TW476771B - Nitrogen-containing and phosphorus-containing resin hardener and flame resistant resin composition containing the hardener - Google Patents
Nitrogen-containing and phosphorus-containing resin hardener and flame resistant resin composition containing the hardener Download PDFInfo
- Publication number
- TW476771B TW476771B TW088119300A TW88119300A TW476771B TW 476771 B TW476771 B TW 476771B TW 088119300 A TW088119300 A TW 088119300A TW 88119300 A TW88119300 A TW 88119300A TW 476771 B TW476771 B TW 476771B
- Authority
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- Taiwan
- Prior art keywords
- group
- hardener
- resin composition
- patent application
- nitrogen
- Prior art date
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- 239000004848 polyfunctional curative Substances 0.000 title claims abstract description 48
- 229920005989 resin Polymers 0.000 title claims abstract description 35
- 239000011347 resin Substances 0.000 title claims abstract description 35
- 239000011342 resin composition Substances 0.000 title claims abstract description 24
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title claims abstract description 19
- 229910052698 phosphorus Inorganic materials 0.000 title claims abstract description 19
- 239000011574 phosphorus Substances 0.000 title claims abstract description 19
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 title claims abstract description 14
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract description 5
- 125000003277 amino group Chemical group 0.000 claims abstract description 4
- 101100294102 Caenorhabditis elegans nhr-2 gene Proteins 0.000 claims abstract description 3
- 125000003118 aryl group Chemical group 0.000 claims abstract description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 46
- 239000003822 epoxy resin Substances 0.000 claims description 41
- 229920000647 polyepoxide Polymers 0.000 claims description 41
- 239000003063 flame retardant Substances 0.000 claims description 38
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 34
- 239000004593 Epoxy Substances 0.000 claims description 23
- -1 benzene diphenanthrene Chemical compound 0.000 claims description 17
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical group C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 16
- 239000000203 mixture Substances 0.000 claims description 12
- 229930185605 Bisphenol Natural products 0.000 claims description 10
- 239000002131 composite material Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 6
- 230000002079 cooperative effect Effects 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 150000001412 amines Chemical class 0.000 claims description 5
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- 238000004519 manufacturing process Methods 0.000 claims description 4
- XYFCBTPGUUZFHI-UHFFFAOYSA-N phosphine group Chemical group P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 claims description 4
- 150000003839 salts Chemical class 0.000 claims description 4
- MBMUWELGNWWSKI-UHFFFAOYSA-N 4-(oxiran-2-ylmethoxy)phenol Chemical group C1=CC(O)=CC=C1OCC1OC1 MBMUWELGNWWSKI-UHFFFAOYSA-N 0.000 claims description 3
- 150000002989 phenols Chemical class 0.000 claims description 3
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 claims description 2
- 238000011049 filling Methods 0.000 claims description 2
