TW498993U - Heat sink assembly - Google Patents

Heat sink assembly

Info

Publication number
TW498993U
TW498993U TW089214921U TW89214921U TW498993U TW 498993 U TW498993 U TW 498993U TW 089214921 U TW089214921 U TW 089214921U TW 89214921 U TW89214921 U TW 89214921U TW 498993 U TW498993 U TW 498993U
Authority
TW
Taiwan
Prior art keywords
heat sink
sink assembly
assembly
heat
sink
Prior art date
Application number
TW089214921U
Other languages
English (en)
Inventor
William C Bamford
Blaine C Wotring
Gregory T Wyler
Original Assignee
Molex Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex Inc filed Critical Molex Inc
Publication of TW498993U publication Critical patent/TW498993U/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW089214921U 1999-08-30 2000-09-27 Heat sink assembly TW498993U (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/386,103 US6851467B1 (en) 1999-08-30 1999-08-30 Heat sink assembly

Publications (1)

Publication Number Publication Date
TW498993U true TW498993U (en) 2002-08-11

Family

ID=23524168

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089214921U TW498993U (en) 1999-08-30 2000-09-27 Heat sink assembly

Country Status (6)

Country Link
US (2) US6851467B1 (zh)
EP (1) EP1081760A3 (zh)
JP (2) JP2001102509A (zh)
CN (1) CN1299553C (zh)
MX (1) MXPA00008166A (zh)
TW (1) TW498993U (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7230828B2 (en) 2003-10-28 2007-06-12 Fu Zhun Precision Ind. (Shenzhen) Co., Ltd. Heat dissipation device

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US6851467B1 (en) * 1999-08-30 2005-02-08 Molex Incorporated Heat sink assembly
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US6479895B1 (en) 2001-05-18 2002-11-12 Intel Corporation High performance air cooled heat sinks used in high density packaging applications
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US6712128B1 (en) 2002-11-20 2004-03-30 Thermal Corp. Cylindrical fin tower heat sink and heat exchanger
CN1307716C (zh) * 2002-12-06 2007-03-28 诺亚公司 多方位储液槽导热装置与方法
CN1293627C (zh) * 2003-01-15 2007-01-03 诺亚公司 单向气流中空腔体能量传输方法与装置
CN2676128Y (zh) * 2003-12-11 2005-02-02 东莞莫仕连接器有限公司 导热装置
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US7149083B2 (en) * 2004-03-05 2006-12-12 Hul-Chun Hsu Heat dissipation structure
US7497248B2 (en) * 2004-04-30 2009-03-03 Hewlett-Packard Development Company, L.P. Twin fin arrayed cooling device
CN2706868Y (zh) * 2004-05-26 2005-06-29 鸿富锦精密工业（深圳）有限公司 散热装置组合
US7296619B2 (en) * 2004-10-21 2007-11-20 Hewlett-Packard Development Company, L.P. Twin fin arrayed cooling device with heat spreader
CN2777753Y (zh) * 2005-01-19 2006-05-03 富准精密工业(深圳)有限公司 散热装置
TWI274539B (en) * 2005-04-01 2007-02-21 Delta Electronics Inc Heat dissipating assembly with composite heat dissipating structure
WO2007053939A1 (en) * 2005-11-09 2007-05-18 Tir Technology Lp. Passive thermal management system
JP2007273868A (ja) * 2006-03-31 2007-10-18 Fujikura Ltd ヒートシンク
US7362573B2 (en) * 2006-04-28 2008-04-22 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US8832742B2 (en) 2006-10-06 2014-09-09 United Video Properties, Inc. Systems and methods for acquiring, categorizing and delivering media in interactive media guidance applications
CN101203117B (zh) * 2006-12-13 2010-08-25 富准精密工业(深圳)有限公司 散热装置
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TW200942145A (en) * 2008-03-20 2009-10-01 Jun-Guang Luo Heat-dissipating device with multiple heat sources
TWM348981U (en) * 2008-06-12 2009-01-11 Acpa Energy Conversion Devices Co Ltd Heat dissipation module
US9228732B2 (en) 2008-07-08 2016-01-05 Us Vaopto, Inc. Modular LED lighting systems, including flexible, rigid, and waterproof lighting strips and connectors
CA2676315A1 (en) 2008-08-22 2010-02-22 Virginia Optoelectronics, Inc. Led lamp assembly
US7740380B2 (en) * 2008-10-29 2010-06-22 Thrailkill John E Solid state lighting apparatus utilizing axial thermal dissipation
US7972037B2 (en) 2008-11-26 2011-07-05 Deloren E. Anderson High intensity replaceable light emitting diode module and array
JP2010219428A (ja) * 2009-03-18 2010-09-30 Delong Chen Ｌｅｄ放熱器の構造
US20110030920A1 (en) * 2009-08-04 2011-02-10 Asia Vital Components (Shen Zhen) Co., Ltd. Heat Sink Structure
US10103089B2 (en) * 2010-03-26 2018-10-16 Hamilton Sundstrand Corporation Heat transfer device with fins defining air flow channels
MX2012011537A (es) 2010-04-05 2013-01-29 Cooper Technologies Co Montajes de iluminación que tienen transferencia de calor direccional controlada.
US8757852B2 (en) 2010-10-27 2014-06-24 Cree, Inc. Lighting apparatus
US20120186798A1 (en) * 2011-01-26 2012-07-26 Celsia Technologies Taiwan, I Cooling module for led lamp
CN102271486A (zh) * 2011-07-21 2011-12-07 尹钟哲 一种散热结构及其应用、制备装置和制备方法
TWI512440B (zh) * 2012-08-01 2015-12-11 Asia Vital Components Co Ltd 散熱裝置及其製造方法
DE102012217399A1 (de) * 2012-09-26 2014-03-27 Robert Bosch Gmbh Kühlstruktur zur Kühlung eines Zylinders
US9326424B2 (en) * 2014-09-10 2016-04-26 Opentv, Inc. Heat sink assembly and method of utilizing a heat sink assembly
US9581322B2 (en) * 2014-09-30 2017-02-28 Aeonovalite Technologies, Inc. Heat-sink for high bay LED device, high bay LED device and methods of use thereof
CN106143521B (zh) * 2016-07-20 2018-10-02 广州市日森机械股份有限公司 一种智能高压热空气冷却作业单元
US11204340B2 (en) 2018-09-21 2021-12-21 Rosemount Inc. Forced convection heater
US11041660B2 (en) * 2018-09-21 2021-06-22 Rosemount Inc. Forced convection heater
DE212019000499U1 (de) * 2019-05-08 2022-01-12 Siemens Energy Global GmbH & Co. KG Kühlkörper
TWD210771S (zh) * 2020-04-09 2021-04-01 宏碁股份有限公司 散熱鰭片

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7230828B2 (en) 2003-10-28 2007-06-12 Fu Zhun Precision Ind. (Shenzhen) Co., Ltd. Heat dissipation device

Also Published As

Publication number Publication date
CN1299553C (zh) 2007-02-07
US6851467B1 (en) 2005-02-08
EP1081760A3 (en) 2003-04-02
CN1286593A (zh) 2001-03-07
JP3105270U (ja) 2004-10-21
MXPA00008166A (es) 2002-03-15
JP2001102509A (ja) 2001-04-13
US20040200601A1 (en) 2004-10-14
EP1081760A2 (en) 2001-03-07

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004