CN1836799A - Substrate disposal device - Google Patents
Substrate disposal device Download PDFInfo
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- CN1836799A CN1836799A CNA2006100069619A CN200610006961A CN1836799A CN 1836799 A CN1836799 A CN 1836799A CN A2006100069619 A CNA2006100069619 A CN A2006100069619A CN 200610006961 A CN200610006961 A CN 200610006961A CN 1836799 A CN1836799 A CN 1836799A
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- Prior art keywords
- ice
- treatment fluid
- gas
- substrate
- pressurized
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- 239000000758 substrate Substances 0.000 title claims abstract description 151
- 239000002002 slurry Substances 0.000 claims abstract description 158
- 238000011282 treatment Methods 0.000 claims abstract description 136
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 188
- 239000012530 fluid Substances 0.000 claims description 99
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 94
- 239000001569 carbon dioxide Substances 0.000 claims description 94
- 238000004781 supercooling Methods 0.000 claims description 27
- 230000008014 freezing Effects 0.000 claims description 8
- 238000007710 freezing Methods 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 4
- 238000004090 dissolution Methods 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 75
- 239000007788 liquid Substances 0.000 abstract description 21
- 239000002245 particle Substances 0.000 abstract description 6
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 61
- 238000004140 cleaning Methods 0.000 description 55
- 238000004519 manufacturing process Methods 0.000 description 39
- 238000009434 installation Methods 0.000 description 38
- 238000010586 diagram Methods 0.000 description 15
- 239000006260 foam Substances 0.000 description 10
- 229920002472 Starch Polymers 0.000 description 8
- 235000019698 starch Nutrition 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000007921 spray Substances 0.000 description 7
- 230000003068 static effect Effects 0.000 description 6
- 238000005192 partition Methods 0.000 description 5
- 239000008107 starch Substances 0.000 description 5
- 238000001816 cooling Methods 0.000 description 3
- 230000008676 import Effects 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- 238000009955 starching Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 235000014347 soups Nutrition 0.000 description 2
- 235000003363 Cornus mas Nutrition 0.000 description 1
- 240000006766 Cornus mas Species 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 210000000981 epithelium Anatomy 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000001141 propulsive effect Effects 0.000 description 1
- 238000009991 scouring Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1316—Methods for cleaning the liquid crystal cells, or components thereof, during manufacture: Materials therefor
Abstract
There is provided a device capable of uniformly treating without unevenness, when treating a substrate by supplying a treatment liquid containing fine ice particles onto the surface of the substrate, and not damaging a coating formed on the substrate. The device includes a substrate treatment unit 10 for treating the substrate, an ice slurry maker 12 causing pure water to contain fine ice particles, a means for dissolving a gas in ice slurry, a pressurizing pump 52 and a pressurizing tank 14 for pressurizing the ice slurry, and an ice slurry supply pipe 56 for supplying the pressurized ice slurry with the gas dissolved to the substrate treatment unit 10.
Description
Technical field
The present invention relates to the substrate board treatment that cleaning etc. that a kind of treatment fluid of supplying with the particulate that contains ice with glass substrate, plasma display (PDP) with the interarea of substrates such as glass substrate, printed base plate, ceramic substrate, electronic device substrate to semiconductor wafer, liquid crystal indicator (LCD) carries out substrate is handled.
Background technology
For example, the cleaning of the substrate in the manufacturing installation of flat-panel monitor such as LCD, PDP (FPD) is undertaken by a series of operation as follows: remove → clean by the scouring of having used roller type brush the removing of the above polluter of 1 μ m that carries out → clean the removing of soup after the soup that carries out cleans → clean the final cleaning that the precision of carrying out is cleaned → undertaken by final washing by 2 fluids by displacement by what the UV by excimer laser shone that the organic matter that carries out pollutes.In addition, in recent years, replacing roller type brush cleans, also proposed a kind of like this cleaning method and be implemented, that is, the microparticulate that is modulated into ice and will ice from nozzle and to starch the surface that is ejected into substrate in liquid and become the ice slurry of the suspension state of fruit Sorbet shape, thereby the particle collision that makes ice is to substrate and cleaning base plate (for example, with reference to No. 3380021 communique of Japan's special permission).
Having used the cleaning method of ice slurry is will ice the surface that slurry is ejected into substrate from nozzle, and the particle collision that makes ice is to substrate, thereby clean the method on the surface of substrate with the particulate of ice, in order to improve cleaning performance, need pressurize and will ice slurry from nozzle with certain pressure the ice slurry sprays.But, be small ice pellets but also be the liquid of the ice pellets of solid though make to contain, the broad range that evenly spreads to substrate surface is extremely difficult, therefore, ice slurry is pressurizeed and when nozzle sprays, according to the position on the substrate surface, the energy when ice slurry strikes substrate surperficial produces inhomogeneous.Particularly substrate has been realized maximization in recent years, therefore in order to make the ice slurry be diffused into the wideer scope of substrate surface, starch from the pressure of nozzle ejection and need to improve ice, so, spray the ice slurry and become difficult more from nozzle, thereby the energy degree of irregularity that ice is starched when striking substrate surface becomes big to the operation that substrate surface disperses equably.There is the uneven problem of processing that inhomogeneous grade takes place to clean in its result.
In addition, in the manufacture process of for example LCD, metal film that the liquid crystal pattern is used adopts as aluminium (Al)+molybdenum (Mo) etc. soft metal material on the physical property and forms, and on the other hand, the ice pellets that is contained in the ice slurry has hardness to a certain degree.Therefore, have such problem, that is, because the Impact energy of the particulate of ice and substrate surface is inhomogeneous, metal film sustains damage partly.
Summary of the invention
The present invention proposes in view of the above problems, its purpose is to provide a kind of substrate board treatment, at the treatment fluid of the particulate that will contain ice when the processing of cleaning of carrying out substrate etc. is supplied with on the surface of substrate, can handle irregular mode and carry out uniform processing substrate not produce, also can not damage the rete of the metal film that is formed on the substrate etc.
(1). the present invention is a kind of substrate board treatment, supplies with treatment fluid and treatment substrate is characterized in that to the interarea of substrate, has: the ice slurry modulating device that makes the particulate that contains ice in the treatment fluid; Make gas be dissolved in gas dissolution apparatus in the treatment fluid; The treatment fluid pressue device that treatment fluid is pressurizeed; To dissolve gas and contain the ice slurry feedway that the pressurized treatment fluid of the particulate of ice is supplied with to the interarea of substrate.
(2)., it is characterized in that above-mentioned ice slurry modulating device is that the ejection supercooling is removed with gas and the device of the supercooling state of removal treating fluid in the treatment fluid of supercooling state as above-mentioned (1) described substrate board treatment; The above-mentioned gas dissolver is that the device that makes its dissolving with gas is removed in the ejection supercooling in the treatment fluid of supercooling state; Above-mentioned treatment fluid pressue device is to remove with gas and contain the device that the treatment fluid of the particulate of ice pressurizes having dissolved supercooling.
(3)., it is characterized in that above-mentioned ice slurry modulating device is that treatment fluid is cooled to its temperature below freezing point and device that the part of treatment fluid is frozen as above-mentioned (1) described substrate board treatment; Above-mentioned treatment fluid pressue device is the device that the treatment fluid to the particulate that contains ice pressurizes; The above-mentioned gas dissolver be with gas pressurized and be transported to the particulate that contains ice and pressurized treatment fluid in and make the device of its dissolving.
(4)., it is characterized in that the above-mentioned gas dissolver is with gas pressurized and is transported to the device that makes its dissolving in the treatment fluid pressurized by above-mentioned pressue device as above-mentioned (1) described substrate board treatment; Above-mentioned ice slurry modulating device is the treatment fluid pressurization of particulate that will ice or the particulate that contains ice and is transported to the device that makes its mixing in the treatment fluid pressurized by above-mentioned pressue device.
(5)., it is characterized in that the above-mentioned gas dissolver is with gas pressurized and is transported to the device that makes its dissolving in the treatment fluid pressurized by above-mentioned pressue device as above-mentioned (1) described substrate board treatment; Above-mentioned ice slurry modulating device is that the device that makes its mixing in gas and the pressurized treatment fluid has been dissolved in the treatment fluid pressurization of particulate that will ice or the particulate that contains ice and being transported to.
(6)., it is characterized in that the above-mentioned gas dissolver is with gas pressurized and is transported to the device that makes its dissolving in the treatment fluid pressurized by above-mentioned pressue device as above-mentioned (1) described substrate board treatment; Above-mentioned ice slurry modulating device is to be cooled to its temperature below freezing point and device that the part of treatment fluid is frozen with having dissolved gas and pressurized treatment fluid.
(7)., it is characterized in that the above-mentioned gas dissolver is with gas pressurized and is transported to the device that makes its dissolving in the treatment fluid pressurized by above-mentioned pressue device as above-mentioned (1) described substrate board treatment; Above-mentioned ice slurry modulating device is to cool off and make it be in the supercooling state having dissolved gas and pressurized treatment fluid, and removes with gas and the device of the supercooling state of removal treating fluid by ejection supercooling in the treatment fluid of this supercooling state.
(8). as each described substrate board treatment in above-mentioned (1), (3)～(7), it is characterized in that above-mentioned gas is a carbon dioxide.
(9)., it is characterized in that it is carbon dioxide that above-mentioned supercooling is removed with gas as above-mentioned (2) or (7) described substrate board treatment.
In above-mentioned (1) described substrate board treatment of the present invention, the treatment fluid that will be contained the particulate of ice by ice slurry feedway is supplied with to the interarea of substrate, thereby, for example in cleaning treatment, be present in the particulate that the polluter of foreign matter particulate in the recess etc. of substrate surface etc. iced and remove, and polluter and treatment fluid flow out and are removed from the interarea of substrate together.At this moment, owing in the treatment fluid of the particulate that contains ice that the substrate interarea is supplied with, be dissolved with gas, so compare soft more with the particulate that only cools off the ice that pure water makes.Therefore, the treatment fluid of particulate that contains ice with pressurized state when substrate sprays, even according to the lip-deep position of substrate, the energy of the particle collision of ice during to substrate surperficial has some inhomogeneous, can prevent that also the metal film that liquid crystal pattern is for example used is subjected to the such situation of local damage.In addition,, spray with high pressure to substrate so dissolved the treatment fluid of gas because the treatment fluid of supplying with to the interarea of substrate is pressurized, thereby because of cavitation small bubble of a large amount of generations in treatment fluid.Thereby the impulsive force of utilizing a large amount of micro-bubble produce in treatment fluid to produce when the skin breakage of substrate can be removed the foreign matter attached to the particulate of substrate surface etc. more efficiently.
Therefore, use above-mentioned (1) described substrate board treatment of the present invention, then can handle uneven mode evenly and carry out the processing such as cleaning of substrate efficiently, and also can not damage the rete of the metal film that is formed on the substrate etc. not produce.
, make respectively and dissolved gas and contained the particulate of ice and pressurized treatment fluid to above-mentioned (7) described each substrate board treatment of the present invention in above-mentioned (2), supply on the interarea of substrate by ice slurry feedway.
In above-mentioned (8) described substrate board treatment of the present invention, be dissolved with carbon dioxide in the treatment fluid owing to the particulate that contains ice, so compare the resistivity value of treatment fluid with pure water smaller.Therefore, the treatment fluid of the particulate of supplying with to the interarea of substrate that contains ice, it is inner and be difficult for producing static when being transported to nozzle to flow through pipe arrangement, thereby needn't worry that fine pattern or the device on the substrate is destroyed because of static when the substrate interarea is supplied with.
In above-mentioned (9) described substrate board treatment of the present invention, be dissolved with carbon dioxide in the treatment fluid owing to the particulate that contains ice, so compare the resistivity value of treatment fluid with pure water smaller.Therefore, the treatment fluid of the particulate of supplying with to the interarea of substrate that contains ice, it is inner and be difficult for producing static when being transported to nozzle to flow through pipe arrangement, thereby needn't worry that fine pattern or the device on the substrate is destroyed because of static when the substrate interarea is supplied with.
