DE60128229D1 - Spule für Vakuum-Plasmabehandlungsvorrichtung - Google Patents

Spule für Vakuum-Plasmabehandlungsvorrichtung

Info

Publication number
DE60128229D1
DE60128229D1 DE60128229T DE60128229T DE60128229D1 DE 60128229 D1 DE60128229 D1 DE 60128229D1 DE 60128229 T DE60128229 T DE 60128229T DE 60128229 T DE60128229 T DE 60128229T DE 60128229 D1 DE60128229 D1 DE 60128229D1
Authority
DE
Germany
Prior art keywords
coil
treatment device
plasma treatment
vacuum plasma
vacuum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60128229T
Other languages
English (en)
Other versions
DE60128229T2 (de
Inventor
Tuqiang Ni
Kenji Takeshita
Tom Choi
Frank Y Lin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of DE60128229D1 publication Critical patent/DE60128229D1/de
Application granted granted Critical
Publication of DE60128229T2 publication Critical patent/DE60128229T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H01J37/3211—Antennas, e.g. particular shapes of coils

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
DE60128229T 2000-06-30 2001-06-26 Spule für Vakuum-Plasmabehandlungsvorrichtung Expired - Lifetime DE60128229T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US607326 1984-05-04
US09/607,326 US6531029B1 (en) 2000-06-30 2000-06-30 Vacuum plasma processor apparatus and method
PCT/US2001/020263 WO2002003763A2 (en) 2000-06-30 2001-06-26 Vacuum plasma processor apparatus and method

Publications (2)

Publication Number Publication Date
DE60128229D1 true DE60128229D1 (de) 2007-06-14
DE60128229T2 DE60128229T2 (de) 2007-08-30

Family

ID=24431792

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60128229T Expired - Lifetime DE60128229T2 (de) 2000-06-30 2001-06-26 Spule für Vakuum-Plasmabehandlungsvorrichtung

Country Status (8)

Country Link
US (2) US6531029B1 (de)
EP (1) EP1300057B1 (de)
JP (2) JP5116203B2 (de)
KR (2) KR100881882B1 (de)
AU (1) AU2001270163A1 (de)
DE (1) DE60128229T2 (de)
TW (1) TW515005B (de)
WO (1) WO2002003763A2 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7571697B2 (en) * 2001-09-14 2009-08-11 Lam Research Corporation Plasma processor coil
US6876155B2 (en) * 2002-12-31 2005-04-05 Lam Research Corporation Plasma processor apparatus and method, and antenna
KR100964398B1 (ko) * 2003-01-03 2010-06-17 삼성전자주식회사 유도결합형 안테나 및 이를 채용한 플라즈마 처리장치
US20040261718A1 (en) * 2003-06-26 2004-12-30 Kim Nam Hun Plasma source coil for generating plasma and plasma chamber using the same
US7713432B2 (en) * 2004-10-04 2010-05-11 David Johnson Method and apparatus to improve plasma etch uniformity
US20080003377A1 (en) * 2006-06-30 2008-01-03 The Board Of Regents Of The Nevada System Of Higher Ed. On Behalf Of The Unlv Transparent vacuum system
DE102008024014A1 (de) * 2008-05-16 2010-04-15 Ofa Bamberg Gmbh Elektronischer Lebensdauerindikator
US20120103524A1 (en) * 2010-10-28 2012-05-03 Applied Materials, Inc. Plasma processing apparatus with reduced effects of process chamber asymmetry
US20120152900A1 (en) * 2010-12-20 2012-06-21 Applied Materials, Inc. Methods and apparatus for gas delivery into plasma processing chambers
US10777387B2 (en) * 2012-09-28 2020-09-15 Semes Co., Ltd. Apparatus for treating substrate
CN109036817B (zh) * 2017-06-08 2021-09-17 北京北方华创微电子装备有限公司 电感耦合线圈和工艺腔室
JP6909824B2 (ja) * 2019-05-17 2021-07-28 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、半導体装置の製造方法及びプログラム
KR20220107521A (ko) * 2021-01-25 2022-08-02 (주) 엔피홀딩스 반응기, 이를 포함하는 공정 처리 장치 및 반응기 제조 방법

