JP2001113217A - Resist coating apparatus and resist coating method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resist coating apparatus and a resist coating method capable of evenly coating a resist solution in a small resist solution discharge amount to a substrate even if the resist solution is hardly dispersed. SOLUTION: Resist solution discharge nozzles 56a-56d are attached to the tip end part of a nozzle arm 55 and a substrate G is set in a spin chuck 51. While the resist solution being discharged out any of the resist solution discharge nozzles 56a-56d to the substrate G, together with the nozzle arm 55, the resist solution discharge nozzles 56a-56d are moved on the substrate by a nozzle transporting mechanism 91 and, at the same time, together with the spin chuck 51, the substrate G is rotated by a substrate rotating mechanism 92 to cause relative scrolling movement between any of the resist solution discharge nozzle 56a-56d and the substrate G and apply the resist solution to the substrate G in scrolls.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resist coating apparatus and a resist coating method for applying a resist solution to a substrate such as a color filter of a color liquid crystal display (LCD).

[0002]

2. Description of the Related Art In the production of a color filter for a color liquid crystal display (LCD), a color resist of four colors (red, green, blue, and black) is applied to a rectangular substrate made of glass, and this is exposed. A color filter is formed by a so-called photolithography technique of developing the color filter.

In the photolithography process of such a color filter, a coating process of a color resist and an exposure and development process are performed for each color. That is, for example, by applying a red color resist,
After development, a green color resist is applied, exposure and development are performed, and then the same processing is performed for blue and black.

[0004] Among the above-mentioned processing steps, in the step of applying each color resist, a rectangular substrate is carried into a resist coating unit and mounted on a spin chuck. Each color resist solution is discharged to the center, and thereafter, the substrate is rotated by a spin chuck, and each color resist solution is diffused by centrifugal force to form each color resist film on the substrate.

[0005]

By the way, a pattern is formed on the surface of the color filter, and the resist liquid does not diffuse in a perfect circular shape due to this effect. Due to this effect, there is a risk that the resist solution will be left uncoated at the time of rotation film formation,
The amount of resist used increases to eliminate the uncoated area.
In addition, since the color resist solution contains a pigment or resin for color, unlike a normal resist solution used for semiconductor wafers, etc., when the substrate is rotated to diffuse the color resist solution, it is formed on the substrate. Difficult to diffuse color resist solution,
Even if the same amount of resist solution is supplied, the resist diffusion area decreases, and the amount of resist solution used for coating the entire surface of the substrate increases. Conversely, unless the amount of the resist solution used is increased, the resist diffusion area is directly reduced, so that film formation after rotation is impossible.

Such a phenomenon occurs not only with the color filter but also with other substrates due to the fact that the frictional resistance of the substrate is large due to the pattern or the like, and the viscosity of the resist solution is high.

Therefore, even in such a case,
There is a demand to reduce the resist as much as possible and to apply the resist liquid uniformly on the substrate without increasing the discharge amount of the resist liquid from the resist liquid discharge nozzle.

The present invention has been made in view of the above circumstances, and has been made in consideration of the above circumstances. Even when the resist solution is not easily diffused, the resist coating can uniformly apply the resist solution onto the substrate with a small amount of the resist solution discharged. It is an object to provide a processing apparatus and a resist coating method.

[0009]

In order to solve the above-mentioned problems, the present invention is directed to a resist coating apparatus for coating a substrate with a resist liquid, comprising a resist liquid discharge nozzle for discharging the coating liquid onto the substrate. A nozzle moving mechanism for moving the resist liquid discharging nozzle, and a substrate rotating mechanism for rotating the substrate, wherein the resist liquid discharging nozzle is moved by the nozzle moving mechanism while the coating liquid is discharged from the resist liquid discharging nozzle to the substrate. Is moved on the substrate at the same time, the substrate is rotated by the substrate rotating mechanism, and the resist liquid is applied to the substrate in a scroll shape while performing a relative scroll operation between the resist liquid discharge nozzle and the substrate. A resist coating apparatus is provided.

Further, in the present invention, in applying a resist liquid to a substrate, the resist liquid discharge nozzle is moved on the substrate while discharging the coating liquid from the resist liquid discharge nozzle onto the substrate, and simultaneously the substrate is rotated. A resist coating method comprising applying a resist liquid on a substrate in a scroll shape while performing a relative scroll operation between a resist liquid discharge nozzle and a substrate.

According to the present invention, while discharging the resist liquid from the resist liquid discharge nozzle to the substrate, the resist liquid discharge nozzle is moved on the substrate and the substrate is rotated at the same time. Since the resist liquid is applied on the substrate in a scroll shape while performing a relative scroll operation, the resist liquid can be spread over a large area on the substrate even if the discharge amount of the resist liquid is not so large. Even when the resist liquid is not easily diffused, the resist liquid can be uniformly applied onto the substrate with a small amount of the resist liquid discharged.

In the above-described resist liquid discharging apparatus, it is preferable that the resist liquid discharging nozzle is configured to discharge the resist liquid in a flat shape. When the resist liquid is applied on the substrate in a scroll shape, when the discharge port of the nozzle is, for example, circular and the discharge width is narrow, a gap is formed between the resist liquid discharged in the scroll shape, Although it may cause coating unevenness, the resist liquid discharge nozzle can be configured to discharge the resist liquid in a flat shape, so that the discharge width can be widened and the resist discharged in a scroll shape can be used. The formation of a gap between the liquids can be avoided. Therefore, the resist liquid applied on the substrate has a circular shape as a whole, and coating unevenness can be prevented. Specifically, the tip of the resist liquid discharge nozzle is formed into a slit shape, or by having a large number of needle-like members in which a resist liquid passage hole is formed, so that the flat shape is obtained in this manner. The resist can be discharged.

Further, it is preferable that the nozzle moving mechanism is configured to move the resist liquid discharging nozzle outward from substantially the center of the substrate. By doing so, the resist liquid ejection direction and the diffusion direction are the same, so that the risk of application unevenness can be eliminated. Conversely, if the resist liquid discharge nozzle is configured to move from the outside toward the approximate center of the substrate, the substrate is rotated and the resist liquid is diffused by the centrifugal force. The direction and the direction of diffusion are opposite, and there is a possibility that coating unevenness may occur.

Further, the nozzle moving mechanism preferably has a variable nozzle moving speed. This makes it possible to adjust the resist liquid application amount by changing the moving speed of the nozzle according to the application state of the resist liquid. Specifically, it is preferable to decrease the moving speed as the resist liquid discharge nozzle moves to the outside of the substrate. Thereby, when applying the resist liquid in a scroll shape on the substrate while performing the relative scroll operation with respect to the resist discharge and the substrate, the application amount of the resist liquid on the inner peripheral side and the outer peripheral side can be equalized. .