Description of drawings
Fig. 1 is the integrally-built skeleton diagram of base plate cleaning device of an example of expression embodiment of the present invention.
Fig. 2 is the stereoscopic figure as the main part of the ice slurry manufacturing installation of one of structural element of base plate cleaning device shown in Figure 1.
Fig. 3 carries out view of apparatus to the part of the state of the main part that longitudinally cuts off ice slurry manufacturing installation shown in Figure 2.
Fig. 4 is the frame assumption diagram that ice shown in Figure 2 is starched manufacturing installation.
Fig. 5 is the general principal view of an example of structure of the processing substrate portion of expression base plate cleaning device shown in Figure 1.
Fig. 6 is the integrally-built skeleton diagram of base plate cleaning device of another embodiment of expression the present invention.
Fig. 7 is the summary section of expression as the structure example of the ice slurry manufacturing installation of one of structural element of base plate cleaning device shown in Figure 6.
Fig. 8 is the integrally-built skeleton diagram of base plate cleaning device of another embodiment of expression the present invention.
Fig. 9 is the integrally-built skeleton diagram of base plate cleaning device of another embodiment of expression the present invention.
Figure 10 is the integrally-built skeleton diagram of base plate cleaning device of another embodiment of expression the present invention.
Figure 11 is the integrally-built skeleton diagram of base plate cleaning device of another embodiment of expression the present invention.
The specific embodiment
Below, at preferred forms of the present invention, with reference to accompanying drawing and describe.
Fig. 1 to Fig. 5 represents an example of embodiment of the present invention, and Fig. 1 is an expression substrate board treatment and represent the integrally-built skeleton diagram of base plate cleaning device in this embodiment.In addition, Fig. 2 is the stereoscopic figure of the ice slurry manufacturing installation main part of one of structural element as this base plate cleaning device, Fig. 3 carries out view of apparatus to the part of the state of the main part that longitudinally cuts off ice slurry manufacturing installation, Fig. 4 is the frame assumption diagram of ice slurry manufacturing installation, and Fig. 5 is the general principal view of an example of structure of the processing substrate portion of expression base plate cleaning device.
This base plate cleaning device have to substrate carry out cleaning treatment processing substrate portion 10, make the treatment fluid of the particulate contain ice, promptly the ice slurry ice slurry manufacturing installation 12, be used for pressurized tank 14 that treatment fluid is pressurizeed.
One example of starching the concrete structure of manufacturing installation 12 at ice describes, and as shown in Figure 2, the main part 16 of ice slurry manufacturing installation 12 forms elongated pipe shape.That is, main part 16 has the straight tube 18 that the mode that reduces gradually with the inner end diameter that makes progress from the bottom forms, and the lower surface of straight tube 18 is stopped up by bottom wall portion 20.Straight tube 18 longitudinally disposes, and preferably keeps vertical position.As shown in Figure 3, liquid ingress pipe portion 22 is fixed on the bottom wall portion 20 of this straight tube 18 in the mode that connects bottom wall portion 20, and the front port of liquid ingress pipe portion 22 is inserted and led to the inside of straight tube 18, and becomes liquid introducing port 24.In addition,, and be provided with very little interval between the bottom wall portion 20 and formed partition wall portion 26, and separate the inside of straight tube 18, import chamber 28 and between itself and bottom wall portion 20, formed gas by partition wall portion 26 in the inboard of straight tube 18.Be formed with a plurality of perforation pores that become gas vent 30 in partition wall portion 26.And, as shown in Figure 2, disposing gas introduction tube portion 32 in bottom wall portion 20, gas introduction tube portion 32 imports chamber 28 with gas and is communicated with.In addition, the upper end of straight tube 18 is by opening, and its upper port becomes the flow export 34 of ice slurry.
As shown in Figure 4, the liquid ingress pipe portion 22 at main part 16 is connected with the feed tube for liquid 36 that supercooled water is supplied with usefulness.In addition, be connected with gas supply pipe 38 in gas introduction tube portion 32, the carbon dioxide supply source of this gas supply pipe 38 and gas bomb etc. forms stream and is connected.Feed tube for liquid 36 is connected with heat exchanger 40 streams, and is communicated with by the internal flow path of heat exchanger 40 and the pure water supply pipe 42 that stream is connected to the pure water supply source.In addition, set up cooler (cooling device) 44 at heat exchanger 40, anti-icing fluid (cold-producing medium) by circulation with pipe arrangement 46,48 circulation between the internal flow path of heat exchanger 40 and cooler 44.And by the pure water that pure water supply pipe 42 is supplied with, the device 44 that is cooled is cooled to temperature below freezing via heat exchanger 40, thereby becomes supercooled water, and this supercooled water is fed into the liquid ingress pipe portion 22 of main part 16 by feed tube for liquid 36.
Have the main part 16 of Fig. 2 to the ice slurry manufacturing installation 12 of structure shown in Figure 4, by liquid ingress pipe portion 22, and by liquid introducing port 24 and to straight tube 18 in the importing supercooled water, in addition, in importing chamber 28, gas imports carbon dioxide by gas introduction tube portion 32, and interior from gas importing chamber 28 by spraying carbon dioxide the supercooled water of a plurality of gas vents 30 in straight tube 18 on the partition wall portion 26.And the foam of supercooled water and carbon dioxide rises from the flow export 34 of bottom to top of straight tube 18.In the process that this foam rises, the vibration that is caused by foam is applied to supercooled water, and vibrate the supercooling state of removing supercooled water by this, in addition, utilize lather collapse in the uphill process of foam and the energy that produces is removed the supercooling state of supercooled water.Thus, form ice-nucleus and generate the particulate of ice.At this moment, the foam of supercooled water and carbon dioxide rises from the bottom to small-bore flow export 34 by the elongated stream in the straight tube 18 together, so during the flow export 34 that arrives straight tube 18, carry out the releasing of supercooling state efficiently by foam, thereby generate the particulate of a lot of ice.In addition, owing to the gas vent 30 that a plurality of perforation pores be made of of carbon dioxide from partition wall portion 26 is ejected into the supercooled water, thus form a lot of tiny foams, and make its total surface area become big.And formed foam can not be to be trapped in the bottom of straight tube 18 and foam sticks together each other, but promptly on the flow export 34 on top is floating.Like this, by forming a lot of foams, and form more ice-nucleus, thereby can make the ice slurry of the particulate that contains more more small ice.In addition, because the total surface area of bubble increases, so the contact area of bubble and supercooled water increases, therefore the dissolving of the carbon dioxide in water is accelerated, thereby can make the ice slurry that has dissolved more carbon dioxide.
In addition, straight tube 18 forms in the mode that the inner end diameter that makes progress from the bottom diminishes gradually, so the ice of the particulate that contains ice that is generated slurry flows well in straight tube 18.And then, because the internal diameter of the flow export 34 of straight tube 18 diminishes, and connects the pipe arrangement 50 of carrying ice slurry usefulness on this flow export 34, so the ice slurry can not flow out and inflow to pipe arrangement 50 in with being detained by flow exports 34 in straight tube 18.In addition, owing in the supercooled water of low temperature, spray carbon dioxide,, starch thereby can access the ice that has dissolved more relatively carbon dioxide so the meltage of carbon dioxide increases.At this particulate that has dissolved the ice that is contained in the ice slurry of carbon dioxide, the particulate of the ice that generates with utilizing usual way to remove the supercooling state of supercooled water is compared, and is more soft.In addition, owing to be dissolved with carbon dioxide in the ice slurry, therefore the resistivity value of ice slurry is smaller.
In addition, in the above-described embodiment, the device of making the ice slurry at carbon dioxide is ejected in the supercooled water is illustrated, but inert gas such as gas beyond the removing carbon dioxide gas, for example nitrogen or air, oxygen, ozone gas etc. are ejected in the cooled liquid except that pure water, remove the supercooling state of cooled liquid, thereby make the ice slurry.In addition,, also suitable medicament, for example surfactant or the pH that can improve cleaning performance can be adjusted agent etc. and add in the pure water etc., thereby improve the impregnability of treatment fluid or change pH and prevent adhering to again of foreign matter particulate according to cleaning purpose.
The flow export 34 of the main part 16 of ice slurry manufacturing installation 12 is connected with the inlet stream of pressurized tank 14 via the pipe arrangement 50 of carrying ice slurry usefulness.Pipe arrangement 50 is provided with force (forcing) pump 52, and is provided with non-return valve 54 in the downstream of force (forcing) pump 52.In addition, though do not illustrate, pressurized tank 14 is provided with liquid level and adjusts valve, safety valve.And, the dissolving of flowing out from ice slurry manufacturing installation 12 the ice slurry of carbon dioxide, pressurized and flow in the pressurized tank 14 by force (forcing) pump 52.Outlet in pressurized tank 14 is connected with ice slurry supplying tubing 56, and this ice slurry supplying tubing 56 is provided with pressure regulator valve 58.And, by force (forcing) pump 52, dissolved carbon dioxide and pressurized ice slurry, and supplied to processing substrate portion 10 by ice slurry supplying tubing 56 through pressurized tank 14.
One example of the concrete structure of processing substrate portion 10 is described according to Fig. 5.
The processing substrate portion 10 of the schematic configuration of expression major part is substrate rotary cleaning device (a rotation swaging machine) in Fig. 5, and this cleaning device has the rotary chuck 60 that substrate W is remained flat-hand position.Rotary chuck 60 is being supported around vertical axis by swivel bearing axle 62 with rotating freely, and rotates around vertical axis by the motor (not shown) that is connected with swivel bearing axle 62.Though omitted diagram, around substrate W that rotary chuck 60 is kept, be equipped with the cup that is used to collect the ice slurry that disperses towards periphery from the substrate W in the mode of surrounding substrate W.In addition, above substrate W that rotary chuck 60 is kept, be equipped with and ice the nozzle 64 that slurry supplying tubing 56 is connected, and dissolved carbon dioxide and pressurized ice is starched from the surface ejection of 64 couples of substrate W of this nozzle.
In device shown in Figure 5, will dissolve carbon dioxide and pressurized ice slurry from nozzle 64 ejections, be rotated that chuck 60 keeps and the surface of the substrate W of rotation and supply to.Thus, be present in the polluters such as foreign matter particulate in the recess etc. on surface of substrate W, the particulate of being iced is removed, and and the ice slurry flow out from the surface of substrate W together and be removed.At this moment owing to from the ice slurry of the 64 couples of substrate W of nozzle ejection, be dissolved with carbon dioxide, so the particulate of the ice in the ice slurry compare with the particulate that only cools off the ice that pure water makes, relatively more soft.Therefore, on the surface of substrate W,, can prevent that also the metal film etc. of the pattern-like that forms on the surface of substrate W is subjected to local damage even the energy of the particle collision of pressurized and ice from the ice slurry of nozzle 64 ejection during to substrate W surperficial has some inhomogeneous.In addition, owing to be dissolved with carbon dioxide in this ice slurry, the resistivity value of ice slurry is smaller.Therefore, ice slurry flows through in the pipe arrangement 50,56 and is transported to and is difficult for producing static in the process of nozzle 64, thereby can prevent that from nozzle 64 during to substrate W ejection ice slurry, fine pattern or device on the substrate W are destroyed because of static.And then, be pressurized because ice is starched, spray with high pressure to substrate W so dissolved the ice slurry of carbon dioxide, thereby because of cavitation small bubble of a large amount of generations in the ice slurry.And the impulsive force that produces when utilizing the skin breakage at substrate W of a large amount of micro-bubble of producing in the ice slurry can be removed the foreign matter attached to the particulate on the surface of substrate W etc. more efficiently.
