JP2007201186A - Substrate cleaning device and substrate cleaning method - Google Patents

Substrate cleaning device and substrate cleaning method Download PDF

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JP2007201186A
JP2007201186A JP2006018117A JP2006018117A JP2007201186A JP 2007201186 A JP2007201186 A JP 2007201186A JP 2006018117 A JP2006018117 A JP 2006018117A JP 2006018117 A JP2006018117 A JP 2006018117A JP 2007201186 A JP2007201186 A JP 2007201186A
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substrate
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Kenichi Morita
健一 森田
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Sharp Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate cleaning device which is capable of sufficiently removing foreign objects attached to the surface of a substrate with a small consumption of cleaning liquid. <P>SOLUTION: The substrate cleaning device 1 is equipped with a cleaning liquid supply unit 4 provided facing the cleaned surface 2a that is one of the main surfaces possessed by a substrate 2, and a cleaning roller 5 which is provided facing the cleaned surface 2a and located nearly in parallel with the cleaning liquid supply unit 4. The cleaning liquid supply unit 4 supplies cleaning liquid 3 onto the cleaned surface 2a, the roller 5 is rotated in the direction of an arrow 17 so as to send the supplied cleaning liquid 3 into a gap 6 formed between the cleaned surface 2a and the cleaning roller 5, and to form a shearing flow of the cleaning liquid 3 in the gap 6 to clean up the cleaned surface 2a. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、基板洗浄装置および基板洗浄方法に関する。   The present invention relates to a substrate cleaning apparatus and a substrate cleaning method.

半導体などを用いる電子デバイスの製造においては、半導体基板の表面に異物が存在することによって、電子デバイス動作の不良につながるので、半導体基板の洗浄が必要不可欠である。また、液晶表示素子、プラズマディスプレイパネル(PDP)などのフラットパネルディスプレイの製造においても、基板上の汚れが表示性能を左右するので、ガラス基板などの洗浄が必要不可欠とされている。したがって、電子デバイスおよびフラットパネルディスプレイ製造工程では、多種多様な基板の洗浄装置および方法が開発されて実用化されている。   In the manufacture of an electronic device using a semiconductor or the like, the presence of foreign matter on the surface of the semiconductor substrate leads to defective operation of the electronic device, and thus the cleaning of the semiconductor substrate is indispensable. Also in the manufacture of flat panel displays such as liquid crystal display elements and plasma display panels (PDPs), dirt on the substrate affects display performance, so that cleaning of glass substrates and the like is indispensable. Therefore, in the manufacturing process of electronic devices and flat panel displays, a wide variety of substrate cleaning apparatuses and methods have been developed and put into practical use.

基板洗浄装置に係る従来技術として、基板にスリット状の吹き出し口を有するノズルから純水を供給し、円筒状のナイロン製ブラシを基板の表面に軽く押付けながら一定速度で回転することによって、基板の表面に付着した異物を除去するスクラブ洗浄が開発されている(特許文献1参照)。   As a conventional technique related to a substrate cleaning apparatus, pure water is supplied from a nozzle having a slit-like outlet to the substrate and rotated at a constant speed while lightly pressing a cylindrical nylon brush against the surface of the substrate. Scrub cleaning that removes foreign matter adhering to the surface has been developed (see Patent Document 1).

特許文献1に開示される基板洗浄装置を用いる洗浄方法では、基板の表面にブラシを機械的に接触させるので、基板の表面を損傷するおそれがある。たとえば昨今の集積度が著しく増し微細な構造を有する基板表面の洗浄においては、ブラシの機械的接触がデバイス製品の良品率を低下させるという問題を惹起すると考えられる。   In the cleaning method using the substrate cleaning apparatus disclosed in Patent Document 1, since the brush is brought into mechanical contact with the surface of the substrate, the surface of the substrate may be damaged. For example, in the recent increase in the degree of integration and the cleaning of the substrate surface having a fine structure, it is considered that the mechanical contact of the brush causes a problem that the yield rate of the device product decreases.

また、未だ表面構造が微細化されていない段階の基板の洗浄においては、ブラシ洗浄は非常に洗浄効果のある技術であるけれども、基板から除去された異物がブラシの中に取り込まれることによりブラシ自身が異物によって汚染され、汚染されたブラシで基板洗浄を行うと、ブラシ中の異物が基板を再汚染するおそれがある。したがって、特許文献1の基板洗浄装置では、ブラシを自己洗浄する構成を必要としている。   In the cleaning of the substrate at the stage where the surface structure has not yet been miniaturized, the brush cleaning is a technology that has a very effective cleaning effect. However, the foreign matter removed from the substrate is taken into the brush and the brush itself When the substrate is cleaned with a contaminated brush, the foreign material in the brush may recontaminate the substrate. Therefore, the substrate cleaning apparatus of Patent Document 1 requires a configuration for self-cleaning the brush.

しかしながら、ブラシを自己洗浄したとしても、基板と長時間接触することによって、ブラシが摩耗してブラシの毛が切れたり、最悪の場合ブラシの毛が脱落して、ブラシ自身の毛が原因となって基板を汚染するという問題がある。   However, even if the brush is self-cleaned, the brush will be worn out due to contact with the substrate for a long time, and the hair of the brush may be cut off. There is a problem of contaminating the substrate.

このような問題に対処する従来技術として、ブラシを用いるスクラブ洗浄とは異なり、基板の被洗浄面に対してノズルから洗浄液を噴出し、基板の被洗浄面の反対面である裏面に対して超音波ノズルから超音波を印加した液体を噴射させることによって、基板に機械的接触をすることなく、洗浄する洗浄装置が提案されている(特許文献2参照)。   Unlike conventional scrub cleaning using a brush, as a conventional technique for dealing with such a problem, a cleaning liquid is jetted from a nozzle to the surface to be cleaned of the substrate, and the surface opposite to the surface to be cleaned of the substrate is super-exposed. There has been proposed a cleaning apparatus that performs cleaning without causing mechanical contact with a substrate by ejecting a liquid to which ultrasonic waves are applied from a sonic nozzle (see Patent Document 2).

特許文献2の従来技術では、超音波によって基板に付着している異物をリフトオフさせ、次に洗浄液の流れをリフトオフされた異物に作用させることによって、基板に機械的接触をすることなく、基板の洗浄を可能としている。   In the prior art of Patent Document 2, foreign matter adhering to the substrate is lifted off by ultrasonic waves, and then the flow of the cleaning liquid is applied to the lifted foreign matter, so that the substrate is not mechanically contacted. Cleaning is possible.