Furthermore, it is preferable that the rotation speed of the substrate rotation mechanism is variable. This makes it possible to adjust the resist solution application amount by changing the substrate rotation speed in accordance with the application state of the resist solution.

Further, it is preferable that the rotation speed of the substrate by the substrate rotation mechanism is maintained so that the outer periphery of the resist solution on the substrate does not spread radially. This can prevent the resist solution from being wasted due to the outer periphery of the resist solution being scattered from the outer periphery of the substrate to the outside.

A control mechanism for controlling the nozzle moving mechanism and the substrate rotating mechanism, wherein the control mechanism moves the resist liquid discharging nozzle by the nozzle moving mechanism when the coating liquid is discharged from the resist liquid discharging nozzle to the substrate; At the same time, it is preferable that the substrate is rotated by the substrate rotation mechanism to perform a relative scrolling operation between the resist liquid discharge nozzle and the substrate. In this case, it is preferable that the control mechanism controls the moving speed of the nozzle and the rotating speed of the substrate during the coating process.

Further, a plurality of resist solution discharge nozzles can be configured to be integrally held at the tip of one nozzle arm. Accordingly, for example, when applying the red, green, blue, and black color resist liquids, it is possible to cope only by moving the nozzle arm, so that the resist application can be performed very efficiently.

[0019]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a plan view showing a system for applying and developing a color filter of an LCD to which the present invention is applied.

The coating / developing system includes a cassette station 1 on which a cassette C accommodating a plurality of color filter substrates G is mounted, and a plurality of processes for performing a series of processes including resist coating and developing on the substrate G. A processing unit 2 having a unit; and an interface unit 3 for transferring a substrate G between the processing unit 2 and an exposure apparatus (not shown). 3 are arranged.

The cassette station 1 has a transport mechanism 1 for transporting the substrate G between the cassette C and the processing section 2.
0 is provided. Then, the cassette C is loaded and unloaded at the cassette station 1. Also, the transport mechanism 1
0 is a transport path 10 provided along the cassette arrangement direction.
A transfer arm 11 is provided which is movable on the substrate a. The transfer arm 11 transfers the substrate G between the cassette C and the processing unit 2.

The processing section 2 is divided into a front section 2a, a middle section 2b, and a rear section 2c.
2, 13 and 14, and each processing unit is disposed on both sides of these transport paths. And between these, the relay parts 15 and 16 are provided.

The front section 2a includes a main transfer device 17 movable along the transfer path 12. On one side of the transfer path 12, two cleaning units (SCR) 21a and 21b are arranged. , On the other side of the transport path 12,
Heating units 25 and 26 in which two heating processing units (HP) are stacked in two stages, and a cooling processing unit (C
OL) is a cooling processing unit 2 in which two upper and lower layers are stacked.
7 are arranged.

The middle section 2b is provided with a main transfer device 18 movable along the transfer path 13. On one side of the transfer path 13, a resist coating unit (CT) for coating a color resist is provided. ) 22 and an edge remover (ER) 23 for removing the color resist on the periphery of the substrate G
And a resist coating unit (CT)
The drying unit 40 is provided between the edge remover 22 and the edge remover (ER) 23. On the other side of the transport path 13, a heating unit 28 in which two heat treatment units (HP) are vertically stacked, and a heating unit in which a heat treatment unit (HP) and a cooling treatment unit (COL) are vertically stacked. Processing / cooling processing unit 29 and cooling processing unit 3 in which two cooling processing devices (COL) are vertically stacked
0 is arranged.

Further, the rear section 2c is provided with a main transport device 19 movable along the transport path 14,
On one side, three development processing units 24a, 24
b and 24c are arranged, and on the other side of the transport path 14, a heat treatment unit 31 in which two heat treatment devices (HP) are vertically stacked, and a heat treatment device (HP) and a cooling treatment device (COL) ) Are stacked on top of each other, and two heat treatment / cooling units 32 and 33 are arranged.

The processing section 2 includes a cleaning processing unit 21a and a resist processing unit 2 on one side of the transport path.
2. Only a spinner unit such as the development processing unit 24a is arranged, and only a heat processing unit such as a heating processing unit or a cooling processing unit is arranged on the other side.

The main transporting devices 17, 18, and 19 respectively include an X-axis driving mechanism, a Y-axis driving mechanism in two directions in a horizontal plane,
And a vertical Z-axis drive mechanism.
A rotation drive mechanism that rotates about an axis is provided, and has arms 17a, 18a, and 19a that support the substrate G, respectively.

A chemical solution supply unit 34 is provided at a portion of the relay units 15 and 16 on the side of the spinner system unit, and a space 35 for maintenance is provided.

The main transfer device 17 transfers the substrate G to and from the arm 11 of the transfer mechanism 10, and loads and unloads the substrate G to and from the processing units in the former stage 2 a, and further transfers the substrate G to and from the relay unit 15. It has a function of transferring the substrate G between the two. Further, the main transfer device 18 is connected to the relay unit 1.
5 and transfer the substrate G to the middle section 2
b has a function of loading / unloading the substrate G to / from each processing unit and transferring the substrate G to / from the relay unit 16. Further, the main transfer device 19 transfers the substrate G to and from the relay unit 16, and loads and unloads the substrate G to and from each processing unit in the subsequent unit 2 c, and transfers the substrate G to and from the interface unit 3. Has the function of performing Note that the relay sections 15 and 16 also function as cooling plates.

The interface unit 3 includes an extension 36 for temporarily holding the substrate when transferring the substrate to and from the processing unit 2, and two buffer stages 37 provided on both sides thereof for disposing a buffer cassette. And a substrate G between these and an exposure apparatus (not shown)
And a transport mechanism 38 for carrying in and out the wafer. The transport mechanism 38 includes a transport arm 39 that can move on a transport path 38 a provided along the direction in which the extension 36 and the buffer stage 37 are arranged. The transport arm 39 allows the substrate G to be moved between the processing unit 2 and the exposure apparatus. Is carried out. By consolidating and integrating the processing units in this manner, space saving and processing efficiency can be achieved.

In the coating / developing processing system configured as described above, the substrate G in the cassette C is transported to the processing unit 2, where the cleaning unit (SCR) 21a, After the scrubber cleaning is performed at 21b, and heated and dried by one of the heat treatment units (HP) of the heat treatment units 25 and 26, the cooling treatment unit 2
7 is cooled by any one of the cooling processing units (COL).

Thereafter, the substrate G is transported to the middle section 2b,
A color resist is applied by a resist coating unit (CT) 22, dried by a drying unit 40, and an extra color resist on the periphery of the substrate G is removed by an edge remover (ER) 23. Thereafter, the substrate G is subjected to a pre-baking process in one of the heat treatment devices (HP) in the middle section 2b, and is cooled by the lower cooling treatment apparatus (COL) of the unit 29 or 30.

Thereafter, the substrate G is transported from the relay section 16 to the exposure apparatus via the interface section 3 by the main transport apparatus 19, where a predetermined pattern is exposed. And
The substrate G is carried in again via the interface unit 3,
The image is developed by any of the development processing units (DEV) 24a, 24b, and 24c. The developed substrate G is
After the post-baking process is performed in any one of the heat treatment devices (HP) in the rear part 2c, it is cooled in any one of the cooling treatment devices (COL) in the rear part 2c.

Such a series of processing for each color is executed according to a preset recipe. For example, the substrate G which has been subjected to red coating, exposure and development processing is sequentially subjected to green, blue and black coating, exposure and development processing. As described later, a resist coating unit (C
Except for using nozzles of different colors in T) 22, each color is processed in substantially the same manner. The completed substrate of the color filter is stored in a predetermined cassette on the cassette station 1 by the main transfer devices 19, 18, and 17 and the transfer mechanism 10.

Next, a resist coating unit (CT) and a reduced-pressure drying unit (V) provided in such a color filter resist coating / developing processing system.
D) and the edge remover (ER) will be described. 2 and 3 show a resist coating unit (C
T) is a schematic plan view and a schematic side view showing a vacuum drying processing unit (VD) and an edge remover (ER).

As shown in FIGS. 2 and 3, the resist coating unit (CT) 22, the vacuum drying unit (VD) 40, and the edge remover (ER) 2
3 are integrally arranged on the same stage. The substrate G to which a predetermined color resist has been applied by the resist coating unit (CT) 22 is subjected to a reduced-pressure drying unit (V) by a pair of transport arms 41 along a guide rail 43.
D) and transferred to the vacuum drying unit (V).
D) The substrate G dried in 40 is transported to an edge remover (ER) 23 along a guide rail 43 by a pair of transport arms 42.

Resist coating unit (CT) 22
Is a horizontally rotatable spin chuck 51 that adsorbs and holds the substrate G, a bottomed open cylinder that surrounds the upper end of the spin chuck 51 and surrounds the substrate G that is adsorbed and held by the spin chuck 51 and has an open upper end. Shaped rotating cup 5
2. It has a lid (not shown) that covers the upper end opening of the rotating cup 52, and a coater cup 53 that is fixedly arranged so as to surround the outer periphery of the rotating cup 52. When the color resist is dropped, the substrate G is rotated by the spin chuck 51 in a state where the lid is opened. When the color resist is diffused, the substrate G is rotated by the spin chuck 51 and at the same time, the lid ( The rotating cup 52 in a state in which the unillustrated (not shown) is closed is rotated. The outer cover 5 is provided around the outer periphery of the coater cup 53.
4 are provided.

Further, a resist coating unit (CT)
Reference numeral 22 denotes a resist substrate discharge nozzle arm 55 for discharging color resists of four colors (red, green, blue, and black) on a rectangular substrate G made of glass. When the color resist is dropped, the tip of the resist liquid discharge nozzle arm 55 is moved from the retracted position shown in FIG.
The substrate is moved to the center of the substrate G.

As shown in detail in FIG. 4, a red color resist nozzle 56a, a green color resist nozzle 56
b, nozzle 56c of blue color resist, nozzle 56d of black color resist, and thinner nozzle 5
6e is provided. Resist supply pipes 57a to 57d are connected to the resist liquid discharge nozzles 56a to 56d for the respective color resists.
7a to 57d are accommodated in two large-diameter tubes 58a and 58b. And, in each resist supply pipe,
Two tanks (not shown) as a resist supply source are connected. The thinner nozzle 56e is connected to a thinner supply source (not shown) via a thinner supply pipe 57e.

With such a configuration, one color resist is applied to the substrate G by one of the color resist resist discharge nozzles 56a to 56d, and then the coating process is performed by a nozzle of another color. It is easy. For example, even if the color of the resist applied to the next substrate is different, it can be easily handled only by changing the nozzle.

The vacuum drying processing unit 40 has a low chamber 61 and an upper chamber 62 provided so as to cover the low chamber 61 and keeping the internal processing chamber airtight. The low chamber 61 is provided with a stage 63 on which the substrate G is placed. At each corner of the low chamber 61, four exhaust ports 64 are provided. The pipe 65 (FIG. 3) is connected to an exhaust pump (not shown) such as a turbo-molecular exhaust pump, whereby the gas in the processing chamber between the low chamber 61 and the upper chamber 62 is exhausted. For example, 0.1 Torr
The pressure is reduced. Stage 6
No suction mechanism is provided in 3, and the substrate G is simply placed thereon. Further, a pin (not shown) for transferring the substrate G is provided on the stage 63 so as to be able to protrude and retract. These pins are arranged at positions where they come into contact with portions of the substrate other than the processing region so as not to adversely affect the processing of the substrate.

A stage 7 for mounting the substrate G is mounted on an edge remover (ER) 23 for performing an end surface processing of the substrate G.
1, two alignment mechanisms 72 for positioning the substrate G are provided at two corners on the stage 71. As described above, the suction mechanism is not provided on the stage 63 of the reduced-pressure drying processing unit (VD) 40, and the substrate G is merely placed on the stage 63. Therefore, the edge resist by the edge remover (ER) 23 is used. Prior to the removal processing, the alignment of the substrate G is performed by the alignment mechanism 72.

At positions corresponding to the four sides of the substrate G, four remover heads 73 for removing extra color resist from the edges of the four sides of the substrate G are provided. Each of the remover heads 73 has a substantially U-shaped cross section so as to discharge the thinner from the inside, and is moved by a moving mechanism (not shown) along four sides of the substrate G. Therefore, each remover head 73 is
While moving along each side of the substrate G and discharging the thinner, it is possible to remove excess color resist adhering to the four edges of the substrate G.

