TW495871B - Semiconductor wafer cleaning apparatus - Google Patents

Semiconductor wafer cleaning apparatus Download PDF

Info

Publication number
TW495871B
TW495871B TW090107029A TW90107029A TW495871B TW 495871 B TW495871 B TW 495871B TW 090107029 A TW090107029 A TW 090107029A TW 90107029 A TW90107029 A TW 90107029A TW 495871 B TW495871 B TW 495871B
Authority
TW
Taiwan
Prior art keywords
wafer
boat
bath
liquid
wafers
Prior art date
Application number
TW090107029A
Other languages
English (en)
Chinese (zh)
Inventor
So-Lip Son
Han-Joo Lee
Original Assignee
Will Be S & Amp T Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Will Be S & Amp T Co Ltd filed Critical Will Be S & Amp T Co Ltd
Application granted granted Critical
Publication of TW495871B publication Critical patent/TW495871B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW090107029A 1999-12-01 2001-03-23 Semiconductor wafer cleaning apparatus TW495871B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019990054236A KR100354664B1 (ko) 1999-12-01 1999-12-01 웨이퍼 세척 장치

Publications (1)

Publication Number Publication Date
TW495871B true TW495871B (en) 2002-07-21

Family

ID=19623015

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090107029A TW495871B (en) 1999-12-01 2001-03-23 Semiconductor wafer cleaning apparatus

Country Status (2)

Country Link
KR (1) KR100354664B1 (ko)
TW (1) TW495871B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI740175B (zh) * 2019-07-05 2021-09-21 弘塑科技股份有限公司 卡匣旋轉設備和卡匣

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114709155A (zh) * 2022-03-29 2022-07-05 成都泰美克晶体技术有限公司 一种晶片用圆片样品清洗治具及其清洗方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0521413A (ja) * 1991-07-10 1993-01-29 Matsushita Electric Ind Co Ltd 半導体基板洗浄装置及び半導体基板洗浄方法
JPH05144795A (ja) * 1991-11-16 1993-06-11 Tokyo Electron Ltd 洗浄方法
JPH09106978A (ja) * 1995-10-11 1997-04-22 Nippon Steel Corp 半導体製造装置
JPH1167866A (ja) * 1997-08-20 1999-03-09 Kokusai Electric Co Ltd 半導体製造装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI740175B (zh) * 2019-07-05 2021-09-21 弘塑科技股份有限公司 卡匣旋轉設備和卡匣

Also Published As

Publication number Publication date
KR20010053746A (ko) 2001-07-02
KR100354664B1 (ko) 2002-10-04

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Legal Events

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GD4A Issue of patent certificate for granted invention patent