TW554022B - Chemical mechanical polishing composition and method for planarizing a silicon containing substrate with a polishing pad - Google Patents

Chemical mechanical polishing composition and method for planarizing a silicon containing substrate with a polishing pad Download PDF

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Publication number
TW554022B
TW554022B TW089123290A TW89123290A TW554022B TW 554022 B TW554022 B TW 554022B TW 089123290 A TW089123290 A TW 089123290A TW 89123290 A TW89123290 A TW 89123290A TW 554022 B TW554022 B TW 554022B
Authority
TW
Taiwan
Prior art keywords
polishing composition
polishing
chemical mechanical
patent application
mechanical polishing
Prior art date
Application number
TW089123290A
Other languages
English (en)
Chinese (zh)
Inventor
Alicia F Francis
Brian L Mueller
James A Dirksen
Paul M Feeney
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Application granted granted Critical
Publication of TW554022B publication Critical patent/TW554022B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Inorganic Insulating Materials (AREA)
TW089123290A 1999-11-04 2000-12-05 Chemical mechanical polishing composition and method for planarizing a silicon containing substrate with a polishing pad TW554022B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/428,965 US6350393B2 (en) 1999-11-04 1999-11-04 Use of CsOH in a dielectric CMP slurry

Publications (1)

Publication Number Publication Date
TW554022B true TW554022B (en) 2003-09-21

Family

ID=23701170

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089123290A TW554022B (en) 1999-11-04 2000-12-05 Chemical mechanical polishing composition and method for planarizing a silicon containing substrate with a polishing pad

Country Status (11)

Country Link
US (1) US6350393B2 (https=)
EP (1) EP1234010B1 (https=)
JP (3) JP2003514061A (https=)
KR (1) KR20020077343A (https=)
CN (1) CN1220742C (https=)
AT (1) ATE263224T1 (https=)
AU (1) AU3639001A (https=)
DE (1) DE60009546T2 (https=)
HK (1) HK1048826A1 (https=)
TW (1) TW554022B (https=)
WO (1) WO2001032793A2 (https=)

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DE10063491A1 (de) * 2000-12-20 2002-06-27 Bayer Ag Saure Polierslurry für das chemisch-mechanische Polieren von SiO¶2¶-Isolationsschichten
US20060005763A1 (en) 2001-12-24 2006-01-12 Crystal Is, Inc. Method and apparatus for producing large, single-crystals of aluminum nitride
US8545629B2 (en) 2001-12-24 2013-10-01 Crystal Is, Inc. Method and apparatus for producing large, single-crystals of aluminum nitride
US7638346B2 (en) * 2001-12-24 2009-12-29 Crystal Is, Inc. Nitride semiconductor heterostructures and related methods
US7677956B2 (en) 2002-05-10 2010-03-16 Cabot Microelectronics Corporation Compositions and methods for dielectric CMP
KR100526092B1 (ko) * 2002-10-15 2005-11-08 주식회사 네패스 실리콘 웨이퍼용 에지연마 조성물
US7071105B2 (en) 2003-02-03 2006-07-04 Cabot Microelectronics Corporation Method of polishing a silicon-containing dielectric
US7964005B2 (en) * 2003-04-10 2011-06-21 Technion Research & Development Foundation Ltd. Copper CMP slurry composition
US7186653B2 (en) 2003-07-30 2007-03-06 Climax Engineered Materials, Llc Polishing slurries and methods for chemical mechanical polishing
US20050279733A1 (en) * 2004-06-18 2005-12-22 Cabot Microelectronics Corporation CMP composition for improved oxide removal rate
US7524347B2 (en) * 2004-10-28 2009-04-28 Cabot Microelectronics Corporation CMP composition comprising surfactant
JP5319887B2 (ja) * 2005-01-05 2013-10-16 ニッタ・ハース株式会社 研磨用スラリー
US7351662B2 (en) * 2005-01-07 2008-04-01 Dupont Air Products Nanomaterials Llc Composition and associated method for catalyzing removal rates of dielectric films during chemical mechanical planarization
US20060288929A1 (en) * 2005-06-10 2006-12-28 Crystal Is, Inc. Polar surface preparation of nitride substrates
WO2007038399A2 (en) * 2005-09-26 2007-04-05 Cabot Microelectronics Corporation Metal cations for initiating chemical mechanical polishing
CN101415864B (zh) * 2005-11-28 2014-01-08 晶体公司 具有减少缺陷的大的氮化铝晶体及其制造方法
US7641735B2 (en) 2005-12-02 2010-01-05 Crystal Is, Inc. Doped aluminum nitride crystals and methods of making them
US9034103B2 (en) 2006-03-30 2015-05-19 Crystal Is, Inc. Aluminum nitride bulk crystals having high transparency to ultraviolet light and methods of forming them
CN101454487B (zh) 2006-03-30 2013-01-23 晶体公司 氮化铝块状晶体的可控掺杂方法
US20080020680A1 (en) * 2006-07-24 2008-01-24 Cabot Microelectronics Corporation Rate-enhanced CMP compositions for dielectric films
US7678700B2 (en) * 2006-09-05 2010-03-16 Cabot Microelectronics Corporation Silicon carbide polishing method utilizing water-soluble oxidizers
CN101528882B (zh) * 2006-10-16 2014-07-16 卡伯特微电子公司 玻璃抛光组合物及方法
WO2008088838A1 (en) 2007-01-17 2008-07-24 Crystal Is, Inc. Defect reduction in seeded aluminum nitride crystal growth
US9771666B2 (en) 2007-01-17 2017-09-26 Crystal Is, Inc. Defect reduction in seeded aluminum nitride crystal growth
US8080833B2 (en) 2007-01-26 2011-12-20 Crystal Is, Inc. Thick pseudomorphic nitride epitaxial layers
WO2008094464A2 (en) 2007-01-26 2008-08-07 Crystal Is, Inc. Thick pseudomorphic nitride epitaxial layers
US8088220B2 (en) * 2007-05-24 2012-01-03 Crystal Is, Inc. Deep-eutectic melt growth of nitride crystals
US7922926B2 (en) 2008-01-08 2011-04-12 Cabot Microelectronics Corporation Composition and method for polishing nickel-phosphorous-coated aluminum hard disks
US8754021B2 (en) 2009-02-27 2014-06-17 Advanced Technology Materials, Inc. Non-amine post-CMP composition and method of use
JP5806734B2 (ja) 2010-06-30 2015-11-10 クリスタル アイエス, インコーポレーテッドCrystal Is, Inc. 熱勾配制御による窒化アルミニウム大単結晶成長
US8962359B2 (en) 2011-07-19 2015-02-24 Crystal Is, Inc. Photon extraction from nitride ultraviolet light-emitting devices
CN105869997A (zh) * 2011-10-21 2016-08-17 安格斯公司 无胺cmp后组合物及其使用方法
US9039914B2 (en) 2012-05-23 2015-05-26 Cabot Microelectronics Corporation Polishing composition for nickel-phosphorous-coated memory disks
EP2973664B1 (en) 2013-03-15 2020-10-14 Crystal Is, Inc. Ultraviolet light-emitting device and method of forming a contact to an ultraviolet light-emitting device

