CN1627993A - Nozzle device and substrate processing device with nozzle device - Google Patents
Nozzle device and substrate processing device with nozzle device Download PDFInfo
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- CN1627993A CN1627993A CN02829087.9A CN02829087A CN1627993A CN 1627993 A CN1627993 A CN 1627993A CN 02829087 A CN02829087 A CN 02829087A CN 1627993 A CN1627993 A CN 1627993A
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- liquid
- substrate
- treatment fluid
- outlet
- spray nozzle
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/027—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/14—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openings; with strainers in or outside the outlet opening
- B05B1/20—Arrangements of several outlets along elongated bodies, e.g. perforated pipes or troughs, e.g. spray booms; Outlet elements therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- Cleaning Or Drying Semiconductors (AREA)
- Nozzles (AREA)
- Coating Apparatus (AREA)
Abstract
A nozzle device and a substrate processing device capable of preventing liquid from dripping after completing the application of the liquid and forming processing liquid film of uniform thickness no a substrate with small amount of processing liquid, the nozzle device comprising a plruality of outlets formed in the lower surface thereof, a liquid reserving chamber for reserving the supplied processing liquid, and a plurality of liquid discharge flow passages allowed to communicate with the outlets for discharging the processing liquid from the outlets, wherein the upper ends of the liquid discharge flow passages are positioned above the upper end of the liquid reserving chamber and the liquid discharge flow passages are allowed to communicate with the liquid reserving chamber through a communication passage, and the minimum height dimension of the communication passage is set to 0.05 to 0.2 mm and the minimum diameter of the liquid discharge flow passages is set to 0.35 to 1.0mm.
Description
Technical field
The invention relates to liquid crystal glass base, semiconductor wafer (silicon chip), be used for photomask glass substrate, be used for the substrates such as substrate of CD, the spray nozzle device of treatment fluids such as spraying soup or cleaning solution and have the substrate board treatment of spray nozzle device.
Background technology
For example, the glass substrate that constitutes crystal liquid substrate is produced through various operations, in each operation to glass substrate coating diaphragm or developer solution, be coated with various treatment fluids such as being applied to the soup peeled off or cleaning solution.
The coating of treatment fluid on the glass substrate, existing by carrying out as Figure 15 and spray nozzle device shown in Figure 16.This spray nozzle device comprises: the supporting mechanism of horizontal support glass substrate; Discharge the spray nozzle device of treatment fluid on by the glass substrate of horizontal support; Make spray nozzle device above glass substrate, move the mobile device of (scanning) along substrate.
As Figure 15 and shown in Figure 16, described spray nozzle device 100 has: above glass substrate W, along the microscler nozzle body 101 of its width (being the direction vertical with paper among Figure 15, the H direction among Figure 16 shown in the arrow) installation; And be connected on the described nozzle body 101, and be connected the carriage 108 of the suitable support sector of described mobile device.
In addition, first parts 102 above the supply interface 104 that a side opening, opposite side are communicated with described supply room 103 is installed.Supply interface 104 is connected by pipe joint 112 with the supply pipe 111 that is connected treatment fluid feeding mechanism 110, and treatment fluid is from treatment fluid feeding mechanism 110, again through being fed to described supply room 103 inside behind supply pipe 111, the supply interface 104.
In addition, below first parts 102, reach long side direction formation one row of the tap 105 of described supply room 103 upper sheds along first parts 102, and wear with the regulation pitch-row and to form, the treatment fluid that is fed to above-mentioned supply room 103 is through tap 105 inside, after the peristome discharge, be coated on the substrate W.
Have in the spray nozzle device 100 of said structure, its above-mentioned carriage 108 is connected with the suitable support portion of described mobile device, thereby be supported on this mobile device, move (scanning) along the direction vertical with the width (arrow H direction) of glass substrate W by this mobile device.
Have the as above substrate board treatment of structure, when glass substrate W by the state of described supporting construction horizontal support under, the treatment fluid of pressurization is fed to spray nozzle device 100 from treatment fluid feeding mechanism 110, discharges from the peristome of described tap 105 again.
The treatment fluid that described each tap 105 is discharged, the liquid that forms the linear of a rule respectively flows, and integral body flows down with the curtain shape, is coated on the glass substrate W.Then, by described mobile device spray nozzle device 100 is moved along the vertical direction of substrate W width (arrow H direction), be coated to the treatment fluid of glass substrate W, on glass substrate W, form the strip liquid stream that extends along the moving direction of spray nozzle device 100, soon between the strip liquid of the adjacency stream because surface tension is mixed into the processing liquid film with regulation film thickness.
