成物所製備 而成的硬化劑，和12份重的丙烯酸胺寡聚合物之增塑劑。 此外，亦混入0.1份重的消泡劑。如此形成的组合物之粘度 爲 5,200 mPa · s。 經濟部中央標準局員工消費合作社印製 使用場錫乳液（PS10R-350A-F92C ;由 Hanma Chemicals，Jm 561178 A7 B7 V. Description of the invention (7) number; R5 is hydrogen or methyl; and χ is an integer of 1 to 3. Examples of (meth) propanoic acid esters of xiyuan ether include ethylene glycol di (meth) acrylic acid, monoethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylic acid, g Namely, tetraethylene glycol di (meth) acrylate, 1,3-butanediol di (meth) acrylate and trimethylolpropane tri (meth) acrylate. Examples of the (meth) acrylate of a polyvalent epoxy compound include a di (meth) acrylate of a bisphenol A epichlorohydrin reaction product. Aromatic or aliphatic vinegars used as plasticizers in the present invention include aromatic narrow dialkyl dialkyl esters, that is, phthalic acid di (Ci_Cl) alkyl vinegars, such as monomethyl phthalate, phthalic acid Diethyl ester, di-n-octyl phthalate, di-2-octyl phthalate, and g octyl decyl 'aliphatic monobasic acid esters, such as butyl oleate and glycerol monooleate; And aliphatic dibasic acid esters, such as dibutyl adipate, hexamethylene di-2--2-ethylhexan g, dibutyl sebacate, and sebacic acid 2-ethyl (please read the back first) (Notes on this page, please fill out this page),?! The Central Consumers Bureau of the Ministry of Economic Affairs, the Consumer Cooperatives, printed hexyl esters. Among these plasticizers, a (meth) acrylate of a hydrogen-poly (oxyene) amine or an alkanolamine represented by the above formula, a di (Ci_Ci2 alkyl) phthalate, and an alkyl group (a (Meth) acrylates, and (fluorenyl) acrylates of alicyclic alcohols are most preferred. The plasticizer component is usually used in an amount of 1 to about 90 parts by weight per 100 parts by weight of the epoxy resin. A preferred range is 5 to 50 parts by weight of the resin. The thermosetting resin composition of the present invention can be formulated as a one-component composition in which all raw materials are mixed together, or can be formulated as a two-component composition in which 1 epoxy resin and hardener are stored separately and mixed before use. Therefore, the hardener used in the present invention can usually be one-component and two-component epoxy resins. -10- The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297). 561178 A7 B7 V. Description of the invention (8 ) Any hardener used in the formulation. However, preferred agents of the present invention include amine compounds, imidazole compounds, denatured amine compounds, and denatured flavor compounds. Examples of amine compounds include cyanoguanidine; aliphatic polyamines such as diethylenetriamine, triethylenetetramine, and diethylaminopropylamine; aromatic polyamines such as m-xylylenediamine and diaminodiphenylamine; alicyclic rings Groups of polyamines, such as isophoryl diamine and stemene diamine; and polyamines. Examples of Weijun compounds include 2-methyl miso, 2-ethylmethyl miso, and 2-phenylimid. sit. Examples of denatured amine compounds include epoxy addition polyamines formed by adding amine compounds to epoxy compounds, and examples of denatured flavor compounds include imidazole additions formed by adding imidazole compounds to epoxides. Thing. Among these hardeners, the latent hardeners used for one-component epoxy resins are the best. From a repairability point of view, it is best to use a denatured amine bond of 5 to 95% by weight based on the total weight of the hardener. " To 5% by weight of cyanoguanidine. The usual hardener itself is used in an amount of about 3 to about 60 parts by weight per 100 parts by weight of the epoxy resin. A preferred range is from $ 4 to 4 by weight of the resin. 〇Printed by the Consumers' Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs, the thermosetting resin composition preferably contains the aforementioned plasticizer and a single g of this% oxygen resin, and the combined amount is about 5 to about 40% Percent by weight. This ⑤ Mingzu A solid resin composition can penetrate into the 2 gap between the circuit board and the semiconductor package K. These new compositions also show lower viscosity at least under Gao Tan, so they can penetrate those Within the gap. The types and proportions of various raw materials need to be selected to prepare the thermosetting resin composition so that it will dry at 25 ° C to form a shape starting from ¥. And, in order to improve the reliability and durability of the connection: The gaps between the carrier substrates can be appropriately Resin is used for sealing. Semiconductor devices that can be used in the present invention include CSPs and BGAs. There is no particular limitation on the type of circuit board used in the present invention, and any general circuit board such as glass reinforced epoxy resin, resin Second, the installation method is described below. First, solder the solder emulsion to the required position of the circuit board and dry it properly to drive out the solvent. Then, install the device with the pattern on the circuit board. This circuit The board passes a counter-current furnace to melt the tin and solder the semiconductor device. The electrical connection between the semiconductor device and the circuit board is not limited to the use of solder emulsion. ## 谇 球球 also can be used. In addition, this connection can also be used Conductive adhesive or anisotropic conductive adhesion training is achieved. And 'solder emulsions can also be applied to circuit boards or semiconducting devices. To make future repairs easier, the solder, electrical or alien The selection of the conductive conductive desiccant must pay attention to its melting point, connection strength, etc. After the semiconductor device is electrically connected to the circuit board in this way, all the The completed structure usually needs to be tested for continuity, etc. After passing this test, the semiconductor device can be fixed with the resin composition. In this method, if it fails, it can be compared before fixing the semiconductor device with the resin composition. It is easy to remove it. Then 'apply a thermosetting resin composition to the periphery of the semiconductor element using a suitable device such as a dispenser. When this composition is applied to a semiconductor device, it penetrates into the circuit board and the substrate via capillary action. Semiconductor device carrier-13- 561178 A7 B7 V. Description of the invention (11) In the space between the substrates. Second, the thermosetting resin composition is hardened by heat. In the early stage of heating, the viscosity of the thermosetting resin composition will be greatly reduced. As a result, its fluidity is increased, so that it can more easily penetrate into the space between the circuit board and the semiconductor device. Furthermore, after the circuit board is provided with appropriate vent holes, the thermosetting resin composition can completely penetrate into the circuit board and the semiconductor Within the entire gap between the devices. The amount of the thermosetting resin composition to be applied needs to be appropriately adjusted so as to fill the gap between the circuit full and the semiconductor almost completely. When the above-mentioned thermosetting resin composition is used, it is usually heated to 150 C and hardened for about 5 to 20 minutes. Therefore, the present invention can use a relatively low temperature and short time hardening situation and can achieve excellent productivity. The installation structure shown in FIG. 1 is completed by this method. Among them, a (meth) acrylic acid ester is used as a plasticizer in a thermosetting resin composition, and a photopolymerization reaction initiator is added, so that the thermosetting resin composition can be temporarily exposed to light and hardened before heat curing. Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs in the installation procedure using the thermosetting resin composition of the present invention. After the semiconductor device is mounted on the circuit board as described above, the structure formed must be tested for the characteristics of the semiconductor device, the semiconductor device and the Connections between circuit boards, other electrical properties, and packaging conditions. If failure is found, the following methods can be used to repair it. The vicinity of the failed semiconductor device is heated to about 190 to about 260 t for about 10 seconds to about 1 minute. Although the method of heating is not particularly limited, it is preferable to use local heating. You can use a fairly simple method. ___-14- The paper size is suitable for g gj home standards (CNS) A as ^ Q χ 297 public director) (Please read the precautions on the back before filling out this page) 561178 5. Description of the invention (Η) Success. When the fault is found on the lightning board, the hardening reaction of the A-mouth resin composition can be removed according to the above-mentioned Wanfa Qingyi A mouth resin composition; the residue 13 of the aj and the β of the solder μ this material spoon \ 物 15, so that semi-conductive bone # loaded stop. In the case of success, the present invention can add the following examples (to μΈ, A, τ, unrestricted) for further explanation. Examples Example 1 Compound __setting resin group meeting makeup _ thermosetting resin composition is prepared by mixing-a type of epoxy resin (consisting of 85 parts by weight of bisphenol A epoxy resin, 4 parts by weight of varnish epoxy resin, and ⑴A mixture of 12 to 14 carbon atoms of alkyl glycidol); a hardener made of epoxy resin adduct of 3 parts by weight of cyanoguanine and 19 parts by weight of amine , And 12 parts by weight of a plasticizer of amine oligomers of acrylic acid. In addition, 0.1 parts by weight of a defoamer is also mixed. The viscosity of the composition thus formed was 5,200 mPa · s. Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs, Tin Emulsion (PS10R-350A-F92C; by Hanma Chemicals,

Inc·所製造），將2〇 mm平方大小的CSP組件，直徑爲〇 5 mm 的電極，1 ·〇 mm的電極高度，和由氧化鋁製的載體基質安 裝到具有電路之1.6 mm厚玻璃補強環氧樹脂板上。 然後’用分配器將熱固性樹脂組合物施加到CSP的周圍 ，並加熱至約150Ϊ且持續約5分鐘的時間。在硬化完成之 削’熱固性樹脂組合物會滲入半導體裝置與電路板之間的 -16- 本紙張尺度適用中國國家標準（CNS ) A4M ( 210X297公釐） 561178 五、發明説明（14 ) 空隙内。 熱衝擊 25個依上述製備的樣品暴露在熱猶環中，將樣品維持在 约-4(TC的溫度下約财鐘，然後將溫度升至室溫約3分鐘 ，隨後將溫度升至約8代並維持約如分鐘的時間。在達到 :定次數的熱循環後，對樣品作連續性測試以確認Up與 兒板之間的連接。當1，_次或以上的循環週期後連續性仍 存在時’則樣品被認定是合格的，且在此次數之循環遲期 到達（前，當連續性由㈣線等而喪失時，則樣品是不合 格的。對於此例之安裝結構，即使在〗，_次以上的循環^ 期下，所有25個樣品均需是合格的。 修理 使用熱空氣產生器，將依上述用熱固性樹脂組合物固定 至電路板上之CSP的周圍區域用熱空氣加熱至25〇ri分鐘 ;、、：彳又’可在CSP與玻均補強環氧樹脂板之間插入一片金 屬片而很容易地取下CSP。 經濟部中央標準局員工消費合作社印製 田破4補強環氧樹脂被放在一個熱板上（或用遠紅外線 …、等來加^ )以維持在約1 〇〇 C時，留在破喊補強環 氧樹脂板上的樹脂可用溶劑如ps_丨（由Dal-lchl Kogyc)Inc.), a 20mm square CSP module, an electrode with a diameter of 0.05mm, an electrode height of 1.0mm, and a carrier substrate made of alumina were mounted on a 1.6mm thick glass with a circuit to reinforce it Epoxy board. The thermosetting resin composition is then applied to the periphery of the CSP with a dispenser and heated to about 150 [deg.] F. for a period of about 5 minutes. The cured thermosetting resin composition that has been cured will penetrate between the semiconductor device and the circuit board. -16- This paper is in accordance with Chinese National Standard (CNS) A4M (210X297 mm) 561178 V. Description of the invention (14). Thermal shock 25 samples prepared as described above were exposed to the heat ring, the samples were maintained at a temperature of about -4 ° C for about a few minutes, then the temperature was raised to room temperature for about 3 minutes, and then the temperature was increased to about 8 Generation and maintenance for about a minute. After reaching a certain number of thermal cycles, make a continuity test on the sample