CN102915940A - Substrate surface processing system having compact structure and substrate surface treatment method - Google Patents
Substrate surface processing system having compact structure and substrate surface treatment method Download PDFInfo
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- CN102915940A CN102915940A CN2012102773541A CN201210277354A CN102915940A CN 102915940 A CN102915940 A CN 102915940A CN 2012102773541 A CN2012102773541 A CN 2012102773541A CN 201210277354 A CN201210277354 A CN 201210277354A CN 102915940 A CN102915940 A CN 102915940A
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Abstract
The present invention provides a substrate surface treatment system having a compact structure and a substrate surface treatment method. The substrate surface treatment system comprises: a first treatment chamber including an inlet at a first end portion and extending along a direction parallel to the ground; a second treatment chamber extending along a direction perpendicular to the direction of the ground, wherein the second end portion of the first treatment chamber is attached to the upper portion of the second treatment chamber at the position of the first end portion of the second treatment chamber; a third treatment chamber extending along the direction parallel to the ground, and located under the first treatment chamber, and having an outlet at the first end portion, wherein the lower portion, located in the first end portion of the second treatment chamber, of the second treatment chamber is attached to the third treatment chamber at the position of the second end of the third treatment chamber; a first horizontal transfer unit; a second horizontal transfer unit; a vertical transfer unit; a third horizontal transfer unit; and a treatment module installed in at least one of the first treatment chamber to the third treatment chamber and treatment a substrate surface.
Description
Technical field
The present invention relates to a kind of substrate surface treatment system and a kind of method for processing surface of substrate, more specifically, relate to a kind of substrate surface treatment system and a kind of method for processing surface of substrate with cramped construction.
Background technology
Be formed with the driving element that comprises a plurality of thin-film transistors (thin-film transistor, TFT) at the substrate that is used to form organic illuminated display element or liquid crystal display cells.
For forming this kind driving element, form silicon fiml at substrate, for example polysilicon film.Polysilicon film is by with crystallization processes (for example ELA) the amorphous silicon film crystallization being formed.Polysilicon film is patterned, with the active layer (active layer) as TFT.
Yet natural feature becomes to have silicon oxide film on the surface of amorphous silicon film and/or polysilicon film.
Silicon oxide film can adversely affect crystallization processes.In addition, silicon oxide film can affect the characteristic of TFT, and can become pollutant sources (for example particle sources) in manufacture process.Therefore, need to be before crystallization processes and/or remove afterwards silicon oxide film.
And, because the polysilicon film that forms has high surface roughness, thereby need to improve the surface evenness of polysilicon film in crystallization processes.
Owing to these reasons, need to be formed with by silicon fiml being carried out etching the substrate surface of silicon fiml above processing.
The open case 2004-006618 of Japanese Patent Laid discloses a kind of conventional substrate Etaching device for spray etchant to substrate in the substrate rotation.Yet, although the method for spraying etchant to substrate in substrate rotation is applicable to small-sized substrate (the 4th generation substrate (730 * 460mm) or less substrate) for example, yet be difficult to the method be used for large substrate (for example the 5.5th generation substrate (1,300 * 1,500mm) or larger substrate).Reason is, is difficult to make large substrate rotation, even and can make large substrate rotation, rotary speed also can be reduced to 600RPM or following, thereby after etching, may form stain at substrate.In addition, the central part of substrate and edge part can be by unevenly etchings, and because the inwall of etchant bump etching chamber and being sprung back on the substrate can form stain at substrate.
For addressing the above problem, the substrate surface treatment system can be arranged in in-line arrangement (inline) system.Yet in this kind situation, the substrate surface treatment system may have excessive length.Thus, just need larger space to come the installation base plate superficial treatment system.
Korean Patent special permission communique discloses a kind of system with two-layer stratigraphic structure 2007-0048036 number, and described two-layer stratigraphic structure comprises upper strata and lower floor.In the system that discloses, will carry out vertically stacked be used to two layers that carry out same operation, to increase the quantity of substrate to be dealt with.Yet the system that discloses provides the inline system that has straight line path for single technique, thereby the overall length of substrate surface treatment system is reduced.
Summary of the invention
The invention provides a kind of when mounted without the substrate surface treatment system with cramped construction and a kind of method for processing surface of substrate of spatial limitation.
According to an aspect of the present invention, provide a kind of substrate surface treatment system, comprising: the first treatment chamber comprises that at the first end place entrance and edge are parallel to the direction extension on ground; The second treatment chamber is extended along the direction perpendicular to ground, and the second end of wherein said the first treatment chamber is attached to the top of described the second treatment chamber at the first end place of described the second treatment chamber; The 3rd treatment chamber, extend along the direction that is parallel to ground, be positioned at the below of described the first treatment chamber, and having outlet at the first end place, the bottom of described the second treatment chamber that wherein is positioned at the described first end place of described the second treatment chamber is attached to described the 3rd treatment chamber at the second end place of described the 3rd treatment chamber; The first horizontal transfer unit is installed in described the first treatment chamber and along first direction and flatly transmits substrate towards described the second treatment chamber; The second horizontal transfer unit is installed on and also flatly transmits described substrate in described the second treatment chamber; Vertical delivery unit is installed in described the second treatment chamber, and is combined with described the second horizontal transfer unit, and vertically upwards and move down described the second horizontal transfer unit; The 3rd horizontal transfer unit is installed in described the 3rd treatment chamber and the edge second direction relative with described first direction flatly transmits the described substrate of discharging from described the second treatment chamber; And processing module, be installed on described the first treatment chamber to described the 3rd treatment chamber in one of them and the surface of processing described substrate at least.
Described substrate surface treatment system can further comprise pre-moistening unit, and described pre-moistening unit is arranged in described the first treatment chamber and the surface of pre-wetting described substrate.
Described substrate surface treatment system can further comprise following at least one of them: the flushing unit is arranged in described the 3rd treatment chamber and washes the surface of described substrate; And drying unit, be arranged in described the 3rd treatment chamber and the surface of dry described substrate.
Described substrate surface treatment system can further comprise fan filtering unit, and described fan filtering unit is installed on described the first treatment chamber to described the 3rd treatment chamber at least in one of them.
Described processing module can be arranged in described the 3rd treatment chamber.
Described substrate surface treatment system can further comprise tilt drive unit, one of them at least a portion is combined at least to described the 3rd horizontal transfer unit for described tilt drive unit and described the first horizontal transfer unit, and described the first horizontal transfer unit to described at least one of them the described at least part of described the 3rd horizontal transfer unit is tilted.
Described the first horizontal transfer unit or described the 3rd horizontal transfer unit can comprise a plurality of the first driven rollers and a plurality of the second driven roller, described a plurality of the first driven roller can be oriented to compare the more close described entrance of described a plurality of the second driven roller or described outlet, and the diameter of described a plurality of the first driven rollers can be greater than the diameter of described a plurality of the second driven rollers.
Described the second horizontal transfer unit can comprise a plurality of driven rollers.
Described processing module can comprise fluid ejection module and air injection modules, described fluid ejection module and described air injection modules are integrated into single unit, described fluid ejection module can spray towards described substrate the etchant of at least a type, the etchant of described at least a type can the described substrate of etching described lip-deep silicon fiml, and described air injection modules can be to described jet surface fluid cutting (fluid-cutting) air of described substrate.
Described fluid ejection module and described air injection modules can be configured to work simultaneously.
Described processing module can comprise a plurality of nozzles.
One of them can be configured to along the vertical linear ground of described substrate mobile at least for described substrate and described processing module.
According to a further aspect in the invention, provide a kind of method for processing surface of substrate, comprising: the first horizontal transmission is used for flatly transmitting substrate along first direction; Transmit downward vertically, be used for vertically falling described substrate; The second horizontal transmission is used for flatly transmitting described substrate along the second direction relative with described first direction; And surface treatment, be used for described the first horizontal transmission, the described transmission downward vertically and described the second horizontal transmission at least during one of them, or described the first horizontal transmission, the described transmission downward vertically and surface that described substrate is wherein processed in described the second horizontal transmission at least between the two.
Described the first horizontal transmission can comprise the surface of pre-wetting described substrate.
Described the second horizontal transmission can comprise at least one in the surface of the surface of washing described substrate and dry described substrate.
Described surface treatment can be carried out between described downward vertically transmission and described the second horizontal transmission.
Described the first horizontal transmission, described transmit downward vertically and described the second horizontal transmission one of them can comprise and makes described substrate with respect to ground inclination at least.
Describedly make described substrate tilt to comprise described substrate is inclined to the surface that makes described substrate to tilt with respect to the direction vertical with described first direction or described second direction.
Described surface treatment can comprise that one of them provides the surface to described substrate at least with the etchant of at least a type and fluid cutting air, the lip-deep silicon fiml that the etchant of described at least a type can the described substrate of etching.
Described etchant and described fluid cutting air can be provided during described surface treatment simultaneously.
Description of drawings
By the exemplary embodiment that present invention will be described in detail with reference to the accompanying, above-mentioned and other feature of the present invention and advantage will become more very clear.In the accompanying drawing:
Fig. 1 is the schematic diagram of substrate surface treatment system according to an embodiment of the invention.
Fig. 2 A and Fig. 2 B are respectively the figure that shows the first driven roller and the second driven roller.
Fig. 3 is the plane graph of drying unit shown in Figure 1.
Fig. 4 shows the first horizontal transfer unit be installed in the first treatment chamber and the figure of vertical delivery unit.
Fig. 5 is the transverse sectional view of the first horizontal transfer unit shown in Figure 4 and working fluid exhaust unit.
Fig. 6 to Figure 10 is the schematic diagram that shows according to the substrate surface treatment system with processing module of other embodiments of the invention.
Figure 11 shows according to an embodiment of the invention processing module.
Figure 12 shows according to another embodiment of the present invention processing module.
Figure 13 to Figure 17 is the schematic diagram according to the substrate surface treatment system of other embodiments of the invention.
Figure 18 shows according to another embodiment of the present invention substrate surface treatment system.
Figure 19 shows according to another embodiment of the present invention substrate surface treatment system.
Figure 20 A and Figure 20 B are the figure of the inclination of display base plate.
Figure 21 shows the according to another embodiment of the present invention figure of the second horizontal transfer unit.
The explanation of symbol:
10: substrate
11: basal substrate
12: silicon fiml
13: silicon oxide film
35: the first containers
36: the first open/close valves
45: the second containers
55: the three containers
56: the three open/close valves
56a: the 3rd open/close valves
56b: the 3rd open/close valves
65: air tank
66: the four open/close valves
70: control unit
100: the substrate surface treatment system
110: the first treatment chamber
111: entrance
114: the first fan filtering units
120: the second treatment chamber
121: the substrate entrance
122: the substrate outlet
123: sidewall
124: the second fan filtering units
130: the three treatment chamber
131: outlet
134: the three fan filter elements
141: the first horizontal transfer unit
142: the second horizontal transfer unit
143: the three horizontal transfer unit
144: the first driven rollers
145: the second driven rollers
146: framework
146a: the first framework
146b: the second framework
146c: the 3rd framework
146d: the 4th framework
147: support bar
148: support roller
149a: gear
149b: helical gear
150: vertical delivery unit
150a: the first vertical delivery unit
150b: the second vertical delivery unit
151: loading zone
152: pre-wetted area
153: the surface treatment district
154: rinsing area
155: dry section
156: unload zone
161: the first plasma feeding units
162: the second plasma feeding units
163: pre-moistening unit
164: the first flushing unit
165: the second flushing unit
166: aqueous jet
167: drying unit
167a: nozzle unit
171: position adjustment unit
172: pin
180: processing module
180a: fluid ejection module
180b: air injection modules
181: the first processing modules
182: the second processing modules
183: the three processing modules
184: the Fluid injection hole
185: fluid supply tube
186: air jet hole
187: the air supply pipe
188: combined bracket
190: the working fluid exhaust unit
191: the discharging connector
192: delivery pipe
193: roller
194: conduit
201: the first supply pipes
202: the second supply pipes
203: the first blocks
204: the second blocks
206: the three supply pipes
207: the four supply pipes
210: nozzle
300: nozzle
301: the first nozzles
302: second nozzle
303: the three nozzles
d
1: diameter
d
2: diameter
P1: primary importance
P2: the second place
X1: first direction
X2: second direction
Embodiment
Below, will describe the present invention in detail by being explained with reference to the drawings the preferred embodiments of the present invention.
Fig. 1 is the schematic diagram of substrate surface treatment system 100 according to an embodiment of the invention.
As shown in Figure 1, substrate surface treatment system 100 comprises the first treatment chamber 110, the second treatment chamber 120 and the 3rd treatment chamber 130.
The first treatment chamber 110 is attached to the top of the sidewall 123 of the second treatment chamber 120, and is formed along the direction extension that is parallel to ground.The first end place of the first treatment chamber 110 is formed with entrance 111, and substrate 10 is to be introduced in the first treatment chamber 110 via entrance 111 by independent transfer robot (not shown).
The second treatment chamber 120 is extended along the direction perpendicular to ground, and the first end of the second treatment chamber 120 is attached to the second end of the first treatment chamber 110.
Be formed with substrate entrance 121 and substrate outlet 122 in the sidewall 123 of the second treatment chamber 120.Herein, substrate entrance 121 is formed at the top of substrate outlet 122.Substrate entrance 121 and substrate outlet 122 are arranged at the direction that is parallel to ground along on the line that extends perpendicular to the direction on ground and edge extends, and is respectively applied to be carried to substrate 10 in the second treatment chamber 120 and substrate 10 is carried out the second treatment chamber 120.Can omit sidewall 123, substrate entrance 121, reach substrate outlet 122, and the part of sidewall 123 can only be set.
The 3rd treatment chamber 130 extends and is arranged at the below of the first treatment chamber 110 along the direction that is parallel to ground.The first end place of the 3rd treatment chamber 130 is formed with outlet 131, and the second end of the 3rd treatment chamber 130 is attached to the first end of the second treatment chamber 120.The 3rd treatment chamber 130 is communicated with substrate outlet 122.
Outside the outlet 131 of the 3rd treatment chamber 130, be provided with for the transfer robot (not shown) that after surface treatment, substrate 10 is carried out substrate surface treatment system 100.
In the first treatment chamber 110, be provided with for the first horizontal transfer unit 141 that flatly transmits substrate 10 along first direction X1 towards the second treatment chamber 120.
In the 3rd treatment chamber 130, be provided with for the 3rd horizontal transfer unit 143 that flatly transmits substrate 10 along second direction X2 (that is, the direction relative with first direction X1).
In the second treatment chamber 120, be provided with for the second horizontal transfer unit 142 that flatly transmits substrate 10 along first direction X1 and second direction X2, wherein vertical delivery unit 150 and the second horizontal transfer unit 142 are combined, vertically to make progress and to move down the second horizontal transfer unit 142.
