JP2004025144A - Substrate treatment apparatus and substrate washing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a treatment apparatus for wet-treating a semiconductor wafer, a glass substrate for producing a flat panel display such as a liquid crystal display and a plasma display, and a sheet-like substrate such as a printed circuit board and a substrate washing apparatus by high-pressure fluid discharge which prevents the re-adhesion of particles etc. <P>SOLUTION: A washing container has a double box structure of a first container 3 for washing by discharging washing fluids 11 and 12 at a high pressure and a second container 4 on the outside of the first container 3. In the opening parts 3a and 3b of the first container 3 hitting the conveyance route of the substrate W, pure water is discharged by a pipe shower 7 toward a gap formed between it and the substrate W to form a water seal 13 in the gap to control the leakage of the washing fluids 11 and 12. Since the atmosphere of the washing fluids 11 and 12, even when leaked from the first container 3, is discharged in the second container, particles etc., contained in the atmosphere are prevented from adhering again to the substrate etc. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a processing apparatus for wet-processing a semiconductor wafer, a glass substrate for manufacturing a flat panel display such as a liquid crystal display and a plasma display, and a plate-like substrate such as a printed circuit board.
[0002]
[Prior art]
BACKGROUND ART In a processing apparatus for cleaning a plate-like substrate such as a semiconductor wafer, a glass substrate for manufacturing a flat panel display, and a printed circuit board by a wet process, for example, Japanese Patent Application Laid-Open No. 8-294679 discloses a method for improving the substrate cleanliness. As described above, a technique has been proposed in which a high-pressure fluid is discharged from a nozzle to a substrate.
[0003]
[Problems to be solved by the invention]
However, when a high-pressure fluid is discharged to the substrate, the mist that is scattered diffuses throughout the processing tank and reattaches to the processing substrate, causing a problem that the substrate is contaminated.
[0004]
In such a case, it is conceivable to cover the corresponding nozzle or the portion to be cleaned of the substrate in the processing tank with a box having a narrow opening for the substrate to enter and exit, thereby preventing the mist from scattering outside the box. However, this method has the following problems.
[0005]
・ Since the cleaning liquid tends to stay on the substrate inside the box, the particles removed by cleaning are likely to adhere to the substrate again.
[0006]
-If the pressure is too high, mist will leak from the opening.
[0007]
-If the substrate opening is made extremely narrow, a large substrate or a thin substrate comes into contact with the substrate due to bending or vibration during transportation.
[0008]
It is also conceivable to provide a nozzle for discharging a liquid in a curtain shape in the opening against the mist leakage from the opening as described above, and shield the opening with a so-called liquid curtain. However, there are the following problems.
[0009]
-Reattachment is likely to occur because the mist atmosphere stays inside the box.
[0010]
-If the pressure is too high, mist will leak from the opening.
[0011]
The present invention has been made in view of the above problems, and has as its object to provide a substrate processing apparatus in which mist and particles do not adhere to a substrate again.
[0012]
[Means for Solving the Problems]
In order to solve the above problem, the invention according to claim 1 includes a first storage container portion having at least one first storage container having a first opening and a second opening on side surfaces facing each other, and the first storage container. A second storage container that stores the container portion and has a third opening and a fourth opening on opposing side surfaces; and a substrate that is carried into the second storage container from the third opening, and the first storage container. In the part, the substrate is sequentially loaded from the first opening of the first storage container, unloaded from the second opening, and after passing through the first storage container part, the substrate is transferred from the fourth opening to the second storage part. (2) transport means for unloading the substrate out of the storage container, first discharge means disposed inside the first storage container portion for discharging a processing fluid toward the transported substrate, and the first storage A first exhaust unit that exhausts the inside of the container, and an inside of the second storage container. Characterized in that it comprises a second exhaust means for the gas, a.
[0013]
According to a second aspect of the present invention, in the substrate processing apparatus according to the first aspect, an exhaust speed by the second exhaust unit is higher than an exhaust speed by the first exhaust unit.
[0014]
According to a third aspect of the present invention, there is provided the substrate processing apparatus according to the first or second aspect, wherein an opening existing as the first opening at a receiving end of the substrate in the first storage container section. Defining a first outermost opening, and defining a second outermost opening by an opening existing as the second opening at the sending-out end of the substrate in the first container, the first container; A gap between the first end opening and the substrate and a gap between the second end opening and the substrate disposed outside the portion and near each of the first and second end openings. And a plurality of second ejection means for ejecting the liquid toward.
[0015]
According to a fourth aspect of the present invention, in the substrate processing apparatus according to the third aspect, the first and second endmost openings pass through the first and second endmost openings, respectively. The semiconductor device has a surface facing substantially parallel to the substrate.
[0016]
According to a fifth aspect of the present invention, in the substrate processing apparatus according to any one of the first to fourth aspects, at least one of the third and fourth openings is provided inside the second storage container. The liquid ejection apparatus further includes a third discharge unit that is disposed near one and discharges the liquid to form a liquid flow so as to close at least one of the third and fourth openings.
[0017]
According to a sixth aspect of the present invention, there is provided the substrate processing apparatus according to any one of the first to fifth aspects, further comprising an upper discharging means and a lower discharging means as the first discharging means, wherein the upper and lower discharging means are provided. The discharge means is arranged on each of different surfaces of the substrate conveyed to the first storage container portion.
[0018]
The invention according to claim 7 is the substrate processing apparatus according to claim 6, wherein at least one of the upper and lower discharge means discharges a mixture of gas and liquid as the processing fluid. I do.
[0019]
Further, the invention according to claim 8 is characterized in that a main storage container having a first opening and a second opening on side surfaces facing each other, and a substrate is loaded into the main storage container through the first opening and the second storage container. Transfer means for unloading from the opening, first discharge means disposed inside the main storage container for discharging the processing fluid toward the transferred substrate, and first exhaust for discharging the inside of the main storage container Means, disposed outside the main container and near each of the first and second openings, toward a gap formed by the first and second openings and the substrate being conveyed. And a plurality of second ejection means for ejecting liquid.
[0020]
According to a ninth aspect of the present invention, in the substrate processing apparatus according to the eighth aspect, the first and second openings are substantially the same as the substrate passing through the first and second openings, respectively. It is characterized by having parallel surfaces.
[0021]
According to a tenth aspect of the present invention, there is provided the substrate processing apparatus according to the eighth or ninth aspect, wherein the first and second discharging units include an upper discharging unit and a lower discharging unit. The substrates are transported to the main container, and are arranged on different sides of the substrate.
[0022]
An eleventh aspect of the present invention is the substrate processing apparatus according to the tenth aspect, wherein at least one of the upper and lower discharge means discharges a mixture of gas and liquid as the processing fluid. I do.
[0023]
According to a twelfth aspect of the present invention, in the substrate processing apparatus according to any one of the eighth to eleventh aspects, the sub-accommodating portion sharing a side surface having the first and second openings, and A second exhaust unit that exhausts the inside of the storage unit, wherein the second discharge unit is disposed in the sub-storage unit, and the sub-storage unit has a third opening and a fourth opening through which the substrate passes. The transfer means has an opening on a side surface facing the opening, and the transfer means carries the substrate into the main storage container through the third opening from outside the sub-storage, and then transfers the substrate from the main storage container to the fourth storage. It is characterized in that it is carried out through the opening to the outside of the sub-housing unit.
[0024]
According to a thirteenth aspect of the present invention, in the substrate processing apparatus according to any one of the first to twelfth aspects, the transporting unit is arranged so that the transporting unit faces the substrate in a direction inclined with respect to a horizontal direction. The method is characterized by transporting a substrate.
[0025]
According to a fourteenth aspect of the present invention, there is provided a first storage container having at least one first storage container having a first opening and a second opening on side surfaces opposed to each other, and a third opening and a fourth storage. A method of cleaning a substrate inside a second storage container having an opening on a side surface facing the opening, wherein the substrate is loaded into the second storage container from the third opening, and the first storage container portion is washed. In the above, the substrate is sequentially loaded from the first opening of the first storage container, unloaded from the second opening, and after passing through the first storage container, the second substrate is transferred from the fourth opening to the second storage container. Unloading the substrate out of the container, discharging the processing fluid toward the transported substrate inside the first container, and evacuating the inside of the first container, The inside of the second container is evacuated.
[0026]
According to a fifteenth aspect of the present invention, in the substrate cleaning method according to the fourteenth aspect, an opening existing as the first opening at a receiving end of the substrate in the first storage container portion has a first extreme end. When an opening is defined and a second endmost opening is defined by an opening existing as the second opening at the sending-out end of the substrate in the first storage container portion, the first and second endmost ends are defined. A discharge step of discharging a liquid toward a gap formed by the opening and the substrate to be conveyed, wherein in the discharge step, the substrate passing through the first and second endmost openings and The gap between the first and second outermost openings and the edge is sealed with water.
[0027]
According to a sixteenth aspect of the present invention, there is provided the substrate cleaning method according to the fourteenth or fifteenth aspect, wherein at least one of the third and fourth openings is provided inside the second container. Wherein the liquid is discharged and at least one of the third opening and the fourth opening is closed by the liquid flow.
[0028]
According to a seventeenth aspect of the present invention, in the substrate cleaning method according to any one of the fourteenth to sixteenth aspects, the transporting step is performed with respect to the substrate in a direction inclined with respect to a horizontal direction. The method is characterized by transporting a substrate.
[0029]
The invention according to claim 18 is characterized in that a first storage container having an opening through which the substrate passes, a second storage container having an opening through which the substrate passes and storing the first storage container, Through the opening of the second storage container and the opening of the first storage container, the substrate is transferred from the outside of the second storage container through the first storage container in the second storage container to the second storage container again. A transport unit configured to transport the processing fluid to the outside of the storage container, a supply unit configured to supply the processing fluid to the substrate in the first storage container, a first exhaust unit configured to exhaust the inside of the first storage container, and the second exhaust unit. And second exhaust means for exhausting the inside of the storage container.
[0030]
Also, the invention according to claim 19 is a storage container having an opening through which the substrate passes, and the substrate is transferred from outside the storage container to the outside of the storage container again via the opening of the storage container through the inside of the storage container. Transport means for transporting the processing fluid to the substrate in the storage container, and a second supply means for supplying a liquid toward the gap between the opening of the first storage container and the substrate. It is characterized by comprising a supply means and an exhaust means for exhausting the inside of the storage container.
[0031]
According to a twentieth aspect of the present invention, one of the main container having the first opening and the second opening through which the substrate passes and one of the side surfaces having the first opening and the second opening are shared. At least one sub-container provided with an opening through which the substrate passes, and the sub-container via the opening of the sub-container and the first and second openings of the main container. Transport means for transporting the substrate so as to pass through the storage container and the main storage container; supply means for supplying a processing fluid to the substrate in the main storage container; and first means for exhausting the inside of the main storage container. An exhaust unit and a second exhaust unit that exhausts the inside of the sub-container are provided.
[0032]
BEST MODE FOR CARRYING OUT THE INVENTION
<First embodiment>
<Apparatus configuration>
FIG. 1 is a side sectional view schematically showing a configuration of a substrate processing apparatus 1 according to a first embodiment of the present invention. The substrate processing apparatus 1 transports a substrate W such as a semiconductor substrate, a rectangular glass substrate for manufacturing a flat panel, or a printed wiring board by a transport roller 2 driven by a drive source (not shown) in the processing tank 1a. This is a substrate cleaning apparatus that performs a cleaning process to clean the substrate W.
[0033]
In the processing tank 1a of the substrate processing apparatus 1, a first cleaning mechanism 53 including a nozzle 51 for discharging pure water and a roll brush 52, and a second cleaning mechanism 54 to be described later are arranged in this order from the upstream side in the transport direction of the substrate. And a third cleaning mechanism 56 having a nozzle 55 for supplying pure water in a spray form. FIG. 2 is a schematic side sectional view showing the second cleaning mechanism 54. The second cleaning mechanism 54 has a double box structure in which the first storage container 3 that performs the cleaning process inside is further stored in the second storage container 4. The first opening 3a and the second opening 3b are provided on the two sides facing each other in the former, and the third opening 4a and the second opening 3a are provided on the two sides facing each other in the former. The four openings 4b are provided at the same height and on a straight line. The substrate W is transported by the transport roller 2 in the horizontal direction indicated by the arrow AR1 so as to sequentially pass through these openings. FIG. 2 shows three-dimensional coordinates in which the transport direction of the substrate W indicated by the arrow AR1 is the positive x-axis direction, the direction perpendicular to the x-axis direction in the horizontal plane is the y-axis direction, and the direction perpendicular to the xy plane is the z-axis direction. Is attached. The ends 3ae, 3be, 4ae, and 4be of the first opening 3a, the second opening 3b, the third opening 4a, and the fourth opening 4b respectively correspond to the first and second storage containers 3,4. Is formed in a beak shape protruding inward, and a plane substantially parallel to the transferred substrate W is formed on a surface on a substrate passing side thereof.
[0034]
A pressing roller 9 driven by a driving source (not shown) is provided at a position facing the transport roller 2 with a region through which the substrate W passes therebetween. The pressing roller 9 plays a role of assisting the transfer of the substrate W by pressing the substrate W that vibrates with the transfer and cleaning from above. Further, the first storage container 3 includes a support roller 10 which does not have a driving source but functions as a guide for further stabilizing the transfer of the substrate W. As a result, the substrate W is conveyed while suppressing displacement caused by vibration caused by collision of a high-pressure mist-like fluid described later.
[0035]
Further, the first container 3 is provided with an upper discharge means 5 above the position where the substrate W passes, and a lower discharge means 6 below the position where the substrate W passes. The former is provided mainly for cleaning the front surface of the substrate W, and the latter is provided for cleaning the rear surface.
[0036]
The upper discharge means 5 is a so-called two-fluid nozzle that mixes air and pure water at a volume ratio of, for example, about 100: 1, and discharges the mist-like mixed fluid to the surface of the substrate W as indicated by an arrow AR2. . Here, air is supplied from the air supply source AS via the air supply path AL while being adjusted by the air valve AV. Pure water is taken from a pure water supply source WS by a pump P1, and supplied through a pure water supply path WL1 while the flow rate is adjusted by a valve V1.
[0037]
The lower discharge means 6 is for discharging the pure water similarly supplied from the pure water supply source WS via the pure water supply path WL4 to the back surface of the substrate W as a spray as indicated by an arrow AR3. .
[0038]
A known spraying technique can be used for the upper discharging means 5 and the lower discharging means 6. In addition, the lower discharge means 6 may be configured to discharge a mixed fluid with air. In addition, contrary to the above, a mode in which the lower discharging means 6 discharges the mixed fluid and the upper discharging means 5 discharges pure water may be adopted.
[0039]
Although not explicitly shown in FIG. 2 for convenience of illustration, in the substrate processing apparatus 1 according to the present embodiment, the substrate W is inclined by a predetermined angle θ from the y-axis direction, and The substrate W is transported in a state where the substrate W is tilted to the left. FIG. 3 is a diagram for explaining the inclined conveyance of the substrate W. As shown in FIG. 3, the openings including the first opening 3a are also formed in accordance with the inclination of the substrate. The transport roller 2 is provided with two rollers 2a and 2b which are in direct contact with the substrate, while the roller 2b provided on the inclined side is provided with a flange portion 2c for preventing the substrate from sliding down. Similarly, the pressing roller 9 and the supporting roller 10 are provided with two rollers 9a and 9b and 10a and 10b which are in direct contact with the substrate.
[0040]
Further, outside the first storage container 3, near the first opening 3a and the second opening 3b, pipe showers 7 are provided vertically at respective locations with the substrate interposed therebetween. Further, inside the second storage container 4, near the third opening 4a and the fourth opening 4b, liquid knives 8 are provided vertically at respective locations with the substrate interposed therebetween. FIG. 4 is a perspective view schematically showing a part of the pipe shower 7 and the liquid knife 8 for describing the same.
[0041]
The pipe shower 7 is arranged in the yz plane and in a direction along the inclination of the substrate W, as shown in FIG. In the pipe shower 7, pure water is supplied from a pure water supply source WS via a pure water supply path WL2 (the supply path WL2 is only partially shown in FIG. 2). 7a, the gap between the first opening 3a and the substrate W passing through the opening, and the gap between the second opening 3b and the substrate W passing through the opening, as indicated by an arrow AR4 in FIG. Discharged toward the gap.
[0042]
On the other hand, the liquid knife 8 is arranged in the yz plane and in a direction along the inclination of the substrate W, as shown in FIG. In the liquid knife 8, pure water supplied from a pure water supply source WS via a pure water supply path WL3 (the supply path WL3 is only partially shown in FIG. 2) is supplied to a plurality of discharge ports provided at predetermined intervals. From 8a, as shown by an arrow AR5 in FIG. 2, the liquid is discharged in a direction orthogonal to the substrate W so as to form a so-called liquid curtain. In addition, since the liquid knife 8 discharges pure water so as to sandwich the substrate W from above and below, the liquid knife 8 also serves as a lead for suppressing vibration of the substrate W when an end of the substrate W passes and for smoothly transporting the substrate W. Play. Note that the liquid knife 8 does not necessarily have to be provided near the third opening 4a as long as it is provided at least near the fourth opening 4b. For example, in a case where leakage of the cleaning fluid toward the fourth opening 3b on the downstream side in the transport path is not allowed, leakage of the cleaning fluid toward the third opening 4a on the upstream side is acceptable. The liquid knife 8 does not necessarily have to be provided near the third opening 4a.
[0043]
The atmosphere in the first container 3 is exhausted by the first exhaust means V1 via the exhaust path VL1. The atmosphere in the second container 4 is exhausted by the second exhaust means V2 via the exhaust path VL2. It is desirable that these exhausts be performed in conjunction with the discharge of the cleaning fluid from the upper discharge unit 5 and the lower discharge unit 6. By adopting a mode in which the exhaust is performed only when the cleaning fluid is discharged, it is possible to prevent the outside atmosphere from flowing into the first storage container 3 when the cleaning is not being performed. It also leads to a reduction in the utility load.
[0044]
The pure water supplied from the pipe shower 7 and the liquid knife 8 into the first storage container 3 and the second storage container 4 and the pure water which has been mist-formed and liquefied again are discharged to the drain DR.
[0045]
In addition, the first storage container 3 and the second storage container 4 are provided with cleaning nozzles 15 for discharging a cleaning liquid for cleaning the inside of the first storage container 3 and the second storage container 4, for example, at four corners inside the containers.
[0046]
<Substrate cleaning process>
Next, a substrate cleaning process performed in the substrate processing apparatus 1 will be described. When the substrate W transferred from the previous process enters the processing tank 1a, the substrate W is first brush-cleaned by the first cleaning mechanism 53. Next, the substrate W enters the second container 4 of the second cleaning mechanism 54. The second cleaning mechanism 54 will be described with reference to FIG. FIG. 5 is a diagram schematically illustrating the inside of the first storage container 3 and the second storage container 4 during the substrate cleaning process.
[0047]
In the first storage container 3, a mist-like high-pressure cleaning fluid 11 and a pure water spray 12 are discharged from the upper discharge means 5 and the lower discharge means 6 toward the substrate W passing therethrough. Particles or the like adhering to the substrate W can be removed by colliding the cleaning fluid 11 and the fine particles of pure water constituting the spray 12 with the front surface or the back surface of the substrate W at high speed. Particles, mist of pure water, and the like removed by the collision are scattered in the atmosphere in the first storage container 3. However, in order to prevent the particles from re-adhering to the substrate W, the first storage The atmosphere in the container 3 is exhausted by the first exhaust means V1 through the exhaust path VL1.
[0048]
However, since the cleaning fluid 11 and the spray 12 are jetted toward the substrate W at a high pressure and at a high speed, even after the exhaust from the exhaust unit V1 is performed, they are hit after the substrate W is hit. It travels in the horizontal direction along the surface of the substrate W, most of which is not from the exhaust path VL1, but from the gap between the substrate W and the opening in the first opening 3a and the second opening 3b. Try to get out. If the removed particles, mist, and the like flow out along with this, inconveniences such as re-adhesion to the substrate W or adhesion to the substrate processing apparatus 1 such as the inner surface of the processing tank 1a may occur.
[0049]
Therefore, the substrate processing apparatus 1 according to the present embodiment realizes a state in which pure water is discharged from the pipe shower 7 into the gap and the gap is filled with pure water, that is, the gap is sealed. Hereinafter, the pure water causing this state is referred to as a water seal 13. The ends 3ae and 3be of both the first opening 3a and the second opening 3b have flat surfaces substantially parallel to the substrate W, so that the water seal 13 can be easily realized. Although the water seal 13 does not completely seal the gap, it has sufficient resistance for the cleaning fluids 11 and 12 to reduce the flow rate thereof. And the amount and speed of the spray 12 can be significantly reduced. In addition, even when the substrate is not present, by discharging the pure water from the pipe shower 7, the outflow of the cleaning fluid 11 and the spray 12 to the outside of the first container 3 is suppressed to some extent.
[0050]
Further, the inside of the second storage container 4 is also exhausted by the second exhaust means V2 via the exhaust path VL2. Since the flow rates of the cleaning fluids 11 and 12 are significantly reduced by the water seal 13, the atmosphere 14 flowing out of the first container 3 can be sufficiently exhausted by the second exhaust means V2. By making the exhaust speed by the second exhaust unit V2 higher than the exhaust speed by the first exhaust unit V1, the effect becomes more sufficient. This can prevent particles and mist from re-adhering to the substrate W. The second storage container 4 is provided with a liquid knife 8, which discharges pure water so that a gap between the substrate W and the third opening 4a or the fourth opening 4b is formed when the substrate W passes. Water sealing is performed, and when the substrate W does not pass, a curtain-like flow of pure water is formed so as to close the third opening 4a and the fourth opening 4b so as to function as a shutter, and to allow the inside and outside atmosphere to enter and exit. As a result, the outflow of the cleaning fluid 11 and the spray 12 out of the second storage container 4 can be further effectively reduced.
[0051]
Note that a large amount of pure water is supplied on the substrate W as a result, but since the substrate W is transported in the inclined posture as described above, the pure water does not stay on the substrate W, It easily flows down to the bottom of the first storage container 3 and the second storage container 4 and is discharged through the route BL. That is, the surface of the substrate W is replaced with the newly supplied pure water in a relatively short time.
[0052]
As described above, in the substrate processing apparatus 1 according to the present embodiment, the storage container in the second cleaning mechanism 54 has a double box structure, and the opening of the inner first storage container 3 is closed. In addition to suppressing the outflow of the cleaning fluids 11 and 12 that have been sealed and sealed by the water seal 13 and discharged at a high pressure, the outside second storage container 4 is also evacuated to prevent the particles and the like removed by the cleaning from re-adhering. Can be suppressed.
[0053]
When the cleaning by the second cleaning mechanism 54 is completed in this way, the substrate W is then spray-cleaned by the third cleaning mechanism 56. Finally, it is carried out of the processing tank 1a and transported to a drying device for performing the next drying step.
[0054]
In the present embodiment, by discharging the liquid from the outside of the first storage container 3 toward the openings 3a and 3b, the cleaning fluid 11 that travels on the substrate W and moves outward can be dammed. Even when the openings 3a and 3b are relatively wide, the openings can be water-sealed, which is effective for shielding liquid mist and the like.
[0055]
<Second embodiment>
FIG. 6 is a diagram schematically illustrating a configuration of a cleaning mechanism 101 according to the second embodiment of the present invention. The cleaning mechanism 101 is, similarly to the second cleaning mechanism 54 according to the first embodiment, an example of a substrate cleaning apparatus for cleaning a substrate W such as a semiconductor substrate, a glass substrate for manufacturing a flat panel display, or a printed wiring board. Since the same components are used in the same manner, the same components are denoted by the same reference numerals as in the case of the second cleaning mechanism 54, and description thereof will be omitted below. In FIG. 6, only a part of the supply path of air and pure water is shown for simplification of illustration.
[0056]
The substrate processing apparatus 101 differs from the substrate processing apparatus 1 according to the first embodiment in that a first storage container unit 30 including a plurality of first storage containers is provided inside a second storage container 4. I have. FIG. 6 exemplarily shows a case where the first storage container section 30 is configured by two first storage containers 31 and 32.
[0057]
The two first storage containers 31 and 32 are arranged in series in close proximity to each other so that the substrate W passes in this order, and openings 31a, 31b, 32a, formed on two side surfaces facing each other, respectively. 32b are linearly aligned. And the upper discharge means 5 (51, 52) and the lower discharge means 6 (61, 62) are provided, respectively. In addition, the second exhaust unit V2 simultaneously exhausts both of the two first storage containers 31 and 32. The substrates transported to the first opening 31a of the first storage container 31 and the second opening 32b of the first storage container 32, which correspond to the openings at both ends of the first storage container 30, respectively. It has beak-shaped ends 31ae and 32be having a surface substantially parallel to W.
[0058]
The “first outermost opening” is defined by the first opening 31 a at the receiving end of the substrate W in the first storage container portion 30, and is defined at the sending end of the substrate W in the first storage container portion 30. When the “second end opening” is defined by the second opening 32 b, the second opening 32 b is located outside the first storage container portion 30 and near the first and second end openings 31 a and 32 b. A plurality of pipe showers 7 for discharging liquid toward a gap formed by the first and second end openings 31a and 32b and the substrate W to be conveyed are arranged. In the first embodiment (FIG. 2), "first end opening" and "second end opening" can be defined. In this case, the first opening 3a is Since there is only one, this first opening 3a functions as a first endmost opening. Similarly, since there is only one second opening 3b, this second opening 3b functions as a second endmost opening. I do.
[0059]
In the case of the substrate processing apparatus 101 according to the present embodiment, pure water discharged from the pipe shower 7 flows into the first opening 31a of the first storage container 31 and the second opening 32b of the first storage container 32. A water seal 13 is formed. In this case, a water seal is not formed at the opening between the two first storage containers, but by arranging them close to each other, the outflow of the atmosphere to the outside is suppressed. As in the first embodiment, the outflow of the atmosphere from the entire container section 30 is suppressed to such an extent that the second container 4 can be exhausted.
[0060]
In other words, even in a mode in which a plurality of storage containers for performing the cleaning process are provided as in the present embodiment, a water seal is formed at the opening portions of the storage containers at both ends, so that the cleaning process without reattachment of particles or the like is performed. Is possible.
[0061]
<Modification>
As described above, in the present invention, the flow rate of the cleaning fluid discharged at a high pressure is suppressed by forming a water seal, but the shape of the end of the opening for forming the water seal is as described above. It is not limited to an embodiment. FIG. 7 is a view showing a typical modification of the shape of the end 3 e of the first storage container 3. That is, the end 3e may have a structure in which a flat portion projects outside the first storage container 3 as shown in FIG. 7A, or a structure in which the end 3e projects on both sides as shown in FIG. 7B. Alternatively, as shown in FIG. 7C, a structure having a further inclination may be used. Alternatively, as shown in FIG. 7D, the thickness of a member constituting the container of the storage container 3 may be used.
[0062]
Further, in the above-described embodiment, since the high-pressure cleaning fluid 11 is supplied to the upper surface of the substrate W, the transport roller or the supporting roller that supports the lower surface side of the substrate is placed at a position as close as possible to the supply portion. Is desirably provided. In the above embodiment, since the spray 12 is supplied to the lower surface side in order to also perform the cleaning process on the lower surface side of the substrate, the support rollers 10 are provided before and after the supply center position of the cleaning fluid 11 and the spray 12. For example, when the lower surface side does not need to be cleaned, supply of the liquid to the lower surface is omitted, and a support roller or a transport roller may be provided at a position corresponding to the supply center of the cleaning fluid 11. In addition, if the cleaning fluid is supplied to the lower surface of the substrate at high pressure and the cleaning fluid is supplied to the upper surface at low pressure, even if the substrate is thin, bending due to gravity or the like applied to the substrate is reduced, and transport is stabilized. Can be enhanced.
[0063]
Further, in the above-described embodiment, the air is exhausted only from the upper side of the container, but the air may be exhausted from the lower side, or the air can be exhausted more efficiently by exhausting from both the upper and lower sides. In addition, the first storage container 3 and the second storage container 4 are connected to separate exhaust means, respectively, but one large-capacity exhaust means that can also be used as the two exhaust means may be provided.
[0064]
Further, in the above-described embodiment, the second cleaning mechanism 54 has a double container structure in which the first container 3 is accommodated in the second container 4. However, the present invention is not limited to this. As shown, a first sub-container 41 is provided outside the first container 3 as a main container so as to share a side having an opening 3a as a sub-container, and a side having an opening 3b. The second sub-container 42 may be provided so as to share the same.
[0065]
In FIG. 8, the sub-containers 41 and 42 have components and functions of the second container 4 in the above-described embodiment divided and provided before and after the transport path. That is, a third opening 4a is formed in the sub-container 41, a fourth opening 4b is formed in the sub-container 42, and the respective sub-containers 41 and 42 are connected to the exhaust means V2. I have. Outside the openings 3a, 3b of the first container 3, that is, inside the sub-containers 41 and 42, there is provided a pipe shower 7 for supplying liquid to the openings 3a, 3b. A liquid knife 8 is provided near the fourth opening.
[0066]
With such a configuration, substantially the same effects as in the above embodiment can be obtained. However, the effect of decelerating the cleaning fluid 11 that has passed through the water seal by the pipe shower 7 from the openings 3a and 3b and that has come to the outside of the first storage container 3 is connected between the openings 3a and 3b. However, the double container structure in which the volume can be easily increased is superior. Here, the sub-container does not necessarily need to be provided on both sides of the openings 3a and 3b of the first storage container 3. For example, although the leakage of the cleaning fluid toward the opening 3a on the upstream side as viewed from the first storage container 3 is acceptable, the cleaning fluid toward the opening 3b on the downstream side as viewed from the first storage container 3 is allowed. If leakage cannot be tolerated, at least the sub-container 42 on the opening 3b side may be provided.
[0067]
In the above-described embodiment, the cleaning is performed using pure water. However, the composition of the cleaning fluid discharged from the upper discharging unit 5 or the lower discharging unit 6 is not limited to this, and a predetermined processing liquid, For example, a developing solution, an etching solution, a stripping solution, or the like may be used. Further, the supply of pure water to each discharge means, the pipe shower, and the liquid knife may be performed from different supply means.
[0068]
In the above embodiment, the used pure water is discharged to the drain DR and discarded. However, the present invention is not limited to this, and the processing liquid may be circulated and reused. For example, in the first embodiment, pure water is separated and collected for each of the cleaning mechanisms 53, 54, and 56, and the pure water used in the third cleaning mechanism 56 is then supplied to the second cleaning mechanism 54. The pure water may be further supplied to the first cleaning mechanism 53 for use.
[0069]
Further, a plurality of upper discharging means and lower discharging means may be provided inside one first storage container.
[0070]
【The invention's effect】
As described above, according to the first to seventh aspects and the fourteenth to eighteenth aspects of the present invention, the processing vessels are provided in a double structure, and the exhaust is performed in each of the processing vessels. The gas can be exhausted without leaking to the outside of the storage container.
[0071]
Further, according to the second to fourth aspects and the fifteenth to seventeenth aspects of the present invention, even if there is a processing fluid that cannot be completely exhausted and leaks in the first storage container, it is completely stored in the second storage container. As a result, the processing fluid can be exhausted without leaking to the outside of the container.
[0072]
According to the third, fourth, eighth, twelfth, twelfth, and fifteenth aspects of the present invention, a water seal is formed in a gap between the substrate and the opening at the opening that is the transfer path of the substrate. By doing so, the leakage of the processing fluid to the outside can be suppressed.
[0073]
According to the fourth and ninth aspects of the present invention, the water seal can be formed more reliably.
[0074]
According to the fifth and sixteenth aspects of the present invention, the liquid inside and outside of the processing container can be blocked by the liquid, so that the leakage of the processing fluid and the mixing in the outside of the processing container can be avoided.
[0075]
Further, according to the inventions of claim 6, claim 7, claim 10 and claim 11, both surfaces of the substrate can be simultaneously cleaned in one storage container.
[0076]
According to the seventh and eleventh aspects of the present invention, it is possible to clean a substrate using a mixture processing fluid having a high detergency on a surface requiring higher cleanliness.
[0077]
In addition, according to the twelfth and twentieth aspects of the present invention, since the exhaust is also performed before and after the main processing container, the processing fluid can be exhausted without leaking to the outside.
[0078]
Further, according to the invention of claims 13 and 17, since the liquid used for cleaning does not stay on the substrate surface for a long time, reattachment of impurities and the like is suppressed.
[Brief description of the drawings]
FIG. 1 is a diagram schematically illustrating an overall configuration of a substrate processing apparatus 1 according to a first embodiment.
FIG. 2 is a view schematically showing a detailed configuration of a second cleaning mechanism 54.
FIG. 3 is a diagram for explaining inclined conveyance of a substrate W;
FIG. 4 is a perspective view for explaining a pipe shower 7 and a liquid knife 8;
FIG. 5 is a view schematically showing the state inside the first storage container 3 and the second storage container 4 during the substrate cleaning process.
FIG. 6 is a diagram schematically illustrating a configuration of a substrate processing apparatus 101 according to a second embodiment.
FIG. 7 is a view showing a typical modification of the shape of the end 3e of the first storage container 3.
FIG. 8 is a view showing a modification including a sub-container.
[Explanation of symbols]
1,101 substrate processing apparatus
2 Transport rollers
3, 31, 32 First container
4 Second container
5 Upper discharge means
6 Lower discharge means
7 Pipe shower
8 liquid knife
9 Holding roller
10 Support rollers
11,12 Cleaning fluid
13 Water Seal
52 Roll Brush
53 1st cleaning mechanism
54 Second cleaning mechanism
56 3rd cleaning mechanism
V1 First exhaust means
V2 Second exhaust means
W substrate

Claims (20)

A first storage container portion having at least one first storage container having a first opening and a second opening on side surfaces facing each other;
A second storage container that stores the first storage container portion and has a third opening and a fourth opening on opposing side surfaces;
The substrate is loaded into the second storage container from the third opening, and the substrate is sequentially loaded into the first storage container from the first opening of the first storage container, and the substrate is loaded into the second storage container. Transport means for unloading the substrate from the unit, and unloading the substrate from the fourth opening to the outside of the second storage container after passing through the first storage container unit;
A first discharge unit that is disposed inside the first storage container unit and discharges a processing fluid toward the transported substrate;
First exhaust means for exhausting the inside of the first storage container portion;
Second exhaust means for exhausting the inside of the second storage container;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 1,
The substrate processing apparatus according to claim 1, wherein an exhaust speed of the second exhaust unit is higher than an exhaust speed of the first exhaust unit. The substrate processing apparatus according to claim 1 or 2, wherein:
Defining a first outermost opening by an opening present as the first opening at the receiving end of the substrate in the first container;
When a second endmost opening is defined by an opening existing as the second opening at the sending end of the substrate in the first storage container portion,
A gap between the first end opening and the substrate, and a second end opening disposed outside the first container and near each of the first and second end openings; A plurality of second discharging means for discharging the liquid toward the gap between the substrate and the substrate,
A substrate processing apparatus, further comprising: The substrate processing apparatus according to claim 3, wherein
The substrate processing apparatus according to claim 1, wherein the first and second end openings each have a surface substantially parallel to the substrate passing through the first and second end openings. The substrate processing apparatus according to any one of claims 1 to 4, wherein
It is arranged inside the second container and near at least one of the third and fourth openings, and discharges liquid to close at least one of the third and fourth openings. A substrate processing apparatus, further comprising a third discharge means for forming a liquid flow on the substrate. The substrate processing apparatus according to claim 1, wherein:
An upper discharge unit and a lower discharge unit as the first discharge unit;
The substrate processing apparatus, wherein the upper and lower discharge units are arranged on different sides of the substrate conveyed to the first container. The substrate processing apparatus according to claim 6,
A substrate processing apparatus, wherein at least one of the upper and lower discharge means discharges a mixture of a gas and a liquid as the processing fluid. A main container having a first opening and a second opening on side surfaces facing each other;
Transport means for loading a substrate into the main container from the first opening and unloading the substrate from the second opening;
A first discharge unit that is disposed inside the main storage container and discharges a processing fluid toward the transported substrate;
First exhaust means for exhausting the interior of the main container;
Discharges liquid toward a gap formed between the first and second openings and the substrate to be transported, which is disposed outside the main container and near each of the first and second openings. A plurality of second ejection means,
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 8, wherein:
The substrate processing apparatus according to claim 1, wherein the first and second openings have surfaces substantially parallel to the substrate passing through the first and second openings, respectively. The substrate processing apparatus according to claim 8, wherein:
An upper discharge unit and a lower discharge unit as the first discharge unit;
The substrate processing apparatus according to claim 1, wherein the upper and lower discharge units are arranged on different sides of the substrate transferred to the main container. The substrate processing apparatus according to claim 10,
A substrate processing apparatus, wherein at least one of the upper and lower discharge means discharges a mixture of a gas and a liquid as the processing fluid. The substrate processing apparatus according to claim 8, wherein:
A sub-accommodating portion sharing a side surface having the first and second openings;
Second exhaust means for exhausting the inside of the sub-accommodating portion;
Further comprising
The second discharge means is disposed in the sub-accommodating portion,
The sub-accommodating portion has a third opening and a fourth opening through which the substrate passes, on opposite side surfaces,
The carrying means, after carrying the substrate from outside of the sub-housing unit to the main housing container via the third opening, from the main housing container to outside of the sub-housing via the fourth opening. A substrate processing apparatus characterized by carrying out. The substrate processing apparatus according to claim 1, wherein
The substrate processing apparatus, wherein the transport unit transports the substrate in a direction inclined with respect to a horizontal direction with respect to the substrate. A first container having at least one first container having a first opening and a second opening on opposite sides is accommodated, and a third opening and a fourth opening are provided on opposite sides. Cleaning the substrate inside the second container, comprising:
The substrate is loaded into the second storage container from the third opening, and the substrate is sequentially loaded into the first storage container from the first opening of the first storage container, and the substrate is loaded into the second storage container. Unloading the substrate, unloading the substrate from the fourth opening to the outside of the second storage container after passing through the first storage container,
Inside the first storage container portion, while discharging the processing fluid toward the transported substrate,
While evacuating the inside of the first storage container portion,
A method for cleaning a substrate, wherein the inside of the second container is evacuated. The substrate cleaning method according to claim 14, wherein
Defining a first outermost opening by an opening present as the first opening at the receiving end of the substrate in the first container;
When a second endmost opening is defined by an opening existing as the second opening at the sending end of the substrate in the first storage container portion,
A discharge step of discharging a liquid toward a gap formed by the first and second endmost openings and the substrate to be transferred;
Further comprising
In the discharging step, a gap between a substrate passing through the first and second endmost openings and an edge of the first and second endmost openings is water-sealed. Substrate cleaning method. A substrate cleaning method according to claim 14 or claim 15, wherein
A liquid is discharged inside the second container and near at least one of the third and fourth openings, and at least one of the third and fourth openings is discharged by the liquid flow. A substrate cleaning method characterized by closing a substrate. A substrate cleaning method according to any one of claims 14 to 16, wherein
The substrate cleaning method, wherein the transporting step transports the substrate in a direction inclined with respect to a horizontal direction with respect to the substrate. A first storage container having an opening through which the substrate passes;
A second storage container that has an opening through which the substrate passes and that stores the first storage container;
Through the opening of the second storage container and the opening of the first storage container, the substrate is again transferred from outside the second storage container through the first storage container in the second storage container. Conveying means for conveying outside the second storage container;
Supply means for supplying a processing fluid to the substrate in the first storage container;
First exhaust means for exhausting the inside of the first storage container;
Second exhaust means for exhausting the inside of the second storage container;
A substrate processing apparatus comprising: A storage container having an opening through which the substrate passes,
Transport means for transporting the substrate from outside the storage container through the opening of the storage container to the outside of the storage container again through the inside of the storage container,
First supply means for supplying a processing fluid to the substrate in the storage container;
Second supply means for supplying a liquid toward a gap between the opening of the first container and the substrate;
Exhaust means for exhausting the inside of the storage container,
A substrate processing apparatus comprising: A main container having a first opening and a second opening through which the substrate passes;
At least one sub-container provided so as to share one of the side surfaces having the first opening and the second opening, and having an opening through which the substrate passes;
Via the opening of the sub-container and the first opening and the second opening of the main storage, a transfer means for transferring a substrate so as to pass through the sub-container and the main storage;
Supply means for supplying a processing fluid to the substrate in the main storage container,
First exhaust means for exhausting the interior of the main container;
Second exhaust means for exhausting the inside of the sub-container,
A substrate processing apparatus comprising:

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