to confirm the connection between the Up and the child board. When 1, _ or more cycles, the continuity is still When it exists, the sample is deemed to be qualified, and the cycle is delayed after this number of times (previously, when the continuity is lost by the squall line, etc., the sample is unqualified. For the installation structure of this example, even if 〖, More than _ cycles ^ In the next period, all 25 samples must be qualified. Repair using a hot air generator, heat the surrounding area of the CSP fixed with the thermosetting resin composition to the circuit board as described above, and heat with hot air To 25〇ri minutes; ,,: 彳 You can easily remove the CSP by inserting a piece of metal sheet between the CSP and the glass-reinforced epoxy resin board. Printed by Tian Po 4 from the Consumer Cooperatives of the Central Standards Bureau, Ministry of Economic Affairs Reinforced epoxy is placed in a Hot plate (or use far-infrared rays, etc. to add ^) to maintain at about 100 C, the resin remaining on the epoxy reinforced epoxy resin plate can be used as a solvent such as ps 丨 (by Dal-lchl Kogyc)

Seiyaku Co.，Ltd.所製造）或 7360(由 Loctite Corporation所製造） 來加以膨潤，然後抹刀加以刮除。留在玻螭補強環氧樹脂 板上的焊錫可用焊錫吸附的辮帶來加以清除。此修理操作 所需的時間在3分鐘内，這由實務的觀點上看來是相當短 的。 -17 本紙張尺度適用中關家標準（CNS ) A4· ( 21Qx297公 561178 五 、發明説明（π) 員 工 消 費 烊錫礼液可再施加至已依上述方法取下CSP之破璃補強 衣氧树脂板上，然後再安裝上新的c sp。在此操作中，焊 锡乳液可印在新的CSP上。 如上述相同的方法，將熱固性樹脂組合物施加到CSP的 周圍然後加熱至15(TC 5分鐘。 在如此修理之CSP安裝板上，可牢固地產生電氣接頭。 並且，在熱衝擊測試上，顯示出類似於未修理的板子一樣 核佳的性質。 除了在例1中用作增塑劑之丙烯酸胺寡聚合物的量依下 面所示的改變之外，重覆例！的步驟。所形成的安裝結構 通過熱衝擊測試，且其修理時間在3分鐘内。 例2 ·· 1.2份重。 例3 : 6.0份重。 例4 : 21.0份重。 例5 : 50.0份重。 比較例1 除了不使用增塑劑之外，重❹i的步驟。所形成的安 裝結構顯示出合格的修理性，但並未通過熱衝擊測試因爲 連續性在少於1，000次的循環週期下喪失。 比較例2 除了在例1中用作增塑劑之丙烯酸胺寡聚合物的量變成 12〇份重之外，重覆m的步驟。所形成的安裝結構顯示出 合格的修理性，但並未通過熱衝擊測試因爲連續性在少於 -18- 項 Ift 頁 訂 I 4 本纸張尺度適用中國國家標準（CNS ) Μ規格（21〇><297公釐） 經濟部中央標準局員工消費合作社印製 561178 五、發明説明（16) 1，000次的循環週期下喪失 例6 - 9 除了在例1中所用之12至14個碳原子之烷基縮水甘油醚 之混合物的量依下面所示的改變之外，重覆例1的步驟。 所形成的士裝結構通過熱衝擊測試，且其修理時間在3分 鐘内。 例6 : 0份重。 例7 : 2.7份重。 例8 : 5.3份重。 例9 : 20.0份重。 比車交例3 除了在例1中所用之12至14個碳原子之垸基縮水甘油酸 之混合物的量變成40份重之外，重覆例1的步驟。所形成 的安裝結構顯示出合格的修理性，但並未通過熱衝擊測試 因爲連續性在少於1 ,〇〇〇次的循環週期下喪失。 例 1 0 - 1 2 除了在例1中用作增塑劑之丙烯酸胺寡聚合物被下面所 示的每種化合物取代之外，重覆例1的步驟。所形成的安 裝結構通過熱衝擊測試，且其修理時間在3分鐘内。 例10 : DOP(酞酸二辛酯）° 例11 ··丙烯酸異莅酯° 例12 :甲基丙烯酸-2 -羥乙酯。 例13 除了在例1中用作硬化劑之胺的環氧樹脂加成物被味峻 -19- 本紙張尺度適用中國國家標準（CNS ) 21QX297M ) ^---Γ- 衣-- (讀先閲讀背面之注意事項再填寫本頁)Seiyaku Co., Ltd.) or 7360 (manufactured by Loctite Corporation) to swell, and then scrape with a spatula. The solder left on the glass-reinforced epoxy board can be removed with a braid band that is adsorbed by the solder. The time required for this repair operation is within 3 minutes, which is quite short from a practical standpoint. -17 This paper standard is applicable to Zhongguanjia Standard (CNS) A4 · (21Qx297 Gong 561178) V. Description of Invention (π) Employees' tin tin can be re-applied to the glass-reinforced clothing oxygen resin that has been removed from CSP according to the above method. Board, and then install a new csp. In this operation, the solder emulsion can be printed on the new CSP. In the same way as above, the thermosetting resin composition is applied around the CSP and then heated to 15 (TC 5 Minutes. On the CSP mounting plate repaired in this way, the electrical connector can be firmly produced. Also, in the thermal shock test, it shows the same excellent properties as the unrepaired board. Except that it is used as a plasticizer in Example 1. The amount of acrylic amine oligomer is changed as shown below, repeating the steps of Example! The mounting structure formed has passed the thermal shock test, and its repair time is within 3 minutes. Example 2 · 1.2 parts by weight Example 3: 6.0 parts by weight. Example 4: 21.0 parts by weight. Example 5: 50.0 parts by weight. Comparative Example 1 The procedure was repeated except that no plasticizer was used. The resulting mounting structure showed acceptable repairability. But