A7 561071 五、發明說明（/ ) [技術領域] 本發明，係關於對液晶玻璃基板、半導體晶圓(矽晶圓 )、光罩用玻璃基板、光碟用基板等基板，噴出及塗佈藥水 或洗淨液的噴嘴裝置及具備其之基板處理裝置。 [習知技術] 例如，構成液晶基板之玻璃基板，係經過各種製程所 製造，各製程中，會對該基板進行光阻膜或顯影液之塗佈 ，其剝離用之藥水、或洗淨液之塗佈等各種處理液之塗佈。 對該玻璃基板之處理液之塗佈，習知方式，係使用一 基板處理裝置來進行，該基板處理裝置具有將玻璃基板支 撐爲水平之支撐機構，對被支撐爲水平之玻璃基板噴出處 理液之噴嘴裝置，以及將噴嘴裝置在玻璃基板上方使其沿 此基板移動（掃描）之移動裝置。作爲前述噴嘴裝置，係使 用圖15及圖16所示之噴嘴裝置。 如圖15及圖16所示，前述噴嘴裝置100，具備：於 玻璃基板W上方，沿其寬度方向（圖15中與紙面正交之方 向，圖16所示之箭頭Η方向)配置之長條狀噴嘴體101， 以及固著於此噴嘴體101、連結於前述移動裝置之適當支 撐部的支架108等。 噴嘴體101，係由長條狀第1構件102及第2構件 106所構成，此等第丨構件102及第2構件106，具有透過 密封用墊片107接合之構造。第1構件1〇2，具備沿其長 邊方向於一側面開口之槽103，與此處接合第2構件106 3 衣紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) 入§ ·. ;線. A7 561071 ___B7 __ 五、發明說明（> ) 以堵塞該開口部，據以形成供應室1〇3。 (請先閱讀背面之注意事項再填寫本頁) 又，於第2構件102，設有一方開口於上面、另一方 連通於前述供應室之供應璋104。於此供應璋104 ’透 過管接頭112連接供應管111(係連接於處理液供應裝置 110)，自處理液供應裝置111經供應管111、供應璋104 將處理液供應至前述處理室1〇3內。 又，於第2構件102，穿設有於其下面及前述供應室 103開口之噴出口 105，該噴出口 105係沿第1構件102之 長邊方向成一列、且具有既定節距。供應至前述供應室 103內之處理液，即流通於此噴出口 105內，從其開口部 噴出，塗佈於基板W上。 -線 具有上述構成之噴嘴裝置100，其前述支架108係連 結於前述移動裝置之適當支撐部，而被該移動裝置支撐’ 藉由此移動裝置移送(掃描)於與玻璃基板W寬度方向(箭頭 Η方向）正交之方向。 根據具有上述構成之基板處理裝置，係在玻璃基板W 被前述支撐機構支撐爲水平的狀態下，加壓之處理液從處 理液供應裝置110供應至噴嘴裝置100,而自前述各噴出 口 105之開口部噴出。 從前述各噴出口 105噴出之處理液，分別成爲一線條 狀之液體流，其全體成簾狀流下，塗佈於基板W上。然後 ，藉前述移動裝置，使前述噴嘴裝置100朝與玻璃基板W 寬度方向（箭頭Η方向)正交之方向移動，塗佈於玻璃基板 W上之處理液，即成爲沿噴嘴裝置100移動方向延伸之筋 4 幸、紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 561071 A7 __B7_ 五、發明說明（4 ) 狀液條而載於玻璃基板W上，不久，相鄰之筋狀液條即因 此表面張力而彼此混合成爲既定厚度之處理液膜。 上述習知之基板處理裝置，即係以此方式將處理液塗 佈於玻璃基W上，以所塗佈之處理液來處理玻璃基板w。 [發明欲解決之課題] 然而，上述噴嘴裝置100，由於其構造係將供應埠 104、供應室103、噴出口 105由噴嘴體1〇1之上端朝下端 依序連續設置，因此在停止處理液供應裝置110所供應之 處理液結束該塗佈時，充塡於供應室103內之處理液的重 量即直接作用於噴出口 105內之處理液，進而導致處理液 從前述噴出口 105滴落至基板W上，而產生基板W上所 塗佈之處理液膜厚不均的問題。 又，現在，玻璃基板等之基板w其尺寸年年增大。因 此，皆要求能對基板全面進行均勻的處理，且爲了降低處 理成本，能盡量的以少量之處理液在基板上塗佈相同膜厚 之處理液的技術。 因此，需盡量的縮小上述習知例之噴嘴裝置100之噴 出口 105的口徑，且盡量的縮小其配置節距間隔。 然而，由於上述噴嘴裝置100之噴出口 105係配置成 一列，因此若將前述配置節距間隔縮得過小的話，從前述 噴出口 105噴出、成一條線狀態流下之液體流的間隔將變 得極爲接近，其結果，不僅相鄰之液體流彼此接合，相互 混合成帶狀液體流流下，亦會因其表面張力使液體流之寬 5______ 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱） (請先閱讀背面之注意事項再填寫本頁) %: -線 561071 B7 五、發明說明（火） 度成爲前端窄的狀態，產生無法將處理液塗佈於基板W之 全寬的問題，此外，亦會產生所塗佈之處理液之膜厚反而 變厚的問題。 另一方面，若加寬配置節距間隔以使相鄰液體流彼此 不致接合的話，由於從各噴出口噴出之處理液量較少’將 會成爲如圖π所示般，基板w上之各液滴R彼此不接觸 之獨立狀態，而無法在基板W上形成處理液膜。 本發明，有鑑於上述情事，其目的在提供一種能有效 防止塗佈結束後之液體滴落，且能以少量的處理液在基板 上形成均勻厚度之處理液膜的噴嘴裝置及具備其之基板處 理裝置。 [用以解決課題之手段] 爲達成上述目的，本發明之噴嘴裝置，具備長條狀噴 嘴體，從該噴嘴體噴出處理液以塗佈於被處理物上，其特 徵在於： 前述噴嘴體，具備形成於其下面、且沿長邊方向排列 之複數個噴出口，用以留滯所供應之處理液的液體留滯室 ，分別連通於前述各噴出口、使處理液流通以從前述噴出 口噴出之複數個液體噴出流路； 前述液體留滯室與各液體噴出流路，係設置成彼此平 行，且前述各液體噴出流路之上端係配置在前述液體留滯 室上端的上方’且前述液體留滯室之上端部與前述各液體 噴出流路之上端部係以連通路加以連通； _ 6 本、紙張尺度適用中國國家標準(CNS)A4規格（210 X 297公爱) '"""" (請先閱讀背面之注意事項再填寫本頁) %: -線 561071 A7 --------------〜_B7___—_ -- 五、發明說明（< ) 此外，前述連通路內之最小高度尺寸係設定在〇.〇5mm 以上0.2mm以下，前述各液體噴出流路之最小口徑係設定 在0.35mm以上1 〇mm以下。 此噴嘴裝置，係設置在被支撐機構支撐之基板上方， 將處理液供應機構所加壓之處理液供應至噴嘴體，且藉由 移動機構，沿前述基板相對移動。 在處理對象之基板被前述支撐機構支撐爲水平的狀態 下，加壓之處理液由前述處理液供應機構供應至噴嘴裝置 後，所供應之處理液即流入噴嘴體之液體留滯室內，依序 流過連通路內及譯體噴出流路內後，由前述各噴出口噴出。 從各噴出口噴出之處理液，分別成爲一線條狀之液體 流，整體成一簾狀流下，塗佈於基板上。然後，藉由前述 移動機構，使噴嘴體向與其長邊方向正交之方向移動，自 各噴出口流下之處理液即成爲一沿噴嘴體移動方向延伸之 筋狀液條而載於基板上，相鄰之筋狀液條藉由表面張力而 彼此混合，成爲既定厚度均勻之處理液膜。 然而，若將前述液體留滞室與液體噴出流路上下連續 設置的話，將會與上述習知噴嘴裝置同樣的，即使停止來 自處理液供應機構之處理液供應，亦將由於充塡於液體留 滯室內處理液之重量直接作用於液體噴出流路內之處理液 ，因而產生處理液從噴出口滴下，使基板上所塗佈之處理 液膜厚不均勻的問題。 有鑑於此，本發明係將液體留滯室與液體噴出流路平 行並設，將液體噴出流路之上端配置在液體留滯室上端更 7 木紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公楚） (請先閱讀背面之注意事項再填寫本頁) 旬· -線 A7 561071 _B7_ 五、發明說明（L ) (請先閱讀背面之注意事項再填寫本頁) 上方之位置，且將液體留滯室之上端部與液體噴出流路之 上端部以連通路加以連通。 據此，在從處理液供應機構供應處理液之狀態下，液 體留滯室內之處理液壓高於液體噴出流路內之處理液壓， 處理液自液體留滯室經由連通路流入液體噴出流路內而從 噴出口噴出，另一方面，當停止處理液之供應時，充塡於 液體留滯室內處理液之重量不致直接作用於液體噴出流路 內之處理液，液體噴出流路內之處理液會因本身之表面張 力而留在該液體噴出流路內，而能防止液滴從前述噴出口 滴下。 -線 又，藉由將前述連通路內之最小高度尺寸設定在 0.05mm以上0.2mm以下，前述各液體噴出流路之最小口 徑設定在〇.35mm以上1.0mm以下，即能提高前述連通路 內及液體噴出流路內處理液之相對本身重量之表面張力的 比率，藉由此種構成，即能將處理液有效保持於前述連通 路內及液體噴出流路內，進而有效防止上述液滴之滴下。 又，之所以將連通路內之最小高度尺寸設定成〇.〇5mm 以上、將液體噴出流路之最小口徑設定成〇.35mm以上， 係因小於此的話，處理液之流通將受到阻礙之故。 前述各液體噴出流路，例如，可由大徑部、中徑部、 小徑部等複數之口徑構成，在此場合，係將最小口徑設定 在上述〇.35mm以上1.0mm以下。 又，前述噴出口，可係沿前述噴嘴體之長邊方向配置 成複數列，且各列之噴出口，係配置在相鄰噴出口列之各 8 f紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐) 561071 A7 ____B7_ 五、發明說明（1 ) 噴出口配置間，各噴出口於排列方向設置成鋸斷狀。 以此方式配置，能使噴嘴體長邊方向之全部噴出口之 配置間距更爲緊密，使置於基板上彼此相鄰之前述條狀液 體極爲接近，而使兩者成接觸狀態。據此，能使基板上所 形成之處理液膜之膜壓更爲均勻。又，即使各噴出口口徑 爲小徑者，亦不需使其配置間距過於狹小，而能使噴出口 整體之配置間距更爲緊密，以少量的處理液即能在基板上 形成均勻膜厚之處理液膜。 又，若設置用以調節前述連通路內之高度尺寸的調節 機構，即能容易地將該高度尺寸設定成上述0.05mm以上 0.2mm以下。 又，本發明亦可構成如下，亦即，於前述液體噴出流 路與連通路之間形成1或複數個液體供應室，將該液體供 應室之上端配置在前述液體留滯室之上端的上方，同時將 前述液體供應室之下端部與複數個前述液體噴出流路之上 端部加以連通，且將前述液體供應室之上端部與前述連通 部加以連通，透過前述液體供應室將處理液自前述連通路 供應至各液體噴出流路。不過，此時，就防止上述液滴滴 落的觀點而言，將液體供應室之容量，設定成能藉由各液 體噴出流路內之處理液藉由本身之表面張力，來停留於該 液體噴出流路內一事，是非常重要的。 又，前述支撐機構與移動機構，可一體的構成爲具備 用以支撐前述基板之複數個滾輪，藉各滾輪之旋轉來直線 搬送前述基板的滾輪搬送裝置。 _ 9 私紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱）_- (請先閱讀背面之注意事項再填寫本頁)A7 561071 V. Description of the Invention (/) [Technical Field] The present invention relates to the spraying and coating of liquid crystals on substrates such as liquid crystal glass substrates, semiconductor wafers (silicon wafers), photomask glass substrates, and optical disk substrates. Nozzle device for cleaning liquid and substrate processing device including the same. [Know-how] For example, a glass substrate constituting a liquid crystal substrate is manufactured through various processes. In each process, the substrate is coated with a photoresist film or a developing solution, a peeling solution, or a cleaning solution. Coating of various processing liquids such as coating. The conventional method for applying the processing liquid to the glass substrate is to use a substrate processing device having a supporting mechanism for supporting the glass substrate horizontally, and spraying the processing liquid to the horizontally supported glass substrate. A nozzle device and a moving device for moving (scanning) the nozzle device over a glass substrate along the glass substrate. As the nozzle device, the nozzle device shown in Figs. 15 and 16 is used. As shown in FIGS. 15 and 16, the nozzle device 100 includes a strip arranged above the glass substrate W in a width direction (a direction orthogonal to the paper surface in FIG. 15 and an arrow Η direction shown in FIG. 16). Shaped nozzle body 101, a bracket 108 fixed to the nozzle body 101, and an appropriate support portion connected to the aforementioned moving device. The nozzle body 101 is composed of a long first member 102 and a second member 106. The first member 