In addition, as processing substrate portion 10, be not limited to aforesaid substrate rotary cleaning device, and can use the base plate cleaning device of various processing modes.For example, it also can be the device of this spline structure, promptly, is inclination attitude and carry out horizontal conveyance to the direction vertical with this incline direction by roller path with substrate supporting, simultaneously from be provided in substrate directly over the nozzle of position dissolved carbon dioxide and pressurized ice slurry to the substrate ejection.In addition, also can be the device of this spline structure, that is, with substrate dipping and remain in the treatment fluid that is contained in the treatment trough, and dissolved carbon dioxide and pressurized ice slurry to the substrate ejection from the ejiction opening that is arranged on treatment trough inside.
Then, Fig. 6 and Fig. 7 represent another embodiment of the present invention, and Fig. 6 is the integrally-built skeleton diagram of expression base plate cleaning device, and Fig. 7 is the summary section of expression as the structure example of the ice slurry manufacturing installation of one of structural element of this base plate cleaning device.This base plate cleaning device has substrate is carried out the processing substrate portion 10 of cleaning treatment, the ice slurry manufacturing installation 66 of making the ice slurry, the pressurized tank 68 that is used for treatment fluid is pressurizeed, is used to make gas, for example carbon dioxide to be dissolved in the carbon dioxide gas body feeding 70 etc. of ice slurry.
As shown in Figure 7, ice slurry manufacturing installation 66 has container 72, and this container 72 forms with double-wall structure and has internal perisporium face cylindraceous, and is provided with the supply port 74 of treatment fluid, for example pure water and the outlet 76 of ice slurry.The supply port 74 of container 72 is connected with pure water supply pipe 78, and this pure water supply pipe is connected with pure water supply source stream.On pure water supply pipe 78, be respectively arranged with pump 80, filter 82 and open and close valve 84.In addition, be filled with anti-icing fluid 86 in the space between the inner and outer wall of container 72.Anti-icing fluid 86 is circulation between the double wall inside of container 72 and cooler 88, and is cooled to temperature below freezing by cooler 88, thereby the cooling of the internal perisporium face of container 72 remains on the following temperature of freezing point.In the inside of container 72, be connected with swivel bearing axle 90 along its shaft core position is slotting, and on swivel bearing axle 90, be fixed with helical blade 92.The extension of swivel bearing axle 90 is arranged on the end of the outside of container 72, is connected with the rotating shaft of motor 94.Helical blade 92 has the periphery blade front end near the internal perisporium face of container 72.And utilize motor 94 to make 90 rotations of swivel bearing axle, thereby helical blade 92 is with the state rotation of periphery blade front end near the internal perisporium face of container 72.
In this ice slurry manufacturing installation 66, utilize pump 80 to supply with pure water to the supply port 74 of container 72 by pure water supply pipe 78, if pure water flows in the containers 72 by supply port 74, then the part of this pure water is in the internal perisporium face cooling of container 72 and freeze.And, separate out and the crystallization of the ice of growing at the inner peripheral surface of container 72, scraped off by the periphery blade front end of helical blade 92.The crystallization of the ice that is scraped from the inner peripheral surface wall of container 72 is spread pure water and is modulated into the ice slurry.The ice slurry that becomes in the inner modulation of container 72 is subjected to the propulsive force that the spiral by helical blade 92 rotatablely moves and produces, and discharges by outlets 76 in container 72.
The outlet 76 of the container 72 of ice slurry manufacturing installation 66 is connected with the inlet stream of pressurized tank 68 via the pipe arrangement 96 of carrying ice slurry usefulness.Pipe arrangement 96 is provided with force (forcing) pump 98, and is provided with non-return valve 100 in the downstream of force (forcing) pump 98.And, from icing the ice slurry that slurry manufacturing installation 66 flows out, in force (forcing) pump 98 pressurizations and inflow pressurized tank 68.Be connected with the carbon dioxide supply pipe 102 of carbon dioxide gas body feeding 70 in pressurized tank 68.Carbon dioxide supply pipe 102 is provided with air compressor 104.And, the carbon dioxide of supplying with from the carbon dioxide supply source is by air compressor 104 and pressurized, pressurized carbon dioxide is supplied with to pressurized tank 68 in by carbon dioxide supply pipe 102, thereby carbon dioxide being dissolved in ice in pressurized tank 68 starches.
Outlet in pressurized tank 68 is connected with ice slurry supplying tubing 106, and this ice slurry supplying tubing is provided with pressure regulator valve 108.And, by force (forcing) pump 98, dissolved carbon dioxide and pressurized ice slurry is sent in pressurized tank 68, and supplied with to processing substrate portion 10, and carried out aforesaid substrate cleaning treatment in processing substrate portion 10 by ice slurry supplying tubing 106.
In addition, also can in ice slurry manufacturing installation 66, carry out such processing, promptly, in pure water, utilize carbon dioxide to carry out bubbling or using gases dissolving module, carbon dioxide is dissolved in from the pure water that the pure water supply source is supplied with, and supply with arbon dioxide solutions and replace pure water to the supply port 74 of container 72, make the ice slurry that has dissolved carbon dioxide, and to pressurized tank 68 in, carry the ice that has dissolved carbon dioxide to starch by pipe arrangement 96.
Fig. 8 is the integrally-built skeleton diagram of base plate cleaning device of another embodiment of expression the present invention.This base plate cleaning device have to substrate carry out the processing substrate portion 10 of cleaning treatment, the pressurized tank 110 that is used for treatment fluid is pressurizeed, the particulate that makes ice is blended in treatment fluid and modulates the ice slurry modulating device 112 of ice slurry, is used for making gas, for example carbon dioxide to be dissolved in the carbon dioxide gas body feeding 114 etc. of ice slurry.