しかしながら、洗浄に使用する洗浄液をノズルから常に噴出させることが必要になるので、多量の洗浄液を必要とするという問題がある。また、基板の裏面から超音波を印加して異物をリフトオフさせる効果を発揮させるために、超音波の伝播媒体として超純水などの清浄液体を、常に超音波ノズルから基板へ供給しなければならないので、ノズルから噴出される洗浄液と同様に、多量の清浄液体を必要とするという問題がある。さらに、洗浄液として超純水をノズルから高速で噴出させる場合、流動の摩擦力で発生する静電気によって超純水が帯電し、最悪の場合、基板表面に形成されている微細な電気配線の構造が破壊されるおそれがある。   However, since it is necessary to always eject the cleaning liquid used for cleaning from the nozzle, there is a problem that a large amount of cleaning liquid is required. Also, in order to exert the effect of lifting off foreign matter by applying ultrasonic waves from the back surface of the substrate, a clean liquid such as ultrapure water must always be supplied from the ultrasonic nozzle to the substrate as an ultrasonic propagation medium. Therefore, there is a problem in that a large amount of cleaning liquid is required as in the case of the cleaning liquid ejected from the nozzle. Furthermore, when ultrapure water is ejected from the nozzle as a cleaning liquid at high speed, the ultrapure water is charged by static electricity generated by the flowing frictional force, and in the worst case, the structure of fine electrical wiring formed on the substrate surface There is a risk of being destroyed.

特開平6−13359号公報JP-A-6-13359 特開2005−33092号公報JP-A-2005-33092

本発明は、上述のような問題点を鑑みてなされたものであり、その目的は、基板に機械的接触をすることなく、かつ少ない洗浄用液の使用量で基板表面に存在する異物を充分に除去することができる基板洗浄装置および基板洗浄方法を提供することである。   The present invention has been made in view of the above-described problems, and its purpose is to sufficiently remove foreign substances present on the substrate surface without mechanical contact with the substrate and with a small amount of cleaning liquid used. The present invention provides a substrate cleaning apparatus and a substrate cleaning method that can be removed.

本発明は、基板の一方の面である被洗浄面に洗浄液を供給して洗浄する基板洗浄装置において、
基板の被洗浄面を臨んで設けられ、基板の被洗浄面に洗浄液を供給する洗浄液供給部と、
基板の被洗浄面を臨み洗浄液供給部と略平行になるように設けられる洗浄ローラであって、回転することによって洗浄液を基板の被洗浄面との間に形成される間隙へ送込む洗浄ローラとを含むことを特徴とする基板洗浄装置である。
The present invention provides a substrate cleaning apparatus for supplying a cleaning liquid to a surface to be cleaned, which is one surface of a substrate, and cleaning the substrate,
A cleaning liquid supply unit that faces the surface to be cleaned of the substrate and supplies a cleaning liquid to the surface to be cleaned of the substrate;
A cleaning roller provided so as to face the surface to be cleaned of the substrate so as to be substantially parallel to the cleaning liquid supply unit, and the cleaning roller that rotates to send the cleaning liquid to a gap formed between the surface to be cleaned and the substrate; A substrate cleaning apparatus comprising:

また本発明は、洗浄ローラを、基板の被洗浄面に対して接近させ、また離反させるローラ昇降手段を含むことを特徴とする。   In addition, the present invention is characterized in that it includes roller raising / lowering means for bringing the cleaning roller closer to and away from the surface to be cleaned.

また本発明は、基板を略水平方向に搬送する搬送手段を含むことを特徴とする。
また本発明は、洗浄ローラは、その外周面が親水性を有することを特徴とする。
In addition, the present invention is characterized in that it includes transport means for transporting the substrate in a substantially horizontal direction.
The present invention is also characterized in that the cleaning roller has a hydrophilic outer peripheral surface.

また本発明は、基板の被洗浄面に供給されて被洗浄面から離脱する洗浄液を回収する回収手段を含むことを特徴とする。   In addition, the present invention is characterized by including a recovery means for recovering the cleaning liquid that is supplied to the surface to be cleaned of the substrate and separates from the surface to be cleaned.

また本発明は、洗浄ローラが最も被洗浄面に接近する部位と、被洗浄面との間隔が、3mm以下であることを特徴とする。   Further, the present invention is characterized in that the distance between the portion where the cleaning roller is closest to the surface to be cleaned and the surface to be cleaned is 3 mm or less.

本発明は、基板の一方の面である被洗浄面に洗浄液を供給して洗浄する基板洗浄方法において、
基板の被洗浄面を臨んで設けられる洗浄液供給部から基板の被洗浄面に対して洗浄液を供給するステップと、
基板の被洗浄面を臨み洗浄液供給部と略平行になるように設けられる洗浄ローラの回転によって、洗浄液を基板の被洗浄面と洗浄ローラとの間に形成される間隙へ送込むステップとを含むことを特徴とする基板洗浄方法である。
The present invention provides a substrate cleaning method for supplying a cleaning liquid to a surface to be cleaned, which is one surface of a substrate, and cleaning the substrate.
Supplying a cleaning liquid to a surface to be cleaned from a cleaning liquid supply unit provided facing the surface to be cleaned of the substrate;
A step of feeding a cleaning liquid into a gap formed between the surface to be cleaned and the cleaning roller by rotation of a cleaning roller provided so as to face the surface to be cleaned of the substrate and to be substantially parallel to the cleaning liquid supply unit. This is a substrate cleaning method.

また本発明は、洗浄される基板を略水平姿勢に保つことを特徴とする。
また本発明は、洗浄液には、比抵抗が10MΩ・cm以上の純水が用いられることを特徴とする。
Further, the present invention is characterized in that the substrate to be cleaned is maintained in a substantially horizontal posture.
Further, the present invention is characterized in that pure water having a specific resistance of 10 MΩ · cm or more is used for the cleaning liquid.

本発明によれば、基板の被洗浄面に洗浄液を供給する洗浄液供給部と、基板の被洗浄面を臨み洗浄液供給部と略平行になるように設けられる洗浄ローラとを備え、洗浄液供給部から供給される洗浄液を、洗浄ローラの回転によって基板の被洗浄面との間に形成される間隙へ送込んで被洗浄面を洗浄するので、基板に機械的接触をすることなく、かつ少ない洗浄用液体の使用量で基板表面に存在する異物を充分に除去することができる基板洗浄装置が提供される。   According to the present invention, the cleaning liquid supply unit that supplies the cleaning liquid to the surface to be cleaned of the substrate and the cleaning roller that faces the surface to be cleaned of the substrate and is provided to be substantially parallel to the cleaning liquid supply unit are provided. The supplied cleaning liquid is fed into the gap formed between the substrate and the surface to be cleaned by the rotation of the cleaning roller, and the surface to be cleaned is cleaned. There is provided a substrate cleaning apparatus capable of sufficiently removing foreign substances present on the substrate surface with the amount of liquid used.

また本発明によれば、洗浄ローラを基板の被洗浄面に対して接近させ、また離反させるローラ昇降手段を含み、基板の厚さに応じて洗浄ローラを昇降させることができるので、洗浄ローラと基板の被洗浄面とで形成される間隙を最適な距離になるように容易に設定できる。   In addition, according to the present invention, the cleaning roller can be moved up and down according to the thickness of the substrate, including roller lifting means for moving the cleaning roller toward and away from the surface to be cleaned. The gap formed by the surface to be cleaned of the substrate can be easily set to an optimum distance.

また本発明によれば、基板を略水平方向に搬送する搬送手段を含み、基板を搬送手段によって搬送しながら洗浄処理することができるので、多量の基板を容易に洗浄処理することが可能になる。   Further, according to the present invention, it is possible to include a transport unit that transports the substrate in a substantially horizontal direction, and the substrate can be cleaned while being transported by the transport unit. .

また本発明によれば、洗浄ローラはその外周面が親水性を有するので、洗浄ローラの表面と洗浄液との粘性摩擦を大きくすることができる。このことによって、回転する洗浄ローラから伝達されて、洗浄ローラの外周面に接する洗浄液を移動させるように作用する力が大きくなるので、洗浄ローラの回転により間隙へと送込まれる洗浄液の被洗浄面付近における流速を速めて洗浄効果を向上することができる。   Further, according to the present invention, since the outer peripheral surface of the cleaning roller is hydrophilic, the viscous friction between the surface of the cleaning roller and the cleaning liquid can be increased. This increases the force that is transmitted from the rotating cleaning roller and acts to move the cleaning liquid in contact with the outer peripheral surface of the cleaning roller, so that the surface to be cleaned of the cleaning liquid fed into the gap by the rotation of the cleaning roller The cleaning effect can be improved by increasing the flow velocity in the vicinity.

また本発明によれば、基板の被洗浄面に供給されて被洗浄面から離脱する洗浄液を回収する回収手段を含むので、装置内における洗浄液の不要な飛散および滞留を防止できる。また、回収手段とともに、たとえば浄化装置を含む循環手段を設けることによって、回収した洗浄液を無駄なく繰返し使用することが可能になる。   In addition, according to the present invention, since the recovery means for recovering the cleaning liquid supplied to the surface to be cleaned of the substrate and separated from the surface to be cleaned is included, unnecessary scattering and retention of the cleaning liquid in the apparatus can be prevented. Further, by providing, for example, a circulation means including a purification device together with the recovery means, the recovered cleaning liquid can be repeatedly used without waste.

また本発明によれば、洗浄ローラが最も被洗浄面に接近する部位と被洗浄面との間隔が3mm以下に設定される。このことによって、洗浄ローラの回転により間隙へと送込まれる洗浄液の被洗浄面付近における流速を速めて洗浄効果を向上することができる。   Further, according to the present invention, the distance between the cleaning roller closest to the surface to be cleaned and the surface to be cleaned is set to 3 mm or less. Thus, the cleaning effect can be improved by increasing the flow rate of the cleaning liquid fed into the gap by the rotation of the cleaning roller in the vicinity of the surface to be cleaned.

本発明によれば、基板の被洗浄面を臨んで設けられる洗浄液供給部から基板の被洗浄面に対して洗浄液を供給し、供給される洗浄液を、基板の被洗浄面を臨み洗浄液供給部と略平行になるように設けられる洗浄ローラの回転によって、基板の被洗浄面と洗浄ローラとの間に形成される間隙へ送込んで被洗浄面を洗浄するので、基板に機械的接触をすることなく、かつ少ない洗浄液の使用量で基板表面に存在する異物を充分に除去することができる基板洗浄方法が実現される。   According to the present invention, the cleaning liquid is supplied to the surface to be cleaned from the cleaning liquid supply unit provided facing the surface to be cleaned of the substrate, and the supplied cleaning liquid is exposed to the surface to be cleaned and the cleaning liquid supply unit. By rotating the cleaning roller provided so as to be substantially parallel, it is sent to the gap formed between the surface to be cleaned and the cleaning roller to clean the surface to be cleaned. In addition, a substrate cleaning method that can sufficiently remove foreign substances present on the substrate surface with a small amount of cleaning liquid used is realized.

また本発明によれば、洗浄される基板を略水平姿勢に保つので、被洗浄面をほぼ均質に充分清浄な状態に洗浄することができる。   Further, according to the present invention, the substrate to be cleaned is maintained in a substantially horizontal posture, so that the surface to be cleaned can be cleaned in a substantially uniform and sufficiently clean state.

また本発明よれば、洗浄液として比抵抗が10MΩ・cm以上の純水を用いるので、入手が容易な洗浄液によって高い洗浄効果を実現することができる。   According to the present invention, since pure water having a specific resistance of 10 MΩ · cm or more is used as the cleaning liquid, a high cleaning effect can be realized with an easily available cleaning liquid.

図1は本発明の実施の第1形態である基板洗浄装置1の構成を簡略化して示す上面図であり、図2は図1に示す基板洗浄装置1の側面図である。   FIG. 1 is a top view showing a simplified configuration of a substrate cleaning apparatus 1 according to a first embodiment of the present invention, and FIG. 2 is a side view of the substrate cleaning apparatus 1 shown in FIG.

基板洗浄装置1は、基板2の一方の面である被洗浄面2aを臨んで設けられ、基板2の被洗浄面2a(以後、単に被洗浄面2aと呼ぶ)に洗浄液3を供給する洗浄液供給部4と、被洗浄面2aを臨み洗浄液供給部4と略平行になるように設けられる洗浄ローラ5であって、回転することによって洗浄液2を被洗浄面2aとの間に形成される間隙6へ送込む洗浄ローラ5とを含んで構成される。基板洗浄装置1は、被洗浄面2aに洗浄液3を供給し、被洗浄面2aに付着しているパーティクルなどの微細な異物を除去洗浄することに用いられる。   The substrate cleaning apparatus 1 is provided so as to face the surface to be cleaned 2a, which is one surface of the substrate 2, and supplies cleaning liquid 3 to the surface 2a to be cleaned (hereinafter simply referred to as surface 2a to be cleaned). A cleaning roller 5 provided so as to face the surface 4a to be cleaned and to be substantially parallel to the cleaning liquid supply unit 4, and a gap 6 formed between the cleaning liquid 2 and the surface 2a to be cleaned by rotating. And the cleaning roller 5 fed to the The substrate cleaning apparatus 1 is used for supplying a cleaning liquid 3 to the surface to be cleaned 2a and removing and cleaning fine foreign matters such as particles adhering to the surface to be cleaned 2a.

基板洗浄装置1によって洗浄される基板2としては、ガラス基板、半導体基板、シリコンウエハなどが挙げられる。基板2は、不図示の搬送手段の上に略水平に戴置され、予め定める1方向(図1および図2中に示す矢符S方向)に搬送される途上において、被洗浄面2aが洗浄される。本実施の形態において、基板2の平面形状は矩形であるけれども、これに限定されることなく、さらなる多角形であってもよく、輪郭が曲線で形成されているものであってもよい。   Examples of the substrate 2 to be cleaned by the substrate cleaning apparatus 1 include a glass substrate, a semiconductor substrate, and a silicon wafer. The substrate 2 is placed substantially horizontally on a transport means (not shown), and the surface to be cleaned 2a is cleaned while being transported in one predetermined direction (the arrow S direction shown in FIGS. 1 and 2). Is done. In the present embodiment, the planar shape of the substrate 2 is a rectangle, but is not limited to this, and may be a further polygonal shape or a contour formed by a curve.

