TW553195U - Substrate supporting slot plate and substrate cassette using the same - Google Patents

Substrate supporting slot plate and substrate cassette using the same

Info

Publication number
TW553195U
TW553195U TW091216036U TW91216036U TW553195U TW 553195 U TW553195 U TW 553195U TW 091216036 U TW091216036 U TW 091216036U TW 91216036 U TW91216036 U TW 91216036U TW 553195 U TW553195 U TW 553195U
Authority
TW
Taiwan
Prior art keywords
substrate
same
slot plate
supporting slot
cassette
Prior art date
Application number
TW091216036U
Other languages
English (en)
Inventor
Chun-Kai Huang
Ming-Hui Chang
Original Assignee
Foxsemicon Integrated Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxsemicon Integrated Tech Inc filed Critical Foxsemicon Integrated Tech Inc
Priority to TW091216036U priority Critical patent/TW553195U/zh
Priority to JP2003151433A priority patent/JP3936309B2/ja
Publication of TW553195U publication Critical patent/TW553195U/zh
Priority to US10/678,522 priority patent/US20040069728A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
TW091216036U 2002-10-09 2002-10-09 Substrate supporting slot plate and substrate cassette using the same TW553195U (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW091216036U TW553195U (en) 2002-10-09 2002-10-09 Substrate supporting slot plate and substrate cassette using the same
JP2003151433A JP3936309B2 (ja) 2002-10-09 2003-05-28 基板支承に用いるスロットプレート及び該スロットプレートを用いる基板カセット
US10/678,522 US20040069728A1 (en) 2002-10-09 2003-10-03 Cassette

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW091216036U TW553195U (en) 2002-10-09 2002-10-09 Substrate supporting slot plate and substrate cassette using the same

Publications (1)

Publication Number Publication Date
TW553195U true TW553195U (en) 2003-09-11

Family

ID=31885777

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091216036U TW553195U (en) 2002-10-09 2002-10-09 Substrate supporting slot plate and substrate cassette using the same

Country Status (3)

Country Link
US (1) US20040069728A1 (zh)
JP (1) JP3936309B2 (zh)
TW (1) TW553195U (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI310850B (en) * 2003-08-01 2009-06-11 Foxsemicon Integrated Tech Inc Substrate supporting rod and substrate cassette using the same
JP2005340480A (ja) * 2004-05-26 2005-12-08 Nippon Oil Corp 基板カセット用サポートバー
TWI315002B (en) * 2005-04-15 2009-09-21 Innolux Display Corp Substrate cassette
TWI469901B (zh) * 2008-01-13 2015-01-21 Entegris Inc 晶圓容置箱及其製造方法
KR101479302B1 (ko) * 2008-07-02 2015-01-05 삼성디스플레이 주식회사 기판 소성 장치
KR101212889B1 (ko) * 2010-10-01 2012-12-14 하이디스 테크놀로지 주식회사 기판 적재용 카세트
JP6015905B2 (ja) * 2012-05-25 2016-10-26 パナソニックＩｐマネジメント株式会社 梱包材
US8997996B2 (en) * 2013-03-18 2015-04-07 Shenzhen China Star Optoelectronics Technology Co., Ltd. Drawer type cushioning packaging device for liquid crystal glass
JP7205848B2 (ja) * 2018-02-15 2023-01-17 株式会社リニア・サーキット 基板収納用のケーシング
TWI751814B (zh) * 2020-09-22 2022-01-01 家登精密工業股份有限公司 支撐片狀物的中央支撐裝置及存放片狀物的儲存設備

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4153164A (en) * 1978-06-13 1979-05-08 Kasper Instruments, Inc. Carrier for semiconductive wafers
US4515104A (en) * 1983-05-13 1985-05-07 Asq Boats, Inc. Contiguous wafer boat
US4676008A (en) * 1986-05-16 1987-06-30 Microglass, Inc. Cage-type wafer carrier and method
US4872554A (en) * 1987-07-02 1989-10-10 Fluoroware, Inc. Reinforced carrier with embedded rigid insert
JP3145252B2 (ja) * 1994-07-29 2001-03-12 淀川化成株式会社 基板支承用側板およびそれを用いたカセット
US5452795A (en) * 1994-11-07 1995-09-26 Gallagher; Gary M. Actuated rotary retainer for silicone wafer box
US6776289B1 (en) * 1996-07-12 2004-08-17 Entegris, Inc. Wafer container with minimal contact
US6092981A (en) * 1999-03-11 2000-07-25 Applied Materials, Inc. Modular substrate cassette
CN1136609C (zh) * 1999-09-06 2004-01-28 淀川化成株式会社 基板用盒
US6378538B1 (en) * 1999-12-13 2002-04-30 Advanced Micro Devices, Inc. Durable, multi-piece rotor for spray acid tools
JP2002324830A (ja) * 2001-02-20 2002-11-08 Mitsubishi Electric Corp 基板熱処理用保持具、基板熱処理装置、半導体装置の製造方法、基板熱処理用保持具の製造方法及び基板熱処理用保持具の構造決定方法
JP4467028B2 (ja) * 2001-05-11 2010-05-26 信越石英株式会社 縦型ウェーハ支持治具
JP2002343789A (ja) * 2001-05-16 2002-11-29 Mitsubishi Electric Corp 補助保温治具、その製造方法、板状断熱材付きウエハボート、縦型熱処理装置、縦型熱処理装置の改造方法および半導体装置の製造方法
US6758339B2 (en) * 2001-07-12 2004-07-06 Entegris, Inc. Thin wafer carrier

Also Published As

Publication number Publication date
JP3936309B2 (ja) 2007-06-27
JP2004134737A (ja) 2004-04-30
US20040069728A1 (en) 2004-04-15

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees