CN1240488C - Substrate treating apparatus and substrate cleaning method - Google Patents

Substrate treating apparatus and substrate cleaning method Download PDF

Info

Publication number
CN1240488C
CN1240488C CNB031480985A CN03148098A CN1240488C CN 1240488 C CN1240488 C CN 1240488C CN B031480985 A CNB031480985 A CN B031480985A CN 03148098 A CN03148098 A CN 03148098A CN 1240488 C CN1240488 C CN 1240488C
Authority
CN
China
Prior art keywords
aforementioned
peristome
accepting container
base plate
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB031480985A
Other languages
Chinese (zh)
Other versions
CN1470337A (en
Inventor
芳谷光明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Publication of CN1470337A publication Critical patent/CN1470337A/en
Application granted granted Critical
Publication of CN1240488C publication Critical patent/CN1240488C/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04BGENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
    • E04B1/00Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
    • E04B1/02Structures consisting primarily of load-supporting, block-shaped, or slab-shaped elements
    • E04B1/08Structures consisting primarily of load-supporting, block-shaped, or slab-shaped elements the elements consisting of metal
    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04BGENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
    • E04B1/00Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
    • E04B1/18Structures comprising elongated load-supporting parts, e.g. columns, girders, skeletons
    • E04B1/24Structures comprising elongated load-supporting parts, e.g. columns, girders, skeletons the supporting parts consisting of metal
    • E04B2001/2481Details of wall panels
    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04BGENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
    • E04B1/00Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
    • E04B1/18Structures comprising elongated load-supporting parts, e.g. columns, girders, skeletons
    • E04B1/24Structures comprising elongated load-supporting parts, e.g. columns, girders, skeletons the supporting parts consisting of metal
    • E04B2001/249Structures with a sloping roof

Abstract

The present invention provides a substrate washing apparatus by high-pressure fluid discharge which prevents the re-adhesion of particles etc. A washing container has a double box structure of a first container 3 for washing by discharging washing fluids 11 and 12 at a high pressure and a second container 4 on the outside of the first container 3. In the opening parts 3a and 3b of the first container 3 hitting the conveyance route of the substrate W, pure water is discharged by a pipe shower 7 toward a gap formed between it and the substrate W to form a water seal 13 in the gap to control the leakage of the washing fluids 11 and 12. Since the atmosphere of the washing fluids 11 and 12, even when leaked from the first container 3, is discharged in the second container 4, particles etc., contained in the atmosphere are prevented from adhering again to the substrate etc.