102 and the second member 106 have a structure joined by a gasket 107 for sealing. The first member 102 has a groove 103 opened on one side along its long side direction, and the second member 106 is joined here. The paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) ( Please read the precautions on the back before filling in this page) Enter § ·.; Line. A7 561071 ___B7 __ V. Description of the invention (>) Block the opening to form the supply room 103. (Please read the precautions on the back before filling out this page.) Also, on the second member 102, one side is provided with an opening on the top, and the other side is connected to a supply port 104 connected to the aforementioned supply room. Here, supply 璋 104 ′ is connected to the supply pipe 111 (connected to the processing liquid supply device 110) through the pipe joint 112, and the processing liquid is supplied from the processing liquid supply device 111 through the supply pipe 111 and the supply 璋 104 to the aforementioned processing chamber 103. Inside. In addition, the second member 102 is provided with ejection ports 105 provided below the opening and the supply chamber 103, and the ejection ports 105 are aligned in a row along the longitudinal direction of the first member 102 and have a predetermined pitch. The processing liquid supplied into the aforementioned supply chamber 103 flows through the discharge port 105, is discharged from the opening portion, and is applied onto the substrate W. -The nozzle device 100 having the above-mentioned configuration, the aforementioned bracket 108 is connected to an appropriate supporting portion of the aforementioned mobile device, and is supported by the mobile device ', whereby the mobile device is moved (scanned) in the width direction (arrow) with the glass substrate W Η direction) orthogonal direction. According to the substrate processing apparatus having the above configuration, in a state where the glass substrate W is horizontally supported by the support mechanism, the pressurized processing liquid is supplied from the processing liquid supply device 110 to the nozzle device 100, and The opening is ejected. The processing liquid ejected from each of the above-mentioned ejection outlets 105 respectively forms a linear liquid flow, and the whole flows down in a curtain shape and is applied to the substrate W. Then, the nozzle device 100 is moved in a direction orthogonal to the width direction (arrow Η direction) of the glass substrate W by the moving device, and the processing liquid applied on the glass substrate W is extended in the moving direction of the nozzle device 100. Fortunately, the paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 561071 A7 __B7_ V. Description of the invention (4) The strip is placed on the glass substrate W. Soon, the adjacent ribs The liquid strips are thus mixed with each other to form a treatment liquid film of a predetermined thickness due to surface tension. The conventional substrate processing apparatus described above applies the processing liquid to the glass substrate W in this manner, and processes the glass substrate w with the applied processing liquid. [Problems to be Solved by the Invention] However, the above-mentioned nozzle device 100 has a structure in which the supply port 104, the supply chamber 103, and the discharge port 105 are sequentially and sequentially installed from the upper end to the lower end of the nozzle body 101. When the coating of the processing liquid supplied by the supply device 110 ends, the weight of the processing liquid filled in the supply chamber 103 directly acts on the processing liquid in the ejection outlet 105, thereby causing the processing liquid to drip from the aforementioned ejection outlet 105 to On the substrate W, there is a problem that the thickness of the processing liquid applied on the substrate W is uneven. In addition, the size of a substrate w such as a glass substrate is increasing every year. Therefore, it is required that the substrate can be uniformly processed on all sides, and in order to reduce the processing cost, a technology that can apply a small amount of processing liquid to the substrate with the same film thickness as much as possible. Therefore, it is necessary to reduce the diameter of the discharge port 105 of the nozzle device 100 of the conventional example as much as possible, and to reduce the arrangement pitch interval as much as possible. However, since the ejection outlets 105 of the nozzle device 100 are arranged in a row, if the pitch of the arrangement is too small, the interval of the liquid flow ejected from the ejection outlet 105 and flowing in a linear state will become extremely small. As a result, not only the adjacent liquid streams are joined to each other and mixed with each other to form a band-like liquid stream, but also the width of the liquid stream is widened due to its surface tension. 5______ This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 public love) (Please read the precautions on the back before filling this page)%: -line 561071 B7 V. Description of the invention (fire) The state of the front end is narrow, resulting in the inability to apply the treatment liquid to the full width of the substrate W In addition, there is also a problem that the film thickness of the applied treatment liquid becomes thicker instead. On the other hand, if the arrangement pitch is widened so that adjacent liquid flows do not join each other, since the amount of processing liquid ejected from each ejection port is small, it will become as shown in FIG. The droplets R are in an independent state in which they are not in contact with each other, so that a processing liquid film cannot be formed on the substrate W. In view of the above circumstances, the present invention aims to provide a nozzle device capable of effectively preventing dripping of liquid after coating is completed, and capable of forming a processing liquid film with a uniform thickness on a substrate with a small amount of processing liquid, and a substrate having the same. Processing device. [Means for Solving the Problems] In order to achieve the above-mentioned object, the nozzle device of the present invention includes a long nozzle body, and the treatment liquid is sprayed from the nozzle body to be applied to a to-be-processed object. A plurality of ejection outlets formed below the ejection outlets are arranged in the longitudinal direction, and a liquid retention chamber for retaining the supplied processing liquid is communicated with each of the ejection outlets and allows the treatment liquid to flow from the ejection outlets. A plurality of liquid ejection flow paths that are ejected; the liquid retention chamber and each liquid ejection flow path are arranged parallel to each other, and the upper end of each liquid ejection flow path is disposed above the upper end of the liquid retention chamber; and The upper end of the liquid stagnation chamber is connected to the upper end of each of the aforementioned liquid ejection flow paths by a communication path; _ 6 books and paper standards are applicable to China National Standard (CNS) A4 (210 X 297 public love) '" " " " (Please read the precautions on the back before filling this page)%: -line 561071 A7 -------------- ~ _B7 ___—_-5. Description of the invention (<) In addition, the minimum The height dimension is set to not less than 0.05 mm and not more than 0.2 mm, and the minimum diameter of each liquid discharge flow path is set to 0.35 mm or more and 10 mm or less. This nozzle device is provided above the substrate supported by the supporting mechanism, and supplies the processing liquid pressurized by the processing liquid supply mechanism to the nozzle body, and moves relatively along the substrate by the moving mechanism. In a state where the substrate to be processed is horizontally supported by the aforementioned support mechanism, after the pressurized processing liquid is supplied to the nozzle device by the aforementioned processing liquid supply mechanism, the supplied processing liquid flows into the liquid retention chamber of the nozzle body, in order After flowing through the communication path and the transliteration ejection flow path, it is ejected from each of the aforementioned ejection ports. The processing liquid ejected from each of the ejection outlets becomes a linear liquid flow, respectively, and flows down as a curtain as a whole, and is coated on the substrate. Then, by the aforementioned moving mechanism, the nozzle body is moved in a direction orthogonal to the longitudinal direction of the nozzle body, and the processing liquid flowing from each ejection port becomes a rib-like liquid strip extending along the moving direction of the nozzle body and is carried on the substrate. Adjacent tendon-like liquid strips are mixed with each other by surface tension to form a treatment liquid film with a uniform thickness. However, if the above-mentioned liquid retention chamber and the liquid ejection flow path are continuously installed, it will be the same as the above-mentioned conventional nozzle device, and even if the supply of the processing liquid from the processing liquid supply mechanism is stopped, it will be filled with liquid. The weight of the processing liquid in the stagnation chamber directly acts on the processing liquid in the liquid discharge flow path, thereby causing the problem that the processing liquid drips from the discharge port and makes the film thickness of the processing liquid coated on the substrate uneven. In view of this, the present invention is to set the liquid retention chamber parallel to the liquid ejection flow path, and the upper end of the liquid ejection flow path is arranged at the upper end of the liquid retention flow path. The paper size is applicable to the Chinese National Standard (CNS) A4 specification ( 210 X 297) (please read the precautions on the back before filling this page) X-line A7 561071 _B7_ V. Description of the invention (L) (Please read the precautions on the back before filling out this page) The upper end portion of the liquid retention chamber and the upper end portion of the liquid ejection flow path communicate with each other through a communication path. Accordingly, when the processing liquid is supplied from the processing liquid supply mechanism, the processing hydraulic pressure in the liquid retention chamber is higher than the processing hydraulic pressure in the liquid ejection flow path, and the processing liquid flows from the liquid retention chamber into the liquid ejection flow path through the communication path. On the other hand, when the supply of the processing liquid is stopped, the weight of the processing liquid filled in the liquid retention chamber does not directly affect the processing liquid in the liquid discharge flow path, and the liquid is discharged from the processing liquid in the flow path. Due to its own surface tension, it stays in the liquid ejection flow path, so that liquid droplets can be prevented from dripping from the ejection port. -By setting the minimum height dimension in the communication path to 0.05 mm or more and 0.2 mm or less, and setting the minimum diameter of each liquid ejection flow path to 0.35 mm or more and 1.0 mm or less, the communication path can be improved. And the ratio of the surface tension of the processing liquid in the liquid ejection flow path relative to its own weight, with this structure, the treatment liquid can be effectively maintained in the communication path and the liquid ejection flow path, thereby effectively preventing the droplets. dropping. In addition, the minimum height dimension in the communication path is set to 0.05 mm or more, and the minimum diameter of the liquid ejection flow path is set to 0.35 mm or more. If it is smaller than this, the flow of the treatment liquid will be hindered. . Each of the liquid discharge flow paths may be formed of a plurality of diameters, such as a large diameter portion, a middle diameter portion, and a small diameter portion. In this case, the minimum diameter is set to be 0.35 mm or more and 1.0 mm or less. In addition, the ejection outlets may be arranged in a plurality of rows along the long side direction of the nozzle body, and the ejection outlets of each row are each 8 f paper sizes arranged in the adjacent ejection outlet rows, and the Chinese National Standard (CNS) A4 is applicable. Specifications (210 X 297 mm) 561071 A7 ____B7_ V. Description of the Invention (1) Each of the ejection outlets is arranged in a saw-off shape in the arrangement direction. By arranging in this way, the arrangement pitch of all the discharge ports in the longitudinal direction of the nozzle body can be made closer, so that the aforementioned stripe liquids placed adjacent to each other on the substrate are extremely close, and the two are brought into contact. Accordingly, the film pressure of the processing liquid film formed on the substrate can be made more uniform. In addition, even if the diameter of each ejection outlet is small, there is no need to make the arrangement pitch too narrow, and the overall arrangement interval of the ejection outlet can be made closer. A small amount of processing liquid can form a uniform film thickness on the substrate. Process liquid film. Moreover, if an adjustment mechanism for adjusting the height dimension in the communication path is provided, the height dimension can be easily set to the above 0.05 mm or more and 0.2 mm or less. The present invention may also be structured such that one or a plurality of liquid supply chambers are formed between the liquid discharge flow path and the communication path, and the upper end of the liquid supply chamber is disposed above the upper end of the liquid retention chamber. At the same time, the lower end portion of the liquid supply chamber is communicated with the upper end portions of the plurality of liquid ejection flow paths, and the upper end portion of the liquid supply chamber is communicated with the communication portion. The communication path is supplied to each liquid ejection flow path. However, at this time, from the viewpoint of preventing the droplets from dripping, the capacity of the liquid supply chamber is set so that the processing liquid in each liquid ejection flow path can stay in the liquid by its surface tension. It is very important to spit out the flow path. Further, the supporting mechanism and the moving mechanism may be integrally provided with a plurality of rollers for supporting the substrate, and a roller conveying device for linearly conveying the substrate by rotating the rollers. _ 9 Private paper size applies to China National Standard (CNS) A4 (210 X 297 public love) _- (Please read the precautions on the back before filling this page)
I -TJ- 丨線 561071 A7 _B7_ 五、發明說明（3 ) (請先閱讀背面之注意事項再填寫本頁) 或者，前述支撐機構，由基板裝載用的裝載台構成， 前述移動機構，由沿基板移送噴嘴體之移送裝置來構成亦 可。此時，亦可進一步的設置用以使前述裝載台水平旋轉 之旋轉驅動裝置。若根據此種基板處理裝置，在以噴嘴裝 置將處理液塗佈於基板上後，使用前述旋轉驅動裝置使基 板水平旋轉，即能藉由離心力使基板上所塗佈之處理液薄 薄地延伸，而進一步的在基板上形成厚度均勻的處理液膜。 此外，能適用本發明之作爲處理對象之基板，並無任 何限制，可將本發明適用於液晶玻璃基板、半導體晶圓（矽 晶圓）、光罩用玻璃基板、光碟用基板等各種基板。又，本 發明之處理液亦無任限制，可使用半導體或液晶製程中所 使用之顯影液、光阻液、光阻剝離液、蝕刻液、洗淨液(包 含純水、臭氧水、含氫水、電解離子水)等各種處理液。 [圖式之簡單說明] 圖1，係顯示本發明較佳實施形態之基板處理裝置的 俯視截面圖，爲圖2中箭頭Π-Π方向的俯視截面圖。 圖2，係圖1之箭頭I - I方向的側視截面圖。 圖3,係顯示本發明較佳實施形態之噴嘴裝置的前視 截面圖，爲圖5中箭頭IV-IV方向的前視截面圖。 圖4，係圖3所示之噴嘴裝置的仰視圖。 圖5，係圖3中箭頭ΠΙ-ΠΙ方向的側視截面圖。 圖6,係用以說明本實施形態之噴嘴裝置之處理液塗 佈作用的說明圖。 10 木紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 561071 A7 _B7_ 五、發明說明（f ) (請先閱讀背面之注意事項再填寫本頁) 圖7,亦係用以說明本實施形態之噴嘴裝置之處理液 塗佈作用的說明圖。 圖8,係用以說明本實施形態之噴嘴裝置之效果的說 明圖。 圖9,亦係用以說明本實施形態之噴嘴裝置之效果的 說明圖。 圖10,係顯示本發明另一實施形態之噴嘴裝置的前視 截面圖，爲圖11中箭頭VI-VI方向的截面圖。 圖11，係圖10中箭頭V - V方向的側視截面圖。 圖12,係顯示本發明再一實施形態之噴嘴裝置的側視 截面圖。 圖13，係顯示本發明另一實施形態之基板處理裝置的 前視截面圖， 圖14，係圖13所示之基板處理裝置的俯視圖。 線 圖15，係顯示習知例之噴嘴裝置的側視截面圖。 圖16，係圖15所示之噴嘴裝置的仰視圖。 圖Π，係用以說明習知例之噴嘴裝置之處理液塗佈作 用的說明圖。 [符號說明] 1，50 基板處理裝置 2 蓋體 3 搬送裝置 4 搬送滾輪 11 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 561071 A7 B7 五、發明說明（丨〇 )I -TJ- 丨 line 561071 A7 _B7_ V. Description of the invention (3) (Please read the precautions on the back before filling out this page) Or, the aforementioned support mechanism is composed of a loading platform for substrate loading, and the aforementioned movement mechanism is composed of The transfer device of the substrate transfer nozzle body may be configured. At this time, a rotation driving device for horizontally rotating the loading table may be further provided. According to such a substrate processing apparatus, after the processing liquid is coated on the substrate by a nozzle device, the substrate is rotated horizontally by using the aforementioned rotation driving device, so that the processing liquid applied on the substrate can be thinly extended by centrifugal force. Further, a uniform processing liquid film is formed on the substrate. In addition, the substrate to which the present invention can be applied is not subject to any limitation, and the present invention can be applied to various substrates such as liquid crystal glass substrates, semiconductor wafers (silicon wafers), photomask glass substrates, and optical disk substrates. In addition, the processing liquid of the present invention is not limited in any way, and a developer, a photoresist, a photoresist peeling solution, an etching solution, and a cleaning solution (including pure water, ozone water, and hydrogen containing water) used in a semiconductor or liquid crystal manufacturing process can be used. Water, electrolytic ion water) and other processing liquids. [Brief description of the drawings] FIG. 1 is a top sectional view showing a substrate processing apparatus according to a preferred embodiment of the present invention, and is a top sectional view in the direction of arrows Π-Π in FIG. 2. FIG. 2 is a side cross-sectional view in the direction of arrows I-I of FIG. 1. FIG. 3 is a front cross-sectional view showing a nozzle device according to a preferred embodiment of the present invention, which is a front cross-sectional view in the direction of arrows IV-IV in FIG. 5. FIG. 4 is a bottom view of the nozzle device shown in FIG. 3. FIG. 5 is a side cross-sectional view in the direction of arrows II-III in FIG. 3. Fig. 6 is an explanatory diagram for explaining the application effect of the treatment liquid by the nozzle device of this embodiment. 10 Wood paper scale is applicable to China National Standard (CNS) A4 (210 X 297 mm) 561071 A7 _B7_ V. Description of the invention (f) (Please read the precautions on the back before filling this page) Figure 7 is also used for An explanatory diagram for explaining the application effect of the processing liquid by the nozzle device of this embodiment. Fig. 8 is an explanatory diagram for explaining the effect of the nozzle device of this embodiment. Fig. 9 is an explanatory diagram for explaining the effect of the nozzle device of this embodiment. Fig. 10 is a front sectional view showing a nozzle device according to another embodiment of the present invention, and is a sectional view taken along the arrow VI-VI direction in Fig. 11. FIG. 11 is a side sectional view in the direction of arrows V-V in FIG. 10. Fig. 12 is a side sectional view showing a nozzle device according to still another embodiment of the present invention. FIG. 13 is a front sectional view showing a substrate processing apparatus according to another embodiment of the present invention, and FIG. 14 is a plan view of the substrate processing apparatus shown in FIG. 13. FIG. 15 is a side sectional view showing a nozzle device of a conventional example. FIG. 16 is a bottom view of the nozzle device shown in FIG. 15. Figure Π is an explanatory diagram for explaining the application of the processing liquid by the nozzle device of the conventional example. [Description of symbols] 1,50 substrate processing device 2 cover body 3 conveying device 4 conveying roller 11 This paper size applies to China National Standard (CNS) A4 specification (210 X 297 mm) 561071 A7 B7 V. Description of the invention (丨 〇)
10, 100 11，101 12, 102 13, 19 14, 104 15, 106 15b 16, 103 17 17a 17b 18, 105 20, 21，107 22 23 24 30, 108 35, 112 36, 111 37, 110 旋轉軸 滾輪 (請先閱讀背面之注意事項再填寫本頁) 軸承 驅動機構 噴嘴裝置 噴嘴體 第1構件 槽部 供應埠 第2構件 第2構件水平邊 液體供應室 縱孔 小徑部 大徑部 噴出口 密封用墊片 液體留滯室 連通路 接合構件 支架 管接頭 供應管 處理液供應裝置 衣紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 561071 B7 五、發明說明（/1 ) 51 旋轉裝置 52 旋轉夾頭 53 旋轉軸 54 驅動機構部移送裝置 61 支撐臂 62 移送機構部 f請先閱讀背面之沒意事項再填寫本頁} [發明之實施形態] 以下，根據所附圖式詳細說明本發明。 -線· 如圖1及圖2所示，本發明之基板處理裝置1，具備 形成封閉空間之蓋體2，於前述封閉空間內以既定間隔配 置之複數個搬送滾輪4，將處理對象之基板w以此搬送滾 輪4加以支撑並搬送之搬送裝置3 ’配置在一連串搬送滾 輪組4上方、將處理液噴出塗佈於前述基板w上之噴嘴裝 置10，將加壓之處理液供應至噴嘴裝置10之處理液供應 裝置37等。 搬达裝置3 ’除上述複數個搬送滚輪4外，亦具備將 此等滾輪支撐爲旋轉自如之軸承8及用以驅動各搬送滾輪 .4之驅動機構9等。搬送滾輪4，係由兩端分別被前述軸承 8支撐爲旋轉自如之旋轉軸5，與沿其長邊方向以既定間隔 固定於此旋轉軸5之滾輪6, 7所構成，旋轉軸5之軸方向 兩端部之滾輪7分別具有突緣部，藉由此突緣部，來限制 滾輪6, 7上所搬送至基板W不致從搬送路上脫離。 又’雖未具體圖示，前述驅動機構9，係由驅動馬達 13 本紙張又度適用中國國家標準（CNS)A4規格（210 X 297公釐) " A7 561071 五、發明說明（/，） ’以及捲掛於各旋轉軸5、將前述驅動馬達之動力傳遞至 各旋轉軸之傳動帶等所構成，使前述各旋轉軸5旋轉以將 基板W搬送於箭頭T方向。 前述噴嘴裝置10，如圖1所示，具備：沿基板W寬 度方向（箭頭Η方向)配置之長條狀噴嘴體11，以及固定於 此噴嘴體11、連結於適當構造體(未圖示)之支架30等。 如圖3至圖5所示，噴嘴體11係由長條狀第1構件 12及第2構件15構成，此等第1構件12及第2構件15 透過密封用墊片20, 21而接合。此等第1構件12及第2 構件15，分別呈橫截面形狀具有水平邊12b，15b及垂直邊 12a，15a的鉤狀，其中第1構件12之水平邊12b端面與第 2構件15之垂直邊15a端面，係透過前述墊片20接合， 第1構件12之垂直邊12a端面與第2構件15之水平邊 15b端面，係透過前述墊片21接合。又，第1構件及第2 構件係使用四氟乙烯樹脂(PTFE)。 又，第1構件12之水平邊12b下面與垂直邊12a端面 交叉之角部，於前述長邊方向形成槽部13，第2構件15 之水平邊15b上面與同端面交叉之角部，於前述長邊方向 形成有槽部19，第1構件與第2構件在上述接合之狀態， 藉前述槽部13及19來形成液體留滯室22。 又，於第2構件15，穿設有作爲液體噴出流路之複數 個縱孔17，此等縱孔17之一方開口於水平邊15b的上面 ，另一方則作爲噴出口 18而開口於水平邊15b的下面。此 縱孔17，如圖4所示，係沿第2構件15之長邊方向排列 14 一幸、纸張尺度適用中國國家標準（CNS)A4規格（210 X 297公 (請先閱讀背面之注意事項再填寫本頁) 0: >aj. -線 A7 561071 __B7_ 五、發明說明（叭） (請先閱讀背面之注意事項再填寫本頁) 由供應管36、供應璋14將加壓之處理液供應至前述液體 留滯室22。 根據具有上述構成之本例的基板處理裝置1，以搬送 裝置3搬送於箭頭T方向之基板W到達既定位置時，處理 液供應裝置37即開始處理液之供應，加壓之處理液從處理 液供應裝置37透過供應管36供應至前述噴嘴體11。供應 至噴嘴體11之處理液，從供應埠14流入液體留滯室22後 ，依序流過連通路23內、縱孔17內，而分別從設置成A 列及B列之2列的各噴出口 18噴出，成一線條狀液體流 ，全體成簾狀流下。 另一方面，基板W持續被前述搬送裝置3於前述噴嘴 體11之下方朝箭頭T方向搬送，自前述噴嘴體11成一線 條狀液體流流下之處理液，即成爲沿基板W之搬送方向延 伸之筋狀液條而載於玻璃基板W上。具體而言，從位於基 板W搬送方向（箭頭T方向）下流側之A列噴出口 18流下 之液體流載於基板W上，接著，從位於上流側之B列噴出 口 18流下之液體流再載於基板W上。此狀態顯示於圖6 。此外，圖6中，係以實線顯示從A列噴出口 18流下之 液滴Ra，以虛線顯示從B列噴出口 18流下之液滴Rb。 雖然亦會受A，B各列噴出口 18配置節距間隔P之影 響，但若如前所述，將配置節距間隔P設定成P$2d’的話 ，如圖6所示，從A列噴出口 18流下之處理液(Ra)、與從 B列噴出口 18流下之處理液(Rb)，將在基板W上重疊而 混合，藉由其表面張力，處理液即在基板W上薄薄的擴張 16 幸、紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） A7 561071 __ B7____ 五、發明說明（β) ，而如圖7所示的，在基板W上形成既定膜厚均勻的處理 液膜(R)。 (請先閱讀背面之注意事項再填寫本頁) 以此方式於基板W之上面全面塗佈處理液後，處理液 供應裝置37及停止處理液之供應。之後，對依序搬送之基 板W反覆進行上述處理，於各基板W上形成處理液膜。 如前所述，本例之基板處理裝置1，由於係將噴嘴裝 置10之縱孔Π上端設置在液體留滯室22上端的上方，因 此塡充於液體留滯室22內之處理液之重量不致直接作用於 縱孔17內之處理液，縱孔17內之處理液將因本身之表面 張力而停留在該縱孔17內。如此，藉由該作用，而能防止 停止處理液之供應時自前述噴出口 18滴下液滴，據此，防 止基板W上所形成之處理液膜產生厚度不均的現象。 又，藉由將連通路23內之高度尺寸t設定在0.05mm 以上0.2mm以下，縱孔17之口徑d設定在0.35mm以上 1.0mm以下，即能提高前述連通路23及縱孔17內處理液 之相對本身重量之表面張力的比率，藉由此種構成，即能 將處理液有效保持於前述連通路23內及縱孔17內，進而 有效防止上述液滴之滴下。 承上所述，處理液使用25 °C之純水（22 °C之黏度爲 ImPa · s)，在對上述連通路23內之高度尺寸t及縱孔17 之口徑d進行各種變化下，將觀察處理液供應停止後自噴 出口 18之液滴滴下狀態的結果顯示於圖8，又，處理液使 用80°C之單乙醇胺(出>^112(^2011)(22^：之黏度爲10mPa • s) ’與前述同樣的，在對連通路23內之高度尺寸t及縱 17 衣紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 一 561071 A7 ____B7_ 五、發明說明（4) 孔17之口徑d進行各種變化下，將觀察處理液供應停止後 自噴出口 18之液滴滴下狀態的結果顯示於圖9。 又，圖8及圖9中，關於「液滴滴下之程度」，「無 」係指10秒間無任何液滴滴下的狀態，「些微」係指10 秒間滴下1〜3滴液滴的狀態，「少」係指1〇秒間滴下4 〜1〇滴液滴的狀態，「多」係指1〇秒間滴下10數滴以上 之液滴的狀態。 由圖8及圖9可知，將連通路23內之高度尺寸t設定 在0.05mm以上0.2mm以下，且縱孔17之口徑d設定在 〇.35mm以上1.0mm以下時，能有效防止自噴出口 18之液 滴滴下。 又，如前所述，現在，玻璃基板等之基板W其尺寸年 年增大，因此，皆要求能對基板全面進行均勻的處理，且 爲了降低處理成本，能盡量的以少量之處理液在基板上塗 佈相同膜厚之處理液的技術。 本例之基板處理裝置1，由於係將噴出口 18沿噴嘴體 11之長邊方向排列成2列，且各列之噴出口 18，係配置在 相鄰噴出口 18列之各噴出口 18配置間的中間位置，全體 於排列方向設置成鋸齒狀，因此在噴出口 18之口頭徑較小 時’亦不需使其配置間距過於狹小，而能使基板W上之液 滴彼此極爲接近成兩者接觸的狀態，進而能在基板W上形 成既定膜厚之均勻厚度的處理液膜。 以上，雖說明了本發明之一實施形態，但本發明所能 採取之具體形態並不限於此。例如，上例中係將噴出口 18 18 衣紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱） (請先閱讀背面之注意事項再填寫本頁) 零： ta]·- 線- 561071 B7 五、發明說明（） 及縱孔17配置成2列，但若將此配置成1列或3列以上之 複數列亦不致有任何影饗。 又，如圖10及圖11所示，於縱孔17與連通路23之 間，設竃開口於第2構件15之水平邊Mb上面、沿長邊方 向與前述液體留滯室22平行之槽狀液體供應室16，使處 理液經由此液體供應室16供應至縱孔17亦可。 或者，將前述縱孔17，作成如圖12所示之由大徑部 17b及小徑部na所構成之2段孔，或3段以上之多段孔 亦可。不過，此時亦需注意其最小口徑應在〇.35mm以上 1.0mm以下。 如本發明般，縮小縱孔17之口徑，雖將使其加工較困 難’但藉由使其成爲圖10及圖11、或圖12之構成的話， 即能使小徑部分之孔深較淺，而能使加工較爲容易。 又，本發明之基板處理裝置，亦可爲圖13及圖14所 不之形態。此場合，對基板W之處理液塗佈處理’非連糸買 處理，而爲一片片處理。如圖13及圖14所示，此基板處 理裝置50，係由將基板W支撐爲水平、並使其水平旋轉 之支撐旋轉裝置51，上述圖3至圖5、或圖10及圖11或 圖12所示之噴嘴裝置1〇，將處理液供應至此噴嘴裝置10 之處理液供應裝置37，以及支撐噴嘴裝置10使其沿基板 W移動之移送裝置1〇等所構成。 前述支撐旋轉裝置51，係由真空吸附基板W加以水 平支撐之旋轉夾頭52，用以支撐此旋轉夾頭52之旋轉軸 53，以及使旋轉軸53繞軸中心旋轉之驅動機構部54等所 19 衣紙^尺度適用中國國家標準（CNS)A4 g (21〇 X 297公~ " (請先閱讀背面之注意事項再填寫本頁) -轉· 1]- .線 A7 561071 _____B7____ 五、發明說明（t s ) 構成，旋轉軸53及旋轉夾頭52藉由驅動機構部54之動力 旋轉，以使旋轉夾頭52所支撐之基板W水平旋轉。驅動 機構部54,具備算出旋轉軸53於其旋轉方向之既定角度 的功能’據以使旋轉夾頭52在旋轉前後位於預先設定之旋 轉角度位置。然後，在以此方式算出之旋轉夾頭52上，以 圖14所示之姿勢裝載基板w，基板W被該旋轉夾頭52吸 附並加以支撐。又，圖中之符號55，係包覆基板w周圍 之蓋。 前述移送裝置60，係由將噴嘴裝置10支撑爲其長邊 方向沿基板W之寬度方向（箭頭η方向）的支撐臂61，使此 支撐臂61向與前述寬度方向(箭頭η方向)正交之箭頭τ， 方向移動之移送機構部62等所構成。 如前所述，根據此基板處理裝置50，首先，將基板w 裝載於旋轉夾頭52上，在以此旋轉夾頭52加以吸附並支 撐的狀態下，噴嘴裝置10被前述移送裝置60移送向接近 基板W之方向。然後，與此同時，處理液供應裝置37將 加壓之處理液供應至噴嘴裝置10,自該噴出口 18流下處 理液，將此塗佈於基板W上。然後，在基板W之上面全 面塗佈處理液後，將噴嘴裝置10回復至原來位置。 當噴嘴裝置10回到來位置後，接著，即藉由前述驅動 機構部54使基板W水平旋轉既定時間。據此，藉由離心 力使基板W上所塗佈之處理液薄薄地延伸，而進一步的使 基板W上形成之處理液的厚度更爲均勻。之後，停止基板 W，結束一連串之處理。 20 私紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁)10, 100 11, 101 12, 102 13, 19 14, 104 15, 106 15b 16, 103 17 17a 17b 18, 105 20, 21, 107 22 23 24 30, 108 35, 112 36, 111 37, 110 Roller (Please read the precautions on the back before filling out this page) Bearing drive mechanism Nozzle body Nozzle body No. 1 member groove part supply port No. 2 member No. 2 member Horizontal side liquid supply chamber longitudinal hole small diameter portion large diameter portion nozzle outlet seal Gasket liquid staying chamber communication path joint member bracket pipe joint supply pipe treatment liquid supply device clothing paper size applicable to China National Standard (CNS) A4 specification (210 X 297 mm) 561071 B7 V. Description of the invention (/ 1) 51 Rotating device 52 Rotating chuck 53 Rotating shaft 54 Driving mechanism portion transfer device 61 Support arm 62 Transfer mechanism portion f Please read the unintentional matter on the back before filling out this page} [Embodiments of the invention] Hereinafter, according to the drawings The present invention will be described. -Line · As shown in FIGS. 1 and 2, the substrate processing apparatus 1 of the present invention includes a cover 2 forming a closed space, and a plurality of transfer rollers 4 arranged at a predetermined interval in the closed space to transfer the substrate to be processed. w The conveying device 3 ′ supported and conveyed by this conveying roller 4 is disposed above a series of conveying rollers 4 and sprays the nozzle liquid 10 onto the substrate w, and supplies the pressurized treatment liquid to the nozzle device. The processing liquid supply device 37 of 10 and the like. In addition to the plurality of transfer rollers 4 described above, the transfer device 3 'is also provided with bearings 8 that support the rollers to rotate freely, and a drive mechanism 9 for driving the transfer rollers 4 and the like. The conveying roller 4 is composed of a rotating shaft 5 supported at both ends by the aforementioned bearing 8 to rotate freely, and rollers 6 and 7 fixed to the rotating shaft 5 at a predetermined interval along the longitudinal direction thereof. The shaft of the rotating shaft 5 The rollers 7 at both ends of the direction each have a flange portion, and the flange portion is used to restrict the substrate W carried on the rollers 6 and 7 from being separated from the conveyance path. Also 'Although not specifically shown, the driving mechanism 9 mentioned above is driven by a driving motor 13. This paper is also applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) " A7 561071 V. Description of the invention (/,) It is constituted by being wound around each rotation shaft 5 and a belt that transmits the power of the drive motor to each rotation shaft, etc., and rotates each rotation shaft 5 to transport the substrate W in the direction of arrow T. The nozzle device 10 includes, as shown in FIG. 1, a long nozzle body 11 arranged along the width direction (arrow Η direction) of the substrate W, and fixed to the nozzle body 11 and connected to an appropriate structure (not shown). The bracket 30 and so on. As shown in FIG. 3 to FIG. 5, the nozzle body 11 is composed of a long first member 12 and a second member 15, and the first member 12 and the second member 15 are joined through sealing gaskets 20 and 21. The first member 12 and the second member 15 have hook shapes with horizontal sides 12b, 15b and vertical sides 12a, 15a, respectively. The end face of the horizontal side 12b of the first member 12 is perpendicular to the second member 15 The end face of the side 15 a is joined through the aforementioned gasket 20, and the end face of the vertical side 12 a of the first member 12 and the end face of the horizontal side 15 b of the second member 15 are joined through the aforementioned gasket 21. The first member and the second member are made of tetrafluoroethylene resin (PTFE). In addition, the corner portion of the lower surface of the first member 12 that intersects the end surface of the vertical side 12a forms a groove portion 13 in the longitudinal direction, and the corner portion of the second member 15 that intersects the same end surface at the upper portion of the horizontal side 15b. A groove portion 19 is formed in the longitudinal direction, and the first member and the second member are in the above-mentioned joined state, and the liquid stagnation chamber 22 is formed by the groove portions 13 and 19. Further, a plurality of vertical holes 17 are formed in the second member 15 as a liquid discharge flow path. One of the vertical holes 17 is opened on the horizontal side 15b, and the other is opened as a discharge port 18 on the horizontal side. 15b below. This vertical hole 17, as shown in Figure 4, is arranged along the long side of the second member 14. Fortunately, the paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 male) (Please read the precautions on the back first) (Fill in this page again) 0: > aj. -Line A7 561071 __B7_ V. Description of the invention (please read the precautions on the back before filling this page) Supply tube 36 and supply 璋 14 will be pressurized treatment liquid It is supplied to the aforementioned liquid stagnation chamber 22. According to the substrate processing apparatus 1 of this example having the above configuration, when the substrate W transported in the direction of the arrow T by the transfer apparatus 3 reaches a predetermined position, the processing liquid supply device 37 starts the supply of the processing liquid. The pressurized processing liquid is supplied from the processing liquid supply device 37 to the aforementioned nozzle body 11 through the supply pipe 36. The processing liquid supplied to the nozzle body 11 flows into the liquid retention chamber 22 from the supply port 14 and then flows through the communication path in sequence. 