洗浄液供給部4は、本実施形態では金属製の直管から成る供給本体部11と、供給本体部11の被洗浄面2aを臨む側に設けられる洗浄液供給口12とを含む。洗浄液供給部4は、基板2の搬送方向であるS方向に直交する方向(以後、この方向を幅方向と呼ぶ)に延び、被洗浄面2aに対して平行になるように、すなわち水平になるように設けられる。この洗浄液供給部4の幅方向の長さL3は、少なくとも基板2の幅寸法L2よりも長くなるように形成される。このことによって、洗浄液供給部4から基板2の幅方向全体に洗浄液3を供給することができる。   In this embodiment, the cleaning liquid supply unit 4 includes a supply main body 11 made of a straight metal pipe and a cleaning liquid supply port 12 provided on the side of the supply main body 11 facing the surface to be cleaned 2a. The cleaning liquid supply unit 4 extends in a direction orthogonal to the S direction, which is the conveyance direction of the substrate 2 (hereinafter, this direction is referred to as the width direction), and is parallel to the surface to be cleaned 2a, that is, horizontal. It is provided as follows. The length L3 of the cleaning liquid supply unit 4 in the width direction is formed to be at least longer than the width dimension L2 of the substrate 2. Accordingly, the cleaning liquid 3 can be supplied from the cleaning liquid supply unit 4 to the entire width direction of the substrate 2.

洗浄液供給部4には、不図示の配管が接続され、配管はさらに洗浄液供給源に接続される。洗浄液供給源は、たとえば洗浄液貯留槽と、洗浄液貯留槽に貯留される洗浄液を配管へと圧送するポンプと、ポンプを駆動させる電源とを含んでなる。洗浄液供給部4と、配管と、洗浄液供給源とは、洗浄液供給手段を構成する。洗浄液供給源から配管へ圧送される洗浄液3は、中空の供給本体部11を通り、洗浄液供給口12から吐出されて被洗浄面2aへと供給される。   A pipe (not shown) is connected to the cleaning liquid supply unit 4, and the pipe is further connected to a cleaning liquid supply source. The cleaning liquid supply source includes, for example, a cleaning liquid storage tank, a pump that pumps the cleaning liquid stored in the cleaning liquid storage tank to the pipe, and a power source that drives the pump. The cleaning liquid supply unit 4, the piping, and the cleaning liquid supply source constitute a cleaning liquid supply unit. The cleaning liquid 3 pumped from the cleaning liquid supply source to the pipe passes through the hollow supply main body 11 and is discharged from the cleaning liquid supply port 12 and supplied to the surface to be cleaned 2a.

本実施形態では、洗浄液供給部4から被洗浄面2aに対して供給される洗浄液3として、比抵抗が10MΩ・cm以上の純水、より好ましくは比抵抗が18MΩ・cm以上の超純水が用いられる。   In this embodiment, the cleaning liquid 3 supplied from the cleaning liquid supply unit 4 to the surface to be cleaned 2a is pure water having a specific resistance of 10 MΩ · cm or more, more preferably ultrapure water having a specific resistance of 18 MΩ · cm or more. Used.

なお、洗浄液としては、純水に限定されることなく、純水または超純水に二酸化炭素および/またはアンモニアを添加させた液体、いわゆる機能水が用いられてもよい。これらの清浄な洗浄液、または清浄でありかつ化学的作用を有する洗浄液が用いられることによって、良好な洗浄効果を発揮することが可能になる。   Note that the cleaning liquid is not limited to pure water, and liquid obtained by adding carbon dioxide and / or ammonia to pure water or ultrapure water, so-called functional water, may be used. By using such a clean cleaning liquid or a clean cleaning liquid having a chemical action, it is possible to exert a good cleaning effect.

洗浄ローラ5は、ローラ本体部13と、ローラ本体部13を回転駆動させる回転動力部14とを含む。洗浄ローラ5は、アーム部15に回転自在に支持される。アーム部15は、一種の軸受部材であり、軸受部で洗浄ローラ5を回転自在に支持し、軸受部と反対側の端部が、基板洗浄装置1における不図示のフレーム部材などに装着される。回転動力部14は、たとえば電動機とピンチローラとを含み、アーム部15に支持される洗浄ローラ5の回転軸(不図示)に、電動機で回転されるピンチローラを圧接させて回転駆動させる。回転動力部14は、上記の例に限定されるものではなく、他の回転駆動手段を用いるものであってもよい。   The cleaning roller 5 includes a roller body 13 and a rotational power unit 14 that rotationally drives the roller body 13. The cleaning roller 5 is rotatably supported by the arm unit 15. The arm portion 15 is a kind of bearing member, and the cleaning roller 5 is rotatably supported by the bearing portion, and an end opposite to the bearing portion is attached to a frame member (not shown) or the like in the substrate cleaning apparatus 1. . The rotational power unit 14 includes, for example, an electric motor and a pinch roller, and rotates the rotational axis (not shown) of the cleaning roller 5 supported by the arm unit 15 by pressing the pinch roller rotated by the electric motor. The rotational power unit 14 is not limited to the above example, and other rotational driving means may be used.

ローラ本体部13は、たとえばステンレス鋼などの金属製であり、円柱形状であってもよく、また軽量化するために円筒形状にして軸線方向両端部を閉じて回転軸部材を設けるようにしてもよい。   The roller body 13 is made of a metal such as stainless steel, and may have a columnar shape. Alternatively, the roller body 13 may be cylindrical and closed at both ends in the axial direction to provide a rotating shaft member in order to reduce the weight. Good.

本実施形態のローラ本体部13において注目すべきは、その外周面が親水性を有するように、親水処理層16が形成されることである。ローラ本体部13の外周面に親水処理層16を形成する方法は、特に限定されるものではなく、シリカ系親水被膜を形成する方法、またレーザ照射して粗面化する処理であってもよい。シリカ系親水被膜としては、たとえば珪酸ソーダにポリアクリル酸を添加した塗料を塗布したもの、またシリコーン樹脂に光触媒である酸化チタンを添加した塗料を塗布したものなどが挙げられる。なお、酸化チタンを添加した樹脂被膜は、紫外線を受けることによって親水性を発現する。   It should be noted in the roller main body 13 of the present embodiment that the hydrophilic treatment layer 16 is formed so that the outer peripheral surface thereof has hydrophilicity. The method of forming the hydrophilic treatment layer 16 on the outer peripheral surface of the roller main body 13 is not particularly limited, and may be a method of forming a silica-based hydrophilic film or a treatment of roughening by laser irradiation. . Examples of the silica-based hydrophilic film include those obtained by applying a paint obtained by adding polyacrylic acid to sodium silicate, and those obtained by applying a paint obtained by adding titanium oxide as a photocatalyst to a silicone resin. In addition, the resin film which added the titanium oxide expresses hydrophilicity by receiving an ultraviolet-ray.

洗浄ローラ5は、基板2の搬送方向Sに関して洗浄液供給部4よりも上流側に、被洗浄面2aを臨み洗浄液供給部4と略平行になるように設けられる。この洗浄ローラ5におけるローラ本体部13の幅方向すなわち軸線方向の寸法L1は、少なくとも基板2の幅寸法L2よりも長くなるように形成される。このことによって、洗浄ローラ5は、基板2の幅方向全体を洗浄することができる。   The cleaning roller 5 is provided on the upstream side of the cleaning liquid supply unit 4 with respect to the transport direction S of the substrate 2 so as to face the surface to be cleaned 2 a and be substantially parallel to the cleaning liquid supply unit 4. The width L of the roller body 13 in the cleaning roller 5, that is, the dimension L1 in the axial direction is formed to be at least longer than the width L2 of the substrate 2. Accordingly, the cleaning roller 5 can clean the entire width direction of the substrate 2.

図3は、被洗浄面と洗浄ローラとで形成される間隙における洗浄液の流れの状態を説明する図である。以下、図2および図3を参照し、洗浄液3による被洗浄面2aの洗浄について説明する。   FIG. 3 is a diagram for explaining the state of the flow of the cleaning liquid in the gap formed by the surface to be cleaned and the cleaning roller. Hereinafter, the cleaning of the surface 2a to be cleaned with the cleaning liquid 3 will be described with reference to FIGS.

基板2は、不図示の搬送部によって矢符Sの方向に略水平姿勢を保って搬送される。基板2がS方向に搬送される状態で、洗浄液供給部4から洗浄液3を基板2の被洗浄面2aに供給し、洗浄ローラ5のローラ本体部13を矢符17方向に回転させる。このことによって、ローラ本体部13の外周面と洗浄液3との粘性摩擦により、ローラ本体部13が被洗浄面2aとローラ本体部13との間に形成される間隙6へ洗浄液3を送込むように作用するので、間隙6のローラ本体部13の被洗浄面2aに対する最近接位置の基板搬送方向Sの下流側と上流側とにおいて、基板搬送方向Sに逆行する矢符18と矢符19とで示す洗浄液3の流れが発生する。   The board | substrate 2 is conveyed by the conveyance part not shown in the direction of arrow S, maintaining a substantially horizontal attitude | position. In a state where the substrate 2 is conveyed in the S direction, the cleaning liquid 3 is supplied from the cleaning liquid supply unit 4 to the surface 2a to be cleaned, and the roller main body 13 of the cleaning roller 5 is rotated in the direction of arrow 17. As a result, due to the viscous friction between the outer peripheral surface of the roller main body 13 and the cleaning liquid 3, the roller main body 13 sends the cleaning liquid 3 into the gap 6 formed between the surface to be cleaned 2a and the roller main body 13. Therefore, the arrows 18 and 19 reverse to the substrate transport direction S on the downstream side and the upstream side in the substrate transport direction S at the closest position to the surface to be cleaned 2a of the roller body 13 of the gap 6 The flow of the cleaning liquid 3 shown in FIG.

このとき、間隙6における洗浄液3には、矢符Sの方向へ搬送される基板2の被洗浄面2aの移動と、ローラ本体部13の矢符17方向へ回転とによって付加されるせん断力が作用するので、せん断流れ20が形成される。このせん断流れ20が形成されることによって、被洗浄面2aのごく近傍における洗浄液3の流れ20aが発生するので、被洗浄面2aに付着する微細な異物が流れ20aから力を受け、被洗浄面2aから除去される。   At this time, the shearing force applied to the cleaning liquid 3 in the gap 6 by the movement of the surface 2a to be cleaned 2 conveyed in the direction of the arrow S and the rotation in the direction of the arrow 17 of the roller body 13 is applied. As a result, a shear flow 20 is formed. Since the shearing flow 20 is formed, a flow 20a of the cleaning liquid 3 in the very vicinity of the surface to be cleaned 2a is generated. Therefore, fine foreign matter adhering to the surface to be cleaned 2a receives a force from the flow 20a, and the surface to be cleaned. Removed from 2a.

基板洗浄装置1では、以下のような方法によって洗浄効果を一層向上することができる。一つの方法は、ローラ本体部13の矢符17方向の回転速度を速くすることである。ローラ本体部13の矢符17方向の回転速度を速くすることによって、ローラ本体部13の外周面近傍に形成される洗浄液3の流れ20bの速度が一層速くなり、せん断流れ20の速度勾配が大きくなる。   In the substrate cleaning apparatus 1, the cleaning effect can be further improved by the following method. One method is to increase the rotational speed of the roller body 13 in the direction of the arrow 17. By increasing the rotational speed of the roller body 13 in the direction of the arrow 17, the speed of the flow 20 b of the cleaning liquid 3 formed in the vicinity of the outer peripheral surface of the roller body 13 is further increased, and the velocity gradient of the shear flow 20 is increased. Become.

速度勾配は、定性的には、ローラ本体部13の外周面近傍に形成される洗浄液3の流れ20bと、被洗浄面2aの近傍に形成される洗浄液3の流れ20aとの速度差を、被洗浄面2aとローラ本体部13が被洗浄面2aに最接近する部位とで成す間隔、すなわち間隙6の最短部分の距離h(以後、間隙距離hと呼ぶ)で除したものと考えられる。ここでは、洗浄液3の流れ20bと洗浄液3の流れ20aとの速度差が大きい場合を速度勾配が大きいと呼び、洗浄液3の流れ20bと洗浄液3の流れ20aとの速度差が小さい場合を速度勾配が小さいと呼ぶことにする。   The velocity gradient qualitatively represents the difference in velocity between the flow 20b of the cleaning liquid 3 formed near the outer peripheral surface of the roller body 13 and the flow 20a of the cleaning liquid 3 formed near the surface 2a to be cleaned. This is considered to be divided by the distance formed between the cleaning surface 2a and the roller body 13 closest to the surface to be cleaned 2a, that is, the distance h of the shortest portion of the gap 6 (hereinafter referred to as the gap distance h). Here, a case where the speed difference between the flow 20b of the cleaning liquid 3 and the flow 20a of the cleaning liquid 3 is large is called a speed gradient, and a case where the speed difference between the flow 20b of the cleaning liquid 3 and the flow 20a of the cleaning liquid 3 is small is a speed gradient. Let's call it small.

せん断流れ20の速度勾配が大きくなる、すなわち洗浄液3の流れ20bの速度が速くなるのに伴って、被洗浄面2aの近傍における洗浄液3の流れ20aの速度も速められることになるので、被洗浄面2aに付着する微細な異物が、流れから受ける力を大きくして除去効果を向上することができる。   Since the velocity gradient of the shear flow 20 is increased, that is, the velocity of the flow 20b of the cleaning liquid 3 is increased, the velocity of the flow 20a of the cleaning liquid 3 in the vicinity of the surface to be cleaned 2a is also increased. The removal effect can be improved by increasing the force that the fine foreign matter adhering to the surface 2a receives from the flow.

洗浄効果を一層向上させるもう一つの方法は、間隙距離hを小さくすることである。間隙距離hを小さくすることによって、ローラ本体部13の外周面と洗浄液3との粘性摩擦によって洗浄液3のせん断流れ20を形成する力を、より被洗浄面2aに近い側の洗浄液3にまで及ぼすことができるので、被洗浄面2aの近傍における洗浄液3の流れ20aの速度を速め、被洗浄面2aに付着する微細な異物が、流れから受ける力を大きくして除去効果を向上することができる。   Another method for further improving the cleaning effect is to reduce the gap distance h. By reducing the gap distance h, the force that forms the shear flow 20 of the cleaning liquid 3 by the viscous friction between the outer peripheral surface of the roller body 13 and the cleaning liquid 3 is exerted on the cleaning liquid 3 closer to the surface to be cleaned 2a. Therefore, the speed of the flow 20a of the cleaning liquid 3 in the vicinity of the surface to be cleaned 2a can be increased, and the fine foreign matter adhering to the surface to be cleaned 2a can increase the force received from the flow to improve the removal effect. .

このように洗浄効果に寄与する間隙距離hは、3mm以下になるように設定されることが好ましく、より好ましくは1mm以下である。間隙距離hが3mmを超えると、ローラ本体部13と洗浄液3との粘性摩擦によって洗浄液3のせん断流れ20を形成する力が、被洗浄面2aの近傍にまで及びにくくなるので、被洗浄面2aの近傍に形成されるせん断流れ20aの速度が遅く、微細な異物を充分に除去することができない。   Thus, the gap distance h contributing to the cleaning effect is preferably set to be 3 mm or less, and more preferably 1 mm or less. If the gap distance h exceeds 3 mm, the force that forms the shear flow 20 of the cleaning liquid 3 due to the viscous friction between the roller body 13 and the cleaning liquid 3 does not reach the vicinity of the surface to be cleaned 2a. The speed of the shearing flow 20a formed in the vicinity of is low, and fine foreign matters cannot be sufficiently removed.

間隙距離hは、小さいほど、ローラ本体部13と洗浄液3との粘性摩擦によって洗浄液3のせん断流れ20を形成する力が、被洗浄面2aの近傍にまで及び易くなるので好ましい。しかしながら、間隙距離hが小さ過ぎると、ローラ本体部13の外周面が被洗浄面2aに接触するおそれがあるので、約50μm以上に設定されることが好ましい。   The smaller the gap distance h, the better because the force that forms the shear flow 20 of the cleaning liquid 3 due to viscous friction between the roller body 13 and the cleaning liquid 3 easily reaches the vicinity of the surface to be cleaned 2a. However, if the gap distance h is too small, the outer peripheral surface of the roller body 13 may come into contact with the surface to be cleaned 2a.

また本実施形態では、洗浄液3として純水または超純水を用い、洗浄ローラ5のローラ本体部13には親水処理層16が形成されるので、ローラ本体部13の外周面と洗浄液3との粘性摩擦を大きくすることができる。したがって、ローラ本体部13の矢符17の方向への回転速度を速くしなくても、また間隙距離hを小さくしなくても、ローラ本体部13の外周面と洗浄液3との粘性摩擦の増大によって、ローラ本体部13の外周面近傍の洗浄液3の流れ20bの速度を速くすることができ、速度勾配を大きくすることができるので、被洗浄面2aの近傍における洗浄液3の流れ20aの速度も速められ、被洗浄面2aに付着する微細な異物が、流れから受ける力を大きくして除去効果を向上することができる。   In this embodiment, pure water or ultrapure water is used as the cleaning liquid 3, and the hydrophilic treatment layer 16 is formed on the roller main body 13 of the cleaning roller 5, so that the outer peripheral surface of the roller main body 13 and the cleaning liquid 3 The viscous friction can be increased. Therefore, the viscous friction between the outer peripheral surface of the roller body 13 and the cleaning liquid 3 is increased without increasing the rotational speed of the roller body 13 in the direction of the arrow 17 and without reducing the gap distance h. As a result, the speed of the flow 20b of the cleaning liquid 3 in the vicinity of the outer peripheral surface of the roller main body 13 can be increased, and the speed gradient can be increased. Therefore, the speed of the flow 20a of the cleaning liquid 3 in the vicinity of the surface to be cleaned 2a is also increased. The removal effect can be improved by increasing the force received from the flow by the fine foreign matter that is accelerated and adheres to the surface to be cleaned 2a.

また本発明の基板洗浄装置1においては、洗浄ローラ5の矢符17方向の回転によって、基板2の搬送方向上流側へ流れる洗浄液3は、矢符S方向に搬送される基板2の被洗浄面2aとの表面張力の作用によって、洗浄ローラ5の方向へ戻される。この洗浄ローラ5の方向へ戻る洗浄液3は、洗浄液供給部4から供給される洗浄液3を間隙6に貯留するように一種の堰として作用するので、洗浄液供給部4から供給され、間隙6において洗浄に寄与する洗浄液3の量を少量に抑えることが可能になる。   Further, in the substrate cleaning apparatus 1 of the present invention, the cleaning liquid 3 flowing to the upstream side in the transport direction of the substrate 2 by the rotation of the cleaning roller 5 in the direction of the arrow 17 causes the surface to be cleaned of the substrate 2 transported in the arrow S direction. It is returned to the cleaning roller 5 by the action of the surface tension with 2a. The cleaning liquid 3 returning to the direction of the cleaning roller 5 acts as a kind of weir so that the cleaning liquid 3 supplied from the cleaning liquid supply unit 4 is stored in the gap 6, and is supplied from the cleaning liquid supply unit 4. It is possible to keep the amount of the cleaning liquid 3 that contributes to a small amount.

図4は、本発明の実施の第2形態である基板洗浄装置21の構成を簡略化して示す側面図である。本実施形態の基板洗浄装置21は、実施の第1形態の基板洗浄装置1に類似し、対応する部分については同一の参照符号を付して説明を省略する。   FIG. 4 is a side view showing a simplified configuration of the substrate cleaning apparatus 21 according to the second embodiment of the present invention. The substrate cleaning apparatus 21 of the present embodiment is similar to the substrate cleaning apparatus 1 of the first embodiment, and corresponding portions are denoted by the same reference numerals and description thereof is omitted.

基板洗浄装置21において注目すべきは、洗浄ローラ5を、被洗浄面2aに対して接近させ、また離反させるローラ昇降手段22と、基板2を略水平方向に搬送する搬送手段23と、被洗浄面2aに供給されて被洗浄面2aから離脱する洗浄液3を回収する回収手段24とを含むことである。   What should be noted in the substrate cleaning apparatus 21 is that the cleaning roller 5 is moved closer to and away from the surface 2a to be cleaned, a roller lifting and lowering means 22, a transport means 23 for transporting the substrate 2 in a substantially horizontal direction, and a target to be cleaned. And a recovery means 24 that recovers the cleaning liquid 3 that is supplied to the surface 2a and leaves the surface 2a to be cleaned.

ローラ昇降手段22は、たとえばボールねじと、ボールねじのねじ軸を回転駆動させる電動機とを含んで構成され、基板洗浄装置21の不図示のフレームに装着される。ローラ昇降手段22のボールねじのナットは、アーム部15に装着される。ナットに螺合するボールねじのねじ軸は、上記装置のフレームに回転自在に装着される。   The roller lifting / lowering means 22 includes, for example, a ball screw and an electric motor that rotationally drives the screw shaft of the ball screw, and is mounted on a frame (not shown) of the substrate cleaning apparatus 21. The nut of the ball screw of the roller lifting / lowering means 22 is attached to the arm portion 15. A screw shaft of a ball screw that is screwed onto the nut is rotatably mounted on the frame of the device.

ボールねじのナットに螺合されるねじ軸が回転駆動されることによって、ナットはねじ軸に対して相対的に往復運動する。このボールねじのナットの往復運動に従って、ナットが装着されるアーム部15に支持される洗浄ローラ5が、被洗浄面2aに接近し、また被洗浄面2aから離反するように移動、すなわち昇降することができる。   When the screw shaft that is screwed into the nut of the ball screw is driven to rotate, the nut reciprocates relative to the screw shaft. In accordance with the reciprocating motion of the nut of the ball screw, the cleaning roller 5 supported by the arm portion 15 to which the nut is attached moves toward the cleaned surface 2a and moves away from the cleaned surface 2a, that is, moves up and down. be able to.

