495871 ______B7 五、發明說明（/ ) 發明背景 1、 發明領域 本發明係大體上相關於一種半導體晶圓淸洗設備，尤 其相關於一種在此一晶圓淸洗設備中的改良，用以在使被 保持於一水平放下位置中之晶圓進行旋轉之時能夠對數十 個晶圓同時進行淸洗。 2、 相關技藝之描述 爲了在一習知半導體製造程序期間能夠對具有直徑不 超過200mm之傳統小尺寸半導體晶圓進行淸洗及蝕刻，複 數個晶圓係主要被保持在一個垂直保持式晶圓匣中，該晶 圓匣係將該等晶圓保持在一個垂直的直立位置之中。隨後 ，帶有晶圓之垂直保持式晶圓匣係藉由一個機械臂部而在 晶圓沖洗用浴槽中執行所需晶圓淸洗及蝕刻程序之前被浸 入該晶圓沖洗用浴槽之中。 然而，近年來，半導體晶圓在直徑上放大至300mm或 者更大，並且被設計用來將此等大尺寸晶圓保持在一個水 平放下位置中之水平保持式晶圓匣係已被提出及使用。此 等水平保持式晶圓匣係包括有兩種標準化類型，前方開口 一體式莢形(pod-type)匣以及開放類型匣。 當一個原本被設計用來淸洗直徑200mm晶圓之傳統晶 圓淸洗用浴槽係被使用於直徑300mm之晶圓時，必須使用 一個晶圓位置改變用裝置，此裝置係具有一種複雜的結構 ，並且係在將晶圓浸入晶圓沖洗用浴槽中之前被使用來將 直徑300mm晶圓之位置從晶圓匣中的一個水平放下位置改 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) 訂---------線 « 經濟部智慧財產局員工消費合作社印製 495871 A7 ___ B7 五、發明說明（7 ) 變爲一個垂直直立位置。此等晶圓位置改變用裝置之使用 對於使用者來說是不方便的。 這也就是說，在將晶圓浸入原本被設計用來淸洗直徑 200mm晶圓之傳統晶圓淸洗用浴槽中之前，被使用來將直 徑300mm晶圓之位置從晶圓匣中的一個水平放下位置改變 爲一個垂直直立位置的晶圓位置改變用裝置係會非所欲地 增大半導體製造系統所需之設備面積。另外，直徑300mm 晶圓在此晶圓位置改變程序期間係會必然地暴露至大氣中 持續一段預定的時間，並且如此晶圓係會非所欲地被氧化 ，並且不潔物在此晶圓位置改變程序期間係會很容易污染 於晶圓表面上。晶圓位置改變程序亦增長了將晶圓浸入淸 洗用浴槽中或將晶圓從浴槽中取出之處理時間，從而造成 在半導體製造程序期間內產量之惡化。此外，晶圓在晶圓 位置改變期間係必然會與晶圓位置改變用裝置相接觸，從 而會非所欲地增大晶圓表面受到污染的狀況。另一個在使 用晶圓位置改變用裝置所遭遇到的問題是，該裝置係會增 加半導體製造系統之設備成本，並且會增加半導體產品之 生產成本。 發明槪要 據此，本發明係在牢記習知技藝中所發生之上述問題 下加以完成的，而本發明的一個目的係爲提供了一種半導 體晶圓淸洗設備，其係在使被保持於一水平放下位置中之 晶圓進行旋轉之時能夠對數十個晶圓同時進行淸洗，並且 較佳係將傳統晶圓位置改變用裝置從一個半導體生產系統 5 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) --------訂---------j 經濟部智慧財產局員工消費合作社印製 經濟部智慧財產局員工消費合作社印制衣 495871 A7 B7 五、發明說明（^) 中移除。 爲了實現上述目的，本發明係提供一種半導體晶圓淸 洗設備，其係包括有一個晶圓饋送用機械臂部，其係被使 用來將晶圓從一個晶圓匣處饋送至一個晶舟處、並使晶圓 座落在該晶舟中而能夠維持晶圓之水平放下位置。帶有被 水平放下之晶圓的晶舟係藉由一個晶舟驅動單元而被垂直 地向下移動，以便被浸於流動在一晶圓淸洗用浴槽中的晶 圓淸洗液體內。隨後，晶舟係被旋轉於晶圓淸洗液體內’ 並且晶圓係被晶圓淸洗液體所淸潔及淸洗，而在同時係得 以被維持在水平放下位置之中並且水平地進行旋轉。此設 備在晶圓淸洗程序期間並不需要將晶圓從一個水平放下位 置改變至一個垂直直立位置，並且如此該設備較佳係將傳 統晶圓位置改變用裝置從一個半導體生產系統中移除。此 設備從而縮小了用於安裝該系統的面積，並且縮短了晶圓 被暴露至大氣中的時間，並且改善了生產晶圓之產量。 圖示簡單說明 本發明之上述及其他目的、特點、以及其他優點將從 以下詳細敘述並連同伴隨圖示一起詳讀而將獲得更淸楚的 了解，其中之圖示係爲·· 第一圖係爲根據本發明較佳實施例之半導體晶圓淸洗 設備的平面圖； 第二圖係爲根據本發明之半導體晶圓淸洗設備的側視 圖； 第三圖係爲被包含在本發明半導體晶圓淸洗設備中之 6 I紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱） (請先閱讀背面之注意事項再填寫本頁) ·!裝 ------訂---------線 495871 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（A ) 晶舟驅動單元的平面圖； 第四圖係爲被包含在本發明半導體晶圓淸洗設備中之 晶圓淸洗用浴槽的前視截面圖； 第五圖係爲被包含在本發明半導體晶圓淸洗設備中之 晶圓淸洗用浴槽的平面圖； 第六圖係爲被包含在本發明半導體晶圓淸洗設備中之 晶舟的立體圖； 第七圖係爲一個平面截面圖，其係顯示出正被移入至 本發明之晶舟中、以便爲晶舟中之晶圓保持用桿件所保持 住的半導體晶圓； 第八圖係爲一個平面截面圖，其係顯示出被完全地設 置在本發明之晶舟中之後的半導體晶圓；以及 第九圖係爲一個前視圖，其係顯示出正被完全地設置 在本發明之晶舟中的半導體晶圓。 圖示午要元件符號說明 10 20 30 31 32 33 34 35 36 7 (請先閱讀背面之注意事項再填寫本頁) --------訂·-------- 晶圓匣 晶圓饋送用機械臂部 晶圓淸洗用浴槽 液體注入容室 液體排放容室 液體注射噴嘴 液體排放噴嘴 液體注入管線 液體排放管線 錢 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 495871 A7 __B7 五、發明說明（f ) 經濟部智慧財產局員工消費合作社印製 37 液體排放埠口 38 流量控制閥體 39 不純物排放埠口 39， 不純物排放璋口 40 晶舟驅動單元 41 晶舟旋轉用馬達 42 旋轉用軸桿 43 晶舟抬昇用馬達 44 晶圓保持用面板 45 軌道 50 晶舟 51 連接桿件 51， 子連接桿件 52 連接桿件 53 連接桿件 54 上方板件 55 下方板件 56 晶圓接收用刻槽 57 晶圓容座 59 桿件驅動單元 60 晶圓 (請先閱讀背面之注意事項再填寫本頁) «裝 訂---------線』 本發明之詳細說明 現在參照圖示，在圖示中相同的元件符號係在不同圖 示中被使用來標示相同或相似的部件。 8 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 495871 A7 B7 五、發明說明（b) 第一圖至第九圖係爲顯示出根據本發明較佳實施例之 半導體晶圓淸洗設備之結構與操作的圖示。如同在圖示中 所顯示者，本發明之半導體晶圓淸洗設備係包括有複數個 晶圓匣10、一個晶圓饋送用機械臂部20、複數個晶舟50 、複數個晶舟驅動單元40、複數個晶圓淸洗用浴槽30。在 本發明之設備中，晶圓匣10係將複數個晶圓60保持在一 個水平放下位置之中，而機械臂部20係將晶圓60從該等 晶圓匣10處饋送至晶舟50處，而在同時維持晶圓60之水 平放下位置。晶舟50係使從機械臂部20處所接收的晶圓 60座落於其中，而在同時維持晶圓60之水平放下位置。 晶舟驅動單元40係使晶舟50垂直移動於相對方向之上， 並且使該晶舟50旋轉。每一個浴槽30係接收一個晶舟50 ，並且容許晶舟50在執行晶圓淸洗程序之前能夠被浸入晶 圓淸洗液體之中。上述浴槽30係個別具有一個淸洗液體進 入開口。 在本發明之設備之中，被設計用來將晶圓保持在一個 水平放下位置之中的傳統標準化晶圓匣係被使用作爲每一 個晶圓匣10。另外，被使用來將晶圓60從晶圓匣10處饋 送至晶舟50處的機械臂部20係可以較佳從在習知技藝中 較佳被使用之傳統機械臂部來選出。 爲了執行一個晶圓淸洗程序，機械臂部20係將一個晶 圓60從一晶圓匣10處取出，並且將該晶圓6〇饋送至一個 晶舟50處，而在同時維持晶圓60之水平放下位置，以便 將該晶圓60座落在該晶舟50中而處於該水平放下位置之 9 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) 裝---- -------多 經濟部智慧財產局員工消費合作社印製 495871 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（^)) 中0 每一個晶舟50係包括有兩個板件：上方板件54以及 下方t反件55，該等板件係爲平行地彼此分隔，並且係藉由 複數個(例如是三個)垂直的連接桿件51、52、53而被連接 在一起’如同在第六圖中所顯示者。在這三個桿件51、52 、53之中，第一個桿件51係被設計用來被一個桿件驅動 單元59(其係被安裝在晶舟50之上方板件54之上)所向上 拉’以便使被保持在晶舟50中的晶圓60能夠在晶舟50被 浸入被容納在一浴槽30內之晶圓淸洗液體中、或從晶圓淸 洗液體中取出之時得以傾斜，而此將於下文中予以更詳細 地說明。在另一方面，第二及第三桿件52、53係於其相對 端部處被固定至該上方板件54及該下方板件55，以便維 持這兩個板件54、55之水平平行位置。在這樣的情況之中 ，由於第一桿件51係可以相對於上方板件54及該下方板 件55而垂直移動，其係無法維持這兩個板件54、55的水 平平行位置。因此需要將上方板件54及該下方板件55從 屬地保持在一個環繞著該第一桿件51的位置處。在本發明 之較佳實施例之中，上述目的係藉由兩個子連接桿件51’ 所達成，該等子連接桿件51’係於其相對端部處被垂直地 固定至上方板件54及該下方板件55，如同在第七圖以及 第八圖中有最佳顯示。上述之子連接桿件51’在晶圓60 被座落在晶舟50中之時，亦於第一桿件51之周圍處對晶 圓60之邊緣進行引導，另外，這三個桿件51、52、53的 每一個係於其外側表面處被設置有複數個晶圓接收用刻槽 10 本紙張尺度適用中國國家標準（CNS)A4規格（210>< 297公髮1 --------^--------- (請先閱讀背面之注意事項再填寫本頁) 495871 Α7 Β7 五、發明說明（γ) 56。一個晶圓容座57係被形成於每一個刻槽56的下方邊 緣處，並且使晶圓60之邊緣座落於其上。在這樣的情況之 中，每一個晶圓容座57係與一個相關的刻槽56相互聯絡 。當晶圓60係被完全地接收於這三個桿件的刻槽％中之 時，晶圓60係會稍微地向下移動，以便座落在這三個桿件 的晶圓容座57上，如同在第九圖中有最佳的顯示。在本發 明之中，帶有容座57之刻槽56的數目係爲根據在晶圓淸 洗程序期間，希望被座落在每一晶舟50中之晶圓60的數 目所決定者。 在每一個晶舟50的三個桿件51、52、53之中，被安 排在晶舟50之前方部分處的第二以及第三桿件52、53係 被設計成使其刻槽56之內側邊緣能夠彼此分隔一個稍大於 晶圓60之直徑的間距，從而容許晶圓60能夠在晶圓座落 程序期間平順地通過這兩個前方桿件52、53之刻槽56, 如同在第七圖以及第八圖中所最佳顯示者。當晶圓60係被 完全地接收於三個桿件51、52、53之刻槽56中之時，晶 圓60係會稍微地向下移動，以便能夠穩定地座落在這三個 桿件的晶圓容座57之上，如同在第九圖中所顯示者。 在這樣的情況之中，一個由三個桿件51、52、53之晶 圓容座57的內側邊緣所形成圓形的直徑係相等於或稍大於 晶圓60的直徑。