did not pass thermal shock The test was lost due to the continuity at a cycle of less than 1,000 times. Comparative Example 2 The amount of m was repeated except that the amount of the acrylic amine oligomer used as a plasticizer in Example 1 became 120 parts by weight. The installation structure formed shows qualified repairability, but failed the thermal shock test because the continuity is less than -18-item Ift Page Order I 4 This paper size is applicable to Chinese National Standard (CNS) M specifications ( 21〇 > < 297 mm) Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 561178 V. Description of the invention (16) Examples 6 to 9 are lost at a cycle of 1,000 times. Except for 12 to 12 used in Example 1, The amount of the alkyl glycidyl ether mixture of 14 carbon atoms was changed as shown below, and the procedure of Example 1 was repeated. The formed taxi structure passed the thermal shock test, and its repair time was within 3 minutes. Example 6: 0 parts by weight. Example 7: 2.7 parts by weight. Example 8: 5.3 parts by weight. Example 9: 20.0 parts by weight. Specific to Example 3 except that the amidino group of 12 to 14 carbon atoms used in Example 1 has shrunk. The amount of the glyceric acid mixture was changed to 40 parts by weight, and the procedure of Example 1 was repeated. The formed The installation structure showed acceptable repairability, but failed the thermal shock test because the continuity was lost at less than 1,000 cycles. Example 1 0-1 2 Except for plasticizing in Example 1 The acrylic amine oligomer of the agent was replaced with each of the compounds shown below, and the steps of Example 1 were repeated. The resulting mounting structure passed the thermal shock test and its repair time was within 3 minutes. Example 10: DOP ( Dioctyl phthalate) ° Example 11 · Isopropyl acrylate ° Example 12: 2-hydroxyethyl methacrylate. Example 13 Except for the epoxy resin adduct of amine used as hardener in Example 1, Weijun-19- This paper size applies Chinese National Standard (CNS) 21QX297M) ^ --- Γ- clothing-(read first (Read the notes on the back and fill out this page)

、1T 561178 五、發明説明（π) 的環氧樹脂加成物取代之外， 安裝結構通過熱衝擊測試， 重覆例1的步驟。所形成的 且其修理時間在3分鐘内 經濟部中央標準局員工消費合作社印製 除了使用一種含有丙蘇π ^ ^ ^ 年私自曰暴聚合物、丙烯酸酯單體和 光聚合反應起始劑之枯著劑（ΤΒ3006Β ;由Three Pond Co·, 、斤)來取代例1中尸斤用的纟固性樹脂組合物，且將 "她力土半寸姐裝置與電路板之間的空隙内並暴露在光中 且加熱使其硬化之外，香码 重设例1的步驟。當使用此粘著劑 時’在其半硬化的狀態下半導體裝置可得容易的被取下。 在粘著劑完全硬化後，對所形成的安裝結構作熱衝擊測試 ^的熱衝擊性質不合格，因爲連續性在少於！，_次的循 環週期下喪失。 比較例5 除了與例！相同的方法使用—種環氧樹脂封裝劑（sa_5i_ 2 ;由Asah〗 Kaken Co.，Ltd·所製造）來取代例i中所用的熱固 性樹脂组合物，且加熱至1〇〇»c硬化9〇秒鐘之外，重覆例^ 的步驟。在熱衝擊測試中，所形成的安裝結構顯示出與例 1相同程度的可靠性。然而，爲了修理的目的而加熱以嘗 試分開半導體裝置，但是無效。 本發明的全部範圍由申請專利範圍來陳述。 20- 本纸張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁}1T 561178 5. In addition to the epoxy resin adduct of (π), the mounting structure passed the thermal shock test, and the steps of Example 1 were repeated. Printed by the Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs, which has a repair time of less than 3 minutes. In addition to the use of a polymer containing acrylic acid, acrylic acid monomer, and photopolymerization initiator, An adhesive (TB3006B; Three Pond Co., jin) was used to replace the sclerosing resin composition used in the corpse in Example 1, and the quotient was placed in the space between the half-inch device and the circuit board and Except for exposing to light and heating to harden, Fragrance Code reset the procedure of Example 1. When this adhesive is used, the semiconductor device can be easily removed in its semi-hardened state. After the adhesive is completely hardened, perform a thermal shock test on the resulting mounting structure. ^ The thermal shock properties are unacceptable because the continuity is less than! Loss of _ cycles. Comparative Example 5 Except and Example! In the same method, an epoxy resin encapsulant (sa_5i_ 2; manufactured by Asah) Kaken Co., Ltd. was used instead of the thermosetting resin composition used in Example i, and it was heated to 100 ° C and hardened 9 °. Repeat the steps of Example ^ in seconds. In the thermal shock test, the resulting mounting structure showed the same degree of reliability as in Example 1. However, heating for repair purposes to try to separate the semiconductor device is not effective. The full scope of the invention is set forth by the scope of the patent application. 20- This paper size applies to Chinese National Standard (CNS) A4 (210X297 mm) (Please read the precautions on the back before filling this page}