23, and the vertical holes 17, are ejected from the ejection ports 18 provided in the two rows of the A row and the B row, respectively, and form a linear liquid flow, and the whole flows down in a curtain shape. On the other hand, the substrate W is continuously transported by the aforementioned The device 3 faces below the aforementioned nozzle body 11 The processing liquid conveyed in the direction of the arrow T, and the processing liquid flowing down from the nozzle body 11 in a linear liquid flow, is placed on the glass substrate W as a rib-shaped liquid strip extending in the conveying direction of the substrate W. Specifically, In the conveying direction (direction of arrow T), the liquid flow flowing down from the row A discharge port 18 on the downstream side is carried on the substrate W, and then the liquid flow flowing down from the row B discharge port 18 on the upstream side is loaded on the substrate W. This state It is shown in Fig. 6. In addition, in Fig. 6, the droplets Ra flowing from the ejection port 18 of the A row are shown in solid lines, and the droplets Rb flowing from the ejection port 18 of the B row are shown in dashed lines. The effect of the arrangement of the pitch interval P on the ejection outlets 18 of each row, but if the arrangement pitch interval P is set to P $ 2d 'as described above, as shown in FIG. (Ra), and the processing liquid (Rb) flowing down from the ejection port 18 of the B row will be superimposed and mixed on the substrate W. With its surface tension, the processing liquid will expand thinly on the substrate W. 16 Applicable to China National Standard (CNS) A4 (210 X 297 mm) A7 561071 __ B7____ 5 Description of the invention (β), and as shown in FIG. 7, a processing liquid film (R) having a uniform film thickness is formed on the substrate W. (Please read the precautions on the back before filling this page) In this way on the substrate W After the entire surface is coated with the processing liquid, the processing liquid supply device 37 and the supply of the processing liquid are stopped. After that, the substrates W that are sequentially transported are repeatedly processed as described above, and a processing liquid film is formed on each substrate W. As described above, In the substrate processing apparatus 1 of this example, since the upper end of the vertical hole Π of the nozzle device 10 is disposed above the upper end of the liquid retention chamber 22, the weight of the processing liquid filled in the liquid retention chamber 22 does not directly affect the vertical The processing liquid in the hole 17 and the processing liquid in the vertical hole 17 will stay in the vertical hole 17 due to its surface tension. In this way, by this action, it is possible to prevent droplets from dripping from the ejection port 18 when the supply of the processing liquid is stopped, thereby preventing unevenness in the thickness of the processing liquid film formed on the substrate W. Moreover, by setting the height dimension t in the communication path 23 to 0.05 mm or more and 0.2 mm or less and the diameter d of the vertical hole 17 to be 0.35 mm or more and 1.0 mm or less, the internal processing of the communication path 23 and the vertical hole 17 can be improved. With such a structure, the ratio of the surface tension of the liquid relative to its own weight can effectively hold the processing liquid in the communication path 23 and the vertical hole 17, and thus effectively prevent the droplet from dripping. As mentioned above, the treatment solution uses pure water at 25 ° C (viscosity at ImPa · s at 22 ° C), and changes the height dimension t in the communication path 23 and the diameter d of the vertical hole 17 in various ways. The results of observing the dripping state of the droplets from the ejection port 18 after the supply of the treatment liquid was stopped are shown in FIG. 8. Moreover, the treatment liquid used 80 ° C monoethanolamine (out> ^ 112 (^ 2011) (22 ^: the viscosity was 10mPa) • s) 'Same as above, the Chinese National Standard (CNS) A4 specification (210 X 297 mm) is applied to the height dimension t and vertical 17 paper size in the communication path 23 -561071 A7 ____B7_ V. Description of the invention ( 4) With various changes in the diameter d of the hole 17, the results of observing the dripping state of the droplets from the ejection port 18 after the supply of the treatment liquid is stopped are shown in FIG. 9. In addition, in FIG. 8 and FIG. "," None "refers to a state in which no droplets are dropped in 10 seconds," Slight "refers to a state in which 1 to 3 droplets are dropped in 10 seconds, and" Less "refers to 4 to 10 droplets in 10 seconds. "Multi" refers to a state where more than 10 drops are dropped in 10 seconds. From FIG. 8 and FIG. It can be seen that when the height dimension t in the communication path 23 is set to 0.05 mm or more and 0.2 mm or less, and the diameter d of the vertical hole 17 is set to 0.35 mm or more and 1.0 mm or less, it is possible to effectively prevent the liquid dripping from the ejection outlet 18 from dripping. In addition, as mentioned earlier, the size of substrates W such as glass substrates is increasing year by year. Therefore, all substrates are required to be processed uniformly across the board. In order to reduce processing costs, a small amount of processing liquid can be used as much as possible. A technology for coating a substrate with a processing liquid of the same film thickness. The substrate processing apparatus 1 of this example is configured by arranging the ejection ports 18 in two rows along the longitudinal direction of the nozzle body 11, and the ejection ports 18 of each row are arranged. In the middle position between the arrangement of each of the ejection outlets 18 in the adjacent row of ejection outlets 18, the entire arrangement is arranged in a zigzag shape in the arrangement direction. Therefore, when the orifice diameter of the ejection outlets 18 is small, it is not necessary to make the arrangement pitch too narrow, and The droplets on the substrate W can be brought into close contact with each other, and a processing liquid film having a uniform thickness of a predetermined film thickness can be formed on the substrate W. Although one embodiment of the present invention has been described above, the present invention hair The specific form that can be adopted is not limited to this. For example, in the above example, the paper size of the 18 18 clothing paper is applied to the Chinese National Standard (CNS) A4 specification (210 X 297 public love) (Please read the precautions on the back before (Fill in this page) Zero: ta] ·-Line-561071 B7 V. Description of the invention () and vertical holes 17 are arranged in 2 rows, but if this is arranged in a plural number of 1 or 3, it will not have any effect As shown in FIG. 10 and FIG. 11, between the vertical hole 17 and the communication path 23, an opening is formed on the horizontal side Mb of the second member 15 and parallel to the liquid retention chamber 22 along the longitudinal direction. The tank-shaped liquid supply chamber 16 may allow the processing liquid to be supplied to the vertical holes 17 through the liquid supply chamber 16. Alternatively, the vertical hole 17 may be a two-stage hole composed of a large-diameter portion 17b and a small-diameter portion na as shown in FIG. 12, or a multi-stage hole having three or more stages. However, at this time, it should be noted that the minimum diameter should be more than 0.35 mm and less than 1.0 mm. As in the present invention, reducing the diameter of the vertical hole 17 will make processing difficult, but by making it the structure of FIG. 10 and FIG. 11 or FIG. 12, the hole depth of the small diameter portion can be made shallow. , And can make processing easier. The substrate processing apparatus of the present invention may have a form other than that shown in Figs. 13 and 14. In this case, the processing solution coating process for the substrate W is not a flail purchase process, but a piece-by-piece process. As shown in FIGS. 13 and 14, the substrate processing apparatus 50 is a supporting and rotating device 51 that supports the substrate W horizontally and rotates it horizontally. The above-mentioned FIGS. 3 to 5, or 10 and 11 or FIG. The nozzle device 10 shown in FIG. 12 includes a processing liquid supply device 37 for supplying a processing liquid to the nozzle device 10, and a transfer device 10 for supporting the nozzle device 10 to move along the substrate W, and the like. The aforementioned supporting and rotating device 51 is a rotary chuck 52 horizontally supported by a vacuum suction substrate W, used to support a rotary shaft 53 of the rotary chuck 52, and a driving mechanism portion 54 for rotating the rotary shaft 53 about the axis center. 19 The size of the paper is applicable to the Chinese National Standard (CNS) A4 g (21〇X 297 male ~ " (Please read the precautions on the back before filling this page)-turn · 1]-. Line A7 561071 _____B7____ V. Invention Explanation (ts) Structure: The rotating shaft 53 and the rotating chuck 52 are rotated by the power of the driving mechanism portion 54 to horizontally rotate the substrate W supported by the rotating chuck 52. The driving mechanism portion 54 is provided with a calculation of the rotating shaft 53. The function "predetermined angle of rotation direction" is used to position the rotation chuck 52 at a predetermined rotation angle position before and after the rotation. Then, on the rotation chuck 52 calculated in this manner, the substrate w is mounted in the posture shown in FIG. The substrate W is attracted and supported by the rotary chuck 52. In addition, reference numeral 55 in the figure is a cover covering the substrate w. The transfer device 60 is supported by the nozzle device 10 along the substrate along its long side. W width direction The support arm 61 in the direction of the arrow η) is constituted by a transfer mechanism 62 that moves the support arm 61 in the direction of the arrow τ orthogonal to the width direction (the direction of the arrow η), and the like. As described above, according to this substrate processing In the device 50, first, the substrate w is mounted on the rotary chuck 52, and the nozzle device 10 is moved toward the substrate W by the aforementioned transfer device 60 in a state where the rotary chuck 52 is adsorbed and supported. Then, At the same time, the processing liquid supply device 37 supplies the pressurized processing liquid to the nozzle device 10, flows down the processing liquid from the ejection port 18, and applies this to the substrate W. Then, the processing liquid is fully coated on the substrate W After that, the nozzle device 10 is returned to the original position. When the nozzle device 10 returns to its original position, the substrate W is rotated horizontally for a predetermined time by the driving mechanism portion 54. Based on this, the substrate W is coated by centrifugal force. The processing liquid of the cloth extends thinly, and the thickness of the processing liquid formed on the substrate W is further uniformed. After that, the substrate W is stopped to end a series of processing. Standard (CNS) A4 size (210 X 297 mm) (Please read the back of the precautions to fill out this page)
I 訂-· 線 561071 五、發明說明（！/) 又’能適用本發明之作爲處理對象之基板，並無任何 限制’可將本發明適用於液晶玻璃基板、半導體晶圓（矽晶 圓）、光罩用玻璃基板、光碟用基板等各種基板。又，本發 明之處理液亦無任限制，可使用半導體或液晶製程中所使 用之顯影液、光阻液、光阻剝離液、蝕刻液、洗淨液(包含 純水、臭氧水、含氫水、電解離子水)等各種處理液。 [產業上之可利用性] 如前所述，本發明之噴嘴裝置及具備其之基板處理裝 置’適於將藥水或洗淨液等之處理液均勻的塗佈於液晶玻 璃基板、半導體晶圓、光罩用玻璃基板、光碟用基板等各 種基板的裝置。 (請先閱讀背面之注意事項再填寫本頁) 零·· -線 21 衣紙張尺度適用中國國家標準（CNS)a4規格（21〇 X 297公釐）I Order-· Line 561071 V. Description of the invention (! /) And 'the substrate to which the present invention can be applied is processed without any restrictions' The present invention can be applied to liquid crystal glass substrates, semiconductor wafers (silicon wafers) , Substrates such as glass substrates for photomasks and substrates for optical disks. In addition, the processing liquid of the present invention is not limited in any way, and a developer, a photoresist, a photoresist peeling solution, an etching solution, and a cleaning solution (including pure water, ozone water, and hydrogen containing water) used in a semiconductor or liquid crystal manufacturing process can be used. Water, electrolytic ion water) and other processing liquids. [Industrial Applicability] As mentioned above, the nozzle device and the substrate processing apparatus provided therewith of the present invention are suitable for uniformly coating a processing solution such as a chemical solution or a cleaning solution on a liquid crystal glass substrate or a semiconductor wafer. And various substrates such as glass substrates for photomasks and substrates for optical discs. (Please read the precautions on the back before filling in this page) Zero-· -line 21 Applicable to China National Standard (CNS) a4 (21 × X 297 mm)