- 125000001624 naphthyl group Chemical group 0.000 claims description 2
- 239000005022 packaging material Substances 0.000 claims description 2
- 229910000073 phosphorus hydride Inorganic materials 0.000 claims description 2
- 150000008442 polyphenolic compounds Polymers 0.000 claims description 2
- 150000003242 quaternary ammonium salts Chemical group 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 125000001424 substituent group Chemical group 0.000 claims description 2
- YUWBVKYVJWNVLE-UHFFFAOYSA-N [N].[P] Chemical compound [N].[P] YUWBVKYVJWNVLE-UHFFFAOYSA-N 0.000 claims 1
- OKZIUSOJQLYFSE-UHFFFAOYSA-N difluoroboron Chemical compound F[B]F OKZIUSOJQLYFSE-UHFFFAOYSA-N 0.000 claims 1
- 150000002460 imidazoles Chemical class 0.000 claims 1
- 150000002642 lithium compounds Chemical class 0.000 claims 1
- 229920002401 polyacrylamide Polymers 0.000 claims 1
- 125000001302 tertiary amino group Chemical group 0.000 claims 1
- 239000000126 substance Substances 0.000 abstract description 5
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 abstract description 2
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 abstract 1
- 125000004957 naphthylene group Chemical group 0.000 abstract 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 15
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 12
- 150000001875 compounds Chemical class 0.000 description 12
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- 229910052757 nitrogen Inorganic materials 0.000 description 9
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- 230000000052 comparative effect Effects 0.000 description 7
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- 230000015572 biosynthetic process Effects 0.000 description 5
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- 229910052794 bromium Inorganic materials 0.000 description 5
- 238000002485 combustion reaction Methods 0.000 description 5
- 150000002170 ethers Chemical class 0.000 description 5
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 5
- 238000003786 synthesis reaction Methods 0.000 description 5
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- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical compound C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 4
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- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 3
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- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- OZULZNVSOIEBOO-UHFFFAOYSA-N benzyl(propyl)phosphane Chemical class CCCPCC1=CC=CC=C1 OZULZNVSOIEBOO-UHFFFAOYSA-N 0.000 description 1
- JWLJBISFJGEYMT-UHFFFAOYSA-M benzyl(triethyl)azanium;iodide Chemical compound [I-].CC[N+](CC)(CC)CC1=CC=CC=C1 JWLJBISFJGEYMT-UHFFFAOYSA-M 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- IKWKJIWDLVYZIY-UHFFFAOYSA-M butyl(triphenyl)phosphanium;bromide Chemical compound [Br-].C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CCCC)C1=CC=CC=C1 IKWKJIWDLVYZIY-UHFFFAOYSA-M 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 230000000711 cancerogenic effect Effects 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 231100000357 carcinogen Toxicity 0.000 description 1
- 239000003183 carcinogenic agent Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 125000006222 dimethylaminomethyl group Chemical group [H]C([H])([H])N(C([H])([H])[H])C([H])([H])* 0.000 description 1
- IPZJQDSFZGZEOY-UHFFFAOYSA-N dimethylmethylene Chemical group C[C]C IPZJQDSFZGZEOY-UHFFFAOYSA-N 0.000 description 1
- 150000002013 dioxins Chemical class 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006336 epoxy molding compound Polymers 0.000 description 1
- 235000019441 ethanol Nutrition 0.000 description 1
- FYZZJDABXBPMOG-UHFFFAOYSA-N ethanol;n-methylmethanamine Chemical compound CCO.CNC FYZZJDABXBPMOG-UHFFFAOYSA-N 0.000 description 1
- NJXBVBPTDHBAID-UHFFFAOYSA-M ethyl(triphenyl)phosphanium;chloride Chemical compound [Cl-].C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CC)C1=CC=CC=C1 NJXBVBPTDHBAID-UHFFFAOYSA-M 0.000 description 1
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 1
- 150000002240 furans Chemical class 0.000 description 1
- 239000012362 glacial acetic acid Substances 0.000 description 1
- 229910052811 halogen oxide Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 125000004356 hydroxy functional group Chemical group O* 0.000 description 1
- 125000004464 hydroxyphenyl group Chemical group 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002905 metal composite material Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- MNZMMCVIXORAQL-UHFFFAOYSA-N naphthalene-2,6-diol Chemical compound C1=C(O)C=CC2=CC(O)=CC=C21 MNZMMCVIXORAQL-UHFFFAOYSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- RQKYHDHLEMEVDR-UHFFFAOYSA-N oxo-bis(phenylmethoxy)phosphanium Chemical compound C=1C=CC=CC=1CO[P+](=O)OCC1=CC=CC=C1 RQKYHDHLEMEVDR-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 150000003003 phosphines Chemical group 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- LFGREXWGYUGZLY-UHFFFAOYSA-N phosphoryl Chemical group [P]=O LFGREXWGYUGZLY-UHFFFAOYSA-N 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000009824 pressure lamination Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 235000015170 shellfish Nutrition 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- QEMXHQIAXOOASZ-UHFFFAOYSA-N tetramethylammonium Chemical compound C[N+](C)(C)C QEMXHQIAXOOASZ-UHFFFAOYSA-N 0.000 description 1
- BRKFQVAOMSWFDU-UHFFFAOYSA-M tetraphenylphosphanium;bromide Chemical compound [Br-].C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 BRKFQVAOMSWFDU-UHFFFAOYSA-M 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- CMSYDJVRTHCWFP-UHFFFAOYSA-N triphenylphosphane;hydrobromide Chemical class Br.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 CMSYDJVRTHCWFP-UHFFFAOYSA-N 0.000 description 1
- 229940124543 ultraviolet light absorber Drugs 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
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- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
- B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F9/00—Compounds containing elements of Groups 5 or 15 of the Periodic Table
- C07F9/02—Phosphorus compounds
- C07F9/547—Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom
- C07F9/6564—Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom having phosphorus atoms, with or without nitrogen, oxygen, sulfur, selenium or tellurium atoms, as ring hetero atoms
- C07F9/6571—Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom having phosphorus atoms, with or without nitrogen, oxygen, sulfur, selenium or tellurium atoms, as ring hetero atoms having phosphorus and oxygen atoms as the only ring hetero atoms
