TW528644B - Polishing device - Google Patents
Polishing device Download PDFInfo
- Publication number
- TW528644B TW528644B TW091100030A TW91100030A TW528644B TW 528644 B TW528644 B TW 528644B TW 091100030 A TW091100030 A TW 091100030A TW 91100030 A TW91100030 A TW 91100030A TW 528644 B TW528644 B TW 528644B
- Authority
- TW
- Taiwan
- Prior art keywords
- honing
- substrate
- rollers
- carrying
- bodies
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/18—Accessories
- B24B21/22—Accessories for producing a reciprocation of the grinding belt normal to its direction of movement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Ink Jet (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001020017A JP2002224940A (ja) | 2001-01-29 | 2001-01-29 | 研磨装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW528644B true TW528644B (en) | 2003-04-21 |
Family
ID=18885795
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW091100030A TW528644B (en) | 2001-01-29 | 2002-01-03 | Polishing device |
Country Status (4)
Country | Link |
---|---|
US (1) | US20020173257A1 (ja) |
JP (1) | JP2002224940A (ja) |
KR (1) | KR20020063509A (ja) |
TW (1) | TW528644B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111469018A (zh) * | 2020-05-09 | 2020-07-31 | 卓莘汽车科技(上海)有限公司 | 一种用于汽车模型生产的磨砂装置 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100926025B1 (ko) * | 2005-09-14 | 2009-11-11 | 가부시키가이샤 오카모도 코사쿠 기카이 세이사쿠쇼 | 직사각형 기판의 양면 연마 장치 및 양면 연마 방법 |
JP4838703B2 (ja) * | 2006-12-26 | 2011-12-14 | 富士電機株式会社 | 磁気記録媒体用ディスク基板の製造方法、磁気記録媒体用ディスク基板、磁気記録媒体の製造方法、磁気記録媒体、及び磁気記録装置 |
TW200841987A (en) * | 2007-04-16 | 2008-11-01 | Sanshin Co Ltd | Panel grinding device |
CN112139936B (zh) * | 2020-09-29 | 2021-11-19 | 宁波嘉丰精密铸造有限公司 | 一种铸造件毛边打磨设备及其打磨工艺 |
CN114193311A (zh) * | 2021-12-22 | 2022-03-18 | 中国十七冶集团有限公司 | 一种建筑用的智能抛光设备及抛光方法 |
-
2001
- 2001-01-29 JP JP2001020017A patent/JP2002224940A/ja not_active Withdrawn
-
2002
- 2002-01-03 TW TW091100030A patent/TW528644B/zh not_active IP Right Cessation
- 2002-01-28 KR KR1020020004729A patent/KR20020063509A/ko not_active Application Discontinuation
- 2002-01-29 US US10/058,812 patent/US20020173257A1/en not_active Abandoned
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111469018A (zh) * | 2020-05-09 | 2020-07-31 | 卓莘汽车科技(上海)有限公司 | 一种用于汽车模型生产的磨砂装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2002224940A (ja) | 2002-08-13 |
US20020173257A1 (en) | 2002-11-21 |
KR20020063509A (ko) | 2002-08-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4A | Issue of patent certificate for granted invention patent | ||
MM4A | Annulment or lapse of patent due to non-payment of fees |