洗浄される基板2の厚さに応じ、ローラ昇降手段22で洗浄ローラ5を昇降させることによって、上記間隙距離hを3mm以下の所望の大きさに設定することが可能である。   The gap distance h can be set to a desired size of 3 mm or less by moving the cleaning roller 5 up and down by the roller lifting means 22 according to the thickness of the substrate 2 to be cleaned.

搬送手段23は、幅方向に回転軸が延び、回転自在に設けられる複数の搬送ローラ25と、搬送ローラ25を矢符26方向に回転駆動させる不図示の搬送ローラ駆動手段とを含んで構成される。搬送ローラ駆動手段は、個々の搬送ローラごとに駆動源が設けられる構成であってもよく、また1個または数個の駆動源の駆動力が、チェーンまたはベルトなどで複数の搬送ローラ25に伝達される構成であってもよい。   The conveyance means 23 includes a plurality of conveyance rollers 25 that are rotatably provided with a rotation axis extending in the width direction, and conveyance roller drive means (not shown) that rotationally drives the conveyance rollers 25 in the direction of the arrow 26. The The conveying roller driving means may be configured such that a driving source is provided for each individual conveying roller, and the driving force of one or several driving sources is transmitted to a plurality of conveying rollers 25 by a chain or a belt. It may be configured.

複数の搬送ローラ25は、洗浄ローラ5および洗浄液供給部4の下方において、回転頂部を連ねる仮想平面27が水平面と略平行になるように配置され、前記回転頂部を連ねる仮想平面27が基板2のパスラインを構成する。基板2は、複数の搬送ローラ25の上に戴置され、搬送ローラ25が回転駆動されることによって、予め定める1方向である矢符Sで示す方向に、水平姿勢を保って搬送される。   The plurality of transport rollers 25 are arranged below the cleaning roller 5 and the cleaning liquid supply unit 4 so that a virtual plane 27 connecting the rotation tops is substantially parallel to a horizontal plane, and the virtual plane 27 connecting the rotation tops is the substrate 2. Configure the pass line. The board | substrate 2 is mounted on the some conveyance roller 25, and when the conveyance roller 25 is rotationally driven, it is conveyed in the direction shown by the arrow S which is a predetermined one direction, maintaining a horizontal attitude | position.

回収手段24は、複数の搬送ローラ25の下方に設けられる洗浄液回収槽28と、洗浄液回収槽28に接続される回収配管29と、回収配管に接続される不図示の使用済み洗浄液貯留槽とを含んで構成される。洗浄液回収槽28は、たとえばステンレス鋼などからなるパレット状の槽であり、その洗浄ローラ5の下方に位置する部分には、洗浄液回収槽28の底壁部を貫通して排水口30が形成され、排水口30に回収配管29が接続される。   The recovery means 24 includes a cleaning liquid recovery tank 28 provided below the plurality of transport rollers 25, a recovery pipe 29 connected to the cleaning liquid recovery tank 28, and a used cleaning liquid storage tank (not shown) connected to the recovery pipe. Consists of including. The cleaning liquid recovery tank 28 is a pallet-shaped tank made of, for example, stainless steel, and a drain port 30 is formed in a portion located below the cleaning roller 5 through the bottom wall of the cleaning liquid recovery tank 28. The recovery pipe 29 is connected to the drain port 30.

洗浄液供給部4から被洗浄面2aに供給された洗浄液3は、ある程度の量が被洗浄面2a上に滞留すると、余剰分が基板2から離脱、すなわちこぼれ始め、基板2から離脱した洗浄液3が洗浄液回収槽28に回収される。洗浄液回収槽28に回収された洗浄液3は、洗浄液回収槽28の底壁部に形成される排水口30から回収配管29へと流過し、回収配管29を通って基板洗浄装置21の本体外に設けられる使用済み洗浄液貯留槽に貯留される。   When a certain amount of the cleaning liquid 3 supplied to the surface to be cleaned 2a from the cleaning liquid supply unit 4 stays on the surface to be cleaned 2a, the excess liquid starts to detach from the substrate 2, that is, spills. It is recovered in the cleaning liquid recovery tank 28. The cleaning liquid 3 recovered in the cleaning liquid recovery tank 28 flows from the drain port 30 formed in the bottom wall portion of the cleaning liquid recovery tank 28 to the recovery pipe 29, and passes through the recovery pipe 29 to the outside of the main body of the substrate cleaning apparatus 21. Is stored in a used cleaning liquid storage tank.

なお、回収配管29の途中または使用済み洗浄液貯留槽に隣り合うようにして、フィルタなどを含む洗浄液の浄化装置を設けるようにしてもよい。浄化装置を設け、浄化された洗浄液を洗浄液供給手段の洗浄液貯留槽へ戻すことによって、洗浄液の繰返し使用が可能になり、洗浄液コストを節減することができる。   A cleaning liquid purification device including a filter or the like may be provided in the middle of the recovery pipe 29 or adjacent to the used cleaning liquid storage tank. By providing the purification device and returning the purified cleaning liquid to the cleaning liquid storage tank of the cleaning liquid supply means, the cleaning liquid can be used repeatedly, and the cost of the cleaning liquid can be reduced.

基板洗浄装置21では、洗浄される基板2が、搬送ローラ25によって矢符S方向に水平姿勢を保った状態で搬送され、洗浄ローラ5および洗浄液供給部4の下方を通過するように移動する。基板2が搬送されて洗浄ローラ5および洗浄液供給部4の下方に位置するとき、洗浄液供給部4から被洗浄面2aに供給された洗浄液3が、洗浄ローラ5のローラ本体部13の回転によって間隙6へ送込まれる。   In the substrate cleaning apparatus 21, the substrate 2 to be cleaned is transported by the transport roller 25 while maintaining a horizontal posture in the arrow S direction, and moves so as to pass below the cleaning roller 5 and the cleaning liquid supply unit 4. When the substrate 2 is conveyed and positioned below the cleaning roller 5 and the cleaning liquid supply unit 4, the cleaning liquid 3 supplied from the cleaning liquid supply unit 4 to the surface 2 a to be cleaned is separated by the rotation of the roller body 13 of the cleaning roller 5. 6 is sent.

間隙6へ送込まれる洗浄液3は、ローラ本体部13の外周面との粘性摩擦によってせん断流れ20が形成される。被洗浄面2aの近傍に形成されるせん断流れ20aによって、被洗浄面2aに付着する微細な異物が除去洗浄される。さらに基板2が、矢符S方向に搬送され、洗浄ローラ5の下方を被洗浄面2aの全面が通過することによって、その全面が洗浄される。   The cleaning liquid 3 fed into the gap 6 forms a shear flow 20 by viscous friction with the outer peripheral surface of the roller main body 13. By the shear flow 20a formed in the vicinity of the surface to be cleaned 2a, fine foreign substances adhering to the surface to be cleaned 2a are removed and cleaned. Further, the substrate 2 is transported in the direction of the arrow S, and the entire surface to be cleaned 2a passes below the cleaning roller 5, whereby the entire surface is cleaned.

以上に述べたように、本実施の形態では、洗浄液として純水を用いる場合を例示するけれども、これに限定されることなく、洗浄液として機能水、アルカリ水素水、オゾン水、過酸化水素水、酸などが用いられてもよい。   As described above, the present embodiment exemplifies the case where pure water is used as the cleaning liquid, but is not limited thereto, and functional water, alkaline hydrogen water, ozone water, hydrogen peroxide water, An acid or the like may be used.

本発明の実施の第1形態である基板洗浄装置1の構成を簡略化して示す上面図である。It is a top view which simplifies and shows the structure of the board | substrate cleaning apparatus 1 which is 1st Embodiment of this invention. 図1に示す基板洗浄装置1の側面図である。It is a side view of the substrate cleaning apparatus 1 shown in FIG. 被洗浄面と洗浄ローラとで形成される間隙における洗浄液の流れの状態を説明する図である。It is a figure explaining the state of the flow of the cleaning liquid in the gap formed by the surface to be cleaned and the cleaning roller. 本発明の実施の第2形態である基板洗浄装置21の構成を簡略化して示す側面図である。It is a side view which simplifies and shows the structure of the board | substrate cleaning apparatus 21 which is 2nd Embodiment of this invention.

符号の説明Explanation of symbols

1,21 基板洗浄装置
2 基板
3 洗浄液
4 洗浄液供給部
5 洗浄ローラ
6 間隙
22 ローラ昇降手段
23 搬送手段
24 回収手段
DESCRIPTION OF SYMBOLS 1,21 Substrate cleaning apparatus 2 Substrate 3 Cleaning liquid 4 Cleaning liquid supply part 5 Cleaning roller 6 Gap 22 Roller raising / lowering means 23 Conveying means 24 Recovery means

Claims (9)

基板の一方の面である被洗浄面に洗浄液を供給して洗浄する基板洗浄装置において、
基板の被洗浄面を臨んで設けられ、基板の被洗浄面に洗浄液を供給する洗浄液供給部と、
基板の被洗浄面を臨み洗浄液供給部と略平行になるように設けられる洗浄ローラであって、回転することによって洗浄液を基板の被洗浄面との間に形成される間隙へ送込む洗浄ローラとを含むことを特徴とする基板洗浄装置。
In a substrate cleaning apparatus for supplying a cleaning liquid to a surface to be cleaned which is one surface of a substrate and cleaning it,
A cleaning liquid supply unit that faces the surface to be cleaned of the substrate and supplies a cleaning liquid to the surface to be cleaned of the substrate;
A cleaning roller provided so as to face the surface to be cleaned of the substrate so as to be substantially parallel to the cleaning liquid supply unit, and the cleaning roller that rotates to send the cleaning liquid to a gap formed between the surface to be cleaned and the substrate; A substrate cleaning apparatus comprising:
洗浄ローラを、基板の被洗浄面に対して接近させ、また離反させるローラ昇降手段を含むことを特徴とする請求項1記載の基板洗浄装置。   2. The substrate cleaning apparatus according to claim 1, further comprising roller lifting / lowering means for moving the cleaning roller toward and away from the surface to be cleaned. 基板を略水平方向に搬送する搬送手段を含むことを特徴とする請求項1または2記載の基板洗浄装置。   The substrate cleaning apparatus according to claim 1, further comprising a transport unit configured to transport the substrate in a substantially horizontal direction. 洗浄ローラは、その外周面が親水性を有することを特徴とする請求項1〜3のいずれか1つに記載の基板洗浄装置。   The substrate cleaning apparatus according to claim 1, wherein an outer peripheral surface of the cleaning roller is hydrophilic. 基板の被洗浄面に供給されて被洗浄面から離脱する洗浄液を回収する回収手段を含むことを特徴とする請求項1〜4のいずれか1つに記載の基板洗浄装置。   The substrate cleaning apparatus according to claim 1, further comprising a recovery unit that recovers a cleaning liquid that is supplied to the surface to be cleaned of the substrate and leaves the surface to be cleaned. 洗浄ローラが最も被洗浄面に接近する部位と、被洗浄面との間隔が、3mm以下であることを特徴とする請求項1〜5のいずれか1つに記載の基板洗浄装置。   The substrate cleaning apparatus according to claim 1, wherein a distance between a portion where the cleaning roller is closest to the surface to be cleaned and the surface to be cleaned is 3 mm or less. 基板の一方の面である被洗浄面に洗浄液を供給して洗浄する基板洗浄方法において、
基板の被洗浄面を臨んで設けられる洗浄液供給部から基板の被洗浄面に対して洗浄液を供給するステップと、
基板の被洗浄面を臨み洗浄液供給部と略平行になるように設けられる洗浄ローラの回転によって、洗浄液を基板の被洗浄面と洗浄ローラとの間に形成される間隙へ送込むステップとを含むことを特徴とする基板洗浄方法。
In the substrate cleaning method of cleaning by supplying a cleaning liquid to the surface to be cleaned, which is one surface of the substrate,
Supplying a cleaning liquid to a surface to be cleaned from a cleaning liquid supply unit provided facing the surface to be cleaned of the substrate;
A step of feeding a cleaning liquid into a gap formed between the surface to be cleaned and the cleaning roller by rotation of a cleaning roller provided so as to face the surface to be cleaned of the substrate and to be substantially parallel to the cleaning liquid supply unit. And a substrate cleaning method.
洗浄される基板を略水平姿勢に保つことを特徴とする請求項7記載の基板洗浄方法。   8. The substrate cleaning method according to claim 7, wherein the substrate to be cleaned is maintained in a substantially horizontal posture. 洗浄液には、比抵抗が10MΩ・cm以上の純水が用いられることを特徴とする請求項7または8記載の基板洗浄方法。


9. The substrate cleaning method according to claim 7, wherein pure water having a specific resistance of 10 MΩ · cm or more is used as the cleaning liquid.


JP2006018117A 2006-01-26 2006-01-26 Substrate cleaning device and substrate cleaning method Pending JP2007201186A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010087444A (en) * 2008-10-03 2010-04-15 Fujitsu Ltd Ultrasonic irradiation device, cleaning device, and cleaning method
JP2013138089A (en) * 2011-12-28 2013-07-11 Ebara Corp Liquid scattering prevention cup, substrate processing apparatus including liquid scattering prevention cup, and substrate polishing apparatus
US8748062B2 (en) 2011-04-26 2014-06-10 Osaka University Method of cleaning substrate
JP2014109670A (en) * 2012-11-30 2014-06-12 Hoya Corp Method of producing member for lithography, method of producing reflection type mask blank, method of producing mask blank, method of producing reflection type mask, method of producing mask and washing apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010087444A (en) * 2008-10-03 2010-04-15 Fujitsu Ltd Ultrasonic irradiation device, cleaning device, and cleaning method
US8748062B2 (en) 2011-04-26 2014-06-10 Osaka University Method of cleaning substrate
JP2013138089A (en) * 2011-12-28 2013-07-11 Ebara Corp Liquid scattering prevention cup, substrate processing apparatus including liquid scattering prevention cup, and substrate polishing apparatus
JP2014109670A (en) * 2012-11-30 2014-06-12 Hoya Corp Method of producing member for lithography, method of producing reflection type mask blank, method of producing mask blank, method of producing reflection type mask, method of producing mask and washing apparatus

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