- C07F9/657163—Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom having phosphorus atoms, with or without nitrogen, oxygen, sulfur, selenium or tellurium atoms, as ring hetero atoms having phosphorus and oxygen atoms as the only ring hetero atoms the ring phosphorus atom being bound to at least one carbon atom
- C07F9/657172—Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom having phosphorus atoms, with or without nitrogen, oxygen, sulfur, selenium or tellurium atoms, as ring hetero atoms having phosphorus and oxygen atoms as the only ring hetero atoms the ring phosphorus atom being bound to at least one carbon atom the ring phosphorus atom and one oxygen atom being part of a (thio)phosphinic acid ester: (X = O, S)
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4071—Curing agents not provided for by the groups C08G59/42 - C08G59/66 phosphorus containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
- C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/92—Fire or heat protection feature
- Y10S428/921—Fire or flameproofing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31525—Next to glass or quartz
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Health & Medical Sciences (AREA)
- Molecular Biology (AREA)
- Biochemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
- Fireproofing Substances (AREA)
- Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
- Phenolic Resins Or Amino Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
476771 經濟部智慧財產局員工消費合作社印製 Α7 Β7 五、發明說明(1 ) [發明領域] 本發明揭示一種新穎之含磷及氮之樹脂硬化劑以及含 此硬化劑之難燃性樹脂組成物。 本發明之難燃性樹脂組成物不含鹵素及三氧化二銻, 具有達UL 94 V_0之難燃特性且具有高耐熱性,而可用作 為黏合片(bonding sheet或 prepreg)、複合材料 (composite)、積層板(laminate)、印刷電路板(printed circuit board)、增層法基板(build-up, Resin Coated Copper)、半 導體封裝材料(Epoxy Molding Compound)等。 [發明背景] 複合材料’尤其是環氧樹脂複合材料,以其簡易的加 工性、高度的安全性、優異的機械性質及化學性質,廣泛 地被應用於各個領域如塗裝、電氣絕緣、土木建材、接著 劑及積層品等之中。其中,以環氧樹脂製造的積層板,因 %氧樹月曰對玻璃纖維布等補強材的接著力強,硬化時不發 生揮發份,成形收縮小,因此所得到的積層板具有使用範 圍廣、機械強度優、電氣絕緣性佳、耐化學藥品性良好等 優點,大大提高了積層板材的可靠度,使得環氧樹脂積層 板大量使用於電氧及電子產品之中。 然而,為了因應印刷電路板中日益精進的細線路及高 密度的要求,積層板也被要求需具有更優異的電氣性質、 機械性質及耐熱加工性。以目前泛見的FR4積層板來說, 硬化後的玻璃轉移溫度大多在13(TC左右,對於印刷電路 板製程中超過200°C的切割和鑽孔加工,甚至27(rc以 請 閱 讀 t 面 之 注 意 事 填丄 ί裝 頁I ^ I I I I I I •吞丁 嫌 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 1 15876 476771 A7 B7 五、發明說明(2 ) 焊接程序,如此的積層板材料,有可能在製造及加工過程 中發生破裂或爆板。因此,各種強調高熱安定性、高玻璃 轉移溫度的積層板材料陸續被積極開發中。此外,對積層 板而言,另一重要的性質是其難燃特性。在某些使用的場 合中,例如飛機、汽車及大眾運輸等交通工具,因對於人 身體及生命安全直接造成威脅。因此,印刷電路板的難燃 特性是絕對必須的。 為將難燃特性引入積層板材料之中,必要使用某些具 有隔離火燄降低燃燒性質的物質。對環氧樹脂/玻璃纖維 系(或有機纖維)的積層板而言,使用含画素化合物,特別 是含溴的環氧樹脂及硬化劑,並配合如三氧化二銻之類的 難燃助劑’以期能達到對積層板難燃特性的嚴苛要求(如 UL 94V-0等級)。通常,環氧樹脂需含有高達17%到21〇/〇 的溴含量,並配合使用三氧化二銻或其它的難燃劑,才能 達到UL 94V-0的水準。然而,使用高溴含量環氧樹脂或 三氧化二銻,無疑地將對人類帶來些危險。 經濟部智慧財產局員工消費合作社印製 首先,三氧化二銻已經被列為致癌物質;另一方面, 漠在燃燒的過程當中不只是會產生有腐蝕性的溴自由基及 溴化氫’高溴含量的芳香族化合物更會產生劇毒的溴化呋 喃類及溴化戴奥辛類化合物,嚴重影響到人的健康及環 境。因此’尋求一種新的難燃材料及難燃化方法,來改進 目前積層板因使用溴化環氧樹脂而造成的汙染及環保問 題,是刻不容緩的事。尤其,FR-4類的環氧玻纖積層板 使用量大,則需求更殷。 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公董) 2 15876 71 71
五、發明說明(3 ) 科系匕σ物作為新一代具有環保概念的難燃劑,已被 廣泛地研究和應用。例如直接使用紅鱗或填的有機化合物 (例如二本基膦酸酯、三苯甲基膦酸酯、碳酸等)等來取代 画素化合物當作難燃劑,以改善高分子材料或硬化型樹脂 的燃燒特性1而,直接添加這些化合物在樹脂之中,不 僅因受限於這些化合物的難燃效率而需要較大的添加量, 且因其低刀子戛,高漂移性(migration)將直接影響到樹脂 基材的特性:如電氣性質、皆著強度等,造成實用的困難。 近年來,以反應型難燃劑的觀念配合環保和安全的考 置,磷化環氧樹脂已經被用來取代溴化環氧樹脂,作為難 燃積層板的配方,例如美國專利5376453號,使用帶環氧 基的磷酸酯配合含氮的環狀硬化劑做成積層板,卻為了彌 補磷含量不足難以達到UL 94 V-0要求的缺點,添加了多 種磷酸酯環氧化物;美國專利5458978號則利用環氧磷酸 酯配合含氮的環氧樹脂及金屬複合物作為硬化劑,其成品 玻璃轉移溫度約175°C,難燃性質則達於UL 94V-0邊緣(42 秒相對於臨界值50秒)。美國專利4973631號及美國專 5086156號使用具活性氫取代基(如胺基)的三烴基膦氯化 物單獨或配合其他胺類硬化劑,用於環氧樹脂的硬化;然 而使用硬化劑導入磷於樹脂中有磷含量低的缺點,該兩份 專利中亦無實際難燃效果的測量。 本發明即針對上述,改進現行技術中的缺點,並以提 同電氣及機械基本性質與降低成本為目標,因而完成本發 明。 請 先 閱, 讀 背 面' 之 注 意 事 填 寫裝 頁I w I I I [ I I 訂 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 3 15876 476771 A7 B7 五、發明說明(4 ) [發明詳細說明] 其具有下式 本發明有關一種含磷及氮之樹脂硬化劑 所示之結構: 中 式
2 CH - R1 2 CH rr 子 原 氳 或 閱、 讀 背 Φ 之 注 但至少一個R2不為氫原子; R1示NHR2、Cu烷基或苯基; η示0至20之整數; R示伸苯基、伸萘基或下式之基:
經濟部智慧財產局員工消費合作社印製 —A-^(^) 式中 A 示-0-、-S-、-S02-、-CO-、-ch2-、C(CH3)2-或下式之基: —CH2—CH2— 上述R及A所示之基中,芳香族基又可經一或多個 選自羥基、胺基、羧基、C i _6烷基之取代基所取代。 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 4 15876 叫Ί\ Α7
本發明又有關一種難燃性樹脂組成物,包括(Α)環氡 樹知、(B)上述之含磷及氮之樹脂硬化劑及⑴)硬化促 劑。 發明之難燃性樹脂組成物中,所含之環氧樹脂可為 t何環氧樹脂’其具體實例包含雙酚縮水甘油醚、雙二紛 縮欠甘/由_、苯二紛縮水甘油_、含氮環之縮水甘油鱗、 一羥基萘之縮水甘油醚、酚醛聚縮水甘油醚及多羥基酚聚 縮水甘油醚等。 雙酚的縮水甘油醚包括例如雙酚A縮水甘油醚、雙 酚F縮水甘油醚、雙酚AD縮水甘油醚、雙酚$縮水甘油 _四甲基雙酚A縮水甘油醚、四甲基雙酚F縮水甘油 鱗四甲基雙紛AD縮水甘油謎、四甲基雙盼s縮水甘油 鱗。 雙二酚縮水甘油醚包括例如4,4‘_二酚縮水甘油醚、 3,3’_二甲基_4,4‘_二酚縮水甘油醚、3,3,,5,5、四甲基_4,4、 一紛縮水甘油鱗。 經濟部智慧財產局員工消費合作社印製 苯二酚縮水甘油醚包括例如間苯二酚縮水甘油醚、對 苯二酚縮水甘油醚、異丁基對苯二酚縮水甘油醚。 齡酸聚縮水甘油醚包括例如酚醛聚縮水甘油醚、甲酚 酚醛聚縮水甘油醚、雙酚A酚醛聚縮水甘油醚。 笨基夕說基酴聚縮水甘油醚包括例如參(4_經基苯基) 甲烷聚縮水甘油醚、參(4_羥基苯基)乙烷聚縮水甘油醚、 參(4-羥基苯基)丙烷聚縮水甘油醚、參(4_羥基苯基)丁烷 聚縮水甘油醚、參(3_甲基_4-羥基苯基)甲烷聚縮水甘油 本紙張尺度剌帽目家標準(CNS)A4規格(210 X 297公髮) 5 15876 A7 五、發明說明(6 ) 鍵、參(3 5- ψ ti-. 、,一 T基-4-羥基苯基)甲烷聚縮水甘油醚、肆(4· 羥基苯基)乙烷聚縮水甘油醚、肆(3,5·二甲基_4_羥基苯基) 乙烷聚縮水甘油醚、雙環戊烯·酚醛聚縮水甘油醚。 含亂環之縮水甘油醚包括例如異氰尿酸酯之三縮水甘 油醚及氰尿酸醋之三縮水甘油醚。 、 &基萘之‘水甘油醚包括例如1,6 -二經基萘二縮水 甘油醚及2,6-二羥基萘二縮水甘油醚。 該等環氧樹脂可以一種單獨使用或以兩種或多種之混 合物使用。 ^ 其中杈佳為雙酚Α聚縮水甘油醚、酚醛聚縮水甘油 醚、參(4_羥基苯基)甲烷聚縮水甘油醚、雙環戊烯-酚醛聚 縮水甘油醚及四官能基的肆(苯基-4·羥基)乙烷聚縮水甘油 醚,或其混合物。 本發明之難燃性樹脂組成物中之環氧樹脂硬化劑較佳 為下式化合物: 經濟部智慧財產局員工消費合作社印製
A-1 式中b為〇至20之整數。 本發明之難燃性樹脂組成物,除了本發明之含璘及氮 之樹脂硬化劑以外,又可含有其他不含齒素之硬化劑。該 其他不含鹵素之硬化劑包含胺類、雙酚樹酯、苯二酚、多 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 15876 476771 A7 五、發明說明(7 ) 羥基酚樹脂及酚醛類等。 胺類包含例如二氰二醯胺、二胺基二苯基甲烷。 雙盼樹脂’包含例如式H〇_Ph-X_Ph-〇H(其中Ph示 伸苯基 ’ x=ch2_c(ch3)25〇5s5_co_,s〇2w 示之化合物, 例如:雙酚A、雙酚F、雙酚AD、雙酚s '四甲基雙酚 A、四甲基雙酚F、四甲基雙酚AD、四甲基雙酚s、4,4‘二 酚、3,3’-二甲基-4,4‘二酚、3,3,55,5‘四甲基·4,4‘二酚。 苯二酚包括例如間苯二酚、對苯二酚、異丁基對苯二 盼。 多(羥基酚)樹脂包含例如參(4-羥基苯基)甲烷、參(4_ 羥基苯基)乙烷、參(4-羥基苯基)丙烷、參(4-羥基苯基)丁 烷、參(3_甲基-4-羥基苯基)甲烷、參(3 5-二甲基_4_羥基 苯基)甲烷、肆(4_羥基苯基)乙烷、肆(3,5-二甲基_4_羥基 苯基)乙烧。 適合的酚醛類例如:酚甲醛縮合體、甲酚酚醛縮合體、 雙酚A酚醛縮合體、雙環戊烯-酚醛縮合體。 本發明之難燃性樹脂組成物中’硬化劑的添加量依各 硬化劑的反應活性氫當量與環氧樹脂的環氧當量而定,適 合的當量比為對環氧樹脂的環氧當量100%,硬化劑的反 應活性氫當量為20至140%,更適合的當量比為對環氧 樹脂的環氧當量100%,硬化劑的反應活性氫當量為4〇 至95%,又更適合的當量比為對環氧樹脂的環氧當量 100%,硬化劑的反應活性氫當量50至95%。 本發明之難燃性樹脂組成物中,若使用其他不含齒素 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) -----------_裝 (請先,閱讀背Φ之注意事項再填寫本頁) 訂——;------ 經濟部智慧財產局員工消費合作社印製
476771 A7 五、發明說明(8 ) 之硬化劑時,本發明之含磷與氮之環氧樹脂硬化劑與該其 他不含鹵素之硬化劑之使用比例為5 : 95至1 〇〇 : 〇,較 好為20 ·· 80至100 ·· 0,更好為25 : 75至1〇〇 : 〇。若本 發明之含磷與氮之環氧樹脂硬化劑含量過低,則易 燃性與耐熱性不足。 本發明之難燃性樹脂組成物中之硬化促進劑,包含三 級胺、三級膦、季銨鹽、季鱗鹽、三氟化刪錯合物、鐘化 物及咪唑化合物及其混合物。 -級胺例如三乙基胺、三丁基胺、二甲基胺乙醇、二 甲土苯基胺參(N,N_二甲基_胺基甲基)酚、N,N-二甲基_ 胺基甲基酶。 二級膦例如三苯基膦。季録鹽例如四甲基銨氯化物、四▼基錢漠化物、四甲 基銨峨化物、二乙基苯甲基鞍氣化物、三乙基苯甲基 化物、三乙基苯甲基銨碘化物。 、 季鱗鹽例如四丁其名悉备 丁基鱗虱化物、四丁基鱗溴化物、四丁 基鱗化物、四丁 | ^ . 四丁基鱗酯酸鹽醋酸錯合物、四 物、四苯基鱗溴化物、 鳞虱化 本基鱗碘化物、乙基三苯基鱗氯 化物乙基二笨基鱗渗化物、/直——甘 一# 关化物乙基二本基鱗碘化物、乙基 二本基鱗醋酸鹽贈酸人 _ 0 、乙基二本基鱗酯酸鹽璘酸錯 合物、丙基三装其德备7 =茉芙錄雄“ 基三苯基辚溴化物、丙基 本基鱗化物,丁甘一 〇 土二本基鱗氯化物、丁基三苯基鱗溴 化物、丁基三笨基鱗碘化物等。 咪口坐化合物例如2 I_•甲基咪唑、2·苯基咪唑、2-乙基-仁 本紙張尺—财關^ 「裝 (請先閱讀背.面之注意事項再填寫本頁) • 1 ai ·ϋ ----^--------- #· 8 15876 476771 A7 ----— B7 五、發明說明(9 ) 甲基咪唑等。 該等硬化促進劑可單獨或組合兩種或多種使用。 較佳之硬化促進劑為三級胺及咪唑化合物,尤其是二
請 先 m 讀 背· 面 之 注 意 事 t έ 頁 I 甲基苯胺、2-甲基咪唑、2_苯基咪嗤及乙基_4_甲基咪 嗤等。 硬化促進劑之使用量,為環氧樹脂組成物重量之5〇 至50,000ppm,較佳為1〇〇至3〇〇〇〇ppm,更佳為2⑽至 lOOOOppm,又更佳為500至2000ppm。若硬化促進劑之 量超過50,000ppm,雖可縮短反應時間,但對副產物生成 及對隨後之應用如電路板層合體等產生電氣性質、抗濕 ϋ及水性貝不良景> 響' 若添加量大小,則反應速率過慢 而無效率。 本發明之難燃性樹脂組成物欲調製成清漆(vanish) 時,可添加溶劑調整黏度。適宜溶劑包含有機芳族類、酮 類、質子溶劑、醚類、酯類等。 適合的有機芳族類例如:甲苯、二甲苯。 經 濟 部 智 慧 財 產 局 員 工 消 費 合 作 社 印 製 適合的酮類例如:丙酮、甲基乙基酮、甲基異丁基酮。 適合的質子溶劑例如:Ν,Ν-二甲基甲醯胺、Ν,Ν-二 乙基甲醯胺、二甲基亞楓。 適合的醚類例如:乙二醇單甲醚、丙二醇單甲醚。 適合的酯類例如:乙酸乙酯、異丙酸乙酯、丙二醇單 甲醚乙酯。
476771 A7 --— _B7______ 五、發明說明(1〇 ) 加一般添加劑或改質劑,如熱安定劑、光安定劑、紫外光 吸收劑及可塑劑等。 本發明之難燃性樹脂組成物,可利用一般業界已知的 方法’製成鋼箔、纖維支撐物與本發明難燃性樹脂組成物 的層合體。 使用本發明難燃性樹脂組成物調製成清漆(vamish), 含次纖維基材如有機或無機纖維基材例如玻璃纖維、金屬 纖維、碳纖維、芳醯胺纖維、硼及纖維素等將含浸過纖維 基材加熱乾燥,而得到乾的預浸潰體(prepreg)。該預浸潰 體可進一步地可成型製成複合材料積層板,或單獨使用於 其它膠片的黏合層,或將一個或多個組合,於其上一面或 上、下兩面放置銅箔,在加壓下加熱該預浸潰體或其組合 物’所得到的積層板複合材料在尺寸安定性、抗化學藥品 性、抗腐蝕性、吸濕性及電氣性質上都超過目前產品的標 準,適合用於製造使用於電子、太空'交通等的電氣產品了 如用於製造印刷電路板及多層電路板等。 亦可將本發明難燃性樹脂組成物調製成清漆 (varnish),塗布於鋼箔上,加熱乾燥,而得到乾的鋼箔接 著劑(RCC,Resin Coated C〇Pper)。此銅箔接著劑在室溫 下保存性可達數月之久,具有良好的保存安定性。該 可進一步地可成型製成複合材料積層板,或單獨使用於其 它膠片的黏合層,或將一個或多個組合,於| 、,、一 面 w Η、 請 先 閱* 讀 背 面_ 之 注 意 事 填 寫 本 頁 裝 經 濟 部 智 慧 財 產 局 員 工 消 費 合 作 社 印 製 下兩面m欠加層壓合(build_up),所得到的積層 板複合材料在尺寸安定性、抗化學藥品性、抗腐敍性、吸
15876 10 476771 A7 五、發明說明(11 濕性及電氣性質上都超過目前產品的標準,適合用於製造 使用於電子、太空 '交通等的多層印刷電路板。 本發明難燃性樹脂組成物之適合硬化反應溫度為2 〇 至350。(:,較佳為50至30(rc,更佳為1〇〇至25〇c>c,又 更佳為12 0至2 2 0 C。溫度過尚易產生副反應且較難控制 ,、反應速度,而且可能促使樹脂劣化的速度增快;溫度過 低除效率差外,所產生的樹脂待性較難符合高溫使用的需 求。 . 依本發明所組成的難燃性樹脂組成物,不需要添加其 他加工助劑及難燃添加劑,可同時改善了環氧樹脂的難燃 性及耐熱性質。 本發明將以下列合成例及實施例進一步說明,惟不因 此而限制本發明範圍。 合成例及實施例中所用各成分詳述如下: 經濟部智慧財產局員工消費合作社印製 Μ氧樹脂_1一代表長春人造樹脂廠所生產,以商品名 BE 188EL出售之雙酚a的二縮水甘油醚,其環氧當量介 於185至195g/eq,可水解氣為200PPm以下,黏度介於 11000 至 15000cps/25〇C 〇 氧樹脂_代表長春人造樹脂廠所生產,以商0名 CNE200ELD出售之甲酚-醛縮合體的聚縮水甘油醚,其環 氧當量介於190至210g/eq。 Μ氧樹脂_代表長春人造樹脂廠所生產,以商口名 PNE177出售之酚醛聚縮水甘油醚,其環氧當量介於 至 190g/eq。 表紙張尺度適用中國國家標準(CNS)A4規格(21G X 297公爱) 15876 請 先 閱-讀 背. 面 之 注 意 事 項L 填 i I裝 頁I w I I I I I I *叮 11
五、發明說明(u) 環氣樹脂4代爭長杳,4⑴m -一八衣负辱人造樹脂廠所生產,以商品名 BEB530A80出售之四淳雙齡厶 戌雙酚A的二縮水甘油醚,其環氧 當量介於430至450s/ea,咱人b人 王w^g/eq,/臭含量介於18 5至2〇 5wt〇/〇。 表長春人造樹脂廠所生產,商品名 BE501,其環氧當量介於49〇至5i〇g/叫。 K匕齋j A代表一氰二醯胺,1〇〇/0溶於二甲基甲醯胺。 莖代表本發明之下式所示之含磷及氮之環氧 樹脂硬化劑。
經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS)A4規格χ 297公爱) 式中b為〇至20之整數。 翌兔复复劑A代表2·甲基咪唑(2MI),10%溶於甲基 乙基_。 有關本文中所用的j哀氧當量(EEW、Epoxy Equivalent Weight) β 漆黏度(visc〇sity)、固成份(s〇iid content), 係依下述測試法測試者·· (1) 環氧當量(EEW、Epoxy Equivalent Weight):使環 氧樹月曰溶解於氣苯:氣仿=1 : 1的溶劑中,用HBr/冰醋 酸進行滴定,依ASTM D1652的方法測得,其中指示劑 為結晶紫。
(2) 黏度(Viscosity):將含磷環氧樹脂清漆置於25°C Ϊ5876 12 476771 A7 —-----B7__ 五、發明說明(13 ) 恒溫槽中4小時’用布魯克菲爾德(Br〇〇kfieid)黏度計於25 °C量測者。 (3)固成份(Solid content):取1克之含本發明含磷環 氧樹脂之清漆樣品’於1 5 〇 °c烘6 0分鐘所測得之不揮發 份的重莖百分比。 合成例1 :含磷與氮之樹脂硬化劑(硬化劑B)的合成: 配備有電加熱罩、溫度控制器電動攪拌機及攪拌棒、 氮氣入口、熱電偶、水冷式冷凝器、加料漏斗之3000m][ 五頸玻璃反應莶中置入紛1410克(15mole)、92%聚甲酸 244.7 克(7.5mole)、苯脈(benzoguanamine)337 克 (1.8mole)、9,1〇_ 二氫 _9_氧雜 _ι〇_填蒽氧化物(HCA)259 克(1.2mole)、草酸U.2克,熔解後,抽真空使以上的原 料乾燥,然後再通入氮氣,重覆抽真空及適入氮氣程序兩 -人。升脈至100至11〇 PC,反應3小時。再升溫至12〇至 125°C反應2小時。反應完徐徐將未反應完的酚與反應縮 合水以常壓蒸除,最後以18(rc,真空下保持i小時。所 得的產物為本發明之含磷與氮之樹脂硬化劑(硬化劑B)。 經 濟 部 智 慧 財 產 局 員 工 消 費 合 作 社 印 製 經分析軟化點為161°C,理論的氮含量為10 0wt%、磷含 量為2.93wt%、活性氫當量為21〇g/eq。 實施例1至3輿比較例1 於至/3BL下在配備有攪拌器及冷凝器的容器内,依表1 所不比例將合成例1所合成之硬化劑B、其他硬化劑、環 氧樹脂、硬化促進劑與溶劑調製成環氧樹脂清漆。
13 15876 476771 五、發明說明(14 ) 表1 ^量(克) 成分^ 環氧樹脂1 實施例 146 實施例 實施例 —146 環氧樹脂2 533 580 環氧樹脂3 555 壤氧樹脂4 _ 環氧樹脂5 130— — 硬化劑A 硬化劑B 700 700 700 硬化劑C 硬化促進劑A 1.5Π 1.5 1.5 丙_ 530 530 530 丙二醇單甲醚 403 403 403 實施例 555 800 2.1 580 598 500 475 59 2.3 380 300 1250 800 2.2 994 800 6.25 158
請 先 閱, 讀 f 之 注 意 事I έ 本 頁I 經濟部智慧財產局員工消費合作社印製 將已調製成的環氧樹脂清漆與玻璃纖維布含浸’經 180°C乾燥120分鐘後,成為預浸潰體後’所得的預浸潰 體經 DSC(Differential Scan Calorimeter,TA2910)測試其 玻璃轉移點(溫度範圍為50至250°C,升溫速度為20°C/ 分鐘),經燃燒試驗測其難燃性,其係依據UL746之方法’ 將預浸潰體試片切成12.5mm X 1.3mm尺寸5片,每片燃 燒2次,10次燃燒總和不超過50秒,單次最高不超過1 0 秒,即表示燃燒試驗通過。結果如表2所示: 表2 實施例 1 實施例 2 實施例 3 實施例 4 實施例 5 實施例 6 比較例 1 燃燒測試 通過 通過 通過 通過 通過 通過 通過 Tg(I) 163 160 151 148 158 144 132 以八片預浸潰體疊合,其上下各放置一片35m的銅 ,經185°C、25kg/cm2壓力壓合而成為環氧樹脂與玻璃 維布之層合體,分析各層合體之物性結果如表3所示: 本紙張尺度過用肀國國豕ί示準(CNS)A4規格(210 X 297公爱) 15876 I η 476771 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明(15 ) 表3 分析項目 條件與規格 實施例3 實施例4 比較例1 耐焊性 288〇C規袼>300秒 通過 通過 失敗 剝離強度 規格>8 lb/in 8.92 8.56 9.25 表面抗性 規格>1012 2.5*1015 3.3*1015 2.9*1015 容積抗性 規格>1010 11*1013 2.0*1013 1.2*1014 介電常數 規格<5.4 4.45 4.81 4.72 逸散因素 — 0·021 0.023 0.022 實施例7至10及比較例2 於室溫下在配備有攪拌器及冷凝器的容器内,依表4 所示比例將表4所示成分調製成環氧樹脂清漆。 表4 、\^量(克) 組成 實施例7 實施例8 實施例9 實施例10 比較例2 環氧樹脂1 12 6 環氧樹脂2 50 45 45 環氧樹脂3 40 環氧樹脂4 125 環氧樹脂5 23 20 20 硬化劑A 26.5 硬化劑B 62.6 44.5 47.8 52.9 硬化劑C 9.54 5.31 硬化促進劑A 0.21 0.22 0.35 0.36 0.65 丙二醇單甲醚 21 21 17.7 19.3 丙酮 20 21 20 20 上述實施例7、8及10及比較例2所得之環氧樹脂組 成物以80微米厚度塗佈於18微米鋼箔粗糙面上,於150 t烘乾。所得之塗佈環氧樹脂之銅箔加在前述由實施例1 之環氧樹脂組成物製成之預浸潰體上下兩側,經185°C溫 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 15 15876
請 先 閱, 讀 背 面.之 注 意 事 項L 填二ί裝 頁 I tr 476771 A7 B7_ 五、發明說明(16 ) 度及25kg/cm2壓力壓合,製得多層板。分析該多層板之 物性,結果如表5所示。 表5 分析項目 條件與規格 實施例 7 實施例 8 實施例 10 比較例 2 燃燒測試 UL94-V0 通過 通過 通過 通過 耐焊性 288°C規格>300秒 通過 通過 通過 失敗 剝離強度 IPC 規格>61Μη(18μπι) 7.3 7.9 8.1 8.4 由上述結果可看出本發明之含磷及氮之樹脂硬化劑較 不含磷及氮之硬化劑顯示更佳之燃燒測試及耐焊性,但剝 離強度亦未見降低。 -----------_裝 (請先閱讀背·面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 16 15876
Claims (1)
- 476771- 經濟部智慧財產局員工消費合作社印製 A8 B8 C8 D8 「、申請專利範圍 1· 一種含磷及氮之樹脂硬化劑,其具有下式所示之結r2Hnhr2R1 式中 R=-fCH2—R—CH2^或氫原$ . 但至少一個R不為氫原子; R1示NHR2、Cw烷基或苯基; η示0至20之整數; R示伸苯基、伸萘基或下式之基: 式中 A 不-0-、-S-、-S02_、-CO·、_CH2-、-C(Cjj、 3)2 或下式之基· —CH2~{^—(^2一 上述R及A所示之基中,芳香族基又可經一或多 個選自羥基、胺基、羧基、Cw烷基之取代基所取代。 2·如申請專利範圍第1項之含磷及氮之樹脂硬化劑,係 具下式所示之結構者: 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 17 15876 ^9. ^--------訂—τ------^9. (請先閱讀背面之注意事項再填寫本頁) 476771 六、申請專利範圍 式中b為〇至20之整數。 3. —種難燃性樹脂組成物,包括(A)環氧樹脂、(b)如申 请專利範圍第1或2項之含磷及氮之環氧樹脂硬化劑 及(C)硬化促進劑。 4·如申請專利範圍第3項之難燃性樹脂組成物,其中該 環氧樹脂係選自雙酚縮水甘油醚、雙二酚縮水甘油醚、 苯二酚縮水甘油醚、含氮環之縮水甘油醚、=羥基萘 之縮水甘油醚、酚醛聚縮水甘油醚及多羥基酚聚縮水 甘油鱗之組群者。 5·如申請專利範圍第3項之難燃性樹脂組成物,其中該 硬化促進劑係選自三級胺、三級膦、季銨鹽、季鱗鹽、 二氟化硼錯合物、鋰化物及咪唑化合物所組成之組群 者。 6. 如申請專利範圍第3項之難燃性樹脂組成物,其中以 成分(A)之環氧樹脂環氧當量為1〇〇計,成分(b)之硬 化劑用量以其反應活性氫當量計為2〇至4〇者。 7. 如申請專利範圍第3項之難燃性樹脂組成物,其中成 分(C)之硬化促進劑用量,佔環氧樹脂組成物總重之5〇 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公复) 18 15876 476771 A8 B8 C8 D8 六、申請專利範圍 至 5 0,000ppm。 8. 如申請專利範圍第3項之難燃性樹脂組成物,其又可 包含選自胺類、雙齡樹脂、苯二紛、多經基紛樹脂及 酚醛類之組群之其他硬化劑。 9. 如申請專利範圍第3項之難燃性樹脂組成物,係用以 製造黏合片、複合材料、積層板、印刷電路板、增層 法用之基板、半導體封裝材料者。 裝--------訂---7------ (先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 ‘紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 19 15876
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW088119300A TW476771B (en) | 1999-11-05 | 1999-11-05 | Nitrogen-containing and phosphorus-containing resin hardener and flame resistant resin composition containing the hardener |
US09/619,102 US6617028B1 (en) | 1999-11-05 | 2000-07-19 | Phosphorus and nitrogen containing resin hardener and a flame retarding resin composition containing said hardener |
JP2000219289A JP3906961B2 (ja) | 1999-11-05 | 2000-07-19 | 燐および窒素を含む樹脂硬化剤とその硬化剤を含む難燃性樹脂組成物 |
US10/606,620 US20040044168A1 (en) | 1999-11-05 | 2003-06-26 | Phosphorus- and nitrogen-containing resin hardener and a flame retarding resin composition containing said hardener |
Applications Claiming Priority (1)
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TW088119300A TW476771B (en) | 1999-11-05 | 1999-11-05 | Nitrogen-containing and phosphorus-containing resin hardener and flame resistant resin composition containing the hardener |
Publications (1)
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TW476771B true TW476771B (en) | 2002-02-21 |
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TW088119300A TW476771B (en) | 1999-11-05 | 1999-11-05 | Nitrogen-containing and phosphorus-containing resin hardener and flame resistant resin composition containing the hardener |
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US (2) | US6617028B1 (zh) |
JP (1) | JP3906961B2 (zh) |
TW (1) | TW476771B (zh) |
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US7162540B2 (en) * | 2000-05-15 | 2007-01-09 | Catchfire Systems, Inc. | Method and system for prioritizing network services |
US20040166241A1 (en) * | 2003-02-20 | 2004-08-26 | Henkel Loctite Corporation | Molding compositions containing quaternary organophosphonium salts |
JPWO2008010430A1 (ja) * | 2006-07-20 | 2009-12-17 | 昭和高分子株式会社 | リン含有ベンゾオキサジン化合物、その製造方法、硬化性樹脂組成物、硬化物および積層板 |
TWI388567B (zh) * | 2008-11-14 | 2013-03-11 | Chang Chun Plastics Co Ltd | 含磷化合物及其製法 |
CN101698700B (zh) * | 2009-11-03 | 2011-06-08 | 厦门大学 | 一种硅氮磷三者协同阻燃环氧树脂 |
CN103396446B (zh) * | 2013-08-01 | 2016-02-24 | 苏州科技学院相城研究院 | 阻燃剂四(o-丙基-苯基次膦酰基)甘脲化合物及其制备方法 |
CN103396444B (zh) * | 2013-08-01 | 2016-02-24 | 苏州科技学院相城研究院 | 阻燃剂四(o,o-二异丙基磷酰基)甘脲化合物及其制备方法 |
CN103387590B (zh) * | 2013-08-01 | 2015-09-09 | 苏州科技学院相城研究院 | 阻燃剂四(0,0-二甲基磷酰基)甘脲化合物及其制备方法 |
CN103396447B (zh) * | 2013-08-01 | 2016-06-29 | 苏州科技学院相城研究院 | 阻燃剂四(o-丁基-苯基次膦酰基)甘脲化合物及其制备方法 |
CN103396448B (zh) * | 2013-08-01 | 2015-09-09 | 苏州科技学院相城研究院 | 阻燃剂四(o-异丙基-苯基次膦酰基)甘脲化合物及其制备方法 |
CN103396449B (zh) * | 2013-08-01 | 2015-10-21 | 苏州科技学院相城研究院 | 阻燃剂四(o-乙基-苯基次膦酰基)甘脲化合物及其制备方法 |
CN103396450B (zh) * | 2013-08-01 | 2015-09-16 | 苏州科技学院相城研究院 | 阻燃剂四(0,0-二丁基磷酰基)甘脲化合物及其制备方法 |
CN103396445B (zh) * | 2013-08-01 | 2015-09-09 | 苏州科技学院相城研究院 | 阻燃剂四(0,0-二丙基磷酰基)甘脲化合物及其制备方法 |
US10723747B2 (en) * | 2015-09-29 | 2020-07-28 | Nan Ya Plastics Corporation | Low DK phosphorous containing hardener useful for halogen free, flame retardant polymers and use |
CN107383338A (zh) * | 2017-08-16 | 2017-11-24 | 吴丹 | 用于涂料的固化剂 |
CN109467688B (zh) * | 2018-09-17 | 2021-01-15 | 天津慧瑞科技有限公司 | 一种磷-氮-硼协效高阻燃柔韧型固化剂及其合成方法 |
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-
1999
- 1999-11-05 TW TW088119300A patent/TW476771B/zh not_active IP Right Cessation
-
2000
- 2000-07-19 JP JP2000219289A patent/JP3906961B2/ja not_active Expired - Fee Related
- 2000-07-19 US US09/619,102 patent/US6617028B1/en not_active Expired - Fee Related
-
2003
- 2003-06-26 US US10/606,620 patent/US20040044168A1/en not_active Abandoned
Also Published As
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JP3906961B2 (ja) | 2007-04-18 |
JP2001139652A (ja) | 2001-05-22 |
US20040044168A1 (en) | 2004-03-04 |
US6617028B1 (en) | 2003-09-09 |
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