Described existing substrate board treatment to apply treatment fluid as described above on glass substrate W, is handled glass substrate W by the treatment fluid of coating.
But, because in described spray nozzle device 100, make supply interface 104, supply room 103, tap 105 become the structure that is set to the lower end from the upper end of nozzle body 101 successively continuously, therefore when stopping to finish this coating from the supply of the treatment fluid of treatment fluid device 110, the weight of the treatment fluid of filling in the supply room 103 can directly work to the treatment fluid in the tap 105, treatment fluid is dripped on the substrate W from described tap 105, can produce the even problem of treatment fluid non-uniform film thickness that substrate W goes up coating.
In addition, at present, the size of substrate W such as glass substrate increases year by year.For this reason, need a kind of can the processing uniformly, and reduce its processing cost, on substrate W, apply the technology of homogeneous film thickness treatment fluid as far as possible with a spot of treatment fluid whole base plate W.
Therefore, outlet 105 bores of the spray nozzle device 100 of described existing embodiment reduce as far as possible, and are necessary the pitch-row of installing is reduced at interval as far as possible.
Yet, in described spray nozzle device 100, because its tap 105 is arranged in row, the words of too dwindling when the pitch-row interval, the interval of the liquid stream that flows down with the linear of a rule from each tap 105 discharge back is very close, its result makes between the adjacent liquid stream and engages, mix after gathering together mutually, not only form banded liquid stream and flow down, and be subjected to its capillary effect to make the width of liquid stream be the state that front end shrinks, cause treatment fluid can not be coated to problem on the whole base plate W breadth.In addition, also can produce the too thick on the contrary problem of coated treatment fluid thickness.
On the one hand, for not sticking together, the liquid of adjacency stream make installing hole when strengthening at interval, because the processing liquid measure of discharging from each outlet very little, as shown in figure 17, place each drop R on the substrate W not to be in contact with one another and be in separate state, thereby also can't on substrate W, form and handle liquid film.
The present invention is in view of above actual conditions, the drippage of treatment fluid in the time of can preventing to finish to apply effectively, and purpose is to provide a spot of treatment fluid of a kind of usefulness to form the substrate board treatment that film thickness is handled the spray nozzle device of liquid film uniformly and had spray nozzle device on substrate.
Summary of the invention
For reach described purpose the present invention relates to have microscler nozzle body, and discharge the spray nozzle device of treatment fluid coating object being treated from this nozzle body, it is characterized in that,
Described nozzle body comprises: a plurality of outlets that form in its lower section and arrange along long side direction, the liquid holdup chamber that the treatment fluid of being supplied is detained, be communicated with respectively with described each outlet, can discharge stream from a plurality of liquid that described outlet is discharged after making the treatment fluid circulation
Described liquid holdup chamber and each liquid are discharged stream and are arranged in parallel, and the upper end that described each liquid is discharged stream is set to be higher than the upper end of described liquid holdup chamber, the upper end that the upper end of the chamber of described liquid holdup simultaneously and described each liquid are discharged stream is interconnected by interface channel
And the minimum altitude of described interface channel inside is set at below the above 0.2mm of 0.05mm, and the described lowest calibre that each discharges stream is set at below the above 1.0mm of 0.35mm.
This spray nozzle device is installed in the top of the substrate that supported device supporting, and when from the treatment fluid feeding mechanism treatment fluid of pressurization being fed to nozzle body, by mobile device, can relatively move along described substrate.
Under the state as the supported device horizontal support of substrate of handling object, the treatment fluid of pressurization is fed to spray nozzle device from feeding mechanism, it is indoor that the treatment fluid that is supplied flow into the liquid holdup of nozzle body, after flowing through interface channel inside and liquid discharge stream inside more in regular turn, discharge from described outlet.
From the treatment fluid that each outlet ejects, form the liquid stream of the linear of a rule respectively, integral body flows down with the curtain shape, is coated on the substrate.By described mobile device nozzle body is moved along the direction vertical with long side direction then, the treatment fluid that flows down from each outlet forms the strip liquid that prolongs along the nozzle body moving direction at substrate, is mixed into the processing liquid film with a regulation film thickness by surface tension between the strip liquid stream of adjacency.
But, if stream setting is continuously from top to bottom discharged in described liquid holdup chamber and liquid, then the same with described existing spray nozzle device, even stop treatment fluid supply from the treatment fluid feeding mechanism, the weight of the treatment fluid of filling in the liquid holdup chamber can directly work to the treatment fluid that liquid is discharged in the stream, thereby treatment fluid is dripped from described outlet, can produce the even problem of treatment fluid non-uniform film thickness that applies on the substrate.
