TW515005B - Vacuum plasma processor apparatus and method - Google Patents
Vacuum plasma processor apparatus and method Download PDFInfo
- Publication number
- TW515005B TW515005B TW090116008A TW90116008A TW515005B TW 515005 B TW515005 B TW 515005B TW 090116008 A TW090116008 A TW 090116008A TW 90116008 A TW90116008 A TW 90116008A TW 515005 B TW515005 B TW 515005B
- Authority
- TW
- Taiwan
- Prior art keywords
- coil
- patent application
- winding
- center point
- scope
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 26
- 230000005284 excitation Effects 0.000 claims abstract description 39
- 238000012545 processing Methods 0.000 claims abstract description 28
- 238000004804 winding Methods 0.000 claims description 106
- 230000002093 peripheral effect Effects 0.000 claims description 19
- 230000008569 process Effects 0.000 claims description 9
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 4
- 238000000926 separation method Methods 0.000 claims description 2
- 238000009434 installation Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 abstract description 77
- 230000005672 electromagnetic field Effects 0.000 abstract description 2
- 230000004907 flux Effects 0.000 description 26
- 239000002184 metal Substances 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000003990 capacitor Substances 0.000 description 10
- 238000005530 etching Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 7
- 230000008859 change Effects 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 3
- 230000002079 cooperative effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000012935 Averaging Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000000739 chaotic effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 239000010977 jade Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
- H01J37/3211—Antennas, e.g. particular shapes of coils
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- Plasma Technology (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/607,326 US6531029B1 (en) | 2000-06-30 | 2000-06-30 | Vacuum plasma processor apparatus and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW515005B true TW515005B (en) | 2002-12-21 |
Family
ID=24431792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW090116008A TW515005B (en) | 2000-06-30 | 2001-07-11 | Vacuum plasma processor apparatus and method |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US6531029B1 (enExample) |
| EP (1) | EP1300057B1 (enExample) |
| JP (2) | JP5116203B2 (enExample) |
| KR (2) | KR100807143B1 (enExample) |
| AU (1) | AU2001270163A1 (enExample) |
| DE (1) | DE60128229T2 (enExample) |
| TW (1) | TW515005B (enExample) |
| WO (1) | WO2002003763A2 (enExample) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7571697B2 (en) * | 2001-09-14 | 2009-08-11 | Lam Research Corporation | Plasma processor coil |
| US6876155B2 (en) * | 2002-12-31 | 2005-04-05 | Lam Research Corporation | Plasma processor apparatus and method, and antenna |
| KR100964398B1 (ko) * | 2003-01-03 | 2010-06-17 | 삼성전자주식회사 | 유도결합형 안테나 및 이를 채용한 플라즈마 처리장치 |
| US20040261718A1 (en) * | 2003-06-26 | 2004-12-30 | Kim Nam Hun | Plasma source coil for generating plasma and plasma chamber using the same |
| US7713432B2 (en) * | 2004-10-04 | 2010-05-11 | David Johnson | Method and apparatus to improve plasma etch uniformity |
| US20080003377A1 (en) * | 2006-06-30 | 2008-01-03 | The Board Of Regents Of The Nevada System Of Higher Ed. On Behalf Of The Unlv | Transparent vacuum system |
| DE102008024014A1 (de) * | 2008-05-16 | 2010-04-15 | Ofa Bamberg Gmbh | Elektronischer Lebensdauerindikator |
| US20120103524A1 (en) * | 2010-10-28 | 2012-05-03 | Applied Materials, Inc. | Plasma processing apparatus with reduced effects of process chamber asymmetry |
| US20120152900A1 (en) * | 2010-12-20 | 2012-06-21 | Applied Materials, Inc. | Methods and apparatus for gas delivery into plasma processing chambers |
| US10777387B2 (en) * | 2012-09-28 | 2020-09-15 | Semes Co., Ltd. | Apparatus for treating substrate |
| CN109036817B (zh) * | 2017-06-08 | 2021-09-17 | 北京北方华创微电子装备有限公司 | 电感耦合线圈和工艺腔室 |
| JP6909824B2 (ja) * | 2019-05-17 | 2021-07-28 | 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ | 基板処理装置、半導体装置の製造方法及びプログラム |
| KR20220107521A (ko) * | 2021-01-25 | 2022-08-02 | (주) 엔피홀딩스 | 반응기, 이를 포함하는 공정 처리 장치 및 반응기 제조 방법 |
| US20250132127A1 (en) * | 2021-08-06 | 2025-04-24 | Lam Research Corporation | Transformer coupled plasma source design for thin dielectric film deposition |
| US12074390B2 (en) | 2022-11-11 | 2024-08-27 | Tokyo Electron Limited | Parallel resonance antenna for radial plasma control |
| CN116864255A (zh) * | 2023-08-14 | 2023-10-10 | 北京北方华创微电子装备有限公司 | 线圈、线圈组件、线圈装置及半导体工艺设备 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4948458A (en) | 1989-08-14 | 1990-08-14 | Lam Research Corporation | Method and apparatus for producing magnetically-coupled planar plasma |
| US6077384A (en) | 1994-08-11 | 2000-06-20 | Applied Materials, Inc. | Plasma reactor having an inductive antenna coupling power through a parallel plate electrode |
| US5401350A (en) | 1993-03-08 | 1995-03-28 | Lsi Logic Corporation | Coil configurations for improved uniformity in inductively coupled plasma systems |
| US5919382A (en) * | 1994-10-31 | 1999-07-06 | Applied Materials, Inc. | Automatic frequency tuning of an RF power source of an inductively coupled plasma reactor |
| US5838111A (en) | 1996-02-27 | 1998-11-17 | Matsushita Electric Industrial Co., Ltd. | Plasma generator with antennas attached to top electrodes |
| CA2207154A1 (en) | 1996-06-10 | 1997-12-10 | Lam Research Corporation | Inductively coupled source for deriving substantially uniform plasma flux |
| US5759280A (en) | 1996-06-10 | 1998-06-02 | Lam Research Corporation | Inductively coupled source for deriving substantially uniform plasma flux |
| US5800619A (en) | 1996-06-10 | 1998-09-01 | Lam Research Corporation | Vacuum plasma processor having coil with minimum magnetic field in its center |
| US6268700B1 (en) * | 1996-06-10 | 2001-07-31 | Lam Research Corporation | Vacuum plasma processor having coil with intermediate portion coupling lower magnetic flux density to plasma than center and peripheral portions of the coil |
| JP3658922B2 (ja) | 1997-05-22 | 2005-06-15 | 松下電器産業株式会社 | プラズマ処理方法及び装置 |
| EP0870576A3 (en) | 1997-04-08 | 2000-10-11 | Ebara Corporation | Polishing Apparatus |
| US6028285A (en) | 1997-11-19 | 2000-02-22 | Board Of Regents, The University Of Texas System | High density plasma source for semiconductor processing |
| JP2972707B1 (ja) * | 1998-02-26 | 1999-11-08 | 松下電子工業株式会社 | プラズマエッチング装置及びプラズマエッチング方法 |
| US6146508A (en) * | 1998-04-22 | 2000-11-14 | Applied Materials, Inc. | Sputtering method and apparatus with small diameter RF coil |
| US6164241A (en) * | 1998-06-30 | 2000-12-26 | Lam Research Corporation | Multiple coil antenna for inductively-coupled plasma generation systems |
| KR100291898B1 (ko) * | 1999-04-09 | 2001-06-01 | 윤종용 | 스파터 오염원을 감소시키고 플라즈마에 유도 결합을 향상시키기위한 차폐판의 제조방법 및 플라즈마 식각장치 |
| US6319355B1 (en) * | 1999-06-30 | 2001-11-20 | Lam Research Corporation | Plasma processor with coil responsive to variable amplitude rf envelope |
| US6143144A (en) * | 1999-07-30 | 2000-11-07 | Tokyo Electronlimited | Method for etch rate enhancement by background oxygen control in a soft etch system |
-
2000
- 2000-06-30 US US09/607,326 patent/US6531029B1/en not_active Expired - Lifetime
-
2001
- 2001-06-26 KR KR1020077014974A patent/KR100807143B1/ko not_active Expired - Fee Related
- 2001-06-26 KR KR1020027017794A patent/KR100881882B1/ko not_active Expired - Fee Related
- 2001-06-26 WO PCT/US2001/020263 patent/WO2002003763A2/en not_active Ceased
- 2001-06-26 DE DE60128229T patent/DE60128229T2/de not_active Expired - Lifetime
- 2001-06-26 JP JP2002507035A patent/JP5116203B2/ja not_active Expired - Fee Related
- 2001-06-26 EP EP01948718A patent/EP1300057B1/en not_active Expired - Lifetime
- 2001-06-26 AU AU2001270163A patent/AU2001270163A1/en not_active Abandoned
- 2001-07-11 TW TW090116008A patent/TW515005B/zh not_active IP Right Cessation
-
2003
- 2003-01-21 US US10/347,363 patent/US6897156B2/en not_active Expired - Fee Related
-
2011
- 2011-10-17 JP JP2011227690A patent/JP5538340B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US20030106645A1 (en) | 2003-06-12 |
| WO2002003763B1 (en) | 2003-03-13 |
| WO2002003763A2 (en) | 2002-01-10 |
| WO2002003763A3 (en) | 2002-12-27 |
| EP1300057B1 (en) | 2007-05-02 |
| KR100881882B1 (ko) | 2009-02-06 |
| DE60128229T2 (de) | 2007-08-30 |
| US6897156B2 (en) | 2005-05-24 |
| JP2012033958A (ja) | 2012-02-16 |
| DE60128229D1 (de) | 2007-06-14 |
| AU2001270163A1 (en) | 2002-01-14 |
| KR20070074672A (ko) | 2007-07-12 |
| JP5538340B2 (ja) | 2014-07-02 |
| KR100807143B1 (ko) | 2008-02-27 |
| KR20030034108A (ko) | 2003-05-01 |
| JP5116203B2 (ja) | 2013-01-09 |
| WO2002003763A8 (en) | 2002-04-04 |
| US6531029B1 (en) | 2003-03-11 |
| EP1300057A2 (en) | 2003-04-09 |
| JP2004520704A (ja) | 2004-07-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent | ||
| MM4A | Annulment or lapse of patent due to non-payment of fees |