In the present embodiment, in the resist coating unit (CT) 22, each of the color resist liquids is applied to the substrate G from any one of the resist liquid discharge nozzles 56a to 56d as shown in FIG. While discharging
At the same time as moving the nozzle arm 55 in the direction of the arrow to move the resist solution discharge nozzles 56a to 56d on the substrate,
The substrate G is rotated in the direction of the arrow by the spin chuck 51. Thereby, the resist liquid discharge nozzles 56a to 56d
A relative scroll operation occurs between the substrate G and the substrate G, and each color resist liquid is applied on the substrate G in a scroll shape.
At this time, as shown in FIG.
6a to 56d are moved together with the nozzle arm 55 by the nozzle moving mechanism 91, and the substrate G on the spin chuck 51 is rotated by the substrate rotating mechanism 92. The nozzle moving mechanism 91 and the substrate rotating mechanism 92 are controlled by the controller 90, and the above-described relative scroll operation is realized. Further, the nozzle moving mechanism 91 has a variable speed at which the nozzle is moved, and
2 also has a variable rotation speed, and these movement speed and rotation speed are also controlled by the controller 90. For example, the movement (oscillation) speed of the resist solution discharge nozzles 56a to 56d and the rotation speed of the substrate G can be controlled in multiple stages, and can be adjusted and controlled as appropriate depending on the type of the color resist solution.

Further, the nozzle moving mechanism 91 moves (oscillates) the nozzle arm 55 so as to move the resist solution discharge nozzles 56a to 56d outward from the approximate center of the substrate G.
It is configured to be. By doing so, since the resist liquid ejection direction and the diffusion direction are the same,
The possibility of application unevenness can be eliminated. Conversely, when the resist solution discharge nozzles 56a to 56d are configured to move from the outside toward the substantially center of the substrate, the substrate G
Is rotated and the resist solution is diffused by the centrifugal force, so that the direction of ejection and the direction of diffusion are opposite,
It is not preferable because coating unevenness may occur. However, it is possible to move the resist solution discharge nozzles 56a to 56d from outside toward the approximate center of the substrate for other purposes.

Further, the nozzle moving mechanism 91 uses the nozzle arm 55 to move the resist solution discharge nozzles 56a to 56d.
Is configured such that as it moves (oscillates) outward from the substrate G, its moving speed is reduced. Accordingly, when the color resist liquid is applied in a scroll shape on the substrate G while performing a relative scroll operation between the resist liquid discharge nozzles 56a to 56d and the substrate G, the color resist liquid on the inner peripheral side and the outer peripheral side is applied. The application amount can be made uniform.

For example, the nozzle moving mechanism 91 for driving the nozzle arm 55 is constituted by a stepping motor.
The number of pulses is changed to the resist solution discharge nozzles 56a to 56d
Is substantially at the center of the substrate G, for example, 320 pps
The movement (oscillation) speed is relatively high, but as the resist solution discharge nozzles 56a to 56d are moved (oscillated) outward from substantially the center of the substrate G, the speed increases from 320 pps to 25
It can be configured to reduce gradually or stepwise to 0 pps.

Further, it is preferable that the rotation speed of the substrate G by the substrate rotation mechanism 92 is maintained so that the outer periphery of the resist solution on the substrate does not radially spread. This allows
It is possible to prevent the resist solution from being wasted due to the outer periphery of the resist solution being scattered from the outer periphery of the substrate to the outside. Also,
The lower limit of the rotation speed of the substrate G is such that the color resist solution
The rotation speed is set to be equal to or higher than the rotation speed required to spread the light. In consideration of this, the rotation speed of the substrate G is appropriately selected, for example, in a range of 30 to 40 rpm according to the type of the color resist solution and the like.

The resist solution discharge nozzles 56a to 56d
It is configured to discharge the resist liquid in a flat shape.
More specifically, for example, as shown in FIGS. 7A and 7B, a flat discharge port 81 having a wide color resist liquid discharge width is provided. As a result, the color resist liquid is discharged onto the substrate G in a strip shape.

The resist solution discharge nozzles 56a to 56d
As shown in FIG. 8A, the resist liquid may correspond to the spread of the slit-shaped discharge port 81 without any presence inside, but in this case, the discharge of the discharge port 81 is performed. The width is limited to 10 to 15 mm, and it is difficult to widen it further.

On the other hand, the resist solution discharge nozzle 56
As shown in FIG. 8B, a large number of partition plates 82 are provided inside a to 56d so that the color resist liquid is guided to the outside, so that the discharge width of the discharge port 81 is adjusted as shown in FIG. It can be wider than in the case of (a), for example, 20
A discharge width of up to 100 mm can be secured.

Further, in order to discharge the resist liquid in a flat shape, as shown in FIG. 8C, an arc-shaped plate having a large number of small holes formed at the tips of the resist liquid discharge nozzles 56a to 56d. A large number of injection needle-shaped discharge pipes 8 having small holes continuous with the small holes provided in the plate 83;
It may be a bear type in which 4 are radially attached.
Also in this case, the discharge width can be made wider than in the case of FIG. 8A, and for example, a discharge width of 20 to 100 mm can be secured. In this case, the hole diameter of the discharge pipe 84 is, for example, 0.3 mm.

Next, the resist coating processing unit (CT) 22, the reduced pressure drying processing unit (VD) 40, and the edge remover (ER) 2 thus integrally formed.
The processing of the substrate in No. 3 will be described.

First, a resist coating unit (CT)
In 22, the nozzle 56a of a predetermined color resist, for example, a red color resist is caused to reach the center of the spin chuck 51 (the center of the substrate G), and as shown by an arrow in FIG. Then, the substrate G is rotated while discharging the red color resist liquid onto the substrate G. Thereby, the resist liquid is applied to the substrate G in a scroll shape. Thereafter, the number of rotations of the substrate G is increased to, for example, about 800 rpm, the resist solution is spread to every corner of the substrate G, and the thickness of the resist film is adjusted.

By applying such a scroll-like application, the resist liquid can be spread over a large area on the substrate G even if the discharge amount of the resist liquid is not so large. Even when a highly viscous color resist containing a pigment is used, or when the resist liquid is difficult to diffuse as in the case where the substrate G is a color filter substrate with a pattern, the resist liquid is discharged with a smaller resist liquid discharge amount. It can be uniformly applied on a substrate.

When the color resist solution is applied in a scroll shape on the substrate G, the resist solution discharge nozzles 56a to 56d
In the case where the discharge port is, for example, circular and the discharge width is narrow, between the color resist liquid discharged in a scroll shape,
Gaps may be formed in the shape of a mosquito coil, which may cause uneven application. However, as described above, by configuring the resist liquid discharge nozzles 56a to 56d to discharge the resist liquid in a flat shape, the discharge width can be increased, and the color applied to the substrate G in a scroll shape can be increased. The formation of gaps in the resist solution can be avoided. Therefore, the resist liquid can be applied on the substrate in a substantially circular shape, and application unevenness can be prevented (see FIG. 9).

Prior to the discharge of the resist solution, a thinner may be supplied from the thinner nozzle 56e to the center of the substrate G, and the substrate G may be rotated to spread over the entire surface of the substrate G.

The substrate G thus coated with the red color resist is transported by the transport arm 41 to the reduced pressure drying processing unit 40, and the gas in the processing chamber between the low chamber 61 and the upper chamber 62 is exhausted. When the pressure is reduced to a predetermined degree of vacuum, for example, 0.1 Torr, the solvent such as thinner in the color resist is evaporated to some extent, the solvent in the resist is gradually released, and the resist is not adversely affected. Drying can be promoted, and transfer on the substrate G can be effectively prevented.

The dried substrate G is transferred to the transfer arm 42
After being conveyed to the edge remover (ER) 23 and aligned by the alignment mechanism 72, the four remover heads 73 move along each side of the substrate G,
Excess color resist adhering to the four edges of the substrate G is removed by the discharged thinner. In this case, the applied resist film is dried under a reduced-pressure drying unit (VD) 4.
Since it has been dried to some extent by 0, the resist can be removed very easily.

Thereafter, a resist coating unit (C)
T) 22, another substrate G is carried in, and the same red or another color resist is applied. In the case of the same color, the same operation may be repeated, and in the case of a different color, the same processing can be performed simply by dropping a resist of another color from a different color nozzle, so that it is extremely easy to respond. Can be.

On the other hand, the substrate G on which the above-described red color resist is applied is exposed and developed, and after the cleaning process is again carried into the resist coating unit (CT) 22, where the second color resist is applied. For example, a green color resist is applied to the substrate G from a green color resist nozzle 56b, and the above-described processing steps are similarly repeated. Similarly, a third color resist, for example, blue, is applied, and a fourth color resist, for example, black, is applied.

Next, another embodiment of the present invention will be described. FIG. 11 is a cross-sectional view illustrating an example of a resist liquid discharge nozzle according to the present embodiment. As shown in FIG.
This resist liquid discharge nozzle 110 has a nozzle body 111
A plurality of needle-like members 115 provided in an upper portion of the nozzle body 111 for introducing a resist solution, and a plurality of needle-like members 115 provided in a row below the nozzle body 111 and having a resist passage hole therein. have. Nozzle body 11
A storage chamber 112 for storing a resist solution is provided in the inside 1, the introduction port 113 communicates with the upper surface of the storage chamber 112, and one end of each of the plurality of needle-like members 115 has a resist flow hole. It communicates with the lower part of the chamber 112. Also,
The upper surface of the storage chamber 112 has an inclined portion 114 that is inclined so that a portion communicating with the introduction port 113 is higher.

With such a configuration, the resist liquid supplied from the resist liquid supply means (not shown) through the inlet 113 is stored in the storage chamber 112, and each needle-shaped liquid is supplied from the lower part of the storage chamber 112. It is discharged onto the substrate G through a resist passage hole in the member 115.

At this time, the resist liquid is temporarily stored in the storage chamber 112 before being discharged onto the substrate G, and the upper surface of the storage chamber 112 is inclined so that the portion communicating with the introduction port 113 becomes higher. Since it has the inclined portion 114,
The bubbles contained in the resist liquid supplied from the resist liquid supply means float in the storage chamber 112 while the resist liquid is stored in the storage chamber 112, reach the inlet 113 along the inclined portion 114, Is discharged. Therefore, it is possible to prevent bubbles contained in the resist solution from adversely affecting the coating process of the resist solution.

FIG. 12 is a sectional view showing another example of the resist liquid discharge nozzle according to the present embodiment. As shown in FIG. 12, the resist solution discharge nozzle 120 includes a nozzle body 122, an introduction port 124 provided at an upper portion of the nozzle body 122 for introducing a resist solution, and a plurality of nozzles connected to the upper surface of the nozzle body 122. A needle-like member 121. A storage chamber 123 for storing a resist liquid is provided inside the nozzle body 122, and a resist liquid flow hole provided inside the needle-like member 121 communicates with the upper surface of the storage chamber at a communication portion 125. ing. Further, each needle-shaped member 121 has a curved portion 126 such that the flow of the resist solution flowing therethrough rises and then falls.

With such a configuration, the resist liquid supplied from the resist liquid supply means (not shown) through the inlet 124 fills the storage chamber 123, and the needle-like liquid flows from the communicating portion 125 on the upper surface of the storage chamber 123. After rising inside the member 121,
Each of the needle-like members 121 is bent by the bending portion 126 in the flow direction.
Then, the ink is discharged onto the substrate G from the tip of each needle-shaped member 121. After the application of the resist liquid on the substrate G in this manner, the discharge of the resist liquid is terminated by stopping the supply of the resist liquid from the resist liquid supply means (not shown). At this time, when the supply of the resist liquid is stopped, the driving force for the resist liquid to rise inside the needle-shaped member 121 is lost, so that the resist liquid remaining in the storage chamber 123 after the supply of the resist liquid is stopped is removed. It does not spill on the substrate G through the inside of the shape member 121, and it is possible to prevent a failure due to spilling of the resist solution.

Further, the resist solution discharge nozzle 120
In FIG. 12, as shown in FIG. 12, the upper surface of the storage chamber 123 is inclined so that the side of the communicating portion 125 is higher, so that the resist liquid is more reliably prevented from dropping after the supply of the resist liquid is stopped. Can be prevented.

Further, in the resist liquid discharge nozzle of the type in which the resist liquid is discharged from the needle-like member as described above,
As shown in FIG. 13, when the resist liquid discharge nozzle is arranged above the substrate G rotated by the substrate rotating mechanism 92, the needle-like member 121 may be provided so as to be inclined outside the substrate G. By doing so, the resist liquid is discharged from the tip of the needle-like member 121 to the outside of the rotating substrate G, so that the resist liquid easily spreads outside the substrate G, and the resist liquid is more uniformly dispersed. Coating can be performed. In FIG. 13, the axis C indicates the central axis when the substrate rotating mechanism 92 rotates the substrate.

Further, as shown in FIG.
1 may be provided so that the outward inclination angle increases toward the outside. Thus, the resist liquid can be discharged over a wider range.

Further, as shown in FIG. 15, the adjacent needle-shaped members 121 may be connected by a connecting member 151. As a result, as shown in FIG. 16, when the nozzle cleaning mechanism 161 discharges the thinner from the thinner discharge unit 162 to clean the resist liquid discharge nozzle, the thinner is transmitted along the coupling member 151 and each needle-like member 1 is moved.
Since the cleaning liquid is supplied to the cleaning device 21, cleaning can be performed efficiently.