Description

Substrate board treatment and substrate-cleaning method
Technical field
The present invention relates to be used for the treating apparatus that the tabular base such as glass substrate, printed base plate of flat-panel monitor manufacturing usefulness such as wet processed semiconductor wafer, LCD or plasma display is pulled.
Background technology
On the treating apparatus of tabular substrates such as the glass substrate of wet clean process semiconductor wafer or flat-panel monitor manufacturing usefulness, printed base plate, in order to improve the board cleaning degree, for example proposed the spy and opened shown in the flat 8-294679 communique like that, from the technology of nozzle substrate inject high pressure fluid.
But, in substrate ejection high-pressure fluid, exist the mist that disperses to be diffused into treatment trough integral body, adhere again on the treatment substrate and make the contaminated problem of substrate.
At this moment, can consider in treatment trough, cover the position that is cleaned of this nozzle and substrate, prevent that mist from dispersing to the chest outside with the long and narrow chest of offering the peristome that substrate comes in and goes out.But there is following problem in this method.
Easily be trapped on the substrate at the cabinet interior cleaning fluid, so the particle that cleaning is removed is easily once more attached on the substrate.
Mist can overflow peristome when hypertonia.
When supposing that base openings is extremely narrow, if large substrate or thin plate substrate then can be owing to vibration crooked or in transmission is touched.
Again,, also can consider on peristome, to be provided with the nozzle of tentiform atomizing of liquids, utilize so-called liquid curtain to cover peristome, but also there is following problem in this method for leakage from the mist of peristome as described above.
So owing to easily cause adhering to once more in the delay of cabinet interior mist atmosphere.
Mist can overflow peristome when hypertonia.
Summary of the invention
The present invention, at the problems referred to above, purpose is to provide the substrate board treatment that can not adhere to mist and particle on substrate once more.
In order to address the above problem, the invention of scheme 1 is characterized in that having: the first accepting container portion, and it contains at least one first accepting container that has first peristome and second peristome on relative side; Second accepting container, it is accommodated the aforementioned first accepting container portion and have the 3rd peristome and the 4th peristome on relative side; Conveyer, it sends into aforementioned second accepting container with substrate from aforementioned the 3rd peristome, and order is sent into aforesaid base plate and sent from aforementioned second peristome from aforementioned first peristome of aforementioned first accepting container in the aforementioned first accepting container portion, and by from aforementioned the 4th peristome aforesaid base plate being sent outside aforementioned second accepting container after the aforementioned first accepting container portion; First blowoff, it is configured in the aforementioned first accepting container portion inside, handles fluid to the aforesaid base plate ejection that transmits; First exhaust apparatus from the aforementioned first accepting container portion exhaust gas inside; With second exhaust apparatus from the aforementioned second accepting container exhaust gas inside.
Again, the invention of scheme 2 is scheme 1 described substrate board treatments, it is characterized in that: the exhaust velocity of aforementioned second exhaust apparatus, and greater than the exhaust velocity of aforementioned first exhaust apparatus.
Again, the invention of scheme 3, be scheme 1 or scheme 2 described substrate board treatments, it is characterized in that: when the receiving terminal of the aforesaid base plate that will be positioned at the aforementioned first accepting container portion and the peristome that exists as aforementioned first peristome are defined as the first outermost end peristome, in the time of will being positioned at the sending end and be defined as the second outermost end peristome of aforesaid base plate of the aforementioned first accepting container portion as the peristome that aforementioned second peristome exists, this substrate board treatment also has a plurality of second blowoffs, its be configured in the outside of the aforementioned first accepting container portion and aforementioned first and the aforementioned second outermost end peristome separately near, second gap between first gap between aforementioned first outermost end peristome and the aforesaid base plate and aforementioned second outermost end peristome and aforesaid base plate sprays first liquid.
Again, the invention of scheme 4 is scheme 3 described substrate board treatments, it is characterized in that: aforementioned first and the aforementioned second outermost end peristome have respectively with by aforementioned first and the relative plane of aforesaid base plate almost parallel of the aforementioned second outermost end peristome.
Again, the invention of scheme 5, be scheme 1 or scheme 2 described substrate board treatments, it is characterized in that: in the aforementioned second accepting container inside, also has the 3rd blowoff, its be configured in the aforementioned the 3rd and the 4th peristome at least one near, and form liquid stream at least one the mode that sprays second liquid and seal in the 3rd and the 4th peristome.
Again, the invention of scheme 6, be scheme 1 or scheme 2 described substrate board treatments, it is characterized in that: have top blowoff and bottom blowoff as aforementioned first blowoff, above-mentioned top and bottom blowoff are configured in a side of the different surfaces of the aforesaid base plate that transmits in the aforementioned first accepting container portion respectively.
Again, the invention of scheme 7 is scheme 6 described substrate board treatments, it is characterized in that: at least one ejection gas of aforementioned top and bottom blowoff and the 3rd mixtures of liquids are as the aforementioned processing fluid.
Again, the invention of scheme 8, it is method at the inner cleaning base plate of second accepting container, this second accepting container contains the first accepting container portion and have the 3rd peristome and the 4th peristome on relative side, at least one has first peristome and second peristome on relative side first accepting container is contained in this first accepting container portion, aforesaid base plate is sent into aforementioned second accepting container from aforementioned the 3rd peristome, order is sent into aforesaid base plate and send from aforementioned second peristome from aforementioned first peristome of aforementioned first accepting container in the aforementioned first accepting container portion, aforesaid base plate is sent outside aforementioned second accepting container from aforementioned the 4th peristome by after the aforementioned first accepting container portion, inside in the aforementioned first accepting container portion, handle fluid to the aforesaid base plate ejection that transmits, simultaneously from the exhaust gas inside of the aforementioned first accepting container portion, and from the exhaust gas inside of aforementioned second accepting container.
