TW469534B - Plasma processing method and apparatus - Google Patents

Plasma processing method and apparatus Download PDF

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Publication number
TW469534B
TW469534B TW089103065A TW89103065A TW469534B TW 469534 B TW469534 B TW 469534B TW 089103065 A TW089103065 A TW 089103065A TW 89103065 A TW89103065 A TW 89103065A TW 469534 B TW469534 B TW 469534B
Authority
TW
Taiwan
Prior art keywords
vacuum chamber
plasma processing
electrode
plasma
frequency power
Prior art date
Application number
TW089103065A
Other languages
English (en)
Inventor
Tomohiro Okumura
Hideo Haraguchi
Takuya Matsui
Izuru Matsuda
Akio Mihashi
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP04435999A external-priority patent/JP3417328B2/ja
Priority claimed from JP04624599A external-priority patent/JP3485013B2/ja
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Application granted granted Critical
Publication of TW469534B publication Critical patent/TW469534B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/26—Plasma torches
    • H05H1/30—Plasma torches using applied electromagnetic fields, e.g. high frequency or microwave energy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
TW089103065A 1999-02-23 2000-02-22 Plasma processing method and apparatus TW469534B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP04435999A JP3417328B2 (ja) 1999-02-23 1999-02-23 プラズマ処理方法及び装置
JP04624599A JP3485013B2 (ja) 1999-02-24 1999-02-24 プラズマ処理方法及び装置

Publications (1)

Publication Number Publication Date
TW469534B true TW469534B (en) 2001-12-21

Family

ID=26384221

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089103065A TW469534B (en) 1999-02-23 2000-02-22 Plasma processing method and apparatus

Country Status (3)

Country Link
US (2) US6808759B1 (zh)
KR (1) KR100381117B1 (zh)
TW (1) TW469534B (zh)

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CN101653048B (zh) * 2007-03-30 2015-09-23 朗姆研究公司 Rf供电电极上的dc电压控制的方法和设备

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Also Published As

Publication number Publication date
US6808759B1 (en) 2004-10-26
KR20000062605A (ko) 2000-10-25
US20050011453A1 (en) 2005-01-20
KR100381117B1 (ko) 2003-04-23
US7513214B2 (en) 2009-04-07

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