Inlet in pressurized tank 110 is connected with pure water supply pipe 116, and this pure water supply pipe 116 is connected with the supply source stream of treatment fluid, for example pure water.This pure water supply pipe 116 is provided with force (forcing) pump 118, and is provided with non-return valve 120 in the downstream of force (forcing) pump 118.Thereby pressurize from the pressurized pump 118 of pure water that the pure water supply source is supplied with, and flow in the pressurized tank 110.Be connected with the ice particulate carrier pipe 122 of ice slurry modulating device 112 in pressurized tank 110; and by ice the particulate that particulate carrier pipe 122 pressurizes and carries ice in pressurized tank 110; thereby in pressurized tank 110, in the pure water that the particulate of ice is blended in pressurized, and be modulated into the ice slurry.In addition, pressurized tank 110 is connected with the carbon dioxide supply pipe 123 of carbon dioxide gas body feeding 114.Carbon dioxide supply pipe 123 is provided with air compressor 124.And, the carbon dioxide of supplying with from the carbon dioxide supply source is pressurizeed by air compressor 124, pressurized carbon dioxide is supplied with to pressurized tank 110 in by carbon dioxide supply pipe 123, thereby in pressurized tank 110, carbon dioxide is dissolved in to ice and starches.At this moment, by in pressurized tank 110, carrying the particulate of ice, carbon dioxide is dissolved in the ice slurry of low temperature, so more carbon dioxide is dissolved in the ice slurry.
Outlet in pressurized tank 110 is connected with ice slurry supplying tubing 126, on this ice slurry supplying tubing 126 pressure regulator valve 128 is installed.Thereby by force (forcing) pump 118, dissolved carbon dioxide and pressurized ice slurry is sent in pressurized tank 110, supplied with to processing substrate portion 10 by ice slurry supplying tubing 126, and carry out aforesaid substrate cleaning treatment in processing substrate portion 10.
In addition, at ice slurry modulating device 112, also can replace the action of to pressurized tank 110 in, carrying the particulate of ice, and the ice slurry of the particulate that contains a large amount of ice is pressurizeed and is transported in the pressurized tank 110, starch with icing thereby pressurized tank 110 in, mix pure water by ice particulate carrier pipe 122.
Fig. 9 is the integrally-built skeleton diagram of base plate cleaning device of another embodiment of expression the present invention.This base plate cleaning device have to substrate carry out cleaning treatment processing substrate portion 10, the pressurized tank 130 that is used for treatment fluid is pressurizeed, be used for making gas, for example carbon dioxide to be dissolved in the carbon dioxide gas body feeding 132 of treatment fluid, for example pure water, mix the ice slurry modulating device 134 of ice slurry etc. at pure water.
Inlet in pressurized tank 130 is connected with pure water supply pipe 136, and this pure water supply pipe 136 is connected with pure water supply source stream.Pure water supply pipe 136 is provided with force (forcing) pump 138, is provided with non-return valve 140 in the downstream of force (forcing) pump 138.Thereby pressurize by force (forcing) pump 138 from the pure water that the pure water supply source is supplied with, and flow in the pressurized tank 130.Be connected with the carbon dioxide supply pipe 142 of carbon dioxide gas body feeding 132 in pressurized tank 130.Carbon dioxide supply pipe 142 is provided with air compressor 144.And, the carbon dioxide of supplying with from the carbon dioxide supply source is pressurizeed by air compressor 144, pressurized carbon dioxide is by carbon dioxide supply pipe 142 and supply to pressurized tank 130 in, thereby in pressurized tank 130 carbon dioxide is dissolved in the pure water.
Outlet in pressurized tank 130 is connected with ice slurry supplying tubing 146, and this ice slurry supplying tubing 146 is provided with pressure regulator valve 148.In addition, in ice slurry supplying tubing 146 midway, the mode of collaborating with the upstream side that the position is set at pressure regulator valve 148 is communicated with the ice slurry carrier pipe 150 that is connected with ice slurry modulating device 134.Ice slurry carrier pipe 150 is provided with force (forcing) pump 152.Thereby by starching the ice slurry that manufacturing installation is made as Fig. 2 to Fig. 4 or ice shown in Figure 7, pressurized and be transported to ice slurry supplying tubing 146 by force (forcing) pump 152 from ice slurry carrier pipe 150, thus the ice slurry is blended in and has dissolved in carbon dioxide and the pressurized treatment fluid.The dissolving of modulating like this carbon dioxide and pressurized ice slurry, pass through ice by force (forcing) pump 138 and starches supplying tubing 146 and be fed into processing substrate portion 10, in processing substrate portion 10, carry out substrate cleaning treatment as described above.
In addition, in ice slurry adjusting device 134, also can replace the action of in ice slurry supplying tubing 146, carrying the ice slurry by ice slurry carrier pipe 150, and the particulate pressurization by will ice and being transported in the ice slurry supplying tubing 146, thereby the particulate that in ice slurry supplying tubing 146, in having dissolved carbon dioxide and pressurized treatment fluid, mixes ice, and modulation ice is starched.
Figure 10 is the integrally-built skeleton diagram of base plate cleaning device of another embodiment of expression the present invention.This base plate cleaning device have to substrate carry out cleaning treatment processing substrate portion 10, the pressurized tank 154 that is used for treatment fluid is pressurizeed, be used to make gas, for example carbon dioxide be dissolved in treatment fluid, for example pure water carbon dioxide gas body feeding 156, make the ice slurry manufacturing installation 158 of ice slurry etc.
Inlet in pressurized tank 154 is connected with pure water supply pipe 160, and this pure water supply pipe 160 is connected with pure water supply source stream.This pure water supply pipe 160 is provided with force (forcing) pump 162, is provided with non-return valve 164 in the downstream of force (forcing) pump 162.Thereby pressurize by force (forcing) pump 162 from the pure water that the pure water supply source is supplied with, and flow in the pressurized tank 154.Be connected with the carbon dioxide supply pipe 166 of carbon dioxide gas body feeding 156 in pressurized tank 154.Carbon dioxide supply pipe 166 is provided with air compressor 168.Thereby pressurize by air compressor 168 from the carbon dioxide that the carbon dioxide supply source is supplied with, pressurized carbon dioxide is by carbon dioxide supply pipe 166 and supply to pressurized tank 154 in, thereby carbon dioxide is dissolved in the pure water in pressurized tank 154.
The outlet of pressurized tank 154 is via the internal flow path of heat exchanger 170, and by supercooled water supply with usefulness feed tube for liquid 172 and and the ice liquid introducing port stream of starching manufacturing installation 158 be connected.Set up cooler 174 at heat exchanger 170, anti-icing fluid is by circulation circulation between the internal path of heat exchanger 170 and cooler 174 with pipe arrangement.Ice slurry manufacturing installation 158 have with Fig. 2 to the identical structure of ice slurry manufacturing installation shown in Figure 4 12, be connected with the gas supply pipe 176 that is connected with carbon dioxide supply source stream at its gas introduction port.At this ice slurry manufacturing installation 158, ice slurry by making to ice slurry manufacturing installation 12 identical effects shown in Figure 4 with Fig. 2.
Flow export at ice slurry manufacturing installation 158 is connected with ice slurry supplying tubing 178, and ice slurry supplying tubing 178 is provided with pressure regulator valve 180.Thereby by force (forcing) pump 162, dissolved carbon dioxide and pressurized ice slurry is sent from ice slurry manufacturing installation 158, and supplied with to processing substrate portion 10, carried out aforesaid substrate cleaning treatment in processing substrate portion 10 by ice slurry supplying tubing 178.
Figure 11 is the integrally-built skeleton diagram of base plate cleaning device of another embodiment of expression the present invention.This base plate cleaning device have to substrate carry out cleaning treatment processing substrate portion 10, the pressurized tank 182 that is used for treatment fluid is pressurizeed, be used to make gas, for example carbon dioxide be dissolved in treatment fluid, for example pure water carbon dioxide gas body feeding 184, make the ice slurry manufacturing installation 186 of ice slurry etc.
Inlet in pressurized tank 182 is connected with pure water supply pipe 188, and this pure water supply pipe 188 is connected with pure water supply source stream.This pure water supply pipe 188 is provided with force (forcing) pump 190, is provided with non-return valve 192 in the downstream of force (forcing) pump 190.Thereby pressurize by force (forcing) pump 190 from the pure water that the pure water supply source is supplied with, and flow in the pressurized tank 182.Be connected with the carbon dioxide supply pipe 194 of carbon dioxide gas body feeding 184 in pressurized tank 182.Carbon dioxide supply pipe 194 is provided with air compressor 196.And, the carbon dioxide of supplying with from the carbon dioxide supply source is pressurizeed by air compressor 196, pressurized carbon dioxide is by carbon dioxide supply pipe 194 and supply to pressurized tank 182 in, thereby in pressurized tank 182 carbon dioxide is dissolved in the pure water.
Outlet in pressurized tank 182 is connected with the liquid supply port stream of ice slurry manufacturing installation 186 by feed tube for liquid 198.Ice slurry manufacturing installation 186 has the structure identical with ice shown in Figure 7 slurry manufacturing installation 66, and be filled with anti-icing fluid in the space between the inner and outer wall of the container that forms double-wall structure, anti-icing fluid circulates in the double wall of container and between the cooler 200, and makes the internal perisporium face of container cool off the temperature that remains on below the freezing point by cooler 200.In this ice slurry manufacturing installation 186, by making the ice slurry with ice slurry manufacturing installation 66 same effects shown in Figure 7.
Liquid outlet at ice slurry manufacturing installation 186 is connected with ice slurry supplying tubing 202, and this ice slurry supplying tubing 202 is provided with pressure regulator valve 204.And, by force (forcing) pump 190, dissolved carbon dioxide and pressurized ice slurry is sent from ice slurry manufacturing installation 186, and supplied with, and carried out aforesaid substrate cleaning treatment in processing substrate portion 10 by ice slurry supplying tubing 202 and to processing substrate portion 10.
In addition, in each above-mentioned embodiment, be illustrated, but the present invention also goes for the processing substrate except cleaning at the processing of cleaning base plate.For example,, can roughly grind and finish grind, perhaps can on the surface of substrate, form small concavo-convex (hair side processing) the surface of substrate by the hardness of adjusting the particulate of icing the ice that is comprised in the slurry and the ejection pressure of icing slurry.In addition, substrate board treatment of the present invention, can be used in the oxide-film that is formed on the metallic film surface on the substrate remove (photoetch), be used to strengthen when on substrate, forming stacked film adhesion strength base treatment, the fine residue on the substrate remove with the cleaning of burr, substrate when mother metal does not have resistance to chemical reagents on the removing of surperficial epithelium, the precision cleaning of ceramic substrate etc.
Claims (9)
1. substrate board treatment is supplied with treatment fluid and treatment substrate is characterized in that to the interarea of substrate, has:
Make the ice slurry modulating device of the particulate that contains ice in the treatment fluid;
Make gas be dissolved in gas dissolution apparatus in the treatment fluid;
The treatment fluid pressue device that treatment fluid is pressurizeed;
To dissolve gas and contain the ice slurry feedway that the pressurized treatment fluid of the particulate of ice is supplied with to the interarea of substrate.
2. substrate board treatment as claimed in claim 1 is characterized in that,
Above-mentioned ice slurry modulating device is that the ejection supercooling is removed with gas and the device of the supercooling state of removal treating fluid in the treatment fluid of supercooling state;
The above-mentioned gas dissolver is that the device that makes its dissolving with gas is removed in the ejection supercooling in the treatment fluid of supercooling state;
Above-mentioned treatment fluid pressue device is to remove with gas and contain the device that the treatment fluid of the particulate of ice pressurizes having dissolved supercooling.
3. substrate board treatment as claimed in claim 1 is characterized in that,
Above-mentioned ice slurry modulating device is that treatment fluid is cooled to its temperature below freezing point and device that the part of treatment fluid is frozen;
Above-mentioned treatment fluid pressue device is the device that the treatment fluid to the particulate that contains ice pressurizes;
The above-mentioned gas dissolver be with gas pressurized and be transported to the particulate that contains ice and pressurized treatment fluid in and make the device of its dissolving.
4. substrate board treatment as claimed in claim 1 is characterized in that,
The above-mentioned gas dissolver is with gas pressurized and is transported to the device that makes its dissolving in the treatment fluid pressurized by above-mentioned pressue device;
Above-mentioned ice slurry modulating device is the treatment fluid pressurization of particulate that will ice or the particulate that contains ice and is transported to the device that makes its mixing in the treatment fluid pressurized by above-mentioned pressue device.
