TW561071B - Nozzle device and substrate processing device with the nozzle device - Google Patents

Nozzle device and substrate processing device with the nozzle device Download PDF

Info

Publication number
TW561071B
TW561071B TW091111940A TW91111940A TW561071B TW 561071 B TW561071 B TW 561071B TW 091111940 A TW091111940 A TW 091111940A TW 91111940 A TW91111940 A TW 91111940A TW 561071 B TW561071 B TW 561071B
Authority
TW
Taiwan
Prior art keywords
liquid
substrate
processing liquid
nozzle device
aforementioned
Prior art date
Application number
TW091111940A
Other languages
English (en)
Chinese (zh)
Inventor
Shigeru Mizukawa
Takashi Murata
Katsutoshi Nakata
Shunji Matsumoto
Takeshi Akasaka
Original Assignee
Sumitomo Precision Prod Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Precision Prod Co filed Critical Sumitomo Precision Prod Co
Application granted granted Critical
Publication of TW561071B publication Critical patent/TW561071B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/027—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/14—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openings; with strainers in or outside the outlet opening
    • B05B1/20—Arrangements of several outlets along elongated bodies, e.g. perforated pipes or troughs, e.g. spray booms; Outlet elements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Coating Apparatus (AREA)
  • Nozzles (AREA)
TW091111940A 2002-06-05 2002-06-05 Nozzle device and substrate processing device with the nozzle device TW561071B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2002/005567 WO2003103845A1 (ja) 2002-06-05 2002-06-05 ノズル装置及びこれを備えた基板処理装置

Publications (1)

Publication Number Publication Date
TW561071B true TW561071B (en) 2003-11-11

Family

ID=29727316

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091111940A TW561071B (en) 2002-06-05 2002-06-05 Nozzle device and substrate processing device with the nozzle device

Country Status (4)

Country Link
JP (1) JPWO2003103845A1 (ja)
CN (1) CN1627993A (ja)
TW (1) TW561071B (ja)
WO (1) WO2003103845A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101252753B1 (ko) * 2011-08-09 2013-04-09 주식회사 엠엠테크 기판 표면처리용 블레이드 모듈
JP6178185B2 (ja) * 2013-09-24 2017-08-09 積水化学工業株式会社 スリットノズル
CN105298531B (zh) * 2015-10-24 2017-06-30 山西晋城无烟煤矿业集团有限责任公司 掘锚机用喷雾装置
CN106111587B (zh) * 2016-06-23 2018-09-11 武汉华星光电技术有限公司 液刀
TW202204233A (zh) * 2020-07-17 2022-02-01 台郡科技股份有限公司 水平式輸送基板之傳動機構

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3458313B2 (ja) * 1992-12-31 2003-10-20 株式会社サンツール カーテンファイバー状接着剤のスプレー塗布装置
JPH06210228A (ja) * 1993-01-16 1994-08-02 San Tool:Kk カーテンファイバー状スプレー塗布装置
JPH1157573A (ja) * 1997-08-13 1999-03-02 Sun Tool:Kk 外装被覆商品の製造方法および外装被覆商品の製造装置

Also Published As

Publication number Publication date
WO2003103845A1 (ja) 2003-12-18
CN1627993A (zh) 2005-06-15
JPWO2003103845A1 (ja) 2005-10-06

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MM4A Annulment or lapse of patent due to non-payment of fees