When the second horizontal transfer unit 142 is moved upward to position corresponding to substrate entrance 121, the second horizontal transfer unit 142 is along first direction X1 (it is direction from left to right in Fig. 1) moving substrate 10 flatly, and when the second horizontal transfer unit 142 was moved downward to position corresponding to substrate outlet 122, the second horizontal transfer unit 142 was along second direction X2 (it is the direction of right-to-left in Fig. 1) moving substrate 10.
The first horizontal transfer unit 141 comprises a plurality of the first driven rollers 144 and a plurality of the second driven roller 145.
The first driven roller 144 is oriented to compare the second driven roller 145 more close entrances 111.Shown in Fig. 2 A and Fig. 2 B, the diameter d of the first driven roller 144
1Diameter d greater than the second driven roller 145
2
Because the first driven roller 144 is configured to relatively close entrance 111, thereby can relatively promptly carry substrate 10 via entrance 111, therefore, can promptly substrate 10 be carried in the first treatment chamber 110.
Because the second driven roller 145 is to transmit substrate 10 when substrate 10 being carried out particular procedure, therefore, for accurately controlling the transfer rate of substrate 10, the second driven roller 145 can be formed to be less than the first driven roller 144.
The 3rd horizontal transfer unit 143 can comprise described a plurality of the first driven roller 144 and described a plurality of the second driven roller 145.As mentioned above, the diameter d of the first driven roller 144
1Diameter d greater than the second driven roller 145
2
Because the first driven roller 144 is configured to relatively close outlet 131, thereby can relatively promptly carry out substrate 10 via outlet 131, therefore, can promptly substrate 10 be carried out the 3rd treatment chamber 130.
As mentioned above, because the second driven roller 145 is to transmit substrate 10 when substrate 10 being carried out particular procedure, therefore, for accurately controlling the transfer rate of substrate 10, the second driven roller 145 can be formed to be less than the first driven roller 144.
The second horizontal transfer unit 142 can comprise described a plurality of the second driven roller 145, and described a plurality of the second driven rollers 145 have relatively little diameter so that the second horizontal transfer unit 142 can be in the second treatment chamber 120 moving substrate 10 accurately.
In the above-described embodiments, the second driven roller 145 that is arranged in the first horizontal transfer unit 141 to the 3rd horizontal transfer unit 143 can have identical diameter.Yet the present invention is not limited only to this, and the first horizontal transfer unit 141 to the 3rd horizontal transfer unit 143 can comprise the second driven roller with different-diameter.
In the first treatment chamber 110, loading zone 151 and pre-wetted area 152 can be arranged between entrance 111 and the second treatment chamber 120 with described order.In the first horizontal transfer unit 141, the first driven roller 144 is arranged in loading zone 151, the second driven rollers 145 and then is arranged in pre-wetted area 152.
In loading zone 151, be provided with the first plasma feeding unit 161, to be used for the surface execution plasma treatment to the substrate 10 that carries via entrance 111.
Also can in pre-wetted area 152 the second plasma feeding unit 162 be set, therefore, the surface of substrate 10 will be activated before processing in the second treatment chamber 120 fully.
And nonessential arrange simultaneously the first plasma feeding unit 161 and the second plasma feeding unit 162 both, but the first plasma feeding unit 161 or the second plasma feeding unit 162 can only be set also.
In pre-wetted area 152, be provided with pre-moistening unit 163, with the surface for the pre-wetting substrate 10 that comes up by the surface that deionization (deionized water, DI) water is injected into substrate 10.
Make the moving direction of the substrate 10 that receives from the first treatment chamber 110 reverse for making the 3rd treatment chamber 130 receive substrate 10, the second treatment chamber 120.Therefore, the second treatment chamber 120 is as the direction transition zone.In addition, in the second treatment chamber 120, be provided with surface treatment district 153.
In the 3rd treatment chamber 130, rinsing area 154, dry section 155 and unload zone 156 are arranged between the second treatment chamber 120 and the outlet 131 with described order.In the 3rd horizontal transfer unit 143, the first driven roller 144 is arranged in unload zone 156, the second driven rollers 145 and then is arranged in rinsing area 154 and the dry section 155.
In rinsing area 154, be sequentially provided with the first flushing unit 164 and the second flushing unit 165.The first flushing unit 164 and the second flushing unit 165 are injected into deionized water on the surface of the substrate 10 that is carried out surface treatment district 153, so that not residual etchant on the surface of substrate 10.
Between the first flushing unit 164 and the second flushing unit 165, also be provided with aqueous jet 166, to annotate the surface of clean substrate 10 via water under high pressure.
And nonessential arrange the first flushing unit 164, the second flushing unit 165, and aqueous jet 166 in whole, but the first flushing unit 164, the second flushing unit 165, one of them is just enough at least to reach aqueous jet 166.
As shown in Figure 1, the first flushing unit 164, second washes unit 165, reaches top and below that aqueous jet 166 can be arranged at substrate 10.Therefore, can come clean substrate 10 by simultaneously deionized water being provided to end face and the bottom surface of substrate 10.
Drying unit 167 can be arranged in the dry section 155.
As shown in Figure 3, drying unit 167 comprises the nozzle unit 167a with linear shape and injection air, and wherein nozzle unit 167a can be configured to tilt with respect to the direction that moves horizontally of substrate 10.Therefore, nozzle unit 167a is injected into air along diagonal the opposed end of substrate 10 from an end of substrate 10.When nozzle unit 167a begins injection air and the opposed end end injection air on the diagonal of substrate 10 from the end of substrate 10, can more effectively remove moisture from the surface of substrate 10.As shown in Figure 1, drying unit 167 can be arranged at top and the below of substrate 10.Although in the above-described embodiments, the nozzle unit 167a of drying unit 167 be fix and substrate 10 along continuous straight runs move, the present invention is not limited only to this, but nozzle unit 167a also can move along the direction that moves horizontally of substrate 10.
Be provided with the first fan filtering unit 114 on the first treatment chamber 110.The first fan filtering unit 114 is discharged the air in the first treatment chamber 110, so that the inside of the first treatment chamber 110 keeps clean and prevents that particulate is attached to the surface of substrate 10.
Be provided with the second fan filtering unit 124 on the second treatment chamber 120, and be provided with three fan filter element 134 on the 3rd treatment chamber 130.The second fan filtering unit 124 removes the particulate in the second treatment chamber 120, and three fan filter element 134 then removes the particulate in the 3rd treatment chamber 130.
Simultaneously, as shown in Figure 4, the second horizontal transfer unit 142 in the second treatment chamber 120 comprises framework 146.Framework 146 comprises along first direction X1 and extending and the first framework 146a of being parallel to each other and the second framework 146b and the 3rd framework 146c and the 4th framework 146d that extend and be parallel to each other along the direction Y vertical with first direction X1.The first framework 146a to the four framework 146d are combined to form rectangular shape.The 3rd framework 146c that is positioned at the end place of first direction X1 is located lower than other each frameworks, to be easy to be written into substrate.
Such as Fig. 4 and shown in Figure 5, a plurality of support bars 147 are arranged on the first framework 146a and the second framework 146b with equidistant from distance.Described a plurality of the second driven roller 145 is arranged on each support bar 147 with preset space length.Two opposed ends of each support bar 147 are embedded in respectively among the first framework 146a and the second framework 146b.Two opposed end places of each support bar 147 are provided with gear 149a.Be provided with helical gear (helical gear) 149b in the first framework 146a and the second framework 146b, wherein helical gear 149b is by an independent driver element (not shown) driven rotary.Although Fig. 5 is presented at the first framework 146a and the second framework 146b and is provided with helical gear 149b among both, the present invention is not limited only to this, also can be only helical gear 149b be set in the first framework 146a and the second framework 146b in one of them.When driver element drove helical gear 149b rotation, described a plurality of support bars 147 can receive revolving force and rotation, and therefore, described a plurality of the second driven rollers 145 will rotate simultaneously.
As shown in Figure 4, vertical delivery unit 150 is attached to the bottom surface of framework 146.Vertical delivery unit 150 comprises for vertically upwards and move down the unit (for example, piston-cylinder unit) of framework 146.
As shown in Figure 4, below framework 146, be provided with position adjustment unit 171.Position adjustment unit 171 comprises a plurality of pins 172 that project upwards, and can vertically make progress by independent vertical drive units (not shown) and move down.
For example, if the substrate 10 that moves to the second horizontal transfer unit 142 top positions horizontal alignment not, then position adjustment unit 171 can move up, and directly upwards promotes substrate 10 and supporting substrate 10 so that sell 172.Thus, just can make substrate 10 horizontal alignments.Herein, pin 172 can move up to pass the space between each support bar 147 and upwards promote substrate 10.
Simultaneously, working fluid (work fluid, or cooling water) pours into from the top to helical gear 149b, to cool off helical gear 149b and to remove the particulate that produces owing to wearing and tearing.
As shown in Figure 5, working fluid exhaust unit 190 is arranged at the place, bottom surface of the first framework 146a and the second framework 146b.
Working fluid exhaust unit 190 comprises discharging connector 191, delivery pipe 192, reaches conduit (guide) 194.
Discharging connector 191 is connected to the hole that is formed among the first framework 146a, and comprises through hole (viahole), and working fluid can flow in the delivery pipe 192 via described through hole.Discharging connector 191 can be configured to when delivery pipe 192 rotation, and discharging connector 191 will rotate around the part that is attached to the first framework 146a and the second framework 146b.
Discharging connector 191 attached the first framework 146a and the second framework 146b extremely can be designed to be higher than discharging connector 191, so that working fluid can flow in the discharging connector 191.
Delivery pipe 192 has tubular form, and working fluid can flow into downwards in the delivery pipe 192.The first end of delivery pipe 192 (top) is connected to discharging connector 191, and the second end of delivery pipe 192 (bottom) is positioned at conduit 194 places.
The bottom of delivery pipe 192 can be moved and working fluid is expelled to conduit 194 along conduit 194.For realizing the level and smooth movement of delivery pipe 192 bottoms, can roller 193 be set at the place, bottom of delivery pipe 192.
Such as Fig. 4 and shown in Figure 5, in working fluid exhaust unit 190, when vertical delivery unit 150 makes progress and moves down framework 146, the bottom of delivery pipe 192 can reach left along conduit 194 and move right, therefore, working fluid among the first framework 146a and the second framework 146b delivery pipe 192 of can flowing through is discharged to subsequently conduit 194, and is stored in the independent working fluid container (not shown).
Therefore, can prevent outside working fluid overflow to the first framework 146a and the second framework 146b, thereby can prevent that the inside of the second treatment chamber 120 from being polluted by working fluid.
In addition, can prevent that the working fluid among the first framework 146a and the second framework 146b from increasing by the working fluid that immediately discharges in the first framework 146a and the second framework 146b, can prevent that therefore working fluid is introduced into for the driver element that drives helical gear 149b.
By discharging working fluid via delivery pipe 192 and conduit 194, working fluid successfully can be discharged the second treatment chamber 120.
Although Fig. 5 show working fluid exhaust unit 190 be connected to the first framework 146a and the second framework 146b both, the present invention is not limited only to this.If helical gear 149b only is installed on the first framework 146a and the second framework 146b in one of them, then working fluid exhaust unit 190 can be connected to the corresponding person among the first framework 146a and the second framework 146b.
In addition, as shown in Figure 5, if working fluid exhaust unit 190 be connected to the first framework 146a and the second framework 146b both, then two delivery pipes 192 need to be set in the mode of mutually noninterfere.Therefore, in this kind situation, two conduits 194 need to be set respectively below delivery pipe 192.
Next, elaboration is installed on substrate surface treating apparatus in the surface treatment district 153.
As shown in Figure 6, the substrate surface treating apparatus that is installed in the surface treatment district 153 comprises processing module 180, control unit 70, the first container 35 to the 3rd containers 55.
Before processing according to the present invention, substrate 10 can be any in all kinds substrate that is specially adapted to display unit, and can comprise basal substrate (base substrate) 11, silicon fiml 12, and silicon oxide film 13.
Can form amorphous silicon film by the surface at basal substrate 11 and obtain silicon fiml 12.Subsequently, silicon fiml 12 can become via crystallization processes polysilicon film.Described crystallization processes can be laser crystallizing technique (for example ELA).Yet the present invention is not limited only to this, but can adopt in the various crystallization processes any.For example, can use by making polysilicon film that silicon fiml 12 crystallizations obtain as the active layer of the TFT of display unit.In addition, amorphous silicon film can be used as the active layer of TFT after being patterned and mixing.
First fluid is stored in the first container 35, and can comprise the solution that is formed at silicon fiml 12 lip-deep silicon oxide films 13 for etching.According to embodiments of the invention, first fluid can be the fluid that comprises ozone solution.Because it is lower that first fluid and second fluid hereinafter described compare the etch-rate of silicon oxide film 13, so first fluid can be used as for the washing agent of removing substrate 10 lip-deep organic materials.Therefore, first fluid can be neutral detergent or alkaline detergent.
Second fluid is stored in the second container 45, but etching is formed at silicon fiml 12 lip-deep silicon oxide films 13, has the composition different from first fluid, and comprises with first fluid and compare the higher solution of the etch-rate of silicon oxide film.According to embodiments of the invention, second fluid can comprise hydrofluoric acid or ammonium fluoride (ammonium fluoride) solution.
The 3rd fluid storage in the 3rd container 55, and can the surface of substrate 10 dilution first fluid and second fluid at least one of them.According to embodiments of the invention, the 3rd fluid can comprise water (for example, deionization (DI) water).The 3rd fluid can be used as buffer fluid, to be used for stopping as the effect to substrate 10 surfaces of the first fluid of etchant and second fluid.
Can be between the first container 35 to the 3rd containers 55 and processing module 180 sandwiched the first open/close valves 36 to the 3rd open/close valves 56.The first open/close valves 36 to the 3rd open/close valves 56 can be electronic valve, and it is connected to control unit 70 and is opened and closed by control unit 70 controls.
Simultaneously, be provided with whole in the first container 35 to the 3rd containers 55 although Fig. 6 shows, yet the present invention is not limited only to this.Although show among the figure, yet the first container 35 and the second container 45 can only be set, and the first container 35 and the second container 45 can as mentioned belowly constantly provide first fluid and second fluid to the surface of substrate 10 in difference.Thus, removable silicon oxide film 13 also can make the flattening surface of substrate 10.
Can by first fluid, the 3rd fluid, and the order of second fluid first fluid to the three fluids are provided to substrate 10.In the situation that processing module 180 moves around therein, can by first fluid, the 3rd fluid, and second fluid, the 3rd fluid, and the order of first fluid provide first fluid to the three fluids.
The order that first fluid to the three fluids are provided can be according to process conditions and is different.For example, can be by second fluid, the 3rd fluid, and the order of first fluid, provide first fluid to the three fluids by the order of first fluid and the 3rd fluid or by the order of second fluid and the 3rd fluid.As mentioned above, in the situation that processing module 180 moves around therein, can further provide first fluid to the three fluids by reversed sequence.
In addition, can provide first fluid and second fluid by described order, and the 3rd fluid is not provided.As mentioned above, in the situation that processing module 180 moves around therein, can further provide first fluid and second fluid by opposite order.
According to the present invention, by constantly first fluid and second fluid (it is the etchant with different etch-rates) being provided to substrate 10 in difference, but the surface of clean substrate 10, and can effectively control etching to silicon oxide film 13 simultaneously.In addition, can improve the flatness on the surface that is removed the silicon fiml 12 behind the silicon oxide film 13.
In addition, by the 3rd fluid is provided to substrate 10, the lip-deep first fluid and/or the second fluid that residue in substrate 10 can be removed by the 3rd fluid, can prevent from thus producing the etch-rate of not expecting owing to the lip-deep first fluid that residues in substrate 10 mixes with second fluid.Therefore, etch-rate can be accurately managed, and the uniformity on the surface of substrate 10 can be in large-scale production, improved.
The providing of described first fluid to the three fluids is not limited only to single and comes flyback retrace, but comprises at least two kinds that optionally provide via at least twice come flyback retraces in first fluid to the three fluids.
Although Fig. 6 shows the embodiment that first fluid to the three fluids wherein optionally are provided by a described processing module 180, yet the present invention is not limited only to this.
For example, as shown in Figure 7 according to another embodiment of the present invention in the substrate surface treating apparatus, processing module 180 comprises the first processing module 181 to the 3rd processing modules 183.The first processing module 181 to the 3rd processing modules 183 all are configured to fluid ejection module.
The first processing module 181 to the 3rd processing modules 183 are connected to respectively the first container 35 to the 3rd containers 55, and the first open/close valves 36 to the 3rd open/close valves 56 are arranged at respectively between the first container 35 to the 3rd containers 55 and the first processing module 181 to the 3rd processing modules 183.Herein, the first processing module 181 to the 3rd processing modules 183 can be configured to mutually noninterfere movement each other.
In this kind situation, can as described in reference Fig. 6, discharge first fluid to the three fluids with the arbitrary order in the various order.
Simultaneously, the first processing module 181 to the 3rd processing modules 183 can mutually be combined integratedly and work.
Fig. 8 shows according to another embodiment of the present invention processing module 180, and wherein processing module 180 comprises the first processing module 181 and the second processing module 182.In the first processing module 181 and the second processing module 182 each all is connected to both various combination in the first container 35 to the 3rd containers 55.
In the embodiment shown in fig. 8, the first processing module 181 is connected to the first container 35 and the 3rd container 55, the second processing modules 182 then are connected to the second container 45 and the 3rd container 55.Therefore, the 3rd open/ close valves 56a and 56b are installed on respectively between the 3rd container 55 and the first processing module 181 and reach between the 3rd container 55 and the second processing module 182.
In this kind situation, first fluid to the three fluids can be as shown in Figure 6 by the ejection of the random order in the various orders.In addition, the first processing module 181 and the second processing module 182 can mutually be combined integratedly and work.
Fig. 9 shows the according to another embodiment of the present invention configuration of substrate surface treating apparatus, and wherein processing module 180 comprises fluid ejection module 180a and air injection modules 180b.
The two all is connected to control unit 70 fluid ejection module 180a and air injection modules 180b, and fluid ejection module 180a can be Fig. 6 to processing module 180 shown in Figure 8.
Further be provided with the 4th open/close valves 66 between air injection modules 180b and air tank 65, wherein the 4th open/close valves 66 can be connected to control unit 70, so that control unit 70 can be controlled the unlatching of the 4th open/close valves 66 and close.
Fluid cutting air is provided to substrate 10 in an operation, and by by air pressure with first fluid to the three fluids at least one of them surface that pushes away substrate 10 remove in lip-deep described first fluid to the three fluids that residue in substrate 10 described at least one of them.Thus, first fluid to the three fluids just can not mix on the surface of substrate 10, and thereby can prevent that the concentration of first fluid and second fluid from becoming the concentration of not expecting on the surface of substrate 10.Therefore, by using fluid cutting air, can accurately control the etching speed of first fluid and second fluid, and can easily control the cushioning effect of the 3rd fluid.
Although Fig. 9 only shows an air injection modules 180b, yet the present invention is not limited only to this.According to design condition, can arrange any amount among the air injection modules 180b of varying number prevent in first fluid to the three fluids both mix mutually at least.For example, as shown in figure 10, can two air injection modules 180b be set around fluid ejection module 180a.
Fluid cutting air can be injected into that one of them is overlapping at least with first fluid to the three fluids.Herein, " be injected into ... overlapping " this expression refers to that fluid cutting air is that one of them injectedly is injected into substrate 10 in substrate 10 and when acting on substrate 10 at least at first fluid to the three fluids.According to embodiments of the invention, air injection modules 180b operates simultaneously with fluid ejection module 180a, to spray fluid cutting air in one of them at least at injection first fluid to the three fluids.
Figure 11 shows according to an embodiment of the invention processing module 180.In the embodiment shown in fig. 11, the first processing module 181 and the second processing module 182 are combined and form single fluid jet module 180a, and two air injection modules 180b arrange around fluid ejection module 180a.
First fluid and the 3rd fluid can optionally be sprayed by the first processing module 181, and second fluid can be sprayed by the second processing module 182.Yet the present invention is not limited only to this.For example, second fluid and the 3rd fluid can optionally be sprayed by the first processing module 181, and first fluid can be sprayed by the second processing module 182.Another is chosen as, and first fluid and second fluid can optionally be sprayed by the first processing module 181, and the 3rd fluid can be sprayed by the second processing module 182.
Owing to aforesaid processing module 180 can be sprayed etchant, washing agent and fluid and can be used as single module and sprayed the cutting air, thereby the general structure of equipment (more specifically, the structure of the second treatment chamber 120) can become compact.Its reason is, is used for making the size of the linear electrical machine mechanism (linear motor mechanism) that processing module 180 moves around significantly to reduce, and can simplifies the assembly that comprises pump and valve.
Figure 12 shows according to another embodiment of the present invention processing module 180, and wherein processing module 180 can especially be used as fluid ejection module.
Comprise two opposed ends interconnection of two opposed ends and first supply pipe 201 of the first supply pipe 201 and the second supply pipe 202, the second supply pipes 202 according to processing module embodiment illustrated in fig. 12 180.
The first block 203 is connected to described two opposed ends of the first supply pipe 201.In addition, the second supply pipe 202 is configured to have the length corresponding with the length of the first supply pipe 201, and wherein the second block 204 is connected to described two opposed ends of the second supply pipe 202.
The 3rd supply pipe 206 respectively interconnected described two opposed ends in being connected to the first supply pipe 201 the first block 203 and be connected between second block 204 of described two opposed ends of the second supply pipe 202, so that the first supply pipe 201 and the second supply pipe 202 interconnect.In addition, the 4th supply pipe 207 is connected to one of them second block 204, with accommodating fluid.The 4th supply pipe 207 also can be connected to one of them first block 203.The 4th supply pipe 207 can be connected to the exterior reservoir (not shown).
Be connected to the second supply pipe 202 by described two opposed ends with the first supply pipe 201, can be along its length relatively equably to the first supply pipe 201 accommodating fluids, and thereby the changes in flow rate can make nozzle 210 spray fluid the time reduce.
Figure 13 shows according to another embodiment of the present invention and is installed on substrate surface treating apparatus in the surface treatment district 153.
Comprise fluid ejection module 180a and air injection modules 180b according to processing module embodiment illustrated in fig. 13 180.The fluid ejection module 180a of processing module 180 comprises a plurality of nozzles 300.
In said structure, fluid ejection module 180a can fix, and fluid can once be ejected on the whole substrate 10.In this kind situation, need to optionally spray first fluid to the three fluids to substrate 10.
In addition, air injection modules 180b can move along the surface of substrate 10 and spray fluid cutting air to substrate 10.
When nozzle 300 was fixed, substrate 10 can move around.Herein, the displacement of substrate 10 can be equal to or greater than the spacing between each nozzle 300, so fluid can spray on the surface of substrate 10 equably.
Although Figure 13 shows all nozzles 300 and all is connected to the first container 35 to the 3rd containers 55 by the first open/close valves 36 to the 3rd open/close valves 56, yet the present invention is not limited only to this.As shown in figure 14, the first container 35 to the 3rd containers 55 can be connected to respectively the first nozzle 301 to the 3rd nozzles 303.Herein, the first nozzle 301 to the 3rd nozzles 303 can be staggered.In this kind situation, the distance that substrate 10 moves can be equal to or greater than spacing between the first nozzle 301 and the second nozzle 302 or the spacing between second nozzle 302 and the 3rd nozzle 303.
In addition, although do not show among the figure, yet the part in these nozzles 300 can be connected to two in the first container 35 to the 3rd containers 55, and the another part in these nozzles 300 can be connected to remaining one in the first container 35 to the 3rd containers 55.
In addition, although in Figure 13 and two embodiment shown in Figure 14 air injection modules 180b is set all, yet the present invention is not limited only to this.As shown in figure 15, even without air injection modules 180b, also can be simply by making substrate 10 inclinations one predetermined angular remove fluid residual on the surface of substrate 10.Herein, the angle of inclination can be 5 °.Although Figure 15 shows the structure corresponding with structure shown in Figure 14 of wherein omitting air injection modules 180b, yet the present invention is not limited only to this.Although do not show among the figure, yet can omit air injection modules 180b in the embodiment shown in fig. 13 yet.Below, will be elaborated to pitch system.
Although in the embodiment shown in fig. 13 each nozzle 300 is arranged to a plurality of row, yet nozzle 300 also can be arranged to single row as shown in figure 16.Each nozzle 300 of processing module 180 shown in Figure 12 can be arranged to single row.
In described structure, the distance that substrate 10 moves around increases.For example, substrate 10 distance that is equal to or greater than the length of substrate 10 that can move around is so that fluid can be supplied on the surface of substrate 10 fully.Yet the present invention is not limited only to this, and in this kind situation, nozzle 300 can move around on the length direction Linear ground of substrate 10.
In embodiment illustrated in fig. 16, the first container 35 to the 3rd containers 55 are connected to the nozzle 300 that is arranged in single row by the first open/close valves 36 to the 3rd open/close valves 56.Yet the present invention is not limited only to this.As shown in figure 17, the first container 35 to the 3rd containers 55 can be connected to respectively the first nozzle 301 and the 3rd nozzle 303 that is arranged in single row.Herein, the first nozzle 301 to the 3rd nozzles 303 can be staggered.
Figure 16 and embodiment illustrated in fig. 17 in, can in the situation of solid injection module, remove the lip-deep fluid that residues in substrate 10 by making substrate 10 tilt predetermined angulars.Yet the present invention is not limited only to this.As shown in Figure 13 and embodiment shown in Figure 14, air injection modules 180b can be to the jet surface fluid cutting air of substrate 10.
The actuating surface as mentioned below of substrate surface treating apparatus is as shown in Figure 1 processed.
At first, substrate 10 is carried in the first treatment chamber 110 by entrance 111 by the transfer robot (not shown), substrate 10 is pretreated when being transmitted through loading zone 151 and pre-wetted area 152.
The first driven roller 144 of loading zone 151 makes substrate 10 move horizontally along first direction X1 (being direction to the right in Fig. 1).Can carry out plasma treatment by the surface that is arranged at the 161 pairs of substrates 10 of the first plasma feeding unit in the loading zone 151 herein.
Next, the second driven roller 145 by the first treatment chamber 110 moves horizontally substrate 10 in pre-wetted area 152.
In pre-wetted area 152, carry out plasma treatment by 162 pairs of substrates of the second plasma feeding unit 10, and by the surface of pre-moistening unit 163 wetting substrates 10.
Along with the second driven roller 145 is moved further substrate 10 along first direction X1, substrate 10 process substrate entrances 121 also are carried in the surface treatment district 153, and surface treatment district 153 is in the second treatment chamber 120.Herein, in the second treatment chamber 120, the second horizontal transfer unit 142 is promoted to the position corresponding to substrate entrance 121, and substrate 10 moves horizontally along first direction X1 by the second driven roller 145 of the second horizontal transfer unit 142, and is arranged on the second horizontal transfer unit 142.
Next, move down the second horizontal transfer unit 142 by vertical delivery unit 150.
In surface treatment district 153, by the surface of processing module 180 treatment substrates 10.Processing module 180 optionally provides the surface of first fluid to the three fluids to substrate 10.In other words, processing module 180 can be to the jet surface first fluid of substrate 10 and/or the proper combination of second fluid and the 3rd fluid, and wherein first fluid and/or second fluid are used for lip-deep silicon oxide film and/or the silicon fiml of etching substrates 10.The combination of first fluid to the three fluids is as indicated above.
In the selectivity combination that first fluid to the three fluids are provided, also can provide fluid cutting air to substrate 10 herein.The selectivity combination of first fluid to the three fluids and fluid cutting air is as indicated above.
After the processing in finishing surface treatment district 153, the second horizontal transfer unit 142 transmits substrate 10 along the second direction X2 relative with first direction X1, and substrate 10 is carried out the second treatment chamber 120 by substrate outlet 122 and is carried in the rinsing area 154 of the 3rd treatment chamber 130.
When substrate 10 was carried out the second treatment chamber 120, substrate 10 can pass through by the formed air curtain of air injection modules 180b, to remove the lip-deep fluid that residues in substrate 10.
In the 3rd treatment chamber 130, the 3rd horizontal transfer unit 143 further transmits substrate 10 along second direction X2.
In rinsing area 154, deionized water is sprayed on the surface of substrate 10, thus the surface of substrate 10 is cleaned.In detail, the first flushing unit 164 and the second flushing unit 165 carry out the jet surface deionized water of the substrate 10 of the second treatment chamber 120 to quilt, in order to do not have on the surface that etchant residues in substrate 10.Be arranged at the first flushing unit 164 and second and wash aqueous jet 166 between the unit 165 by come the surface of clean substrate 10 to the jet surface water of substrate 10 with high pressure.
Next, be moved further substrate 10 along second direction X2, so that substrate 10 is sent to dry section 155.In dry section 155, remove the lip-deep moisture of substrate 10 by drying process.In detail, the nozzle unit of drying unit 167 moves and removes the lip-deep moisture of substrate 10.
Next, substrate 10 is moved further along second direction X2, then passes through unload zone 156, and is discharged from by exporting 131.
When substrate 10 is carried to system 100 when interior, the first fan filtering unit 114 on the first treatment chamber 110, the second fan filtering unit 124 on the second treatment chamber 120 and the three fan filter element 134 on the 3rd treatment chamber 130 side by side and/or are in order driven, so that the inside of system 100 keeps clean and prevents that particulate is attached on the surface of substrate 10.
According to substrate surface treatment system of the present invention and method for processing surface of substrate, the processing that carry out on the surface of substrate 10 is carried out with U-shaped generally.Therefore, compare with inline system, substrate surface treatment system according to the present invention can have obviously more compact structure, therefore can reduce the used space of installation of substrate surface treatment system.
Figure 18 shows according to another embodiment of the present invention substrate surface treatment system.Be same as according to configuration embodiment illustrated in fig. 1 according to basic configuration embodiment illustrated in fig. 18.
Yet in the present embodiment, surface treatment district 153 is not arranged in the second treatment chamber 120, but is arranged in the 3rd treatment chamber 130.Therefore, the second treatment chamber 120 is only as the direction transition zone, and the substrate 10 that is carried out the second treatment chamber 120 transmits along second direction X2 and also sequentially passes through surface treatment district 153, rinsing area 154, dry section 155 and unload zone 156.
Figure 19 shows according to another embodiment of the present invention substrate surface treatment system.Be same as according to configuration embodiment illustrated in fig. 1 according to basic configuration embodiment illustrated in fig. 19.
Yet in the present embodiment, the vertical delivery unit 150 that is arranged in the second treatment chamber 120 comprises tilt drive unit.
In Figure 19, substrate 10 is carried in the second treatment chamber 120.Shown in Figure 20 A, substrate 10 moves horizontally along first direction X1.Herein, substrate 10 is in primary importance P1, and on primary importance P1, the surface of substrate 10 is parallel to ground.Then, along with substrate 10 is mobile vertically downward, tilt drive unit tilts substrate 10, to form acute angle theta between the surface of substrate 10 and ground.Herein, substrate 10 is inclined between the surface of substrate 10 and direction Y and forms acute angle theta, and wherein direction Y is perpendicular to the direction of first direction X1.On the second place P2 that substrate 10 tilts as mentioned above, substrate 10 moves horizontally and is carried out the second treatment chamber 120 along second direction X2.
Figure 21 shows the second horizontal transfer unit 142 and the vertical delivery unit 150 that is installed in the second treatment chamber 120.
As shown in figure 21, as in the embodiment shown in fig. 4, the second horizontal transfer unit 142 comprises framework 146.Yet the support roller 148 that is used for the side of supporting substrate 10 is installed on the end face of the first framework 146a and the second framework 146b.In addition, support roller 148 also is installed on the end face of the 4th framework 146d.
Equally vertical delivery unit 150 is also as in the situation of tilt drive unit in embodiment as shown in figure 19, and vertical delivery unit 150 can move down substrate 10 and make simultaneously substrate 10 to tilt, shown in Figure 20 A.In other words, if the contraction of the first vertical delivery unit 150a is greater than the second vertical delivery unit 150b when vertical delivery unit 150 moves down substrate 10, then substrate 10 can be positioned at second place P2 naturally, shown in Figure 20 A.In this kind situation, because the support roller 148 on the end face of the first framework 146a, substrate 10 can further not move down.
Under this kind state, if 145 rotations of the second driven roller, then substrate 10 is along second direction X2 horizontal movement, shown in Figure 20 A.
In substrate surface treatment system according to another embodiment of the present invention, be carried to substrate 10 in the second treatment chamber 120 at primary importance P1 place and move down and tilt simultaneously, it tilts to second place P2, and is carried out the second treatment chamber 120.
Next, shown in Figure 20 B, in the 3rd treatment chamber 130, make substrate 10 tilt to primary importance P1 to returning.Herein, as shown in figure 19, position adjustment unit 171 is arranged near the bottom in surface treatment district 153 of the 3rd treatment chamber 130, thereby the position of capable of regulating substrate 10.Position adjustment unit 171 comprises a plurality of pins 172 that project upwards, and can vertically make progress by independent vertical delivery unit (not shown) and move down.
When the processing in finishing surface treatment district 153 and substrate 10 were transferred into rinsing area 154, substrate 10 tilted to second place P2 to returning, and then flatly is sent to second place P2, and through rinsing area 154 at least.
If substrate 10 is large substrates, then make as mentioned above substrate 10 inclination meetings very effective.
In other words, if substrate 10 is large substrates, then rather difficulty and fluid may be gathered on the surface of substrate 10 for carrying substrate 10.After substrate 10 tilts and is carried in the surface treatment district 153, when substrate 10 to returning when tilting to primary importance P1, substrate 10 is placed on the pin of position adjustment unit 171 naturally, thereby can carry out immediately the substrate surface treatment process and need not to adjust the position of substrate 10.Thus, can shorten total processing time.In addition, owing to be when substrate 10 tilts to the second place P2 substrate 10 to be carried out such as techniques such as developing techniques, thereby washing agent can flow on the surface of substrate 10 naturally, and therefore can prevent that fluid collection is on the surface of substrate 10.
Although the only part district medium dip in the second treatment chamber 120 and the 3rd treatment chamber 130 of substrate 10 in the various embodiments described above, yet the present invention is not limited only to this, and substrate 10 can keep second place P2 always in the first treatment chamber 110 to the 3rd treatment chamber 130.
By making substrate keep tilting, can reduce the size of equipment on the substrate width direction, and can reduce thus the installing space of equipment.In addition, by adjusting tilt angle theta, can improve the carrying of large substrate, and the present invention can easily be applied to large substrate.
According to the various embodiments described above of the present invention, the substrate surface treatment system can be implemented to has dual stacked structure, so can become relative compact and spatial limitation when mounted of substrate surface treatment system can reduce.
In addition, described substrate surface treatment system can relatively more be applicable to process large substrate.
In addition, by using first fluid and second fluid, can when the surface of polysilicon film is cleaned, carry out etching to silicon oxide film, and after etching away silicon oxide film, the flatness on the surface of polysilicon film can be further enhanced.
In addition, can control by first fluid and the caused etching of second fluid as etchant by first fluid and second fluid are provided constantly in difference.
In addition, by between as the first fluid of dissimilar etchants and second fluid, providing the 3rd fluid, therefore can accurately control etching by the pooling feature of the 3rd fluid, can prevent from causing the etch-rate do not expected and causing productivity losing because of the etch-rate of not expecting owing to first fluid mixes with second fluid.
In addition, remove in first fluid to the three fluids at least one by fluid cutting air is provided from substrate surface, can prevent that at least two kinds of fluids in first fluid to the three fluids from mixing at substrate surface, can obtain thus initial required etching precision.
Although above specifically shown with reference to exemplary embodiment of the present invention and set forth the present invention, yet, one of ordinary skill in the art will understand, and can be under the condition that does not deviate from the spirit of the present invention that defined by claims and scope it be made the various changes on form and the details.
Claims (20)
1. substrate surface treatment system comprises:
The first treatment chamber comprises that at the first end place entrance and edge are parallel to the direction extension on ground;
The second treatment chamber is extended along the direction perpendicular to ground, and the second end of wherein said the first treatment chamber is attached to the top of described the second treatment chamber at the first end place of described the second treatment chamber;
The 3rd treatment chamber, extend along the direction that is parallel to ground, be positioned at the below of described the first treatment chamber, the 3rd treatment chamber has outlet at its first end place, and the bottom of described the second treatment chamber that wherein is positioned at the described first end place of described the second treatment chamber is attached to described the 3rd treatment chamber at the second end place of described the 3rd treatment chamber;
The first horizontal transfer unit is installed in described the first treatment chamber and along first direction and flatly transmits substrate towards described the second treatment chamber;
The second horizontal transfer unit is installed on and also flatly transmits described substrate in described the second treatment chamber;
Vertical delivery unit is installed in described the second treatment chamber, and is combined with described the second horizontal transfer unit, and vertically upwards and move down described the second horizontal transfer unit;
The 3rd horizontal transfer unit is installed in described the 3rd treatment chamber and the edge second direction relative with described first direction flatly transmits the described substrate of discharging from described the second treatment chamber; And
Processing module is installed on described the first treatment chamber to described the 3rd treatment chamber in one of them and the surface of processing described substrate at least.