Again, the invention of scheme 9, be scheme 8 described substrate-cleaning methods, it is characterized in that: when the receiving terminal of the aforesaid base plate that will be positioned at the aforementioned first accepting container portion and the peristome that exists as aforementioned first peristome are defined as the first outermost end peristome, in the time of will being positioned at the sending end and be defined as the second outermost end peristome of aforesaid base plate of the aforementioned first accepting container portion as the peristome that aforementioned second peristome exists, also have to by aforementioned first and the gap that forms of the aforesaid base plate of aforementioned second outermost end peristome and transmission spray the ejection operation of first liquid, utilize aforementioned ejection operation, align by aforementioned first and the aforesaid base plate of the aforementioned second outermost end peristome and aforementioned first and the end edge portion of the aforementioned second outermost end peristome between the gap carry out water seal.
Again, the invention of scheme 10, be scheme 8 or scheme 9 described substrate-cleaning methods, it is characterized in that: in the aforementioned second accepting container inside, near in the aforementioned the 3rd and the 4th peristome at least one, spray second liquid and form liquid stream, utilize in aforementioned liquids stream sealing the 3rd peristome and the 4th peristome at least one.
Again, the invention of scheme 11 is scheme 8 or scheme 9 described substrate-cleaning methods, it is characterized in that: aforementioned transmission operation makes aforesaid base plate transmit aforesaid base plate towards the direction that tilts with respect to horizontal direction.
Again, the invention of scheme 12 is characterized in that having: first accepting container with peristome that substrate passes through; Have the peristome that aforesaid base plate passes through, and accommodate second accepting container of aforementioned first accepting container; Conveyer, it is outside by the aforementioned peristome of aforementioned second accepting container and the aforementioned peristome of aforementioned first accepting container from aforementioned second accepting container with aforesaid base plate, and delivers to outside aforementioned second accepting container through the inside of aforementioned first accepting container in aforementioned second accepting container again; In aforementioned first accepting container, provide the feedway of handling fluid to aforesaid base plate; First exhaust apparatus from the exhaust gas inside of aforementioned first accepting container; Second exhaust apparatus from the exhaust gas inside of aforementioned second accepting container.
Again, the invention of scheme 13 is characterized in that having: have first peristome that substrate passes through and the main accepting container of second peristome; Be arranged to shared any one at least one secondary accepting container that has the side of aforementioned first peristome or second peristome and have the peristome that aforesaid base plate passes through; By the aforementioned peristome of aforementioned auxiliary accepting container and aforementioned first peristome and second peristome of aforementioned main accepting container, pass aforementioned auxiliary accepting container and main accepting container and transmit the conveyer of aforesaid base plate; In aforementioned main accepting container, provide the feedway of handling fluid to aforesaid base plate; First exhaust apparatus from aforementioned main accepting container exhaust gas inside; Second exhaust apparatus from aforementioned auxiliary accepting container exhaust gas inside.
More than, as described, if the invention of employing scheme 1 to scheme 7 and scheme 8 to scheme 12, then because container handling is designed to double-layer structural, and exhaust respectively, so, can not make and handle fluid and escape to accepting container exhaust externally.
Again, if the invention of employing scheme 2 to scheme 4 and scheme 9 to scheme 11, then when there is the processing gas of continuous leakage in the exhaust with the 1st accepting container 3, also can discharge fully on the 2nd accepting container, the result can not make the processing fluid escape to accepting container exhaust externally.
Again, if the invention of employing scheme 3, scheme 4, scheme 9 then by on the peristome that is positioned on the transmission passage of substrate the gap with substrate being formed water seal, can suppress to handle fluid and spill to the outside.
Again, if the invention of employing scheme 4 and scheme 7 then can form water seal more effectively.
Again, if the invention of employing scheme 5 and scheme 10, then because can utilize the discrepancy of the inside and outside gas medium of liquid partition container handling, so, can avoid handling spilling of fluid and sneaking into of container handling outside.
Again, if the invention of employing scheme 6, scheme 7, then can be in an accepting container two sides of cleaning base plate simultaneously.
Again, if the invention of employing scheme 7, then for requiring the face of high cleanliness more can adopt the processing fluid cleaning base plate of mixture with high cleaning power.
Again, if the invention of employing scheme 13, then because all carry out exhaust in the front and back of main container handling, so, can not make the processing fluid escape to exhaust externally.
Again, if the invention of employing scheme 11, then because the liquid that can not that is used to clean is trapped in substrate surface for a long time, so, adhering to again of impurity etc. can be suppressed.
The simple declaration of accompanying drawing
Fig. 1 is the substrate board treatment 1 whole ideograph that constitutes of the 1st form of implementation.
Fig. 2 is the ideograph of the detailed formation of the 2nd wiper mechanism 54.
Fig. 3 is the figure that is used to illustrate that the inclination of substrate W transmits.
Fig. 4 is the stereogram that is used to illustrate pipe pipe inspection device 7 and liquid cutter 8.
Fig. 5 is the ideograph of the internal state of the 1st accepting container 3 in the substrate cleaning treatment and the 2nd accepting container 4.
Fig. 6 is the substrate board treatment 101 whole ideographs that constitute of the 2nd form of implementation.
Fig. 7 is the figure of typical variant example of shape that shows the end 3e of the 1st accepting container 3.
Fig. 8 is the schematic diagram with variation of secondary accepting container.
Symbol description
1,101 substrate board treatments
2 transfer rollers
3,31,32 the 1st accepting containers
4 the 2nd accepting containers
5 top blowoffs
6 bottom blowoffs
7 pipe inspection devices
8 liquid cuttves
9 press pressure roller
10 backing rolls
11,12 washing fluids
13 water seals
52 rollers brush
53 the 1st wiper mechanisms
54 the 2nd wiper mechanisms
56 the 3rd wiper mechanisms
V1 the 1st exhaust apparatus
V2 the 2nd exhaust apparatus
The W substrate
The form of implementation that carries out an invention
<the 1 form of implementation 〉
<device constitutes 〉
Fig. 1 is the cross-sectional side view of formation of showing the substrate board treatment 1 of the 1st form of implementation of the present invention.Substrate board treatment 1, be to utilize the transfer roller 2 that drives by not shown drive source to transmit semiconductor substrate for example or substrate W such as the dull and stereotyped huge glass substrate of making usefulness or tellite on one side, among treatment trough 1as carry out cleaning treatment and clean the substrate board treatment of this substrate W on one side.