Therefore, the present invention is arranged in parallel liquid holdup chamber and liquid discharge stream, the upper end that liquid is discharged stream is set to be higher than the upper end of liquid holdup chamber, and has the structure that the upper end of liquid holdup chamber and upper end that liquid is discharged stream are interconnected by interface channel.
Therefore, under the state that treatment fluid is supplied from the treatment fluid feeding mechanism, the treatment fluid pressure of liquid holdup chamber interior is higher than the treatment fluid pressure that liquid is discharged stream inside, after treatment fluid flows to the inside on liquid discharge road from the liquid holdup chamber through interface channel, discharge from outlet again, on the other hand, when the supply of treatment fluid stops, the weight that is filled in the treatment fluid in the liquid holdup chamber can't directly work to the treatment fluid that liquid is discharged stream inside, and liquid is discharged the treatment fluid of stream inside because the surface tension of self, rest on this liquid and discharge the inside of stream, thereby can prevent the problem of liquid from described outlet drippage.
In addition, the minimum altitude of described interface channel inside is set at below the above 0.2mm of 0.05mm, the described lowest calibre that each discharges stream is set at below the above 1.0mm of 0.35mm, can improve described interface channel inside and liquid like this and discharge the ratio of the treatment fluid surface tension of stream inside with respect to deadweight, by described structure, can effectively keep described interface channel inside and liquid to discharge the treatment fluid of stream inside, also can effectively prevent the problem of described liquid drippage.
And, with the minimum altitude of interface channel inside be set at more than the 0.05mm, the lowest calibre that will discharge stream is set at more than the 0.35mm, this is because if less than this size, can hinder the circulation of treatment fluid.
Described each liquid is discharged stream, can be made up of heavy caliber, medium caliber, a plurality of bores such as small-bore, and at this moment lowest calibre will be set in more than the above-mentioned 0.35mm, below the 1.0mm.
In addition, described outlet when being arranged in multiple row along described nozzle body long side direction, is arranged between each outlet that respectively outlet of the outlet institute adjacency of row is listed as, and makes whole outlet also passable along the orientation indention.
Can make the disposition interval of whole outlet of nozzle body long side direction tightr like this, make the described strip liquid stream that adjoins each other that places on the substrate more approaching, make both be contact condition.The film pressure of the processing liquid film that forms on the substrate thus, is more even.In addition,, also needn't narrow down to more than the desirable value, can closely be provided with the interval of whole outlet, also can on substrate, form processing liquid film with a spot of treatment fluid with uniform film thickness being provided with at interval even the bore of each outlet is set to path.
In addition, the governor motion of regulating described interface channel internal height is set, can be easily with in the scope of this height setting below the above 0.2mm of 0.05mm.
In addition, can have following structure, described liquid is discharged between stream and the interface channel and is formed with one or more liquid supply rooms, the upper end of this liquid supply room is set to be higher than the upper end of described liquid holdup chamber, the upper end that bottom and a plurality of described liquid of liquid supply room are discharged stream is communicated with simultaneously, and the upper end of liquid supply room and interface channel are communicated with, and treatment fluid is fed to each liquid from described interface channel by the liquid supply room and discharges stream.But in this case, from preventing the viewpoint of described liquid drippage, importantly the capacity setting with the liquid supply room becomes each liquid to discharge the treatment fluid of stream inside because the surface tension of self is trapped in the inside of this liquid discharge stream.
In addition, described bracing or strutting arrangement, mobile device and roller transmissioning device are integrally formed, and described roller transmissioning device has a plurality of rollers that support described substrate, and along with the rotation of each roller transmits described substrate straight line.
Perhaps, described bracing or strutting arrangement can be made up of the plummer of bearing substrate, and described mobile device also can by nozzle body is formed along the conveyer of substrate transmission.At this moment, also the rotating driving device that described plummer is horizontally rotated can be set.According to this substrate board treatment, by spray nozzle device on the substrate coating treatment fluid after, because described rotating driving device horizontally rotates substrate, the treatment fluid that is coated on the substrate is extended under centrifugal action become very thin, more can on substrate, form and handle liquid film uniformly.
Moreover, be not limited to them to being suitable for the substrate that the present invention handles object, the present invention applicable to liquid crystal glass base, semiconductor wafer (silicon chip), be used for photomask glass substrate, be used for the various substrates such as substrate of CD.And then; treatment fluid is not had any restriction yet, can use the developer solution, diaphragm liquid, diaphragm stripper, etching solution, the cleaning solution various treatment fluids such as (pure water, Ozone Water, hydrogen water, electrolytic ionic waters) that in the manufacturing process of semiconductor or liquid crystal, use.