另外，這兩個子連接桿件51’並未被設 置有此等晶圓接收用刻槽56或晶圓容座57，並且係被定 位在晶舟50中，以使得晶圓60之邊緣在晶圓60被完全地 座落在晶舟50中時係能夠於切線方向上被兩個子連接桿件 11 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁)495871 ______B7 V. Description of the Invention (/) Background of the Invention 1. Field of the Invention The present invention relates generally to a semiconductor wafer cleaning equipment, and more particularly, to an improvement in this wafer cleaning equipment for use in When a wafer held in a horizontally lowered position is rotated, dozens of wafers can be cleaned at the same time. 2. Description of related technologies In order to be able to clean and etch traditional small-sized semiconductor wafers with a diameter of not more than 200 mm during a conventional semiconductor manufacturing process, a plurality of wafers are mainly held on a vertically held wafer. In the cassette, the wafer cassette holds the wafers in a vertical upright position. Subsequently, the vertical holding wafer cassette with wafers is immersed into the wafer washing bath by a robot arm portion before performing the required wafer cleaning and etching procedures in the wafer washing bath. However, in recent years, a horizontally held wafer cassette system in which a semiconductor wafer has been enlarged in diameter to 300 mm or more and is designed to hold such large-sized wafers in a horizontally lowered position has been proposed and used. . These horizontally held wafer cassette systems include two standardized types, a front-opening integrated pod-type cassette and an open-type cassette. When a conventional wafer cleaning bath originally designed to clean wafers with a diameter of 200 mm is used for wafers with a diameter of 300 mm, a wafer position changing device must be used. This device has a complicated structure It is used to change the position of a wafer with a diameter of 300mm from a horizontally lowered position in the wafer cassette before immersing the wafer in the wafer washing bath. The paper size applies Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the notes on the back before filling out this page) Order --------- line «Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs's Consumer Cooperatives 495871 A7 ___ B7 V. Description of the invention (7 ) Into a vertical upright position. The use of these wafer position changing devices is inconvenient for users. This means that before immersing a wafer in a conventional wafer cleaning bath that was originally designed to clean wafers with a diameter of 200mm, it was used to position the 300mm diameter wafer from a level in the cassette. A wafer position changing device that changes the drop position to a vertical upright position undesirably increases the equipment area required for the semiconductor manufacturing system. In addition, a 300mm diameter wafer will necessarily be exposed to the atmosphere for a predetermined period of time during this wafer position change process, and thus the wafer system will be undesirably oxidized, and impurities will change at this wafer position. During the process, the surface is easily contaminated. The wafer position change procedure also increases the processing time for immersing the wafer in or removing the wafer from the bath, thereby deteriorating the yield during the semiconductor manufacturing process. In addition, during the wafer position change, the wafer is necessarily in contact with the wafer position changing device, which may undesirably increase the contamination of the wafer surface. Another problem encountered when using a wafer position changing device is that the device increases the equipment cost of a semiconductor manufacturing system and increases the production cost of a semiconductor product. SUMMARY OF THE INVENTION Accordingly, the present invention has been completed with the above problems in mind in mind, and an object of the present invention is to provide a semiconductor wafer cleaning apparatus which is maintained at When a wafer in a horizontally lowered position is rotated, dozens of wafers can be cleaned at the same time, and it is preferable to change the conventional wafer position changing device from a semiconductor production system. CNS) A4 size (210 X 297 mm) (Please read the precautions on the back before filling out this page) -------- Order --------- j Employees ’Intellectual Property Bureau Consumption Cooperative printed by the Intellectual Property Bureau of the Ministry of Economic Affairs. Consumption printed by the cooperative. 495871 A7 B7 5. Removed from the description of the invention (^). In order to achieve the above object, the present invention provides a semiconductor wafer cleaning equipment, which includes a wafer feeding robot arm, which is used to feed wafers from a wafer cassette to a wafer boat. The wafer can be seated in the wafer boat so that the wafer can be kept in a horizontally lowered position. The wafer boat with the wafer placed horizontally is moved vertically downward by a wafer boat driving unit so as to be immersed in a wafer cleaning liquid flowing in a wafer cleaning bath. Subsequently, the wafer boat system is rotated in the wafer cleaning liquid 'and the wafer system is cleaned and cleaned by the wafer cleaning liquid, and at the same time, the system is maintained in the horizontal down position and rotated horizontally. . This device does not require the wafer to be changed from a horizontal down position to a vertical upright position during the wafer cleaning process, and as such the device preferably removes a conventional wafer position changing device from a semiconductor production system . This equipment thus reduces the area used to install the system, reduces the time that wafers are exposed to the atmosphere, and improves the yield of wafers produced. The diagrams briefly explain the above and other objects, features, and other advantages of the present invention. They will be better understood from the following detailed description and the accompanying diagrams. The diagrams are ... FIG. 2 is a plan view of a semiconductor wafer cleaning apparatus according to a preferred embodiment of the present invention; FIG. 2 is a side view of a semiconductor wafer cleaning apparatus according to the present invention; and FIG. 3 is a semiconductor wafer included in the semiconductor wafer of the present invention. The 6 I paper size in the round laundering equipment is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 public love) (Please read the precautions on the back before filling this page) ·! ------ Order- -------- Line 495871 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (A) The plan view of the wafer boat drive unit; The fourth figure is the semiconductor wafer included in the present invention. A front cross-sectional view of a wafer cleaning bath in a cleaning apparatus; the fifth view is a plan view of the wafer cleaning bath included in the semiconductor wafer cleaning apparatus of the present invention; the sixth view is included Cleaning the semiconductor wafer according to the present invention A perspective view of the wafer boat in the middle; the seventh diagram is a plan sectional view showing the semiconductor wafer being moved into the wafer boat of the present invention to be held by the wafer holding rod in the wafer boat The eighth figure is a plan cross-sectional view showing the semiconductor wafer after it is completely set in the wafer boat of the present invention; and the ninth figure is a front view showing the semiconductor wafer being completely A semiconductor wafer grounded in a wafer boat of the present invention. Illustration of the symbol of the main component in the picture 10 20 30 31 32 33 34 35 36 7 (Please read the precautions on the back before filling in this page) -------- Order · -------- Wafer Cartridge wafer feeding robot arm wafer cleaning bath bath liquid injection chamber liquid discharge chamber liquid injection nozzle liquid discharge nozzle liquid injection line liquid discharge line money This paper size applies to China National Standard (CNS) A4 specifications (210 X 297 mm) 495871 A7 __B7 V. Description of the invention (f) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 37 Liquid discharge port 38 Flow control valve body 39 Impurity discharge port 39, Impurity discharge port 40 Wafer drive unit 41 Rotary motor 42 Rotary shaft 43 Rotary boat motor 44 Wafer holding panel 45 Track 50 Wafer 51 Connecting rod 51, Sub connecting rod 52 Connecting rod 53 Connecting rod 54 Upper plate Piece 55 Bottom plate 56 Wafer receiving groove 57 Wafer holder 59 Rod drive unit 60 Wafer (Please read the precautions on the back before filling this page) «Binding --------- line '' Details of the invention DESCRIPTION Referring now shown, the same elements illustrated in the symbol is used to designate the same or similar components shown in the various figures. 8 This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 495871 A7 B7 V. Description of the invention (b) The first to ninth drawings are semiconductors showing the preferred embodiment of the present invention Illustration of the structure and operation of wafer cleaning equipment. As shown in the figure, the semiconductor wafer cleaning equipment of the present invention includes a plurality of wafer cassettes 10, a wafer feeding robot arm portion 20, a plurality of wafer boats 50, and a plurality of wafer boat driving units. 40. A plurality of wafer cleaning baths 30. In the apparatus of the present invention, the wafer cassette 10 holds a plurality of wafers 60 in a horizontally lowered position, and the robot arm portion 20 feeds the wafer 60 from the wafer cassettes 10 to the wafer boat 50 While keeping the horizontal down position of the wafer 60 at the same time. The wafer boat 50 positions the wafer 60 received from the robot arm portion 20 therein while maintaining the horizontally lowered position of the wafer 60 at the same time. The boat driving unit 40 moves the boat 50 vertically above the opposite direction, and rotates the boat 50. Each bath 30 receives a wafer boat 50 and allows the wafer boat 50 to be immersed in the wafer cleaning liquid before the wafer cleaning process is performed. The above-mentioned baths 30 each have a washing liquid inlet opening. In the apparatus of the present invention, a conventional standardized cassette system designed to hold wafers in a horizontally lowered position is used as each cassette 10. In addition, the robot arm portion 20 used to feed the wafer 60 from the wafer cassette 10 to the wafer boat 50 can be preferably selected from a conventional robot arm portion which is preferably used in the conventional art. In order to perform a wafer cleaning process, the robot arm 20 removes a wafer 60 from a cassette 10 and feeds the wafer 60 to a wafer boat 50 while maintaining the wafer 60 The horizontal down position so that the wafer 60 is seated in the wafer boat 50 and the horizontal down position is 9 The paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) (Please read first Note on the back, please fill in this page again) Packing ---- ------- Printed by the Consumers 'Cooperative of the Intellectual Property Bureau of the Ministry of Economy 495871 Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economy A7 B7 V. Invention Description ( ^)) In 0, each wafer boat 50 includes two plates: an upper plate 54 and a lower t-reverse 55. These plates are parallel to each other, and are separated by a plurality (for example, three (A) vertical connecting rods 51, 52, 53 are connected together 'as shown in the sixth figure. Among these three members 51, 52, 53, the first member 51 is designed to be driven by a member driving unit 59 (which is mounted on the plate member 54 above the wafer boat 50). Pull up 'so that the wafer 60 held in the wafer boat 50 can be obtained when the wafer boat 50 is immersed in or removed from the wafer cleaning liquid contained in the bath 30. Tilt, and this will be explained in more detail below. On the other hand, the second and third lever members 52, 53 are fixed to the upper plate member 54 and the lower plate member 55 at their opposite ends so as to maintain the horizontal parallelism of the two plate members 54, 55. position. In such a case, since the first lever member 51 can move vertically with respect to the upper plate member 54 and the lower plate member 55, it cannot maintain the horizontal parallel position of the two plate members 54, 55. Therefore, it is necessary to slavely hold the upper plate member 54 and the lower plate member 55 at a position surrounding the first lever member 51. In a preferred embodiment of the present invention, the above-mentioned object is achieved by two sub-connecting rod members 51 ', which are vertically fixed to the upper plate at opposite ends thereof. 54 and the lower plate 55 are best displayed as in the seventh and eighth figures. When the above-mentioned son connecting rod 51 ′ is seated in the wafer boat 50, the edge of the wafer 60 is also guided around the first rod 51. In addition, the three rods 51, Each of 52 and 53 is provided with a plurality of grooves for receiving wafers on the outer surface of the paper. 10 The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 > < 297 public hair 1 ----- --- ^ --------- (Please read the notes on the back before filling this page) 495871 Α7 Β7 V. Description of the invention (γ) 56. A wafer holder 57 is formed in each At the lower edge of the notch 56 and the edge of the wafer 60 is seated thereon. In this case, each wafer holder 57 is interconnected with an associated notch 56. When the wafer 60 When the system is completely received in the groove% of the three rods, the wafer 60 will move slightly downwards so as to be seated on the wafer holder 57 of the three rods, as in the first The best display is shown in the nine figures. In the present invention, the number of the engraved grooves 56 with the receptacles 57 is based on the Determined by the number of wafers 60 in the wafer boat 50. Among the three rods 51, 52, 53 of each wafer boat 50, the second and third rods arranged at the front part of the wafer boat 50 The pieces 52 and 53 are designed so that the inner edges of the notches 56 can be separated from each other by a distance slightly larger than the diameter of the wafer 60, thereby allowing the wafer 60 to smoothly pass through the two fronts during the wafer seating procedure. The grooves 56 of the rods 52, 53 are as best shown in the seventh and eighth figures. When the wafer 60 is completely received in the grooves 56 of the three rods 51, 52, 53 At this time, the wafer 60 is moved slightly downward so that it can be stably seated on the wafer holder 57 of the three rods, as shown in the ninth figure. In this case, Among them, a circular diameter formed by the inner edges of the wafer holders 57 of the three rods 51, 52, 53 is equal to or slightly larger than the diameter of the wafer 60. In addition, the two sub-connected rods 51 'These wafer receiving grooves 56 or wafer holders 57 are not provided, and are positioned in the wafer boat 50 so that the wafers The edge of the circle 60 can be connected by two sub-rods in the tangential direction when the wafer 60 is completely seated in the wafer boat 50. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) Li) (Please read the notes on the back before filling this page)
· I I 線 經濟部智慧財產局員工消費合作社印製 經濟部智慧財產局員工消費合作社印刹衣 495871 A7 B7 五、發明說明) 51’的外側表面所引導。 晶舟驅動單元40的每一個均包括有一個晶舟抬昇用馬 達43，如同在第一·圖中所顯不者。晶舟旋轉用馬達41係 被連接至晶舟50之旋轉用軸桿42 ’以便使該軸桿42旋轉 ，而在同時晶舟抬昇用馬達43係在兩個垂直軌道45的引 導之下而使一晶圓保持用面板44在一個相反方向上垂直地 移動，從而使晶圓垂直地向上移動或向下移動。當晶圓60 係被完全地座落在晶舟50中之時，抬昇用馬達43係被作 動而使晶舟50垂直地向下移動，直到晶舟50被浸入一個 相關的淸洗用浴槽30之中爲止。隨後，旋轉用馬達41係 被起動而使晶舟50之旋轉用軸桿42進行旋轉，從而使晶 舟50進行旋轉。 當帶有晶圓60之晶舟50被浸入至淸洗用浴槽30中或 將帶有晶圓60之晶舟50從浴槽30中取出之時，降低作用 在被保持在晶舟50中之晶圓上的液壓阻抗是必須的。爲了 實現上述目的，桿件驅動單元59係被安裝在晶舟50的上 方板件54之上，而在同時被連接至第一連接用桿件51。 當帶有晶圓60之晶舟50係被浸入至淸洗用浴槽30中之時 ，桿件驅動單元59係於一個能夠使第一桿件51垂直地向 上移動的方向上被作動，從而使晶圓60得以相對於上方板 件54及下方板件55而傾斜一個預定傾斜角度，並且降低 了在此一晶圓浸入程序期間作用於晶圓60上的液壓阻抗。 在晶舟50被完全地浸入淸洗用浴槽30中之後，桿件驅重力 單元59係在一個相反方向上作動，用以使第一桿件51垂 12 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -------------裝--------訂---------線- (請先閱讀背面之注意事項再填寫本頁) 495871 A7 B7 五、發明說明（/0) (請先閱讀背面之注意事項再填寫本頁) 直地向下移動，從而容許晶圓60能夠回復其在被浸入浴槽 30中之晶舟50中的水平放下位置。當帶有晶圓60之晶舟 50係從淸洗用浴槽30處被取出之時，桿件驅動單元59係 以一種相同於上述之方法來進行作動，用以降低作用在晶 圓60上的液壓阻抗。 經濟部智慧財產局員工消費合作社印製 每一個晶圓淸洗用浴槽30係具有一個雙壁式圓柱形結 構而帶有內側壁部以及外側壁部，如同在第四圖中所顯示 者。每一個浴槽30係包括有一個液體注入容室31以及一 個液體排放容室32,該等容室係位於被形成在內側壁部與 外側壁部之間的空間中。複數個液體注射噴嘴33係被形成 在雙壁式浴槽30的內側壁部之上而位在一個環繞著液體注 入容室31的位置處，並且係被使用來將一晶圓淸洗液體從 液體注入容室31處注入至浴槽30的內部之中。而在同時 ，複數個液體排放噴嘴34係被形成在雙壁式浴槽30的內 側壁部之上而位在一個環繞著液體排放容室32的位置處， 並且係被使用來將一晶圓淸洗液體從浴槽30的內部排放至 液體排放容室32之中。這兩個容室31、32係被緊密地彼 此密封。每一個淸洗用浴槽30的側壁亦包括有兩個不純物 排放埠口 39、39’ ，該等不純物排放埠口 39、39’係延伸 至浴槽30的外部。在這樣的情況之中，雙壁式浴槽30之 外側壁部的頂部邊緣係較內側壁部的頂部邊緣爲高，並且 如此不純物在被排放至浴槽30之外部前，係可以將存在於 晶圓淸洗液體中的不純物從浴槽30之內部處被排放至不純 物排放埠口 39、39’ ，而得以越過內側壁部之頂部邊緣。 13 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 495871 B7 五、發明說明（ 經濟部智慧財產局員工消費合作社印製 在每一個浴槽30的下方部分處，液體注入容室31係被連 接至一個液體注入管線35，而在同時液體排放容室32係 被連接至一個液體排放管線36。一個液體排放璋口 37係 被形成在每一個淸洗用浴槽30的底部壁部上，並且係被使 用來使晶圓淸洗液體從浴槽30的內部能夠經由一個液體排 放管線(如果需要的話)而快速地排放至一個液體貯槽。 一個流量控制閥體38係被設置在液體排放埠口 37處 ，用以控制液體排放埠口 37之開口率。 在本發明之晶圓淸洗設備的操作中，機械臂部20係將 一個晶圓60從晶圓匣10處取出，而在同時能夠維持晶圓 60之水平放下位置，並且將晶圓60饋送至一個晶舟50處 ，以便將晶圓60座落在晶舟50中而得以維持晶圓60之水 平放下位置。 在此一晶圓饋送及座落程序期間，機械臂部20係將晶 圓60從晶圓匣10處取出，並且將晶圓60饋送至晶舟50 處，而在同時使用真空或重力來保持住晶圓60。此等被使 用於機械臂部20之真空類型或重力類型保持用技術係已於 傳統中被使用，並且被廣泛地使用於晶圓淸洗程序之中， 而更進一步的解釋係從而被認爲是不需要的。 當被保持在機械臂部20上的晶圓60係完全地到達晶 舟50之時，機械臂部20係使晶圓60座落在晶舟50之中 。在這樣的情況之中，晶圓60係在一個位於由上方板件 54及下方板件55所界定的間距內的位置處平順地通過兩 個前方連接用桿件52、53的刻槽56。當晶圓60係被完全 14 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 請 先 閱 讀 背 意 事 項· Line I I Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 495871 A7 B7 printed by the Consumer ’s Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Each of the boat driving units 40 includes a boat 43 for lifting the boat, as shown in the first figure. The boat rotating motor 41 is connected to the rotating shaft 42 ′ of the boat 50 so as to rotate the shaft 42, and at the same time, the boat lifting motor 43 is guided by two vertical rails 45. A wafer holding panel 44 is moved vertically in an opposite direction, so that the wafer is moved vertically upward or downward. When the wafer 60 system is completely seated in the wafer boat 50, the lifting motor 43 system is actuated to move the wafer boat 50 vertically downward until the wafer boat 50 is immersed in an associated cleaning bath Until 30. Subsequently, the rotation motor 41 is activated to rotate the rotating shaft 42 of the wafer boat 50, thereby rotating the wafer boat 50. When the wafer boat 50 with the wafer 60 is immersed in the bath 30 for cleaning or when the wafer boat 50 with the wafer 60 is taken out of the bath 30, the crystal acting on the wafer boat 50 is reduced. Hydraulic impedance on the circle is required. In order to achieve the above purpose, the rod driving unit 59 is mounted on the upper plate member 54 of the wafer boat 50, and is simultaneously connected to the first connecting rod 51. When the wafer boat 50 with the wafer 60 is immersed in the bath 30 for cleaning, the lever driving unit 59 is actuated in a direction capable of moving the first lever 51 vertically upward, so that The wafer 60 can be inclined with respect to the upper plate 54 and the lower plate 55 by a predetermined inclination angle, and the hydraulic impedance acting on the wafer 60 during this wafer immersion process is reduced. After the wafer boat 50 is completely immersed in the bath 30 for cleaning, the rod-driven gravity unit 59 is operated in an opposite direction to make the first rod 51 hang down. 12 This paper is in accordance with Chinese National Standards (CNS) A4 size (210 X 297 mm) ------------- install -------- order --------- line- (Please read the note on the back first Please fill in this page again for details) 495871 A7 B7 V. Description of the invention (/ 0) (Please read the precautions on the back before filling this page) Move straight down to allow the wafer 60 to return to being immersed in the bath 30 Level down position in Crystal Boat 50. When the wafer boat 50 with the wafer 60 is taken out of the bath 30 for cleaning, the rod driving unit 59 operates in the same manner as described above to reduce the amount of Hydraulic impedance. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Each wafer cleaning bath 30 has a double-walled cylindrical structure with an inner wall portion and an outer wall portion, as shown in the fourth figure. Each bath 30 includes a liquid injection chamber 31 and a liquid discharge chamber 32, and these chambers are located in a space formed between the inner side wall portion and the outer side wall portion. A plurality of liquid injection nozzles 33 are formed on the inner wall portion of the double-walled bath 30 at a position surrounding the liquid injection chamber 31, and are used to remove a wafer cleaning liquid from the liquid. The injection chamber 31 is injected into the interior of the bath 30. At the same time, a plurality of liquid discharge nozzles 34 are formed on the inner side wall portion of the double-walled bath 30 at a position surrounding the liquid discharge chamber 32, and are used to stack a wafer The washing liquid is discharged into the liquid discharge container 32 from the inside of the bath 30. The two chambers 31, 32 are tightly sealed to each other. The side wall of each decontamination bath 30 also includes two impurity discharge ports 39, 39 'which extend to the outside of the bath 30. In such a case, the top edge of the outer wall portion of the double-walled bath 30 is higher than the top edge of the inner wall portion, and such impurities can exist on the wafer before being discharged to the outside of the bath 30 Impurities in the washing liquid are discharged from the inside of the bath 30 to the impurity discharge ports 39, 39 'so as to pass over the top edge of the inner wall portion. 13 This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 495871 B7 V. Description of the invention (Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs on the lower part of each bath 30, the liquid injection capacity The chamber 31 is connected to a liquid injection line 35, and at the same time the liquid discharge container 32 is connected to a liquid discharge line 36. A liquid discharge nozzle 37 is formed on the bottom wall of each bath 30 It is used to allow the wafer cleaning liquid to be quickly discharged from the inside of the bath 30 to a liquid storage tank through a liquid discharge line (if necessary). A flow control valve body 38 is provided in the liquid The discharge port 37 is used to control the opening rate of the liquid discharge port 37. In the operation of the wafer cleaning apparatus of the present invention, the robot arm 20 removes a wafer 60 from the wafer cassette 10, and At the same time, the level of the wafer 60 can be maintained, and the wafer 60 is fed to a wafer boat 50 so that the wafer 60 is seated in the wafer boat 50 to maintain the level of the wafer 60 During this wafer feeding and seating procedure, the robotic arm 20 removes the wafer 60 from the wafer cassette 10 and feeds the wafer 60 to the wafer boat 50, while using a vacuum or Gravity holds wafer 60. These vacuum-type or gravity-type holding techniques used in robot arm 20 have been used conventionally and are widely used in wafer cleaning processes, and more Further explanation is therefore considered unnecessary. When the wafer 60 held on the robot arm portion 20 reaches the wafer boat 50 completely, the robot arm portion 20 causes the wafer 60 to land on the wafer boat. 50. In such a case, the wafer 60 is smoothly passed through the two front connecting rod members 52, 53 at a position within a distance defined by the upper plate member 54 and the lower plate member 55. Notch groove 56. When the wafer 60 series is completely 14 This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) Please read the note first
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I I I I 訂 i I I 495871 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（μ) 地接收於三個連接用桿件51、52、53之刻槽56中之時， 晶圓60係會稍微地向下移動，以便被座落在這三個桿件 51、52、53的晶圓容座57之上而處於一個水平放下位置之 中。 當晶圓60係如同上述般地被完全地座落在三個連接用 桿件51、52、53之晶圓容座57上而處於水平放下位置中 之時，晶圓60係不會突然地從晶圓容座57處移去。當希 望在晶圓淸洗程序後將晶圓60從晶舟50處移去之時，則 必須使用機械臂部20來將晶圓60垂直地向上移動，用以 容許晶圓60能夠到達三個連接用桿件51、52、53之刻槽 56。隨後，晶圓60係得以藉由將晶圓60拉出刻槽56之外 而從晶舟50處移去。 當所希望數目的晶圓60係被完全地座落在晶舟50中 之時，晶舟抬昇用馬達43係被作動以使晶圓保持用面板 44能夠在引導軌道45的引導之下垂直地向下移動。帶有 晶圓60之晶舟50係從而被浸入淸洗用浴槽30之中，直到 被保持在晶舟50中的晶圓60被完全地浸入至浴槽30的晶 圓淸洗液體之中爲止。 當帶有晶圓60之晶舟50係如上文所述般地被浸入至 淸洗用浴槽30中之時，被安裝在晶舟50之上方板件54上 的桿件驅動單元59係在一個能夠使第一桿件51垂直向上 移動的方向上作動，從而使晶圓60相對於上方板件54及 下方板件55而傾斜一個預定傾斜角度，並且降低了在此一 晶圓浸入程序期間作用於晶圓60上的液壓阻抗。在晶舟 15 本 張尺度適用中國國家標準（CNS)A4規格（210 x 297公釐） " (請先閱讀背面之注意事項再填寫本頁) -裝--------訂---------線j 495871IIII Order II 495871 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (μ) was received in the grooves 56 of the three connecting rods 51, 52, 53 when the wafer 60 series It will move slightly downwards so as to be seated on the wafer holder 57 of the three rods 51, 52, 53 in a horizontally lowered position. When the wafer 60 series is completely seated on the wafer holder 57 of the three connecting rods 51, 52, 53 as described above, and is in the horizontally lowered position, the wafer 60 series does not suddenly Remove from wafer holder 57. When it is desired to remove the wafer 60 from the wafer boat 50 after the wafer cleaning process, the robot arm 20 must be used to move the wafer 60 vertically upward to allow the wafer 60 to reach three The grooves 56 for the connecting rods 51, 52, 53. Subsequently, the wafer 60 can be removed from the wafer boat 50 by pulling the wafer 60 out of the notch 56. When the desired number of wafers 60 are completely seated in the wafer boat 50, the wafer boat lifting motor 43 is operated so that the wafer holding panel 44 can be vertically guided by the guide rail 45 Move down. The wafer boat 50 with the wafer 60 is immersed in the bath 30 for washing, until the wafer 60 held in the wafer boat 50 is completely immersed in the wafer washing liquid of the bath 30. When the wafer boat 50 with the wafer 60 is immersed in the bath 30 for cleaning as described above, the rod driving unit 59 mounted on the plate member 54 above the wafer boat 50 is connected to one The first rod 51 can be moved in the direction of vertical upward movement, so that the wafer 60 is inclined at a predetermined tilt angle relative to the upper plate 54 and the lower plate 55, and the effect during the wafer immersion process is reduced Hydraulic impedance on the wafer 60. In Jingzhou 15, this sheet is in accordance with China National Standard (CNS) A4 (210 x 297 mm) " (Please read the precautions on the back before filling this page) -Install -------- Order- -------- line j 495871
五、發明說明（1 5) 50被完全地浸入淸洗用浴槽30中之後，桿件驅動單元59 係在一個相反方向上作動，用以使第一桿件51垂直地向下 移動，從而容許晶圓60能夠回復其在被浸入浴槽30中之 晶舟50中的水平放下位置。 在淸洗用浴槽30內之晶圓淸洗程序期間，於液體注入 管線35處所加壓之晶圓淸洗液體係從液體注入容室31處 經由液體注射噴嘴33而被連續地注入至浴槽30的內部之 中。因此，液體係連續地流入至浴槽30之中。隨後，液體 係從浴槽30之內部經由液體排放噴嘴34而排放至液體排 放容室32，並且係經由液體排放管線36而被排出之浴槽 30的外部。 當晶舟50被浸入浴槽30中的晶圓淸洗液體之內時， 被保持在晶舟50中的晶圓60係藉由浴槽30中從液體注射 噴嘴33處流動至液體排放噴嘴34的液體所沖洗及淸洗。 在這樣的情況之中，晶舟50係藉由晶舟旋轉用馬達41而 被水平地旋轉於液體之中，晶圓淸洗效應係從而獲得改善 〇 這就是說，在晶圓淸洗程序期間，將複數個晶圓60保 持於其中之晶舟50係藉由晶舟抬昇用馬達43而向下移動 ，以便被浸入至流動於浴槽30中的晶圓淸洗液體之中。在 晶舟50被完全地浸入液體中之後，晶舟旋轉用馬達41係 被起動，用以使旋轉用軸桿42與晶舟50 —起進行旋轉’ 從而使得處於被容納於浴槽30中之液體內的晶圓60得以 旋轉。 16 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ------------«裝 (請先閱讀背面之注意事項再填寫本頁) 訂- 經濟部智慧財產局員工消費合作社印制衣 經濟部智慧財產局員工消費合作社印製 495871 A7 B7 五、發明說明（（ + ) 因此，旋轉之晶圓60係被浴槽30中從液體注射噴嘴 33處流動至液體排放噴嘴34的液體所沖洗及淸洗。 在晶圓淸洗浴槽30之中，液體排放容室32係被局部 地密封，而兩個不純物排放璋口 39、39’係形成在浴槽30 中而處於一個環繞於該液體排放容室32之位置處’而在同 時與浴槽30之外部相連通。在這樣的情況之中，雙壁式浴 槽30之外側壁部的頂部邊緣係較內側壁部之頂部邊緣爲高 ，並且如此位於晶圓淸洗液體中的不純物係可在被排放至 浴槽30之外部前，從浴槽30之內部處溢流至不純物排放 埠口 39、39’ 。 在晶圓淸洗程序期間，由於被保持在晶舟50中的晶圓 60係藉由浴槽30內的晶圓淸洗液體來加以沖洗及淸洗， 而在同時與晶舟50 —起旋轉，本發明之晶圓淸洗設備係能 夠同時對數十片晶圓60進行有效地沖洗及淸洗。另外，該 設備係實現了在晶圓表面上的一種均勻的蝕刻率，並且除 了降低在晶圓淸洗程序期間之處理時間之外，幾乎能夠完 全地將不純物及粒子從晶圓淸洗液體中移除。 在晶圓60被完全地沖洗及淸洗之後，流量控制閥體 38係被開啓，用以使晶圓淸洗流體能夠快速地從浴槽30 之內部處經由液體排放璋口 37而排出至一個排放貯槽。在 本發明之設備之中，在浴槽30完全淸空之後使該浴槽30 之內部如同所需般地完全乾燥是可達成者。在此等浴槽乾 燥程序期間，較佳的情況是將例如是異丙醇氣體(IPA gas) 等適當氣體饋送至浴槽30之中，以便改善浴槽乾燥效果。 17 冢紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ' " (請先閱讀背面之注意事項再填寫本頁)V. Description of the invention (1 5) After the 50 is completely immersed in the bath 30 for washing, the lever driving unit 59 is actuated in an opposite direction to move the first lever 51 vertically downward, thereby allowing The wafer 60 can return to its horizontally lowered position in the wafer boat 50 immersed in the bath 30. During the wafer cleaning process in the cleaning bath 30, the wafer cleaning solution system pressurized at the liquid injection line 35 is continuously injected into the bath 30 from the liquid injection chamber 31 through the liquid injection nozzle 33 Inside. Therefore, the liquid system continuously flows into the bath 30. Subsequently, the liquid is discharged from the inside of the bath 30 to the liquid discharge chamber 32 through the liquid discharge nozzle 34, and is discharged to the outside of the bath 30 through the liquid discharge line 36. When the wafer boat 50 is immersed in the wafer washing liquid in the bath 30, the wafer 60 held in the wafer boat 50 is the liquid flowing from the liquid injection nozzle 33 to the liquid discharge nozzle 34 through the bath 30 Rinse and rinse. In this case, the wafer boat 50 is horizontally rotated in the liquid by the wafer rotation motor 41, and the wafer cleaning effect is improved. That is, during the wafer cleaning process The wafer boat 50 holding the plurality of wafers 60 therein is moved downward by the wafer boat lifting motor 43 so as to be immersed in the wafer cleaning liquid flowing in the bath 30. After the wafer boat 50 is completely immersed in the liquid, the wafer boat rotation motor 41 is started to rotate the rotation shaft 42 and the wafer boat 50 to rotate the wafer shaft 50 so as to be in the liquid contained in the bath 30. The wafer 60 in the body is rotated. 16 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) ------------ «Packing (please read the precautions on the back before filling this page) Order-Economy Printed by the Intellectual Property Bureau's Consumer Cooperative Cooperative Printed by the Ministry of Economics and Intellectual Property Bureau's Employee Cooperative Printed by the Consumer Cooperative 495871 A7 B7 V. Description of the Invention ((+) Therefore, the rotating wafer 60 flows from the liquid injection nozzle 33 in the bath 30 The liquid is flushed and rinsed to the liquid discharge nozzle 34. In the wafer / bath bath 30, the liquid discharge container 32 is partially sealed, and two impurity discharge nozzles 39 and 39 'are formed in the bath 30 In the middle, it is located at a position surrounding the liquid discharge container 32 and communicates with the outside of the bath 30 at the same time. In this case, the top edge of the outer wall portion of the double-walled bath 30 is more than the inner wall The top edge of the part is high, and the impurities in the wafer cleaning liquid can overflow from the inside of the bath 30 to the impurities discharge ports 39, 39 'before being discharged to the outside of the bath 30. In the crystal During the round rinse procedure, The wafer 60 held in the wafer boat 50 is rinsed and cleaned by the wafer washing liquid in the bath 30, and is rotated together with the wafer boat 50 at the same time. The wafer washing equipment of the present invention is Can effectively rinse and clean dozens of wafers 60 at the same time. In addition, the equipment achieves a uniform etching rate on the wafer surface, and in addition to reducing the processing time during the wafer cleaning process, In addition, impurities and particles can be almost completely removed from the wafer cleaning liquid. After the wafer 60 is completely rinsed and cleaned, the flow control valve body 38 is opened to make the wafer cleaning fluid Can be quickly discharged from the inside of the bath 30 to a discharge tank through the liquid discharge port 37. In the apparatus of the present invention, after the bath 30 is completely emptied, the inside of the bath 30 is completely dried as needed It is achievable. During these bath drying procedures, it is preferable to feed an appropriate gas such as isopropyl alcohol gas (IPA gas) into the bath 30 in order to improve the drying effect of the bath. 17 Chinese National Standard (CNS) A4 size (210 X 297 mm) '" (Please read the Notes on the back to fill out this page)
------訂----------線I 495871 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明) 當晶圓60係如同上文所述般地被完全地沖洗及淸洗之 時，晶舟旋轉用馬達41係首要地被停止。隨後，晶舟抬昇 用馬達43係在一個相反方向上被旋轉，用以在容許機械臂 部20將晶圓60從晶舟50中一個一個地取出之前使晶舟50 垂直地向上移動，並將晶圓60儲存在一個所希求之晶圓匣 10中以結束晶圓淸洗程序。 如同上文中所描述者，本發明係提供了一種半導體晶 圓淸洗設備’其係在流動於一晶圓淸洗用浴槽中的晶圓淸 洗液體中同時對複數個晶圓進行淸洗，而在同時使被保持 於一水平放下位置中的晶圓進行旋轉。此設備並不需要使 直徑300mm之晶圓在晶圓淸洗程序期間將其位置從一水平 放下位置改變爲垂直直立位置，並且如此該設備係較佳地 將傳統晶圓位置改變用裝置從一半導體生產系統出移除。 此設備係從而簡化了半導體生產系統的結構，並降低了此 等系統之設備成本。該設備亦縮短了晶圓暴露至大氣中的 時間，改善了晶圓生產之產量，並幾乎可完全地防止晶圓 在其於晶圓淸洗程序期間被饋送時與污染物之接觸。 雖然本發明之較佳實施例係已爲了說明之目的而揭示 ，熟習此技者將了解到的是，不同的修正、附加、以及替 換在不背離本發明於隨附申請專利範圍中所揭示之範圍及 精神的情況下都是可能的。 18 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ---------------------^---------j (請先閱讀背面之注意事項再填寫本頁)------ Order ---------- Line I 495871 Printed by the Consumer Property Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention) When the wafer 60 is as described above At the time of complete washing and rinsing, the boat rotation motor 41 is first stopped. Subsequently, the boat lifting motor 43 is rotated in an opposite direction to move the boat 50 vertically upwards before allowing the robotic arm portion 20 to take out the wafer 60 one by one from the boat 50, and The wafer 60 is stored in a desired wafer cassette 10 to end the wafer cleaning process. As described above, the present invention provides a semiconductor wafer cleaning apparatus, which is used for cleaning a plurality of wafers simultaneously in a wafer cleaning liquid flowing in a wafer cleaning bath. At the same time, the wafer held in a horizontally lowered position is rotated. This device does not require a wafer with a diameter of 300mm to change its position from a horizontally lowered position to a vertical upright position during the wafer cleaning process, and thus the device preferably changes the conventional wafer position changing device from a The semiconductor production system is removed. This equipment simplifies the structure of the semiconductor production system and reduces the equipment cost of these systems. The device also shortens the exposure time of the wafer to the atmosphere, improves the yield of wafer production, and almost completely prevents the wafer from coming into contact with contaminants while it is being fed during the wafer scrubbing process. Although the preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions, and substitutions may be made without departing from the scope of the invention disclosed in the appended patent claims. Scope and spirit are possible. 18 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) --------------------- ^ -------- -j (Please read the notes on the back before filling this page)