Claims (1)

561178 第087100682號專利申請案 中文申請專利範圍替換本(92年3月) ABCD ;E ΐ餐， 六、申請專利範^ J LIT 1· 一種能夠在半導體裝置包括安裝至載體基質上的半導體 晶片與該半導體裝置所電連接的電路板之間進行底部充 填密封之熱固性樹脂組合物，該組合物包括： 100份重的環氧樹脂， 3至60份重的硬化劑，和 1至90份重的增塑劑， 其中該環氧樹脂包含至少一種多官能環氧樹脂，且該熱 固性樹脂組合物於硬化後，係可於1 9 0至2 6 0 °C之溫度 軟化’且該溫度係鬲於用以硬化該組合物之溫度，使該 半導體裝置可立即自該電路板分離。 2·如申请專利範圍第1項之組合物，其中該環氧樹脂包含 至高30%重之至少一種單官能環氧樹脂。 3·如申請專利範圍第1項之組合物，其中該硬化劑包括至 少一種化合物’選自包括胺化合物、咪峡化合物及衍生 物，以及其組合。 4.如申請專利範圍第1項之組合物，其中該增塑劑包含至 少一種化合物’選自包括（甲基）丙缔酸酯、芳族或脂族 酯及其組合。 5·如申凊專利範圍第4項之組合物，其中該增塑劑與該單 &此％乳樹脂之合併量為組合物總重之5至4〇%。 6·如申請專利範圍第4項之組合物，其中該單官能環氧樹 脂具有6至28個碳原子之烷基。 7·如申凊專利範圍;第4項之組合物，其中該多官能環氧樹 本紙張尺度適用中國國豕標準(CNS) Α4規格(21〇 X 297公釐) ABCD 561178 、申請專利範圍 脂含有10至100%重之雙酚A型環氧樹脂。 8, 如申請專利範圍第1項之組合物，其中該增塑劑為羥基 脂族胺之（甲基）丙婦酸酯。 9. 如申請專利範圍第1項之組合物，其具有在25°C溫度下 之黏度低於50,000 mPa · s。 -2- 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐）561178 Patent Application No. 087100682 Chinese Application for Patent Scope Replacement (March 1992) ABCD; E ΐ 食 ， 六 、 Applicable patents ^ J LIT 1. A semiconductor device including a semiconductor wafer mounted on a carrier substrate and A thermosetting resin composition for underfill sealing between circuit boards electrically connected to the semiconductor device, the composition includes: 100 parts by weight of epoxy resin, 3 to 60 parts by weight of hardener, and 1 to 90 parts by weight Plasticizer, wherein the epoxy resin contains at least one polyfunctional epoxy resin, and the thermosetting resin composition can be softened at a temperature of 190 to 260 ° C after hardening, and the temperature is lower than The temperature used to harden the composition allows the semiconductor device to be immediately separated from the circuit board. 2. The composition according to item 1 of the patent application range, wherein the epoxy resin contains at least 30% by weight of at least one monofunctional epoxy resin. 3. The composition according to item 1 of the patent application range, wherein the hardener comprises at least one compound 'selected from the group consisting of an amine compound, a midazo compound and a derivative, and combinations thereof. 4. The composition of claim 1 wherein the plasticizer comprises at least one compound 'selected from the group consisting of (meth) acrylic acid esters, aromatic or aliphatic esters, and combinations thereof. 5. The composition as described in claim 4 of the patent scope, wherein the combined amount of the plasticizer and the single milk resin is 5 to 40% of the total weight of the composition. 6. The composition according to item 4 of the application, wherein the monofunctional epoxy resin has an alkyl group of 6 to 28 carbon atoms. 7. The scope of the patent as claimed; the composition of item 4, wherein the size of the multifunctional epoxy resin paper is applicable to the Chinese National Standard (CNS) A4 specification (21 × X 297 mm) ABCD 561178 Contains 10 to 100% by weight of bisphenol A type epoxy resin. 8. The composition according to item 1 of the application, wherein the plasticizer is (meth) propionic acid ester of hydroxyaliphatic amine. 9. The composition according to item 1 of the patent application scope, which has a viscosity at 25 ° C of less than 50,000 mPa · s. -2- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)
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JP3613367B2 (en) 2005-01-26

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