5. substrate board treatment as claimed in claim 1 is characterized in that,
The above-mentioned gas dissolver is with gas pressurized and is transported to the device that makes its dissolving in the treatment fluid pressurized by above-mentioned pressue device;
Above-mentioned ice slurry modulating device is that the device that makes its mixing in gas and the pressurized treatment fluid has been dissolved in the treatment fluid pressurization of particulate that will ice or the particulate that contains ice and being transported to.
6. substrate board treatment as claimed in claim 1 is characterized in that,
The above-mentioned gas dissolver is with gas pressurized and is transported to the device that makes its dissolving in the treatment fluid pressurized by above-mentioned pressue device;
Above-mentioned ice slurry modulating device is to be cooled to its temperature below freezing point and device that the part of treatment fluid is frozen with having dissolved gas and pressurized treatment fluid.
7. substrate board treatment as claimed in claim 1 is characterized in that,
The above-mentioned gas dissolver is with gas pressurized and is transported to the device that makes its dissolving in the treatment fluid pressurized by above-mentioned pressue device;
Above-mentioned ice slurry modulating device is to cool off and make it be in the supercooling state having dissolved gas and pressurized treatment fluid, and removes with gas and the device of the supercooling state of removal treating fluid by ejection supercooling in the treatment fluid of this supercooling state.
8. as each described substrate board treatment in the claim 1,3～7, it is characterized in that above-mentioned gas is a carbon dioxide.
9. as claim 2 or 7 described substrate board treatments, it is characterized in that it is carbon dioxide that above-mentioned supercooling is removed with gas.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005085351 | 2005-03-24 | ||
| JP2005085351A JP2006269714A (en) | 2005-03-24 | 2005-03-24 | Substrate treatment device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1836799A true CN1836799A (en) | 2006-09-27 |
Family
ID=37014386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006100069619A Pending CN1836799A (en) | 2005-03-24 | 2006-01-26 | Substrate disposal device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2006269714A (en) |
| KR (1) | KR100671774B1 (en) |
| CN (1) | CN1836799A (en) |
| TW (1) | TWI276482B (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102052813A (en) * | 2010-12-15 | 2011-05-11 | 浙江海洋学院 | Miniaturized binary ice generator |
| CN102161042A (en) * | 2010-12-09 | 2011-08-24 | 武汉奋进电力技术有限公司 | Granular ice charged water washing device |
| CN102580954A (en) * | 2011-12-27 | 2012-07-18 | 哈尔滨工业大学 | Pipeline ice crystal flusher |
| CN104634034A (en) * | 2015-02-15 | 2015-05-20 | 天津商业大学 | Device for preparing ice slurry by use of spiral drawknife device |
| CN104826831A (en) * | 2015-05-15 | 2015-08-12 | 北京七星华创电子股份有限公司 | Cryogenic liquid cleaning device |
| CN105215015A (en) * | 2015-10-13 | 2016-01-06 | 安徽松羽工程技术设备有限公司 | A kind of cleaning device |
| TWI615208B (en) * | 2015-07-06 | 2018-02-21 | Shibaura Mechatronics Corp | Water jet, substrate processing device and substrate processing method |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008310172A (en) | 2007-06-15 | 2008-12-25 | Fujinon Corp | Image blur correction unit, image blur correction device, photographing device and portable apparatus |
| JP7256053B2 (en) * | 2019-03-27 | 2023-04-11 | 日本液炭株式会社 | Cleaning agents containing CO2-enriched ice |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB8511702D0 (en) * | 1985-05-09 | 1985-06-19 | Unilever Nv | Producing ice confection product |
| JPH02246255A (en) * | 1989-03-20 | 1990-10-02 | Hitachi Ltd | Semiconductor device |
| JP2000077828A (en) * | 1998-08-27 | 2000-03-14 | Fuji Seiki Mach Works Ltd | Method for cleaning electric circuit board |
| KR100607765B1 (en) * | 2002-09-17 | 2006-08-01 | 동부일렉트로닉스 주식회사 | Apparatus for removing slurry stuck on the chemical-mechanical polisher |
-
2005
- 2005-03-24 JP JP2005085351A patent/JP2006269714A/en not_active Abandoned
- 2005-12-20 TW TW094145250A patent/TWI276482B/en not_active IP Right Cessation
-
2006
- 2006-01-19 KR KR1020060005938A patent/KR100671774B1/en not_active IP Right Cessation
- 2006-01-26 CN CNA2006100069619A patent/CN1836799A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102161042A (en) * | 2010-12-09 | 2011-08-24 | 武汉奋进电力技术有限公司 | Granular ice charged water washing device |
| CN102052813A (en) * | 2010-12-15 | 2011-05-11 | 浙江海洋学院 | Miniaturized binary ice generator |
| CN102052813B (en) * | 2010-12-15 | 2012-11-21 | 浙江海洋学院 | Miniaturized binary ice generator |
| CN102580954A (en) * | 2011-12-27 | 2012-07-18 | 哈尔滨工业大学 | Pipeline ice crystal flusher |
| CN104634034A (en) * | 2015-02-15 | 2015-05-20 | 天津商业大学 | Device for preparing ice slurry by use of spiral drawknife device |
| CN104826831A (en) * | 2015-05-15 | 2015-08-12 | 北京七星华创电子股份有限公司 | Cryogenic liquid cleaning device |
| CN104826831B (en) * | 2015-05-15 | 2016-10-19 | 北京七星华创电子股份有限公司 | A kind of low temperature medicinal liquid cleans device |
| TWI615208B (en) * | 2015-07-06 | 2018-02-21 | Shibaura Mechatronics Corp | Water jet, substrate processing device and substrate processing method |
| CN105215015A (en) * | 2015-10-13 | 2016-01-06 | 安徽松羽工程技术设备有限公司 | A kind of cleaning device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006269714A (en) | 2006-10-05 |
| TW200633793A (en) | 2006-10-01 |
| KR20060103090A (en) | 2006-09-28 |
| KR100671774B1 (en) | 2007-01-19 |
| TWI276482B (en) | 2007-03-21 |
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