2. substrate surface treatment system according to claim 1 is characterized in that, also comprises pre-moistening unit, and described pre-moistening unit is arranged in described the first treatment chamber and the surface of pre-wetting described substrate.
3. substrate surface treatment system according to claim 1 is characterized in that, also comprise following at least one of them:
The flushing unit is arranged in described the 3rd treatment chamber and washes the surface of described substrate; And
Drying unit is arranged in described the 3rd treatment chamber and the surface of dry described substrate.
4. substrate surface treatment system according to claim 1 is characterized in that, also comprises fan filtering unit, and described fan filtering unit is installed on described the first treatment chamber to described the 3rd treatment chamber at least in one of them.
5. substrate surface treatment system according to claim 1 is characterized in that, described processing module is arranged in described the 3rd treatment chamber.
6. each described substrate surface treatment system in 4 according to claim 1, it is characterized in that, also comprise tilt drive unit, one of them at least a portion is combined at least to described the 3rd horizontal transfer unit for described tilt drive unit and described the first horizontal transfer unit, and described the first horizontal transfer unit to described at least one of them the described at least part of described the 3rd horizontal transfer unit is tilted.
7. each described substrate surface treatment system in 4 according to claim 1 is characterized in that described the first horizontal transfer unit or described the 3rd horizontal transfer unit comprise a plurality of the first driven rollers and a plurality of the second driven roller,
Described a plurality of the first driven roller is oriented to compare the more close described entrance of described a plurality of the second driven roller or described outlet, and
The diameter of described a plurality of the first driven rollers is greater than the diameter of described a plurality of the second driven rollers.
8. each described substrate surface treatment system in 4 according to claim 1 is characterized in that described the second horizontal transfer unit comprises a plurality of driven rollers.
9. each described substrate surface treatment system in 4 according to claim 1 is characterized in that described processing module comprises fluid ejection module and air injection modules, and described fluid ejection module and described air injection modules are integrated into single unit,
Described fluid ejection module sprays the etchant of at least a type towards described substrate, the lip-deep silicon fiml that the etchant of described at least a type can the described substrate of etching, and
Described air injection modules is to the jet surface fluid cutting air of described substrate.
10. substrate surface treatment system according to claim 9 is characterized in that, described fluid ejection module and described air injection modules are configured to work simultaneously.
11. each the described substrate surface treatment system in 4 is characterized in that described processing module comprises a plurality of nozzles according to claim 1.
12. each the described substrate surface treatment system in 4 is characterized in that according to claim 1, one of them is configured to along the vertical linear ground of described substrate mobile at least for described substrate and described processing module.
13. a method for processing surface of substrate comprises:
The first horizontal transmission is used for flatly transmitting substrate along first direction;
Transmit downward vertically, be used for vertically falling described substrate;
The second horizontal transmission is used for flatly transmitting described substrate along the second direction relative with described first direction; And
Surface treatment, be used for described the first horizontal transmission, the described transmission downward vertically and described the second horizontal transmission at least during one of them, or described the first horizontal transmission, the described transmission downward vertically and surface that described substrate is wherein processed in described the second horizontal transmission at least between the two.
14. method for processing surface of substrate according to claim 13 is characterized in that, described the first horizontal transmission comprises the surface of pre-wetting described substrate.
15. method for processing surface of substrate according to claim 13 is characterized in that, described the second horizontal transmission comprises at least one in the surface of the surface of washing described substrate and dry described substrate.
16. method for processing surface of substrate according to claim 13 is characterized in that, described surface treatment is to carry out between described downward vertically transmission and described the second horizontal transmission.
17. each described method for processing surface of substrate in 16 according to claim 13, it is characterized in that, described the first horizontal transmission, described transmit downward vertically and described the second horizontal transmission one of them comprises and makes described substrate with respect to ground inclination at least.
18. method for processing surface of substrate according to claim 17 is characterized in that, describedly makes described substrate tilt to comprise described substrate is inclined to the surface that makes described substrate to tilt with respect to the direction vertical with described first direction or described second direction.
19. each described method for processing surface of substrate in 16 according to claim 13, it is characterized in that, described surface treatment comprises that one of them provides the surface to described substrate at least with the etchant of at least a type and fluid cutting air, the lip-deep silicon fiml that the etchant of described at least a type can the described substrate of etching.
20. method for processing surface of substrate according to claim 19 is characterized in that, described etchant and described fluid cutting air is provided during described surface treatment simultaneously.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2011-0078203 | 2011-08-05 | ||
| KR1020110078203A KR20130015886A (en) | 2011-08-05 | 2011-08-05 | Surface treating system for a substrate and surface treating method for the substrate |
| KR20110112500 | 2011-10-31 | ||
| KR10-2011-0112500 | 2011-10-31 | ||
| KR1020110140401A KR20130047533A (en) | 2011-10-31 | 2011-12-22 | Surface treating system for a substrate having a compact structure and surface treating method for the substrate |
| KR10-2011-0140401 | 2011-12-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102915940A true CN102915940A (en) | 2013-02-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2012102773541A Pending CN102915940A (en) | 2011-08-05 | 2012-08-06 | Substrate surface processing system having compact structure and substrate surface treatment method |
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| Country | Link |
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| CN (1) | CN102915940A (en) |
| TW (1) | TW201308500A (en) |
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| CN107887296A (en) * | 2016-09-30 | 2018-04-06 | 盟立自动化股份有限公司 | Wet processing equipment |
| CN112201557A (en) * | 2019-07-08 | 2021-01-08 | 细美事有限公司 | Substrate processing apparatus and method |
| CN113148586A (en) * | 2021-05-14 | 2021-07-23 | 重庆宏旷电子科技有限公司 | Automatic transfer system of printed circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108133887B (en) * | 2017-12-04 | 2019-07-02 | 扬州国宇电子有限公司 | Flattening method based on deep etching |
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| US20020092548A1 (en) * | 1999-12-30 | 2002-07-18 | Park Il Ryong | Unified strip/cleaning apparatus |
| CN1978356A (en) * | 2005-12-05 | 2007-06-13 | 东京毅力科创株式会社 | Substrate conveying system, substrate conveying device and substrate treatment device |
| KR20090060683A (en) * | 2007-12-10 | 2009-06-15 | 주식회사 디엠에스 | A panel conveyor |
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| US20020092548A1 (en) * | 1999-12-30 | 2002-07-18 | Park Il Ryong | Unified strip/cleaning apparatus |
| CN1978356A (en) * | 2005-12-05 | 2007-06-13 | 东京毅力科创株式会社 | Substrate conveying system, substrate conveying device and substrate treatment device |
| KR20090060683A (en) * | 2007-12-10 | 2009-06-15 | 주식회사 디엠에스 | A panel conveyor |
| KR101005888B1 (en) * | 2008-12-02 | 2011-01-06 | 세메스 주식회사 | Apparatus for treating substrate and method of transferring substrate using the same |
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| CN107887296A (en) * | 2016-09-30 | 2018-04-06 | 盟立自动化股份有限公司 | Wet processing equipment |
| CN112201557A (en) * | 2019-07-08 | 2021-01-08 | 细美事有限公司 | Substrate processing apparatus and method |
| CN113148586A (en) * | 2021-05-14 | 2021-07-23 | 重庆宏旷电子科技有限公司 | Automatic transfer system of printed circuit board |
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| TW201308500A (en) | 2013-02-16 |
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Application publication date: 20130206 |