FIGS. 13 to 16 show the form of the needle-like member 121 in the example of the resist liquid discharge nozzle shown in FIG. 12, respectively. Nozzle and FIG.
In the resist liquid discharge nozzle shown in (1), the respective effects can be obtained by adopting the same configuration as above.

Next, another embodiment of the present invention will be described. FIG. 17 is a schematic sectional view showing a resist liquid discharge nozzle according to the present embodiment. As shown in FIG. 17, the resist liquid discharge nozzle 170 is
71, a number of needle-like members 172 that are arranged in a row on the nozzle body 171 and discharge the resist liquid from the tip thereof, and are provided for each of the needle-like members 172. Pump 1 for supplying resist solution
73 and a control unit 174 for controlling the operation of each pump 173
have.

In this manner, the control unit 174 controls each pump 173 to apply the resist liquid while individually controlling the discharge amount of the resist liquid from each needle-shaped member 172. The resist film can be formed more uniformly on the substrate G.

Next, still another embodiment of the present invention will be described. FIG. 18 is a top view showing a state where a resist liquid is applied onto the substrate G using the resist liquid discharge nozzle according to the present embodiment. As shown in FIG. 18, the resist liquid discharge nozzle 180 includes a nozzle body 181 provided at the tip of the nozzle arm 55 and a nozzle body 1
81, a needle-like member 183 that discharges the resist liquid from the tip thereof, and a nozzle rotation mechanism 182 that can rotate the nozzle body 181.

The resist discharge nozzle 1 having such a configuration
When the resist liquid is applied to the substrate G at 80, the nozzle moving mechanism 91 (not shown in FIG. 18) moves the nozzle arm 5 while discharging the resist liquid from the tip of each needle-shaped member 183.
5, the resist solution discharge nozzle 181 is moved outward from the center of the substrate G, and at the same time, the substrate G is rotated by the substrate rotating mechanism 92 (not shown in FIG. 18). At this time, as the resist liquid discharge nozzle 180 moves outward from the center of the substrate G, the nozzle rotation mechanism 182
The direction of the row formed by the needle members 183 is the rotation direction 18 of the substrate G.
The nozzle body 181 is rotated so as to approach the tangential direction of No. 4. This makes it possible to apply the resist liquid uniformly on the inside and outside of the substrate G.

Next, still another embodiment of the present invention will be described. FIG. 19 is a schematic view showing a state in which a resist coating process is being performed using the resist liquid discharge nozzle in the present embodiment. As shown in FIG. 19, the resist liquid discharge nozzle 190 has a slit-shaped discharge port, and a nozzle main body 191 that discharges the resist liquid widely to the substrate G, and is attached to the nozzle main body 191. A distance sensor 192 for measuring an interval between the substrate 191 and the substrate G, and an elevating mechanism 19 for elevating the nozzle body 191
And a control unit 193 that controls the operation of the lifting mechanism 194 based on the measurement result of the distance sensor 192.

In the resist liquid discharge nozzle 190, while discharging the resist liquid from the nozzle body 191,
The distance between the nozzle body 191 and the substrate G is measured by the distance sensor 192, and the control unit 193 operates the elevating mechanism 194 so that the distance between the nozzle body 191 and the substrate G is constant based on the measured value. The control for raising and lowering the main body 191 is performed.

In the case of a slit type nozzle having a slit-shaped discharge port and discharging the resist liquid widely to the substrate G, the resist liquid discharged onto the substrate G when the distance between the substrate G and the nozzle changes However, in the present embodiment, since the distance between the substrate G and the nozzle body 191 is controlled to be constant, such fluctuation in the width of the resist solution is prevented, and Can be discharged with a uniform width.

Next, still another embodiment of the present invention will be described. FIG. 20 is a schematic side view of the resist liquid discharge nozzle according to the present embodiment. As shown in FIG. 20, the resist liquid discharge nozzle 200 is
A needle-like member 202 having a resist liquid flowing hole formed therein and discharging the resist liquid from the tip thereof, and a bubble sensor 203 for detecting bubbles contained in the resist liquid flowing through the needle-like member 202. have. In the resist coating / developing processing means provided with the resist liquid discharge nozzle, a control unit 204 for performing predetermined control based on a detection result from the bubble sensor 203, and a control unit 204
And a warning device 205 for issuing a warning signal.

The needle-shaped member 202 is made of a transparent and highly solvent-resistant material such as polymethylpentene, for detecting bubbles contained in the resist solution flowing therethrough by the bubble sensor 203. Is preferred.

With the above configuration, the foam sensor 20
In step 3, the resist solution is applied while detecting bubbles contained in the resist solution flowing through the needle member 202, and the control unit 204 is operated based on the detection result from the bubble sensor 203.
If the control unit 204 determines that bubbles are contained in the resist solution, the control unit 204 stops the resist coating / developing apparatus and activates the alarm generation unit 205 to perform control to generate an alarm. be able to. Stopping of the resist coating / developing apparatus and generation of an alarm may be controlled so as to perform only one of them. The control unit 20
4 determines from the detection result from the bubble sensor 203 whether the amount of bubbles contained in the resist solution exceeds a predetermined threshold value, and determines whether the amount of bubbles in the resist solution exceeds the threshold value. If it exceeds, the resist coating / developing apparatus may be stopped.

The present invention is not limited to the above embodiments and examples, and various modifications are possible. For example, in the above-described embodiment, the resist coating process on the color filter is described. However, the present invention is not limited to this and can be applied to the resist coating process on another substrate such as an LCD substrate or a semiconductor substrate.

[0083]

(Example 1) Experiments in a conventional case where a resist solution is discharged to the center of a base glass substrate and diffused by rotation of the substrate, and in a case where a resist solution is applied to a base glass substrate in a scroll shape. Was done. Table 1 shows the experimental results.

[0084]

[Table 1]

For example, when the conventional resist solution usage is 30 m
l and the amount of resist solution used for scroll coating is 1
Compared with the case of 5.0 ml, the diameter of the spread portion of the resist solution is 230 to 240 mm, which is almost the same, and in the case of scroll coating, the amount of the resist solution used is almost half that of the conventional case, and is the same. It was confirmed that it was possible to secure a resist spread area.

The amount of resist solution that can be applied to a base glass substrate without coating unevenness is conventionally 2
57.5 ml, but 17.5 in scroll coating
ml, and it was confirmed that the used amount of the resist solution could be reduced to almost 2/3.

Example 2 Experiments were conducted on a conventional case where a resist solution is discharged to the center of a patterned substrate and diffused by rotating the substrate, and a case where a resist solution is applied to a patterned substrate in a scroll shape. went. Table 2 shows the experimental results.

[0088]

[Table 2]

Conventionally, the amount of resist solution that can be applied to a patterned substrate without coating unevenness is 30
ml, whereas in the case of scroll coating, 1
It was 7.5 ml, and it was confirmed that the usage of the resist solution could be reduced to almost half.

(Example 3) A comparative experiment was performed using the above-mentioned slit type nozzle shown in FIG. 8A and the Kumade type shown in FIG. 8C as the resist liquid discharge nozzle. In the slit type, the discharge width was 10 mm, and the slit width was 0.8 mm. In the Kumade type, 11 discharge pipes are used, the discharge width is 20 mm, and the hole diameter of the discharge pipe is 0.1 mm.
3 mm. Using these, a resist solution was applied to a base glass substrate in a scroll shape.

When the used amount of the resist solution is 20 ml,
As shown in FIG. 9, it was determined whether or not a gap was formed between the resist solutions discharged in a scroll shape. That is, the case where the resist on the substrate was circular as shown in FIG. 9A was evaluated as good (○), and the case where the resist became spiral as shown in FIG. 9B was evaluated as defective (×). Table 3 shows the results.

[0092]

[Table 3]

In the case of a slit type nozzle having a discharge width of 10 mm, when the diameter of the resist-applied portion immediately after resist application is 260 mm or less, discharge is performed in a scroll shape as shown in FIG. No gap is formed between the resist solutions, and the coating state is good. However, when the diameter is 280 mm or more, FIG.
As shown in (1), a gap is formed between the resist liquids discharged in a scroll shape, and the coating state is poor.

On the other hand, in the case of a Kumade type nozzle having a discharge width of 20 mm, the diameter immediately after resist coating is 33 mm.
When the distance is 0 mm or less, as shown in FIG. 9A, no gap is formed between the resist liquids discharged in a scroll shape, and the coating state is good, but the diameter is 350 m.
When it is not less than m, a gap is formed between the resist solutions discharged in a scroll shape as shown in FIG.
The application state is defective.

That is, it has been confirmed that, in the coating method in which the resist liquid is applied in a scroll shape, the area where the nozzle can be applied with a wide discharge width can be applied without gaps.

Next, in the same manner as described above, when the amount of resist used is changed and the resist solution is discharged and applied to the center of the conventional substrate (center discharge), scroll coating is performed using the slit type nozzle having a discharge width of 10 mm. The diameter of the resist before rotation was measured for the case where the scroll coating was performed and the case where the scroll coating was performed using the Kumade type nozzle having the discharge width of 20 mm. Table 4 shows the results.

[0097]

[Table 4]

As shown in Table 4, in the case of the conventional center discharge, unless the used amount of the resist liquid is 25 ml or more,
In contrast to the coating unevenness, in the case of scroll coating, 18.5 ml was used for both the case where the slit type nozzle was used and the case where the Kumade type nozzle was used.
Until then, no coating unevenness occurred. Regarding the resist diameter before rotation, in the case of center discharge, the resist diameter before rotation was 240 mm even when the resist discharge amount was 30 ml. At 300
mm. From this, it was confirmed that the use amount of the resist solution can be reduced by the sucrose application as compared with the conventional case.

In the scroll coating method, a slit type nozzle having a discharge width of 10 mm and a discharge nozzle having a discharge width of 2 mm were used.
When the nozzles of the Kumade type having a diameter of 0 mm were compared, it was confirmed that the diameter of the resist before rotation was larger in the Kumade type having a wider ejection width at any amount of the resist used.

(Example 4) Next, the film thickness uniformity when scroll coating was performed was determined. Table 5 shows the resist diameter and film thickness uniformity after discharge when scroll coating is performed while changing the resist discharge time and the amount of resist used. As shown in Table 5, the longer the discharge time, the thicker the central part and the thinner the peripheral part. FIG. 10 is a graph showing a diagonal film thickness profile in the case where scroll coating is performed with a resist consumption of 28 ml and the center discharge is performed in a discharge time of 18.5 sec. As is clear from this graph, it was confirmed that even when the ejection time was long and the amount of the resist used was large, the uniformity of the film thickness was only slightly worse than in the case of the center ejection. From this, it is understood that in the scroll coating, the film thickness uniformity equivalent to that in the case of the center discharge can be obtained by adjusting the discharge time and the amount of the resist used.

[0101]

[Table 5]

[0102]

As described above, according to the present invention,
While discharging the resist liquid from the resist liquid discharge nozzle to the substrate, the resist liquid discharge nozzle is moved on the substrate and at the same time, the substrate is rotated, thereby performing a relative scroll operation between the resist liquid discharge nozzle and the substrate. Since the resist liquid is applied in a scroll shape on the substrate, the resist liquid can be spread over a large area on the substrate even if the discharge amount of the resist liquid is not so large, and the resist liquid is hardly diffused. Even with this, the resist liquid can be uniformly applied onto the substrate with a small amount of the resist liquid discharged.

In this case, the resist liquid discharge nozzle is configured to discharge the resist liquid in a flat shape,
The discharge width can be widened, and a gap can be avoided between the resist liquids discharged in a scroll shape. Therefore, the resist liquid applied on the substrate has a circular shape as a whole, and coating unevenness can be prevented.

[Brief description of the drawings]

FIG. 1 is a plan view showing a system for applying and developing a color filter of an LCD to which the present invention is applied.

FIG. 2 is a schematic plan view showing a resist coating unit (CT), a drying unit, and an edge remover (ER).

FIG. 3 is a schematic side view showing a resist coating unit (CT), a drying unit, and an edge remover (ER).

FIG. 4 is a plan view and a side view of a resist liquid discharge nozzle arm.

FIG. 5 is a plan view schematically showing a resist coating unit (CT) according to one embodiment of the present invention.

FIG. 6 is a schematic diagram showing a control system of a resist coating unit (CT) according to one embodiment of the present invention.

FIG. 7 is a side view and a front view of a resist liquid discharge nozzle used in a resist coating unit (CT) according to an embodiment of the present invention.

FIG. 8 is a diagram schematically illustrating an example of a resist liquid discharge nozzle used in a resist coating unit (CT).

FIG. 9 is a schematic view showing a resist coating state immediately after scroll coating.

FIG. 10 is a graph showing film thickness profiles in the case of center discharge and the case of scroll coating.

FIG. 11 is a sectional view showing an example of a resist liquid discharge nozzle according to another embodiment of the present invention.

FIG. 12 is a cross-sectional view showing another example of a resist liquid ejection nozzle according to another embodiment of the present invention.

