TW436958B - Semiconductor integrated circuit device and process for manufacturing the same - Google Patents

Semiconductor integrated circuit device and process for manufacturing the same Download PDF

Info

Publication number
TW436958B
TW436958B TW088121013A TW88121013A TW436958B TW 436958 B TW436958 B TW 436958B TW 088121013 A TW088121013 A TW 088121013A TW 88121013 A TW88121013 A TW 88121013A TW 436958 B TW436958 B TW 436958B
Authority
TW
Taiwan
Prior art keywords
insulating film
film
groove
forming
opening
Prior art date
Application number
TW088121013A
Other languages
English (en)
Chinese (zh)
Inventor
Isamu Asano
Osamu Tsuchiya
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of TW436958B publication Critical patent/TW436958B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/82—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
    • H10D84/83—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
    • H10D84/85—Complementary IGFETs, e.g. CMOS
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H10B12/48—Data lines or contacts therefor
    • H10B12/485—Bit line contacts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/069—Manufacture or treatment of conductive parts of the interconnections by forming self-aligned vias or self-aligned contact plugs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/081—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts
    • H10W20/089—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts using processes for implementing desired shapes or dispositions of the openings, e.g. double patterning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/03—Making the capacitor or connections thereto
    • H10B12/033—Making the capacitor or connections thereto the capacitor extending over the transistor
    • H10B12/0335—Making a connection between the transistor and the capacitor, e.g. plug
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H10B12/09—Manufacture or treatment with simultaneous manufacture of the peripheral circuit region and memory cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H10B12/31—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor
    • H10B12/315—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor with the capacitor higher than a bit line
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/01—Manufacture or treatment
    • H10D1/041—Manufacture or treatment of capacitors having no potential barriers
    • H10D1/042—Manufacture or treatment of capacitors having no potential barriers using deposition processes to form electrode extensions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H10D1/692—Electrodes
    • H10D1/711—Electrodes having non-planar surfaces, e.g. formed by texturisation
    • H10D1/716—Electrodes having non-planar surfaces, e.g. formed by texturisation having vertical extensions

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Memories (AREA)
TW088121013A 1999-01-19 1999-12-01 Semiconductor integrated circuit device and process for manufacturing the same TW436958B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP01101899A JP3660821B2 (ja) 1999-01-19 1999-01-19 半導体装置およびその製造方法

Publications (1)

Publication Number Publication Date
TW436958B true TW436958B (en) 2001-05-28

Family

ID=11766385

Family Applications (1)

Application Number Title Priority Date Filing Date
TW088121013A TW436958B (en) 1999-01-19 1999-12-01 Semiconductor integrated circuit device and process for manufacturing the same

Country Status (4)

Country Link
US (1) US6238961B1 (https=)
JP (1) JP3660821B2 (https=)
KR (1) KR20000057770A (https=)
TW (1) TW436958B (https=)

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DE10015278B4 (de) * 2000-03-28 2004-09-23 Infineon Technologies Ag Halbleiterspeicher mit einem Speicherzellenfeld
JP2002026008A (ja) * 2000-07-11 2002-01-25 Nec Corp 多層配線構造の形成方法及び多層配線構造が形成されたウエハ
US6573148B1 (en) * 2000-07-12 2003-06-03 Koninklljke Philips Electronics N.V. Methods for making semiconductor inductor
KR100709453B1 (ko) * 2001-06-27 2007-04-18 주식회사 하이닉스반도체 반도체소자의 비트라인 형성방법
US6620676B2 (en) * 2001-06-29 2003-09-16 International Business Machines Corporation Structure and methods for process integration in vertical DRAM cell fabrication
JP2004152878A (ja) * 2002-10-29 2004-05-27 Toshiba Corp 半導体記憶装置及びその製造方法
KR100560803B1 (ko) * 2004-02-04 2006-03-13 삼성전자주식회사 캐패시터를 갖는 반도체 소자 및 그 제조방법
US7485910B2 (en) * 2005-04-08 2009-02-03 International Business Machines Corporation Simplified vertical array device DRAM/eDRAM integration: method and structure
US20090159947A1 (en) * 2007-12-19 2009-06-25 International Business Machines Corporation SIMPLIFIED VERTICAL ARRAY DEVICE DRAM/eDRAM INTEGRATION
KR101432619B1 (ko) * 2008-07-07 2014-08-21 삼성전자주식회사 반도체 장치 및 그 제조 방법
US9704871B2 (en) * 2014-09-18 2017-07-11 Micron Technology, Inc. Semiconductor device having a memory cell and method of forming the same
JP2016066775A (ja) 2014-09-18 2016-04-28 マイクロン テクノロジー， インク． 半導体装置及びその製造方法
US9698213B1 (en) * 2016-09-28 2017-07-04 International Business Machines Corporation Vertical MIM capacitor

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5219793A (en) * 1991-06-03 1993-06-15 Motorola Inc. Method for forming pitch independent contacts and a semiconductor device having the same
JP2765478B2 (ja) * 1994-03-30 1998-06-18 日本電気株式会社 半導体装置およびその製造方法
JP2806795B2 (ja) 1994-05-20 1998-09-30 日本電気株式会社 半導体集積回路の配線構造の製造方法
JPH0955440A (ja) * 1995-08-17 1997-02-25 Sony Corp 半導体装置及び半導体装置の製造方法
KR0168355B1 (ko) * 1995-11-02 1999-02-01 김광호 반도체장치의 배선 형성방법
JP3402022B2 (ja) * 1995-11-07 2003-04-28 三菱電機株式会社 半導体装置の製造方法
US5688713A (en) * 1996-08-26 1997-11-18 Vanguard International Semiconductor Corporation Method of manufacturing a DRAM cell having a double-crown capacitor using polysilicon and nitride spacers
JPH10163316A (ja) 1996-12-04 1998-06-19 Sony Corp 半導体装置における埋め込み配線の形成方法
JPH10178160A (ja) * 1996-12-17 1998-06-30 Hitachi Ltd 半導体集積回路装置およびその製造方法
JP3614267B2 (ja) * 1997-02-05 2005-01-26 株式会社ルネサステクノロジ 半導体集積回路装置の製造方法
TW320765B (en) * 1997-02-22 1997-11-21 United Microelectronics Corp Manufacturing method of self-aligned contact of dynamic random access memory
US6008085A (en) * 1998-04-01 1999-12-28 Vanguard International Semiconductor Corporation Design and a novel process for formation of DRAM bit line and capacitor node contacts
US6054394A (en) * 1998-11-25 2000-04-25 United Microelectronics Corp. Method of fabricating a dynamic random access memory capacitor

Also Published As

Publication number Publication date
US6238961B1 (en) 2001-05-29
JP3660821B2 (ja) 2005-06-15
KR20000057770A (ko) 2000-09-25
JP2000208729A (ja) 2000-07-28

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MM4A Annulment or lapse of patent due to non-payment of fees