In the treatment trough 1a of substrate board treatment 1, from the direction of transfer upstream side of substrate be provided with in proper order nozzle 51 with ejection pure water and roller brush 52 the 1st wiper mechanism 53, the 2nd wiper mechanism 54 described later, have the 3rd wiper mechanism 56 that tentiform is supplied with the nozzle 55 of pure water.Fig. 2 is the model utility cross-sectional side view of showing the 2nd wiper mechanism 54.The 2nd wiper mechanism 54 has double-deck box structure, and promptly portion's the 1st accepting container 3 of carrying out cleaning treatment also is received in the 2nd accepting container 4 within it.As the gateway of substrate W on each accepting container, the former is the 1st peristome 3a and the 2nd peristome 3b that is provided with on 2 sides in opposite directions, the latter is the 3rd peristome 4a and the 4th peristome 4b that is provided with on 2 sides in opposite directions, and they respectively at sustained height and in a straight line.Substrate W utilizes transfer roller 2 to transmit to horizontal direction shown in the arrow A R1 by these peristome ground successively.On Fig. 2, represent with three-dimensional coordinate, wherein, the direction of transfer of the substrate W shown in the arrow A R1 is made as x axle positive direction, is set as the y direction of principal axis, is made as the z direction perpendicular to the direction on xy plane perpendicular to the axial direction of x in horizontal plane.Again, end 3ae, 3be, 4ae and the 4be of the 1st peristome 3a, the 2nd peristome 3b, the 3rd peristome 4a and the 4th peristome 4b is designed to the interior side-prominent rostriform shape to the 1st, the 2nd accepting container 3,4 respectively, by on the face of side, form the plane that becomes almost parallel with the substrate W that transmits the past at its substrate.
On zone of passing through across substrate W and the position relative, be provided with by what not shown drive source drove and press pressure roller 9 with transfer roller 2.Press pressure roller 9,, play the effect of assisting substrate W to transmit by pushing from upside along with transmitting and cleaning the substrate W that vibrates.In the 1st accepting container 3,, the backing roll 10 of the effect play the more stable guide plate of the transmission that makes substrate W is set also though there is not drive source again.Like this, substrate W can suppress the caused dislocation of the vibration ground that the collision because of high-pressure fog shape fluid described later produces and transmit.
Again, on the 1st accepting container 3, respectively substrate W pass through the position more above top blowoff 5 is set, substrate W pass through the position more below bottom blowoff 6 is set.With the former is the surface of main cleaning base plate W, and the latter cleans the back side.
Top blowoff 5 is that air is mixed by for example volume ratio about 100: 1 with pure water, forms the spray form fluid-mixing so-called two-fluid spray nozzle that direction sprays to the surface of substrate W shown in arrow A R2.At this, air is to utilize air valve AV adjusting and process air feed path AL to provide from air supply source AS.Pure water is to utilize pump P1 from pure water supply source WS water intaking, utilizes valve V1 to regulate flow and provides by pure water feed path WL1.
Bottom blowoff 6 is that the pure water that is used for providing through pure water feed path WL4 from pure water supply source WS equally becomes tentiform ground such equipment to substrate W ejection shown in arrow A R3.
On top blowoff 5 and bottom blowoff 6, can utilize well-known spray technique.In addition, the also form of ejection and Air mixing fluid on bottom blowoff 6.Again, with above-mentioned opposite, also bottom blowoff 6 sprays fluid-mixings, the form of top blowoff 5 ejection pure water.
In addition, though illustrated situation does not mark on Fig. 2, on the substrate board treatment 1 of this form of implementation, make substrate W from the y direction of principal axis set angle θ that only tilts, the direction of transfer substrate W of substrate W transmits with the state that tilts to the left relatively.Fig. 3 is the figure that is used to illustrate that the inclination of substrate W transmits.As shown in Figure 3, the peristome with headed by the 1st peristome 3a also cooperates being formed slopely of substrate.Though 2 roller 2a and the 2b that directly contacts with substrate is set, on the roller 2b of setting below the inclination, be provided for preventing the flange part 2c of substrate landing on transfer roller 2 again.About pressing pressure roller 9 and backing roll 10 too, have 2 the roller 9a and 9b and 10a and the 10b that directly contact with substrate.
And,, near the 1st peristome 3a and the 2nd peristome 3b, dispose pipe inspection device 7 up and down across substrate throughout in the outside of the 1st accepting container 3.In the inside of the 2nd accepting container 4, near the 3rd peristome 4a and the 4th peristome 4b, dispose liquid cutter 8 up and down across substrate throughout again.Fig. 4 is that the stereogram of both parts is showed in medelling for pipe inspection device 7 and liquid cutter 8 are described.
Pipe inspection device 7, as shown in Figure 4, in the yz plane and along the configuration of the incline direction of substrate W.On pipe inspection device 7, (pure water feed path WL2 among Fig. 2, only the drawn a part) pure water that provides through pure water feed path WL2 from pure water supply source WS, direction is such shown in arrow A R4 among Fig. 2, from a plurality of ejiction opening 7a that are provided with set interval, to the 1st peristome 3a with just spray with the gap of just passing through between the substrate W of this peristome by gap between the substrate W of this peristome and the 2nd peristome 3b.
On the other hand, liquid cutter 8, as shown in Figure 4, in the yz plane and along the configuration of the incline direction of substrate W.On liquid cutter 8, (pure water feed path WL3 among Fig. 2, only the drawn a part) pure water that provides through pure water feed path WL3 from pure water supply source WS, direction is such shown in arrow A R5 among Fig. 2, from a plurality of ejiction opening 8a that are provided with set interval, we can say to form liquid curtain ground to the direction ejection vertical with substrate W.Again, liquid cutter 8 because from above-below direction across substrate W ground ejection pure water, so, also can play the end that suppresses substrate W by the time the vibration of substrate W, the guiding function of Chuan Songing stably.In addition, liquid cutter 8 also can be provided with near the 4th peristome 4b at least, and needn't be provided with near the 3rd peristome 4a.For example, though when not allowing that washing fluid is transmitting on the passage downstream the 4th peristome 4b side of side and leaking, the tolerable washing fluid also can dispose liquid cutter 8 when upstream the 3rd peristome 4a side of side is leaked near the 3rd peristome 4a.
Again, the gas medium in the 1st accepting container 3 utilizes the 1st exhaust apparatus V1 through exhaust passage VL1 exhaust.Gas medium in the 2nd accepting container 4 utilizes the 2nd exhaust apparatus V2 through exhaust passage VL2 exhaust.These exhausts are wished to carry out with the ejection interlock from the washing fluid of top blowoff 5 and bottom blowoff 6.By taking only when washing fluid sprays, to carry out the form of exhaust, can prevent to flow into from the 1st accepting container 3 of gas medium when not cleaning of outside.And can reduce Payload.
From pipe inspection device 7 and liquid cutter 8 to pure water that the 1st accepting container 3 and the 2nd accepting container 4 provide and after becoming spray form once more the pure water of liquefaction discharge to drainpipe DR.
On the 1st accepting container 3 and the 2nd accepting container 4, locate suitably to be provided with cleaning that ejection is used to clean its inner cleaning fluid with nozzle 15 at four jiaos of for example internal tank etc. again.
<substrate cleaning treatment 〉
Below, the substrate cleaning treatment of carrying out on substrate board treatment 1 is described.Pass the substrate W that comes from the front operation, when entering treatment trough 1a, at first utilize the 1st wiper mechanism 53 to scrub.Substrate W enters the 2nd accepting container 4 of the 2nd wiper mechanism 54 then.About the 2nd wiper mechanism 54, with reference to Fig. 5 explanation.Fig. 5 is the ideograph of the internal state of the 1st accepting container 3 in the substrate cleaning treatment and the 2nd accepting container 4.
On the 1st accepting container 3, from top blowoff 5 and bottom blowoff 6 respectively to the washing fluid 11 of the high pressure of the substrate W ejection spray form that passes through and the jet 12 of pure water.The surface and even the inside that make the particulate that constitutes the pure water in washing fluid 11 and the jet 12 collide substrate W are at a high speed removed attached to the particle on the substrate W etc. like this.Utilize the particle that this collision removes or the mist of pure water etc. to be distributed in the gas medium in the 1st accepting container 3, and in order to prevent it once more attached on the substrate W, the gas mediums in the 1st accepting container 3 utilize the 1st exhaust apparatus V1 to discharge through exhaust passage VL1.
But, because washing fluid 11 and jet 12 spray to substrate W with high pressure, high speed, so, though carry out from the exhaust of exhaust apparatus V1, but they are with after substrate W contacts, face horizontal direction along this substrate W is advanced, and major part is not gone out from exhaust passage VL1, but discharge outside the 1st accepting container 3 in substrate W and the gap between the peristome on the 1st peristome 3a and the 2nd peristome 3b.When flowing out thereupon, particle of removing and mist etc. still are attached to unfavorable conditions such as substrate W goes up or be attached in the substrate board treatment 1 such as treatment trough 1a inner face again.
Therefore, the substrate board treatment 1 of this form of implementation from 7 pairs of this gap ejections of pipe inspection device pure water, realizes utilizing this pure water to be full of the state in this gap, the i.e. state of closing gap.Below, the water that produces this state is called water seal 13.Because on the 1st peristome 3a and the 2nd peristome 3b, the shape of its end 3ae and 3be all forms the plane of pulling the W almost parallel with base, is smooth, so water seal 13 realizes easily.Water seal 13 though be not complete seal clearance, to washing fluid 11 and 12, reduces its flow velocity because become sufficient resistance, so can significantly suppress the washing fluid 11 outside the 1st accepting container 3 and the amount and the speed of jet 12.In addition, not having under the state of substrate, also is by from pipe inspection device 7 ejection pure water, suppresses washing fluid 11 and jet 12 to a certain extent and flows out to the outside of the 1st accepting container 3.
Again, the 2nd accepting container 4 inside remain and utilize the 2nd exhaust apparatus V2 through exhaust passage VL2 exhaust.So, can utilize the abundant exhaust of the 2nd exhaust apparatus V2 from the eluting gas medium 14 of the 1st accepting container 3 because utilize water seal 13 significantly to weaken the flow velocity of washing fluid 11 and 12.Design greatlyyer by exhaust velocity, make its effect more abundant than the 1st exhaust apparatus V1 with the 2nd exhaust apparatus V2.Like this, it is first-class to prevent that particle and mist etc. from adhering again to substrate W.In addition, on the 2nd accepting container 4, has liquid cutter 8, by its ejection pure water, gap when substrate W passes through between water seal this substrate W and the 3rd peristome 4a and the 4th peristome 4b, and tentiform stream at obstructed out-of-date sealing the 3rd peristome 4a of substrate W and the 4th peristome 4b ground formation pure water, play the effect of gate, the discrepancy of the gas medium inside and outside suppressing can more effectively reduce the outflow outside the 2nd accepting container 4 of washing fluid 11 and jet 12.
In addition, on substrate W,,,, flow to the 1st accepting container 3 and the 2nd accepting container 4 bottoms easily, discharge through channel B L so pure water is not trapped on the substrate W because such as described above substrate W transmits with heeling condition though the result provides a large amount of pure water.That is, make the surface of substrate W in the short period of time by the pure water displacement that newly provides.
More than, as described, on the substrate board treatment 1 of this form of implementation, accepting container has double-layer structural on the 2nd wiper mechanism 54, the peristome of the 1st inboard accepting container 3 utilizes water seal 13 sealings and suppresses the washing fluid 11 of high pressure ejection and 12 outflow, the 2nd also exhaust of accepting container 4 in the outside simultaneously can suppress to be cleaned adhering to once more of the particle removed etc. like this.
Like this, when the cleaning that utilizes the 2nd wiper mechanism 54 finished, substrate W utilized 56 jet cleanings of the 3rd wiper mechanism again.Finally send then, deliver to the drying device that carries out following drying process from treatment trough 1a.
In addition, in this form of implementation, spray liquid, can block washing fluid 11 toward the outer side, like this along substrate W by lateral peristome 3a, 3b from the 1st accepting container 3, even but also this peristome of water seal of the state of peristome 3a, 3b broad effectively covers liquid entrainment etc.
<the 2 form of implementation 〉
Fig. 6 is the ideograph of formation of the substrate board treatment 101 of the 2nd form of implementation of the present invention.Substrate board treatment 101, identical with the 2nd wiper mechanism 54 of the 1st form of implementation, be to clean for example part of the base plate cleaning device of substrate W such as semiconductor substrate or flat-panel monitor manufacturing usefulness glass substrate or tellite, because act on identical, so, same symbol when same composed component adopts with the 2nd wiper mechanism 54, below no longer explanation.In addition, in Fig. 6,, only show a part about the feed path of air and pure water for simplicity of illustration.
Substrate board treatment 101, in the 1st accepting container portion 30 that the 2nd accepting container 4 internal configurations are made of a plurality of the 1st accepting containers, different with the substrate board treatment 1 of the 1st form of implementation in this.In Fig. 6, the example when the 1st accepting container portion 30 that is depicted as is made of 2 the 1st accepting containers 31 and 32.
2 the 1st accepting containers 31 and 32 make substrate W by the ground arranged in series of closely interlocking mutually according to this in proper order, on each, and peristome 31a, the 31b, 32a, the 32b that on 2 sides in opposite directions, form, arranged in a straight line.And, top blowoff 5 (51,52), bottom blowoff 6 (61,62) are set respectively.Again, the 2nd exhaust apparatus V2 undertakes 2 the 1st accepting containers 31 and 32 both sides' exhaust simultaneously.And design has the end 31ae and the 32be that become the beak shape with the face of the substrate W almost parallel of transmission respectively on the 2nd peristome 32b of the 1st peristome 31a of the 1st accepting container 31 of the openings at two ends portion that is equivalent to the 1st accepting container portion 30 and the 1st accepting container 32.
And, when the 1st peristome 31a of the substrate receiving terminal that will be positioned at the 1st accepting container portion 30 is defined as " the 1st outermost end peristome ", and the substrate that will be positioned at the 1st accepting container portion 30 is when sending the 2nd peristome 32b of end and being defined as " the 2nd outermost end peristome ", the outside of the 1st accepting container portion 30 and the 1st and the 2nd outermost end peristome 31a, 32b separately near, configuration sprays a plurality of pipe inspection devices 7 of liquid to the gap that is formed by the 1st and the 2nd outermost end peristome 31a, 32b and substrate W.In addition, also definable " the 1st outermost end peristome " and " the 2nd outermost end peristome " in the 1st form of implementation (Fig. 2), at this moment, because the 1st peristome 3a has only 1, so the 1st peristome 3a brings into play the effect of the 1st outermost end peristome, equally, because the 2nd peristome 3b has only 1, so the 2nd peristome 3b brings into play the effect of the 2nd outermost end peristome.
The situation of the substrate board treatment 101 of this form of implementation from the pure water of pipe inspection device 7 ejection, forms water seal 13 on the 2nd peristome 32b of the 1st peristome 31a of the 1st accepting container 31 and the 1st accepting container 32.At this moment, though the peristome between 2 the 1st accepting containers does not form water seal, but pass through both near configuration, can suppress the outflow of gas medium to the outside, so the result is the same with the 1st form of implementation, gas medium is suppressed to the degree that can discharge from the outflow of the 1st accepting container portion 30 integral body on the 2nd accepting container 4.
That is, this form of implementation is provided with a plurality of forms of carrying out the accepting container of cleaning treatment like this, also by form water seal on the peristome of the accepting container at two ends, can carry out the cleaning treatment that particle etc. can not adhere to once more.
<variation 〉
As described above, in the present invention, though be by forming the flow velocity that water seal suppresses the washing fluid of high pressure ejection, the shape of end that is used to form the peristome of water seal is not limited to above-mentioned form.Fig. 7 is the figure of typical variant example of shape that shows the end 3e of the 1st accepting container 3.That is, end 3e, also can be shown in Fig. 7 (a) like that at the structure of the outstanding flat in the outside of the 1st accepting container 3, also can be like that to two side-prominent structures shown in Fig. 7 (b), the also structure that can shown in Fig. 7 (c), tilt more like that.Perhaps also can shown in Fig. 7 (d), utilize the form of thickness of the parts of the container that constitutes accepting container 3 like that.
Again, in above-mentioned form of implementation, because to the washing fluid 11 of high pressure is provided above the substrate W, so hope is arranged on the transfer roller or the backing roll of the following side of supporting substrate as far as possible near this supply unit bit position.In the above-mentioned form of implementation, because for the following side of also cleaning base plate and provide jet 12 to following side, so, front and back in the position, backbone of washing fluid 11 and jet 12 are provided with backing roll 10, but can save to following side in the time of for example needn't cleaning following side liquid is provided, also can backing roll or transfer roller be set in the position of the backbone of corresponding washing fluid 11.In addition, if below substrate, provide washing fluid with high pressure, and with low pressure to washing fluid is provided above the substrate, even the situation of the thin thickness of substrate then, the bending that also can alleviate because the gravity of substrate etc. causes improves the stability that transmits.
Again, though in above-mentioned form of implementation only from the upside exhaust of accepting container, also can be from the downside exhaust, and if from exhaust side exhaust more efficiently up and down.Though the 1st accepting container 3 and the 2nd accepting container 4 are connected on the independent exhaust apparatus, also can design one and can doublely make their two jumbo exhaust apparatus that queue device again.
Again, in above-mentioned form of implementation, though the double container that the 2nd wiper mechanism 54 is the 1st accepting containers 3 to be received in the 2nd accepting container 4 is constructed, but be not limited thereto, also can be as shown in Figure 8, in the outside, as secondary resettlement section as the 1st accepting container 3 of main accepting container, shared have the 1st a peristome 3a the 1st secondary accepting container 41 is set laterally, shared have the 2nd a peristome 3b the 2nd secondary accepting container 42 is set laterally.
In Fig. 8, secondary accepting container 41,42 is distributed in the front and back of transmitting passage and has composed component and the function thereof that the 2nd accepting container 4 in the above-mentioned form of implementation is had.That is, on the 1st secondary accepting container 41, form the 3rd peristome 4a, on secondary accepting container 42, form the 4th peristome 4b, and each secondary accepting container 41,42 edge joint is on the 2nd exhaust apparatus V2.And, in the peristome 3a of the 1st accepting container 3, the outside of 3b, in the promptly secondary accepting container 41 and 42, the pipe inspection device 7 that peristome 3a, 3b is provided liquid is set thereon, and near the 3rd and the 4th peristome, liquid cutter 8 is set.
Adopt such formation also can obtain the effect almost same with above-mentioned form of implementation.But, make from the 1st peristome 3a, 3b and pass the water seal that forms by pipe inspection device 7 and the efficient that can slow down to the washing fluid 11 that the outside of the 1st accepting container 3 is run out of, still peristome 3a side link to each other with peristome 3b side and design easily bigger volume aforesaid double-layer structural a side better.In addition, at this, secondary accepting container needn't be arranged on two sides' the side of peristome 3a, the 3b of the 1st accepting container 3.For example, though the tolerable washing fluid from the 1st accepting container 3 upstream the 1st peristome 3a side of side leak, but when not allowing washing fluid the 2nd peristome 3b side of side being leaked downstream from the 1st accepting container 3, the 2nd secondary accepting container 42 of the 2nd peristome 3b side can be set at least also.
In above-mentioned form of implementation, though the form that is to use pure water to clean is not limited thereto also set treatment fluid, for example imaging liquid, corrosive liquid, stripper etc. from the composition of the washing fluid of top blowoff 5 or 6 ejections of bottom blowoff.Again, the form that provides pure water also to carry out to each blowoff or water jet, liquid cutter from different feedwaies.
Again, discard, be not limited thereto, also can be designed to recycle treatment fluid though the pure water after using in above-mentioned form of implementation is discharged to drainpipe DR.For example in the 1st form of implementation, also can separate on each wiper mechanism 53,54,56 and reclaim pure water, the 3rd wiper mechanism 56 used pure water then be offered the 2nd wiper mechanism 54 use, this pure water then offers the 1st wiper mechanism 53 again and uses.
Also can a plurality of tops blowoff and bottom blowoff be set one the 1st accepting container portion inside again.

Claims (13)

1. substrate board treatment is characterized in that having:
The first accepting container portion, it contains at least one first accepting container that has first peristome and second peristome on relative side;
Second accepting container, it is accommodated the aforementioned first accepting container portion and have the 3rd peristome and the 4th peristome on relative side;
Conveyer, it sends into aforementioned second accepting container with substrate from aforementioned the 3rd peristome, and order is sent into aforesaid base plate and sent from aforementioned second peristome from aforementioned first peristome of aforementioned first accepting container in the aforementioned first accepting container portion, and by from aforementioned the 4th peristome aforesaid base plate being sent outside aforementioned second accepting container after the aforementioned first accepting container portion;
First blowoff, it is configured in the aforementioned first accepting container portion inside, handles fluid to the aforesaid base plate ejection that transmits;
First exhaust apparatus from the aforementioned first accepting container portion exhaust gas inside; With
Second exhaust apparatus from the aforementioned second accepting container exhaust gas inside.
2. substrate board treatment as claimed in claim 1 is characterized in that: the exhaust velocity of aforementioned second exhaust apparatus, and greater than the exhaust velocity of aforementioned first exhaust apparatus.
3. substrate board treatment as claimed in claim 1 or 2, it is characterized in that: when the receiving terminal of the aforesaid base plate that will be positioned at the aforementioned first accepting container portion and the peristome that exists as aforementioned first peristome are defined as the first outermost end peristome, in the time of will being positioned at the sending end and be defined as the second outermost end peristome of aforesaid base plate of the aforementioned first accepting container portion as the peristome that aforementioned second peristome exists, this substrate board treatment also has a plurality of second blowoffs, its be configured in the outside of the aforementioned first accepting container portion and aforementioned first and the aforementioned second outermost end peristome separately near, second gap between first gap between aforementioned first outermost end peristome and the aforesaid base plate and aforementioned second outermost end peristome and aforesaid base plate sprays first liquid.
4. substrate board treatment as claimed in claim 3 is characterized in that: aforementioned first and the aforementioned second outermost end peristome have respectively with by aforementioned first and the relative plane of aforesaid base plate almost parallel of the aforementioned second outermost end peristome.
5. substrate board treatment as claimed in claim 1 or 2, it is characterized in that: in the aforementioned second accepting container inside, also has the 3rd blowoff, its be configured in the aforementioned the 3rd and the 4th peristome at least one near, and form liquid stream at least one the mode that sprays second liquid and seal in the 3rd and the 4th peristome.
6. substrate board treatment as claimed in claim 1 or 2, it is characterized in that: have top blowoff and bottom blowoff as aforementioned first blowoff, above-mentioned top and bottom blowoff are configured in a side of the different surfaces of the aforesaid base plate that transmits in the aforementioned first accepting container portion respectively.
7. as substrate board treatment as described in the claim 6, it is characterized in that: at least one ejection gas of aforementioned top and bottom blowoff and the 3rd mixtures of liquids are as the aforementioned processing fluid.
8. the method for a cleaning base plate, it is method at the inner cleaning base plate of second accepting container, this second accepting container contains the first accepting container portion and have the 3rd peristome and the 4th peristome on relative side, at least one has first peristome and second peristome on relative side first accepting container is contained in this first accepting container portion, aforesaid base plate is sent into aforementioned second accepting container from aforementioned the 3rd peristome, order is sent into aforesaid base plate and send from aforementioned second peristome from aforementioned first peristome of aforementioned first accepting container in the aforementioned first accepting container portion, aforesaid base plate is sent outside aforementioned second accepting container from aforementioned the 4th peristome by after the aforementioned first accepting container portion, inside in the aforementioned first accepting container portion, handle fluid to the aforesaid base plate ejection that transmits, simultaneously from the exhaust gas inside of the aforementioned first accepting container portion, and from the exhaust gas inside of aforementioned second accepting container.
9. substrate-cleaning method as claimed in claim 8, it is characterized in that: when the receiving terminal of the aforesaid base plate that will be positioned at the aforementioned first accepting container portion and the peristome that exists as aforementioned first peristome are defined as the first outermost end peristome, in the time of will being positioned at the sending end and be defined as the second outermost end peristome of aforesaid base plate of the aforementioned first accepting container portion as the peristome that aforementioned second peristome exists, also have to by aforementioned first and the gap that forms of the aforesaid base plate of aforementioned second outermost end peristome and transmission spray the ejection operation of first liquid, utilize aforementioned ejection operation, align by aforementioned first and the aforesaid base plate of the aforementioned second outermost end peristome and aforementioned first and the end edge portion of the aforementioned second outermost end peristome between the gap carry out water seal.
10. substrate-cleaning method as claimed in claim 8 or 9, it is characterized in that: in the aforementioned second accepting container inside, near in the aforementioned the 3rd and the 4th peristome at least one, spray second liquid and form liquid stream, utilize in aforementioned liquids stream sealing the 3rd peristome and the 4th peristome at least one.
11. substrate-cleaning method as claimed in claim 8 or 9 is characterized in that: aforementioned transmission operation makes aforesaid base plate transmit aforesaid base plate towards the direction that tilts with respect to horizontal direction.
12. a substrate board treatment is characterized in that having:
First accepting container with peristome that substrate passes through;
Have the peristome that aforesaid base plate passes through, and accommodate second accepting container of aforementioned first accepting container;
Conveyer, it is outside by the aforementioned peristome of aforementioned second accepting container and the aforementioned peristome of aforementioned first accepting container from aforementioned second accepting container with aforesaid base plate, and delivers to outside aforementioned second accepting container through the inside of aforementioned first accepting container in aforementioned second accepting container again;
In aforementioned first accepting container, provide the feedway of handling fluid to aforesaid base plate;
First exhaust apparatus from the exhaust gas inside of aforementioned first accepting container;
Second exhaust apparatus from the exhaust gas inside of aforementioned second accepting container.
13. a substrate board treatment is characterized in that having:
Have first peristome that substrate passes through and the main accepting container of second peristome;
Be arranged to shared any one at least one secondary accepting container that has the side of aforementioned first peristome or second peristome and have the peristome that aforesaid base plate passes through;
By the aforementioned peristome of aforementioned auxiliary accepting container and aforementioned first peristome and second peristome of aforementioned main accepting container, pass aforementioned auxiliary accepting container and main accepting container and transmit the conveyer of aforesaid base plate;
In aforementioned main accepting container, provide the feedway of handling fluid to aforesaid base plate; First exhaust apparatus from aforementioned main accepting container exhaust gas inside;
Second exhaust apparatus from aforementioned auxiliary accepting container exhaust gas inside.
CNB031480985A 2002-06-28 2003-06-27 Substrate treating apparatus and substrate cleaning method Expired - Lifetime CN1240488C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002189546A JP4091357B2 (en) 2002-06-28 2002-06-28 Substrate processing apparatus and substrate cleaning method
JP189546/2002 2002-06-28
JP189546/02 2002-06-28