Description of drawings
Fig. 1 is the flat sectional drawing of the substrate board treatment of expression optimal way of the present invention, is the flat sectional drawing of the II-II direction of arrow of Fig. 2.
Fig. 2 is the sectional side view of the I-I direction of arrow of Fig. 1.
Fig. 3 is the orthogonal view of the substrate board treatment of expression optimal way of the present invention, is the orthogonal view of the IV-IV direction of arrow of Fig. 5.
Fig. 4 is the upward view of the spray nozzle device shown in Fig. 3.
Fig. 5 is the sectional side view of the III-III direction of arrow of Fig. 3.
Fig. 6 and Fig. 7 are the key diagrams of effect of treatment fluid coating that is used to illustrate the spray nozzle device of present embodiment.
Fig. 8 and Fig. 9 are the key diagrams of effect of treatment fluid coating that is used to illustrate the spray nozzle device of present embodiment.
Figure 10 is the orthogonal view of the spray nozzle device of other modes among expression the present invention, is the sectional side view of the VI-VI direction of arrow of Figure 11.
Figure 11 is the sectional side view of the V-V direction of arrow of Figure 10.
Figure 12 is the sectional side view of the spray nozzle device of another mode among expression the present invention.
Figure 13 is the orthogonal view of the substrate board treatment of other modes among expression the present invention.
Figure 14 is the plane of substrate board treatment shown in Figure 13.
Figure 15 is the sectional side view of the existing spray nozzle device of expression.
Figure 16 is the upward view of spray nozzle device shown in Figure 15.
Figure 17 is the key diagram of the treatment fluid coating effect of the existing spray nozzle device of explanation.
The specific embodiment
Below, for the present invention is illustrated in further detail, base describes with accompanying drawing.
As shown in Figures 1 and 2, the substrate board treatment among the present invention 1 comprises cover body 2 that forms enclosure space and a plurality of delivery rollers 4 of installing with predetermined distance in described enclosure space.Also comprise the conveyer 3 that supports and transmit by this delivery roller 4 as the substrate W that handles object; Be installed in the top of 4 groups of a succession of delivery rollers, the spray nozzle device 10 of coating treatment fluid on described substrate W; And the treatment fluid feeding mechanism 37 etc. that the treatment fluid of pressurization is provided to spray nozzle device 10.
Except described a plurality of delivery rollers 4, conveyer 3 also comprises can rotate bearing 8 that supports delivery roller 4 freely and the driving mechanism 9 that can drive each delivery roller 4.Delivery roller 4 comprises that two ends rotate rotating shaft 5 that is supporting freely and the roller of fixing with predetermined distance along long side direction 6,7 by described bearing 8 respectively on this rotating shaft 5, the roller 7 at the axial both ends of rotating shaft 5 has flange respectively, and this flange can prevent that the substrate W that transmits from coming off from roller 6,7 in transmitting the way.
Also have, though not clearly expression in the accompanying drawings, shown in driving mechanism 9 comprise drive motors and driving-belt etc., described driving-belt is wrapped on each rotating shaft 5 and the power of described drive motors can be sent to each rotating shaft.Make described each rotating shaft 5 rotation, make that substrate W is pressed arrow T direction to be transmitted.
As shown in Figure 1, described spray nozzle device 10 comprises the microscler nozzle body 11 that is provided with along substrate W width (arrow H direction), and by this nozzle body 11 fixing and carriage 30 that be connected with suitable structure (not shown).
To shown in Figure 5, nozzle body 11 comprises the first microscler parts 12 and second parts 15 as Fig. 3, and has the structure that first parts 12 and second parts 15 engage with filler 20,21 by sealing.The transverse shape of these first parts 12 and second parts 15 is respectively have horizontal sides 12b, 15b and vertical edges 12a, 15a hook-shaped, the vertical edges 15a end face of the horizontal sides 12b end face of first parts 12 and second parts 15 engages by described filler 20, and the horizontal sides 15b end face of the vertical edges 12a end face of first parts 12 and second parts 15 engages by described filler 21.Also have, first parts 12 and second parts 15 use politef (PTFE).
In addition, the corner that intersects with vertical edges 12a end face below the horizontal sides 12b of first parts 12 forms groove 13 along described long side direction, on the horizontal sides 15b of second parts 15 and with the bight that end face intersects, forms groove 19 along described long side direction.First parts 12 and second parts 15 are the state for engaging as mentioned above, forms liquid holdup chamber 22 by described groove 13 and 19.