FIG. 13 is a schematic view showing one embodiment of a needle-like member in the resist liquid discharge nozzle shown in FIG.

FIG. 14 is a schematic view showing another embodiment of the needle-like member in the resist liquid discharge nozzle shown in FIG.

FIG. 15 is a partial schematic view showing still another embodiment of the needle-like member in the resist liquid discharge nozzle shown in FIG.

16 is a cross-sectional view showing a state where the resist liquid discharge nozzle shown in FIG. 15 is being cleaned by a nozzle cleaning mechanism.

FIG. 17 is a schematic sectional view showing a resist liquid discharge nozzle according to still another embodiment of the present invention.

FIG. 18 is a top view showing a state in which a resist liquid is applied using a resist liquid discharge nozzle according to still another embodiment of the present invention.

FIG. 19 is a schematic view showing an example of a resist liquid discharge nozzle according to still another embodiment of the present invention.

FIG. 20 is a schematic side view showing an example of a resist liquid discharge nozzle according to still another embodiment of the present invention.

[Explanation of symbols]

 22; resist coating processing unit (CT) 51; spin chuck 55; resist liquid discharge nozzle arms 56a to 56d; color resist liquid discharge nozzles 57a to 57d; color resist supply pipe 81; discharge port 90; controller 91; 92: substrate rotation mechanism G: substrate for color filter

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 21/027 H01L 21/30 564C

Claims (22)

[Claims] 1. A resist coating apparatus for applying a resist liquid to a substrate, comprising: a resist liquid discharge nozzle for discharging a coating liquid onto the substrate; a nozzle moving mechanism for moving the resist liquid discharge nozzle; A substrate rotating mechanism that rotates, while moving the resist liquid discharging nozzle on the substrate by the nozzle moving mechanism while discharging the coating liquid from the resist liquid discharging nozzle to the substrate, and simultaneously moving the substrate by the substrate rotating mechanism. A resist coating apparatus, wherein the resist liquid is applied to the substrate in a scroll shape while rotating to perform a relative scroll operation between the resist liquid discharge nozzle and the substrate. 2. The resist coating apparatus according to claim 1, wherein the resist liquid discharge nozzle discharges the resist liquid in a flat shape. 3. The resist coating apparatus according to claim 2, wherein a tip of the resist liquid discharge nozzle has a slit shape. 4. The resist liquid discharge nozzle has a nozzle main body and a number of needle-like members provided in a row in the nozzle main body and having a resist liquid passage hole formed therein. 3. The resist coating apparatus according to claim 2, wherein: 5. The nozzle body has an inlet for introducing a resist solution, and a storage chamber for storing the resist solution, wherein the inlet communicates with an upper surface of the storage room, and an upper surface of the storage room is The resist coating apparatus according to claim 4, further comprising an inclined portion inclined so that a portion communicating with the introduction port is higher. 6. The nozzle according to claim 4, wherein the needle-shaped member has a curved portion which is connected to the upper surface of the nozzle body and which descends after the flow of the resist solution flowing therethrough rises. A resist coating apparatus according to claim 5. 7. The plurality of needle-like members are provided so as to be inclined to the outside of the substrate when the resist liquid discharge nozzle is disposed above the substrate rotated by the substrate rotation mechanism. The resist coating apparatus according to any one of claims 4 to 6, wherein: 8. The resist coating apparatus according to claim 4, wherein the plurality of needle-like members have a larger outward inclination angle as going outward. 9. The resist coating apparatus according to claim 4, wherein the resist liquid discharge nozzle has a connecting member for connecting adjacent needle-shaped members. 10. The resist coating process according to claim 4, further comprising control means for controlling a discharge amount of the resist liquid for each of the plurality of needle-shaped members. apparatus. 11. A nozzle rotating mechanism for rotating the nozzle body, wherein the nozzle rotating mechanism moves the resist liquid ejection nozzle from the center of the substrate to the outside when the nozzle moving mechanism moves the needle from the center of the substrate. The resist according to any one of claims 4 to 10, wherein the nozzle body is rotated such that a direction of a row formed by the members approaches a tangential direction of a direction in which the substrate rotating means rotates the substrate. Coating equipment. 12. The resist coating apparatus according to claim 4, further comprising a bubble sensor for detecting bubbles in the needle-shaped member. 13. A distance sensor for detecting a distance between the resist liquid discharge nozzle and the substrate, an elevating mechanism for raising and lowering the height of the resist liquid discharge nozzle, and the resist liquid based on a detection result of the distance sensor. 4. The resist coating apparatus according to claim 3, further comprising a nozzle height control means for controlling the elevating mechanism so that a distance between the discharge nozzle and the substrate is constant. 14. The nozzle moving mechanism according to claim 1, wherein the nozzle moving mechanism moves the resist liquid discharge nozzle outward from a substantially center of the substrate.
Item 10. A resist coating apparatus according to Item 1. 15. The resist coating apparatus according to claim 1, wherein the nozzle moving mechanism has a variable moving speed of the resist liquid discharge nozzle. 16. The resist coating apparatus according to claim 15, wherein the nozzle moving mechanism reduces the moving speed as the resist liquid discharge nozzle moves outward from the substrate. 17. The resist coating apparatus according to claim 1, wherein a rotation speed of the substrate rotation mechanism is variable. 18. The resist coating apparatus according to claim 17, wherein the rotation speed of the substrate by the substrate rotation mechanism is maintained such that the outer periphery of the resist solution on the substrate does not radially spread. 19. A control mechanism for controlling the nozzle moving mechanism and the substrate rotating mechanism, wherein the control mechanism is controlled by the nozzle moving mechanism when a coating liquid is being discharged from the resist liquid discharging nozzle onto the substrate. 2. The method according to claim 1, wherein the substrate is rotated by the substrate rotating mechanism at the same time as the resist liquid discharge nozzle is moved, and a relative scroll operation is performed between the resist liquid discharge nozzle and the substrate. Resist coating equipment. 20. The resist coating apparatus according to claim 19, wherein the control mechanism controls a moving speed of the nozzle and a rotating speed of the substrate during the coating process. 21. The resist coating apparatus according to claim 1, wherein a plurality of resist liquid discharge nozzles are integrally held at a tip of one nozzle arm. . 22. When applying a resist liquid to a substrate, the resist liquid discharge nozzle is moved on the substrate while the coating liquid is discharged from the resist liquid discharge nozzle onto the substrate, and the substrate is rotated at the same time. A resist coating method, comprising applying a resist liquid on a substrate in a scroll shape while performing a relative scroll operation between the substrate and the substrate.