Publications (2)

Publication Number Publication Date
CN1470337A CN1470337A (en) 2004-01-28
CN1240488C true CN1240488C (en) 2006-02-08

Family

ID=30437045

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB031480985A Expired - Lifetime CN1240488C (en) 2002-06-28 2003-06-27 Substrate treating apparatus and substrate cleaning method

Country Status (4)

Country Link
JP (1) JP4091357B2 (en)
KR (1) KR100563870B1 (en)
CN (1) CN1240488C (en)
TW (1) TWI228058B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI453848B (en) * 2006-07-24 2014-09-21 Shibaura Mechatronics Corp Apparatus for treating substrates

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2005084831A1 (en) * 2004-03-08 2007-11-29 特定非営利活動法人病院地域医療推進協議会 Method for removing alkali-soluble photosensitive resin
KR101177561B1 (en) * 2004-12-06 2012-08-28 주식회사 케이씨텍 Shaft in apparatus for transferring substrate
KR100740827B1 (en) * 2004-12-31 2007-07-19 주식회사 케이씨텍 Injecting nozzle and cleaning station using the same
JP4823955B2 (en) * 2007-03-30 2011-11-24 能美防災株式会社 High expansion foam fire extinguishing equipment and foaming method thereof
KR100757497B1 (en) 2006-12-14 2007-09-13 주식회사 케이씨텍 Exhaust device of bath
JP5454834B2 (en) * 2007-08-30 2014-03-26 日立化成株式会社 Roughening device
KR100854981B1 (en) * 2007-10-10 2008-08-28 홍경표 Wet processing treatment apparatus for manufacturing printed circuit board
US7964040B2 (en) * 2007-11-08 2011-06-21 Applied Materials, Inc. Multi-port pumping system for substrate processing chambers
KR101341013B1 (en) * 2008-09-04 2013-12-13 엘지디스플레이 주식회사 Washing device
JP5077173B2 (en) * 2008-09-27 2012-11-21 株式会社Gsユアサ UV irradiation treatment equipment
JP4644303B2 (en) * 2009-05-14 2011-03-02 米沢ダイヤエレクトロニクス株式会社 Substrate material surface treatment equipment
JP2011129758A (en) * 2009-12-18 2011-06-30 Dainippon Screen Mfg Co Ltd Substrate processing device
KR101703213B1 (en) * 2011-05-11 2017-02-23 주식회사 엘지화학 Rinsing apparatus for cleaning system of float glass
KR101703212B1 (en) * 2011-06-20 2017-02-23 주식회사 엘지화학 Washing apparatus for cleaning system of float glass
JP2013026490A (en) * 2011-07-22 2013-02-04 Tokyo Electron Ltd Substrate processor
CN103157614B (en) * 2011-12-14 2016-03-30 深南电路有限公司 Wash net machine
KR101405668B1 (en) * 2011-12-22 2014-06-10 다이니폰 스크린 세이조우 가부시키가이샤 Application apparatus
JP5787182B2 (en) * 2012-09-05 2015-09-30 株式会社デンソー Cleaning method and cleaning apparatus used therefor
KR20150057379A (en) * 2013-11-19 2015-05-28 삼성디스플레이 주식회사 Apparatus of cleaning substrate
CN103752571B (en) * 2013-12-27 2017-08-08 深圳市华星光电技术有限公司 Base plate cleaning device
KR101590863B1 (en) * 2014-03-03 2016-02-18 주식회사 한길이에스티 Cleaner for printed circuit board
KR101583750B1 (en) * 2014-05-26 2016-01-19 세메스 주식회사 Apparatus and method for processing substrate
CN104741333B (en) * 2015-04-07 2017-04-05 合肥鑫晟光电科技有限公司 A kind of air flow controller and its control method, substrate cleaning apparatus
CN110575987A (en) * 2018-06-07 2019-12-17 佳宸科技有限公司 Low water spray flushing device
CN109047074B (en) * 2018-08-26 2021-02-26 东莞市金盘模具配件有限公司 Surface cleaning device for machining precision die
CN109772794B (en) * 2019-02-20 2020-12-04 深圳市华星光电技术有限公司 Substrate cleaning machine

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI453848B (en) * 2006-07-24 2014-09-21 Shibaura Mechatronics Corp Apparatus for treating substrates

Also Published As

Publication number Publication date
KR100563870B1 (en) 2006-03-23
KR20040010113A (en) 2004-01-31
CN1470337A (en) 2004-01-28
JP2004025144A (en) 2004-01-29
JP4091357B2 (en) 2008-05-28
TW200407201A (en) 2004-05-16
TWI228058B (en) 2005-02-21

Similar Documents

Publication Publication Date Title
CN1240488C (en) Substrate treating apparatus and substrate cleaning method
CN1250346C (en) Substrate processing device and rinsing apparatus
CN101331584B (en) Device and method for treating the surfaces of substrates
CN1796008A (en) Substrate treatment equipment and treatment method thereof
JP2006114884A (en) Substrate cleaning processing apparatus and substrate processing unit
CN1894780A (en) Method of removing deposit from substrate and method of drying substrate, and device for removing deposit from substrate and device of drying substrate using these methods
CN1684231A (en) Proximity meniscus manifold
CN1590251A (en) Inline transfer system and method
CN1908819A (en) Developing treatment apparatus and developing treatment method
KR20090020171A (en) Two-fluid jet nozzle for cleaning substrate
CN105799330A (en) Multi-nozzle cleaning device of spray printing machine and cleaning method
CN1748879A (en) Method and device for treating base bored
CN1836799A (en) Substrate disposal device
CN1716531A (en) Substrate processor
CN1721091A (en) Cleaning method and cleaning device for the method
CN1879199A (en) Substrate treatment device and substrate treatment method
CN1030043C (en) Continuous ultrasonic cleaning apparatus
EP3840024B1 (en) Module for chemically processing a substrate
CN1721092A (en) Suction unit assembly used for panel treatment system
JP2007059416A (en) Substrate treatment device
JP2007059417A (en) Substrate treatment device
CN1907582A (en) Treating liquid feed device
JP2007201186A (en) Substrate cleaning device and substrate cleaning method
JPH1174195A (en) Liquid treatment device
JP2006093591A (en) Processor of substrate

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20060208