In addition, on second parts 15, wear formation and discharge a plurality of vertical hole 17 of stream as liquid, a side in a plurality of vertical holes 17 opening on horizontal sides 15b, opposite side forms outlet 18 in the lower aperture of horizontal sides 15b.As shown in Figure 4, this vertical hole 17 is arranged in 2 row (A row and B row) along the long side direction of second parts 15.The outlet 18 of each row that spacing P is set is identical, and be arranged on the centre position between each outlets 18 configurations of adjacent rows outlet 18 row, each outlet 18 integral body is along the orientation indention.
Also have, the bore d in described vertical hole 17 is arranged on the following scope of the above 1.0mm of 0.35mm.In addition, spacing P is set is preferably: when the bore (identical with the bore d in vertical hole 17) of outlet 18 is d ', P≤2d '.
In addition, form interface channel 23 below the horizontal sides 12b of described first parts 12 and between the vertical edges 15b of second parts 15 top, this interface channel 23 has the height dimension t of setting range below the above 0.2mm of 0.05mm.Be communicated with described vertical hole 17 and liquid holdup chamber 22 by described interface channel 23.In addition, as shown in Figure 5, vertically the upper end in hole 17 is set to be higher than the upper end of liquid holdup chamber 22.
Also have, described first parts 12 and second parts 15 are inter-connected via a bolt joint, the height that can regulate interface channel 23 by the keyhole and the gap between this bolt of bolt in described scope.
In addition, as shown in Figure 3, the both side ends of first parts 12 and second parts 15 engages with attachment 24 by filler 23 respectively, and the treatment fluid stream is made up of described liquid holdup chamber 22 and interface channel 23, and is closed by filler 20,21,23.
Extremely shown in Figure 5 as Fig. 3, long side direction substantial middle place at first parts 12, form the supply port 14 that reaches 22 upper sheds of liquid holdup chamber in the above, being connected with the supply pipe 36 that is connected with described treatment fluid feeding mechanism 37 by pipe joint 35 on this supply port 14 connects, behind described treatment fluid feeding mechanism 37 process supply pipes 36, supply interface 14, the treatment fluid that pressurizes is fed to 22 inside, liquid holdup chamber.
According to the substrate board treatment 1 of the present embodiment of structure as mentioned above, when the substrate W that transmits along arrow T direction by conveyer 3 arrives the position of regulation, begin by treatment fluid feeding mechanism 37 providing chemical liquids, pressurized treatment fluid is fed to described nozzle body 11 through behind the supply pipe 36 again from treatment fluid feeding mechanism 37.After the treatment fluid that is fed to nozzle body 11 flow into 22 inside, liquid holdup chamber from supply interface 14, flow through interface channel 23 inside more successively, vertically discharge respectively from each outlet 18 that A row and B row two list setting 17 inner backs, hole, form the liquid stream of a rule linear, integral body flows down with the curtain shape.
On the one hand, substrate W is then by described conveyer 3, below described nozzle body 11, transmit, form the liquid stream of a rule linear and the treatment fluid that flows down, on substrate W, present the bar shaped drop state that prolongs along substrate W direction of transfer from described nozzle body 11 along the direction of arrow T.More particularly, be positioned at the liquid that the A row outlet 18 of substrate W direction of transfer (direction of arrow T) downstream one side flows down and wander substrate W, and then be positioned at the liquid that the B row outlet 18 of upstream side flows down and wander on the substrate W.This state is presented among Fig. 6.Also have, in Fig. 6, the drop Ra that the outlet 18 of A row flows down represents that with solid line the drop Rb that the outlet 18 of B row flows down dots.
Spacing is set is P of the outlet 18 of each row of A, B, as mentioned above, when spacing P being set being set to P≤2d ', as shown in Figure 6, the treatment fluid (Rb) that treatment fluid (Ra) that A row outlet 18 flows down and B row outlet 18 flow down is overlapping and both mix on substrate W, by the diffusion thinly on substrate W of its surface tension treatment fluid, as shown in Figure 7, on substrate W, form the uniform treatment liquid film (R) of certain film thickness.
Then, on whole base plate W, be coated with when applying treatment fluid, will stop from the treatment fluid supply of treatment fluid feeding mechanism 37.Afterwards, to the described processing of substrate W repetitive operation that transmits successively, each substrate W is gone up form the processing liquid film.
Like this, in this routine substrate board treatment 1, make the upper end in vertical hole 17 of spray nozzle device 10 be set to be higher than the upper end of liquid holdup chamber 22, therefore the weight that is filled in the treatment fluid of 22 li of liquid holdup chambers can not directly work to the treatment fluid in vertical hole 17, and vertically the treatment fluid in the hole 17 is owing to the surface tension of self is trapped in this vertical hole 17.Like this, when working as the supply that stops treatment fluid, can prevent the phenomenon of liquid from described outlet 18 drippages by described effect.Therefore, can prevent that substrate W from going up the phenomenon that occurs dark spot on the processing liquid film that forms.
In addition, the height dimension t of interface channel 23 inside is set at below the above 0.2mm of 0.05mm, vertically the bore d in hole 17 is set at below the above 1.0mm of 0.35mm, the surface tension of treatment fluid that can improve inner and 17 inside, vertical hole of described interface channel 23 like this is with respect to the ratio of deadweight, by described structure, the treatment fluid that can effectively keep described interface channel 23 inside and 17 inside, vertical hole also can effectively prevent described liquid drippage.
Therefore, treatment fluid uses 25 ℃ pure water (22 ℃ time viscosity be 1mPas), after the bore d in the height t of described interface channel 23 inside and vertical hole 17 carried out various variations, observe the liquid drippage state of outlet 18 when the treatment fluid feeding mechanism is detained, its result is illustrated on Fig. 8.Treatment fluid uses 80 ℃ MEA (H2NCH
2CH
2OH) (22 ℃ time viscosity be 10mPas), as above identical, after the bore d in the height t of interface channel 23 inside and vertical hole 17 carried out various variations, observe that the liquid from outlet 18 drips state when the treatment fluid supply stops after, its result is illustrated on Fig. 9.
And among Fig. 8 and Fig. 9, " liquid drippage degree " represents not drip for 10 seconds one state when being " nothing "; During for " pettiness ", represent to drip for 10 seconds 1～3 state; During for " lacking ", represent to drip for 10 seconds 4～10 state; During for " many ", represent the state more than 10 that drips for 10 seconds.
Can know that from Fig. 8 and Fig. 9 the height t of interface channel 23 inside is set at below the above 0.2mm of 0.05mm, and vertically the bore d in hole 17 is set at the above 1.0mm of 0.35mm when following, can prevent the phenomenon that outlet 18 liquid drip effectively.
In addition, at present, the size of substrate W such as glass substrate increases year by year.For this reason, need a kind of can the processing uniformly, reduce its processing cost, on substrate W, apply the technology of homogeneous film thickness treatment fluid as far as possible with a spot of treatment fluid whole base plate W.
In this routine substrate board treatment 1, because when outlet 18 is configured to two row along the long side direction of nozzle body 11, each row outlet 18 can be arranged on the centre position between each outlet 18 configuration of facing outlet 18 row that connect, make whole outlet indentation in orientation, so when the bore of each outlet is set to when small-bore, even the interval P that is provided with each row does not narrow down to more than the needs, also can dwindle being provided with at interval of two all outlets 18 that are listed as, make the liquid stream that places on the substrate W very approaching, making both is contact condition, forms the processing liquid film with regulation film thickness on substrate W.
More than be that one embodiment of the present of invention are illustrated, but the concrete mode that the present invention adopts is not limited to this.For example, in the last example outlet 18 and vertical hole 17 are set to 2 row, but make into these single-row or also be fully passable more than 3 row.
In addition, as Figure 10, shown in Figure 11, at the liquid supply room 16 that the groove shape vertically is installed between hole 17 and the interface channel 23, described liquid supply room opening on the horizontal sides 15b of second parts 15, be arranged in parallel along long side direction and described liquid-liquid retained chamber 22, treatment fluid is fed to vertical hole 17 after through liquid supply room 16 and also can.
Perhaps, described vertical hole 17 is two sections hole with heavy caliber 17b and small-bore 17a as shown in figure 12, perhaps is the multistage hole more than three sections.But at this moment to be arranged on below the above 1.0mm of 0.35mm be very crucial to Zui Xiao bore scope.
Resemble the present invention like this, if reduce the bore in vertical hole 17, it is difficult that its processing will become, but as Figure 10 and Figure 11 or structure shown in Figure 12, can reduce the degree of depth of small-bore part, makes its processing become easy.
In addition, the substrate board treatment among the present invention can be as Figure 13 and mode shown in Figure 14.At this moment, handling to the coating of the treatment fluid of substrate W is not continuous processing, but handles one by one.As Figure 13 and shown in Figure 14, this substrate board treatment 50 comprises: the support whirligig 51 that can horizontally rotate in horizontal support substrate W; Described Fig. 3 to Fig. 5 or Figure 10 and Figure 11, the perhaps described spray nozzle device 10 of Figure 12; Treatment fluid feeding mechanism 37 to described spray nozzle device 10 providing chemical liquids: support nozzle device 10 and the conveyer 60 that it is moved along substrate W.
Described support whirligig 51 comprises that vacuum holds the rotary chuck 52 of horizontal support behind the substrate W; Support the rotating shaft 53 of described rotary chuck 52; With the driving mechanism portion 54 that makes described rotating shaft 53 in the rotation of axle center.Power by driving mechanism portion 54 makes rotating shaft 53 and rotary chuck 52 rotations, and 52 substrate supported W of rotary chuck are horizontally rotated.Driving mechanism portion 54 has the reckoning function of rotating shaft 53 being calculated the predetermined angular on this direction of rotation, and rotary chuck 52 is calculated to being positioned at the position of the anglec of rotation of predesignating before and after rotation.In addition, on the rotary chuck of extrapolating like this 52, under state shown in Figure 14, substrate W is carried, and substrate W is by these rotary chuck 52 absorption, support.Also have, the symbol 55 among the figure is to surround substrate W cover all around.
Described conveyer 60 comprises that support nozzle device 10 makes the support arm 61 of its long side direction along the width (arrow H direction) of substrate W, with the transfer member 62 that support arm 61 is moved along the T ' direction vertical with described width (arrow H direction) etc.
Like this, according to aforesaid substrate treating apparatus 50, at first substrate W is carried to rotary chuck 52, and under the state that is rotated chuck 52 sorptions and supports, spray nozzle device 10 is sent to direction near substrate W by described conveyer 60.Meanwhile pressurized treatment fluid is fed to spray nozzle device 10 from treatment fluid feeding mechanism 37, flows down from outlet 18, is applied on the substrate W again.In addition, behind the coating treatment fluid, spray nozzle device 10 is got back to initial position on substrate W whole.
After spray nozzle device 10 is got back to initial position, by described driving mechanism portion 54 substrate W is only horizontally rotated in official hour again.Therefore, become very thin thereby the treatment fluid that is coated on the substrate W is extended by centrifugal action, the film thickness that is formed on the processing liquid film on the substrate W is more even.Then, stop substrate W and finish all processing.
Moreover, be not limited to them to being suitable for the substrate that the present invention handles object, the present invention applicable to liquid crystal glass base, semiconductor wafer (silicon chip), be used for photomask glass substrate, be used for the various substrates such as substrate of CD.And then, treatment fluid there is not any restriction yet, can use developer solution, diaphragm liquid, diaphragm stripper, etching solution, the cleaning solution various treatment fluids such as (pure water, Ozone Water, hydrogen water, electrolytic ionic waters) of the manufacturing industry use of semiconductor or liquid crystal.
As mentioned above, the substrate board treatment with the spray nozzle device among the present invention be applicable to liquid crystal glass base, semiconductor wafer (silicon chip), be used for photomask glass substrate, be used for applying equably on the various substrates such as substrate of CD the device of treatment fluids such as soup or cleaning solution.
Claims (9)
1. spray nozzle device, it has microscler nozzle body, and discharges treatment fluid from this nozzle body, is coated on the object being treated, it is characterized in that, and described nozzle body has formation in its lower section and a plurality of outlets of arranging along long side direction; Make the liquid holdup chamber of the treatment fluid delay of being supplied; And is communicated with separately respectively with described each outlet, make treatment fluid circulation and can be from a plurality of liquid discharge streams of described outlet discharge,
Described liquid holdup chamber and each liquid are discharged stream and are arranged in parallel, and the upper end that described each liquid is discharged stream is configured to be higher than the upper end of described liquid holdup chamber, the upper end that the upper end of the chamber of described liquid holdup simultaneously and described each liquid are discharged stream is interconnected by interface channel
And then the minimum altitude of described interface channel inside is set at below the above 0.2mm of 0.05mm, and the described lowest calibre that each discharges stream is set at below the above 1.0mm of 0.35mm.
2. spray nozzle device according to claim 1 is characterized in that, the hole of described each liquid discharge currents route multisection type constitutes, and the hole of described multisection type is formed by multiple bore respectively, and wherein lowest calibre is set in below the above 1.0mm of 0.35mm.
3. spray nozzle device according to claim 1 and 2, it is characterized in that, when described outlet was arranged in multiple row along the long side direction of described nozzle body, outlet of each row was arranged between each outlet configuration of outlet row of adjacency, and each outlet is along the orientation indentation.
4. according to each described spray nozzle device of claim 1 to 3, it is characterized in that, discharge at described liquid and to form one or more liquid supply rooms between stream and the interface channel, and the upper end of this liquid supply room is set to be higher than the upper end of described liquid-liquid retained chamber
Simultaneously, the upper end that the bottom of described liquid supply room and a plurality of described liquid are discharged stream is communicated with, and the upper end of described liquid supply room and described interface channel are communicated with, and by described liquid supply room treatment fluid are fed to each liquid from described interface channel and discharge the stream.
5. according to each described spray nozzle device of claim 1 to 4, it is characterized in that, also comprise the governor motion of the height dimension that is used to regulate described interface channel inside.
6. a substrate board treatment is characterized in that, comprises the bracing or strutting arrangement of supporting substrate; Be installed in by the top of described bracing or strutting arrangement substrate supported, discharge the spray nozzle device that the claim 1 to 5 of treatment fluid is put down in writing in each to this substrate; The treatment fluid feeding mechanism of the treatment fluid after this spray nozzle device supplied with pressurized; And make the mobile device that is relatively moved by described bracing or strutting arrangement substrate supported and described nozzle body.
7. substrate board treatment according to claim 6, it is characterized in that, described bracing or strutting arrangement, mobile device and roller transmissioning device are integrally formed, and described roller transmissioning device has a plurality of rollers that support described substrate, and by the rotation of each roller described substrate straight line are transmitted.
8. substrate board treatment according to claim 6 is characterized in that described bracing or strutting arrangement is made of the plummer that is used for the mounting substrate, and described mobile device is by described nozzle body is constituted along the conveyer that described substrate transmits.
9. substrate board treatment according to claim 8 is characterized in that, also has the rotating driving device that described plummer is horizontally rotated.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2002/005567 WO2003103845A1 (en) | 2002-06-05 | 2002-06-05 | Nozzle device and substrate processing device with the nozzle device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1627993A true CN1627993A (en) | 2005-06-15 |
Family
ID=29727316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN02829087.9A Pending CN1627993A (en) | 2002-06-05 | 2002-06-05 | Nozzle device and substrate processing device with nozzle device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2003103845A1 (en) |
| CN (1) | CN1627993A (en) |
| TW (1) | TW561071B (en) |
| WO (1) | WO2003103845A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102931119A (en) * | 2011-08-09 | 2013-02-13 | 株式会社Mm科技 | Blade module for treating surface of substrate |
| CN105298531A (en) * | 2015-10-24 | 2016-02-03 | 山西晋城无烟煤矿业集团有限责任公司 | Spraying apparatus for driving and bolting machine |
| CN106111587A (en) * | 2016-06-23 | 2016-11-16 | 武汉华星光电技术有限公司 | Liquid cutter |
| CN113942860A (en) * | 2020-07-17 | 2022-01-18 | 台郡科技股份有限公司 | Transmission mechanism for horizontal conveying substrate |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6178185B2 (en) * | 2013-09-24 | 2017-08-09 | 積水化学工業株式会社 | Slit nozzle |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3458313B2 (en) * | 1992-12-31 | 2003-10-20 | 株式会社サンツール | Spray coater for curtain fiber adhesive |
| JPH06210228A (en) * | 1993-01-16 | 1994-08-02 | San Tool:Kk | Curtain fiber like spray coating device |
| JPH1157573A (en) * | 1997-08-13 | 1999-03-02 | Sun Tool:Kk | Production of externally coated merchandise and application for production of externally coated merchandise |
-
2002
- 2002-06-05 TW TW091111940A patent/TW561071B/en not_active IP Right Cessation
- 2002-06-05 CN CN02829087.9A patent/CN1627993A/en active Pending
- 2002-06-05 JP JP2004510958A patent/JPWO2003103845A1/en active Pending
- 2002-06-05 WO PCT/JP2002/005567 patent/WO2003103845A1/en active Application Filing
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102931119A (en) * | 2011-08-09 | 2013-02-13 | 株式会社Mm科技 | Blade module for treating surface of substrate |
| CN105298531A (en) * | 2015-10-24 | 2016-02-03 | 山西晋城无烟煤矿业集团有限责任公司 | Spraying apparatus for driving and bolting machine |
| CN106111587A (en) * | 2016-06-23 | 2016-11-16 | 武汉华星光电技术有限公司 | Liquid cutter |
| CN106111587B (en) * | 2016-06-23 | 2018-09-11 | 武汉华星光电技术有限公司 | Liquid cutter |
| CN113942860A (en) * | 2020-07-17 | 2022-01-18 | 台郡科技股份有限公司 | Transmission mechanism for horizontal conveying substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| TW561071B (en) | 2003-11-11 |
| JPWO2003103845A1 (en) | 2005-10-06 |
| WO2003103845A1 (en) | 2003-12-18 |
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