TW517326B - Electrostatic chucking device and manufacturing method thereof - Google Patents

Electrostatic chucking device and manufacturing method thereof Download PDF

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Publication number
TW517326B
TW517326B TW90119917A TW90119917A TW517326B TW 517326 B TW517326 B TW 517326B TW 90119917 A TW90119917 A TW 90119917A TW 90119917 A TW90119917 A TW 90119917A TW 517326 B TW517326 B TW 517326B
Authority
TW
Taiwan
Prior art keywords
insulating layer
film
polyimide
electrostatic chuck
layer
Prior art date
Application number
TW90119917A
Other languages
English (en)
Chinese (zh)
Inventor
Yoshiaki Tatsumi
Kinya Miyashita
Original Assignee
Creative Tech Corp
Kawamura Sangyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Creative Tech Corp, Kawamura Sangyo Co Ltd filed Critical Creative Tech Corp
Application granted granted Critical
Publication of TW517326B publication Critical patent/TW517326B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/23—Chucks or sockets with magnetic or electrostatic means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/269—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension including synthetic resin or polymer layer or component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
TW90119917A 2000-08-16 2001-08-14 Electrostatic chucking device and manufacturing method thereof TW517326B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000246740A JP4753460B2 (ja) 2000-08-16 2000-08-16 静電チャック及びその製造方法

Publications (1)

Publication Number Publication Date
TW517326B true TW517326B (en) 2003-01-11

Family

ID=18736992

Family Applications (1)

Application Number Title Priority Date Filing Date
TW90119917A TW517326B (en) 2000-08-16 2001-08-14 Electrostatic chucking device and manufacturing method thereof

Country Status (5)

Country Link
US (2) US6813134B2 (de)
EP (1) EP1180793A3 (de)
JP (1) JP4753460B2 (de)
KR (1) KR100691098B1 (de)
TW (1) TW517326B (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102543813A (zh) * 2010-12-16 2012-07-04 应用材料公司 用于半导体晶圆处理的高效率静电夹盘组件
TWI401768B (zh) * 2008-09-09 2013-07-11 Komico Ltd 包含用以降低熱應力之緩衝層之靜電夾頭
TWI453857B (zh) * 2007-08-02 2014-09-21 Ulvac Inc Manufacturing method of electrostatic chuck mechanism

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KR100899292B1 (ko) * 2003-01-06 2009-05-26 주식회사 코미코 수명을 연장시키는 절연막을 갖는 반도체 장비용 정전척
KR100912003B1 (ko) * 2003-01-06 2009-08-14 주식회사 코미코 웨이퍼 주변을 보호하는 반도체 장비용 정전척
JP2004235563A (ja) * 2003-01-31 2004-08-19 Tomoegawa Paper Co Ltd 静電チャック装置用電極シート及びこれを用いた静電チャック装置
US7084492B2 (en) * 2003-06-30 2006-08-01 Intel Corporation Underfill and mold compounds including siloxane-based aromatic diamines
US6944028B1 (en) * 2004-06-19 2005-09-13 C-One Technology Corporation Storage memory device
JP2006049357A (ja) * 2004-07-30 2006-02-16 Toto Ltd 静電チャックおよび静電チャックを搭載した装置
US7648914B2 (en) * 2004-10-07 2010-01-19 Applied Materials, Inc. Method for etching having a controlled distribution of process results
US7544251B2 (en) 2004-10-07 2009-06-09 Applied Materials, Inc. Method and apparatus for controlling temperature of a substrate
US7436645B2 (en) 2004-10-07 2008-10-14 Applied Materials, Inc. Method and apparatus for controlling temperature of a substrate
US8226769B2 (en) 2006-04-27 2012-07-24 Applied Materials, Inc. Substrate support with electrostatic chuck having dual temperature zones
US9275887B2 (en) 2006-07-20 2016-03-01 Applied Materials, Inc. Substrate processing with rapid temperature gradient control
US8123902B2 (en) * 2007-03-21 2012-02-28 Applied Materials, Inc. Gas flow diffuser
JP4976915B2 (ja) 2007-05-08 2012-07-18 新光電気工業株式会社 静電チャックおよび静電チャックの製造方法
MY166000A (en) * 2007-12-19 2018-05-21 Lam Res Corp A composite showerhead electrode assembly for a plasma processing apparatus
US8449786B2 (en) * 2007-12-19 2013-05-28 Lam Research Corporation Film adhesive for semiconductor vacuum processing apparatus
US8876024B2 (en) 2008-01-10 2014-11-04 Applied Materials, Inc. Heated showerhead assembly
US8043433B2 (en) * 2008-02-11 2011-10-25 Applied Materials, Inc. High efficiency electro-static chucks for semiconductor wafer processing
TWI475594B (zh) 2008-05-19 2015-03-01 Entegris Inc 靜電夾頭
WO2009148253A2 (ko) * 2008-06-02 2009-12-10 고려대학교 산학협력단 반도체 발광소자 제조용 지지기판 및 상기 지지기판을 이용한 반도체 발광소자
US9520314B2 (en) * 2008-12-19 2016-12-13 Applied Materials, Inc. High temperature electrostatic chuck bonding adhesive
JP5193886B2 (ja) * 2009-01-14 2013-05-08 株式会社巴川製紙所 静電チャック装置の補修方法および補修装置、ならびに静電チャック装置
US8861170B2 (en) 2009-05-15 2014-10-14 Entegris, Inc. Electrostatic chuck with photo-patternable soft protrusion contact surface
SG176059A1 (en) 2009-05-15 2011-12-29 Entegris Inc Electrostatic chuck with polymer protrusions
WO2011149918A2 (en) 2010-05-28 2011-12-01 Entegris, Inc. High surface resistivity electrostatic chuck
JP5885404B2 (ja) * 2010-08-04 2016-03-15 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法
EP2490073B1 (de) 2011-02-18 2015-09-23 ASML Netherlands BV Substrathalter, lithografische Vorrichtung und Verfahren zur Herstellung eines Substrathalters
KR20130025025A (ko) * 2011-09-01 2013-03-11 주식회사 코미코 정전척
CN109298602B (zh) 2012-02-03 2021-10-15 Asml荷兰有限公司 衬底保持器和光刻装置
KR101970301B1 (ko) 2012-07-11 2019-04-18 삼성전자주식회사 웨이퍼 테스트 장치
JP5981358B2 (ja) 2013-01-23 2016-08-31 東京エレクトロン株式会社 伝熱シート貼付方法
KR102046534B1 (ko) * 2013-01-25 2019-11-19 삼성전자주식회사 기판 가공 방법
CN104752301B (zh) * 2013-12-31 2018-05-25 北京北方华创微电子装备有限公司 一种静电卡盘以及腔室
KR102311586B1 (ko) 2014-12-26 2021-10-12 삼성디스플레이 주식회사 증착 장치 및 증착 장치 내 기판 정렬 방법
KR102373326B1 (ko) 2014-12-26 2022-03-11 삼성디스플레이 주식회사 증착 장치 및 증착 장치 내 기판 정렬 방법
KR102540912B1 (ko) 2015-08-27 2023-06-08 스미토모 오사카 세멘토 가부시키가이샤 정전 척 장치
US10570257B2 (en) 2015-11-16 2020-02-25 Applied Materials, Inc. Copolymerized high temperature bonding component
JP6616363B2 (ja) * 2017-09-05 2019-12-04 日本特殊陶業株式会社 保持装置
CN110473824A (zh) * 2019-09-05 2019-11-19 苏州芯慧联半导体科技有限公司 一种半导体用可再生静电卡盘及其制造方法
CN113613411B (zh) * 2021-09-23 2023-04-07 浙江清华柔性电子技术研究院 柔性电路基板及其制备方法和应用

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI453857B (zh) * 2007-08-02 2014-09-21 Ulvac Inc Manufacturing method of electrostatic chuck mechanism
TWI401768B (zh) * 2008-09-09 2013-07-11 Komico Ltd 包含用以降低熱應力之緩衝層之靜電夾頭
CN102543813A (zh) * 2010-12-16 2012-07-04 应用材料公司 用于半导体晶圆处理的高效率静电夹盘组件
CN105914175A (zh) * 2010-12-16 2016-08-31 应用材料公司 用于半导体晶圆处理的高效率静电夹盘组件

Also Published As

Publication number Publication date
JP2002064134A (ja) 2002-02-28
US6813134B2 (en) 2004-11-02
KR20020014722A (ko) 2002-02-25
KR100691098B1 (ko) 2007-03-09
US7411773B2 (en) 2008-08-12
US20040160021A1 (en) 2004-08-19
JP4753460B2 (ja) 2011-08-24
US20020021545A1 (en) 2002-02-21
EP1180793A3 (de) 2004-06-16
EP1180793A2 (de) 2002-02-20

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