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4948458A (en) 1989-08-14 1990-08-14 Lam Research Corporation Method and apparatus for producing magnetically-coupled planar plasma
US6077384A (en) 1994-08-11 2000-06-20 Applied Materials, Inc. Plasma reactor having an inductive antenna coupling power through a parallel plate electrode
US5401350A (en) 1993-03-08 1995-03-28 Lsi Logic Corporation Coil configurations for improved uniformity in inductively coupled plasma systems
US5919382A (en) * 1994-10-31 1999-07-06 Applied Materials, Inc. Automatic frequency tuning of an RF power source of an inductively coupled plasma reactor
US5838111A (en) 1996-02-27 1998-11-17 Matsushita Electric Industrial Co., Ltd. Plasma generator with antennas attached to top electrodes
CA2207154A1 (en) 1996-06-10 1997-12-10 Lam Research Corporation Inductively coupled source for deriving substantially uniform plasma flux
US5800619A (en) 1996-06-10 1998-09-01 Lam Research Corporation Vacuum plasma processor having coil with minimum magnetic field in its center
US5759280A (en) 1996-06-10 1998-06-02 Lam Research Corporation Inductively coupled source for deriving substantially uniform plasma flux
US6268700B1 (en) * 1996-06-10 2001-07-31 Lam Research Corporation Vacuum plasma processor having coil with intermediate portion coupling lower magnetic flux density to plasma than center and peripheral portions of the coil
JP3658922B2 (ja) 1997-05-22 2005-06-15 松下電器産業株式会社 プラズマ処理方法及び装置
US6077385A (en) 1997-04-08 2000-06-20 Ebara Corporation Polishing apparatus
US6028285A (en) 1997-11-19 2000-02-22 Board Of Regents, The University Of Texas System High density plasma source for semiconductor processing
JP2972707B1 (ja) * 1998-02-26 1999-11-08 松下電子工業株式会社 プラズマエッチング装置及びプラズマエッチング方法
US6146508A (en) * 1998-04-22 2000-11-14 Applied Materials, Inc. Sputtering method and apparatus with small diameter RF coil
US6164241A (en) * 1998-06-30 2000-12-26 Lam Research Corporation Multiple coil antenna for inductively-coupled plasma generation systems
KR100291898B1 (ko) * 1999-04-09 2001-06-01 윤종용 스파터 오염원을 감소시키고 플라즈마에 유도 결합을 향상시키기위한 차폐판의 제조방법 및 플라즈마 식각장치
US6319355B1 (en) * 1999-06-30 2001-11-20 Lam Research Corporation Plasma processor with coil responsive to variable amplitude rf envelope
US6143144A (en) * 1999-07-30 2000-11-07 Tokyo Electronlimited Method for etch rate enhancement by background oxygen control in a soft etch system

Also Published As

Publication number Publication date
TW515005B (en) 2002-12-21
JP2004520704A (ja) 2004-07-08
US6531029B1 (en) 2003-03-11
WO2002003763A3 (en) 2002-12-27
DE60128229T2 (de) 2007-08-30
EP1300057B1 (de) 2007-05-02
JP5538340B2 (ja) 2014-07-02
AU2001270163A1 (en) 2002-01-14
KR20030034108A (ko) 2003-05-01
US6897156B2 (en) 2005-05-24
WO2002003763B1 (en) 2003-03-13
JP2012033958A (ja) 2012-02-16
EP1300057A2 (de) 2003-04-09
JP5116203B2 (ja) 2013-01-09
KR20070074672A (ko) 2007-07-12
KR100881882B1 (ko) 2009-02-06
WO2002003763A8 (en) 2002-04-04
WO2002003763A2 (en) 2002-01-10
KR100807143B1 (ko) 2008-02-27
US20030106645A1 (en) 2003-06-12

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition