TW459393B - Electronic component and method for improving pixel charge transfer in the electronic component - Google Patents
Electronic component and method for improving pixel charge transfer in the electronic component Download PDFInfo
- Publication number
- TW459393B TW459393B TW089107460A TW89107460A TW459393B TW 459393 B TW459393 B TW 459393B TW 089107460 A TW089107460 A TW 089107460A TW 89107460 A TW89107460 A TW 89107460A TW 459393 B TW459393 B TW 459393B
- Authority
- TW
- Taiwan
- Prior art keywords
- region
- edge
- image sensing
- area
- electronic component
- Prior art date
Links
- 238000012546 transfer Methods 0.000 title claims abstract description 81
- 238000000034 method Methods 0.000 title abstract description 10
- 239000004065 semiconductor Substances 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 11
- 230000003647 oxidation Effects 0.000 claims description 10
- 238000007254 oxidation reaction Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- 230000007704 transition Effects 0.000 claims description 5
- 239000012535 impurity Substances 0.000 claims description 3
- PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 claims 1
- 230000004888 barrier function Effects 0.000 description 21
- 230000000875 corresponding effect Effects 0.000 description 16
- 230000003287 optical effect Effects 0.000 description 10
- 230000002079 cooperative effect Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000013459 approach Methods 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 230000005611 electricity Effects 0.000 description 5
- 230000012447 hatching Effects 0.000 description 5
- 230000003068 static effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 235000015170 shellfish Nutrition 0.000 description 2
- 229910021332 silicide Inorganic materials 0.000 description 2
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 2
- 206010061307 Neck deformity Diseases 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000747 cardiac effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000005036 potential barrier Methods 0.000 description 1
- 102200024817 rs121908818 Human genes 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/15—Charge-coupled device [CCD] image sensors
- H10F39/152—One-dimensional array CCD image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/15—Charge-coupled device [CCD] image sensors
- H10F39/151—Geometry or disposition of pixel elements, address lines or gate electrodes
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/347,552 US6476426B1 (en) | 1999-07-06 | 1999-07-06 | Electronic component and method for improving pixel charge transfer in the electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW459393B true TW459393B (en) | 2001-10-11 |
Family
ID=23364207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW089107460A TW459393B (en) | 1999-07-06 | 2000-04-20 | Electronic component and method for improving pixel charge transfer in the electronic component |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6476426B1 (enExample) |
| JP (1) | JP4709351B2 (enExample) |
| KR (1) | KR100637756B1 (enExample) |
| CN (1) | CN1175495C (enExample) |
| TW (1) | TW459393B (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100574971B1 (ko) * | 2004-02-17 | 2006-05-02 | 삼성전자주식회사 | 멀티-게이트 구조의 반도체 소자 및 그 제조 방법 |
| JP5427173B2 (ja) * | 2008-06-05 | 2014-02-26 | 本田技研工業株式会社 | 光受信機 |
| JP7455525B2 (ja) * | 2018-07-17 | 2024-03-26 | ブリルニクス シンガポール プライベート リミテッド | 固体撮像装置、固体撮像装置の製造方法、および電子機器 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4484210A (en) | 1980-09-05 | 1984-11-20 | Nippon Electric Co., Ltd. | Solid-state imaging device having a reduced image lag |
| JPS60170383A (ja) * | 1984-02-14 | 1985-09-03 | Mitsubishi Electric Corp | 固体撮像素子 |
| JPH02219270A (ja) | 1989-02-20 | 1990-08-31 | Nec Corp | 固体撮像装置 |
| JPH05283666A (ja) | 1992-03-30 | 1993-10-29 | Sony Corp | 固体撮像素子 |
| JP2825702B2 (ja) | 1992-05-20 | 1998-11-18 | シャープ株式会社 | 固体撮像素子 |
| JPH05347401A (ja) * | 1992-06-15 | 1993-12-27 | Matsushita Electron Corp | 固体撮像素子 |
| JP2699841B2 (ja) | 1993-12-10 | 1998-01-19 | 日本電気株式会社 | 固体撮像装置 |
| KR0136934B1 (ko) | 1994-02-23 | 1998-04-24 | 문정환 | 선형 고체영상소자 |
| JP3482689B2 (ja) * | 1994-05-27 | 2003-12-22 | ソニー株式会社 | 固体撮像装置及びこれを用いたバーコード読取り装置 |
| US5488239A (en) | 1994-07-14 | 1996-01-30 | Goldstar Electron Co., Ltd. | Solid state image sensor with shaped photodiodes |
| US5625210A (en) | 1995-04-13 | 1997-04-29 | Eastman Kodak Company | Active pixel sensor integrated with a pinned photodiode |
| JPH09289301A (ja) * | 1996-04-22 | 1997-11-04 | Nikon Corp | 固体撮像装置 |
| US5903021A (en) | 1997-01-17 | 1999-05-11 | Eastman Kodak Company | Partially pinned photodiode for solid state image sensors |
| US6657665B1 (en) * | 1998-12-31 | 2003-12-02 | Eastman Kodak Company | Active Pixel Sensor with wired floating diffusions and shared amplifier |
-
1999
- 1999-07-06 US US09/347,552 patent/US6476426B1/en not_active Expired - Lifetime
-
2000
- 2000-04-20 TW TW089107460A patent/TW459393B/zh not_active IP Right Cessation
- 2000-06-01 JP JP2000163965A patent/JP4709351B2/ja not_active Expired - Lifetime
- 2000-06-12 KR KR1020000032233A patent/KR100637756B1/ko not_active Expired - Lifetime
- 2000-07-03 CN CNB001199382A patent/CN1175495C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1175495C (zh) | 2004-11-10 |
| JP2001036061A (ja) | 2001-02-09 |
| US6476426B1 (en) | 2002-11-05 |
| CN1283872A (zh) | 2001-02-14 |
| KR20010029795A (ko) | 2001-04-16 |
| KR100637756B1 (ko) | 2006-10-23 |
| JP4709351B2 (ja) | 2011-06-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW544905B (en) | Semiconductor device and method of driving the same | |
| TWI320861B (en) | A liquid crystal display device and fabricating method thereof | |
| TW295683B (enExample) | ||
| US10579852B2 (en) | Fingerprint identification device and manufacturing method thereof, array substrate and display apparatus | |
| TWI536351B (zh) | 半導體顯示裝置及其驅動方法 | |
| KR0163933B1 (ko) | 박막트랜지스터 액정 디스플레이의 기생용량 및 축적용량의 구조 및 그 제조 방법 | |
| CN106935601B (zh) | 半导体器件、阵列基板和半导体器件的制造方法 | |
| JP5109684B2 (ja) | 検出装置及び電子機器 | |
| JP2943437B2 (ja) | 指紋センサ | |
| JP4474900B2 (ja) | 静電気保護回路およびそれを備えた電子回路 | |
| TW459393B (en) | Electronic component and method for improving pixel charge transfer in the electronic component | |
| CN111967423B (zh) | 像素电路及其驱动方法、阵列基板、显示装置 | |
| CN103259983A (zh) | 一种平板图像传感器 | |
| JP4347427B2 (ja) | センサアレイデータライン読み出しにおけるクロストークを減少するセンサアレイ及びその操作方法 | |
| Ito et al. | a-Si: H TFT driven linear image sensor | |
| TWI245957B (en) | Active matrix display device | |
| JP5109687B2 (ja) | 検出装置及び電子機器 | |
| JP2002343953A (ja) | 半導体装置および光電変換装置 | |
| TW301782B (enExample) | ||
| TW495979B (en) | Image input device and manufacturing method thereof | |
| CN109099940B (zh) | 感测装置 | |
| TW493095B (en) | Liquid-crystal display with inter-line short-circuit preventive function and process for producing same | |
| CN109244089A (zh) | 一种感测基板及其制作方法、显示装置 | |
| CN110690239B (zh) | 一种针状面阵成像器件 | |
| TW412708B (en) | Method for reading signal and improving sensitivity of contact image sensor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent | ||
| MM4A | Annulment or lapse of patent due to non-payment of fees |