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EP0322721B1 (en) * 1987-12-29 1993-10-06 E.I. Du Pont De Nemours And Company Fine polishing composition for wafers
JP2625002B2 (ja) * 1988-06-27 1997-06-25 イー・アイ・デュポン・ドゥ・ヌムール・アンド・カンパニー ウェハーのファイン研磨用組成物
US5352277A (en) 1988-12-12 1994-10-04 E. I. Du Pont De Nemours & Company Final polishing composition
JP2714411B2 (ja) * 1988-12-12 1998-02-16 イー・アイ・デュポン・ドゥ・ヌムール・アンド・カンパニー ウェハーのファイン研摩用組成物
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US5714418A (en) * 1995-11-08 1998-02-03 Intel Corporation Diffusion barrier for electrical interconnects in an integrated circuit
EP0779655A3 (en) * 1995-12-14 1997-07-16 International Business Machines Corporation A method of chemically-mechanically polishing an electronic component
EP0786504A3 (en) * 1996-01-29 1998-05-20 Fujimi Incorporated Polishing composition
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JPH09316431A (ja) * 1996-05-27 1997-12-09 Showa Kiyabotsuto Super Metal Kk 研磨用スラリー

Also Published As

Publication number Publication date
WO2001032793A3 (en) 2001-08-02
CN1220742C (zh) 2005-09-28
DE60009546T2 (de) 2005-02-03
CN1387556A (zh) 2002-12-25
JP2012156550A (ja) 2012-08-16
EP1234010B1 (en) 2004-03-31
US6350393B2 (en) 2002-02-26
HK1048826A1 (zh) 2003-04-17
DE60009546D1 (de) 2004-05-06
EP1234010A2 (en) 2002-08-28
WO2001032793A2 (en) 2001-05-10
AU3639001A (en) 2001-05-14
JP6030703B2 (ja) 2016-11-24
WO2001032793A8 (en) 2001-10-04
JP2015147938A (ja) 2015-08-20
JP2003514061A (ja) 2003-04-15
KR20020077343A (ko) 2002-10-11
ATE263224T1 (de) 2004-04-15
US20010051433A1 (en) 2001-12-13

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