TW436374B - Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization - Google Patents

Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization Download PDF

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Publication number
TW436374B
TW436374B TW088119569A TW88119569A TW436374B TW 436374 B TW436374 B TW 436374B TW 088119569 A TW088119569 A TW 088119569A TW 88119569 A TW88119569 A TW 88119569A TW 436374 B TW436374 B TW 436374B
Authority
TW
Taiwan
Prior art keywords
roller
pressure
patent application
polishing pad
pad
Prior art date
Application number
TW088119569A
Other languages
English (en)
Chinese (zh)
Inventor
Michael Labunsky
Tac Huynh
Anthony S Meyer
Andrew J Nagengast
Glenn W Travis
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Application granted granted Critical
Publication of TW436374B publication Critical patent/TW436374B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/02—Wheels in one piece

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW088119569A 1998-11-09 2000-01-24 Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization TW436374B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/188,779 US6086460A (en) 1998-11-09 1998-11-09 Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization

Publications (1)

Publication Number Publication Date
TW436374B true TW436374B (en) 2001-05-28

Family

ID=22694491

Family Applications (1)

Application Number Title Priority Date Filing Date
TW088119569A TW436374B (en) 1998-11-09 2000-01-24 Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization

Country Status (7)

Country Link
US (2) US6086460A (enExample)
EP (1) EP1128932A4 (enExample)
JP (1) JP2002529924A (enExample)
KR (1) KR100642405B1 (enExample)
AU (1) AU1224400A (enExample)
TW (1) TW436374B (enExample)
WO (1) WO2000027585A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7425172B2 (en) 2003-03-25 2008-09-16 Nexplanar Corporation Customized polish pads for chemical mechanical planarization
TWI394637B (zh) * 2005-08-30 2013-05-01 Tokyo Seimitsu Co Ltd 墊調節器、墊調節方法及拋光裝置
TWI451938B (zh) * 2010-05-10 2014-09-11 Samsung Electronics Co Ltd 化學機械研磨設備之調節器

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US6306019B1 (en) 1999-12-30 2001-10-23 Lam Research Corporation Method and apparatus for conditioning a polishing pad
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US6343977B1 (en) * 2000-03-14 2002-02-05 Worldwide Semiconductor Manufacturing Corp. Multi-zone conditioner for chemical mechanical polishing system
US6626743B1 (en) 2000-03-31 2003-09-30 Lam Research Corporation Method and apparatus for conditioning a polishing pad
US6361414B1 (en) 2000-06-30 2002-03-26 Lam Research Corporation Apparatus and method for conditioning a fixed abrasive polishing pad in a chemical mechanical planarization process
US6645046B1 (en) 2000-06-30 2003-11-11 Lam Research Corporation Conditioning mechanism in a chemical mechanical polishing apparatus for semiconductor wafers
US6435952B1 (en) 2000-06-30 2002-08-20 Lam Research Corporation Apparatus and method for qualifying a chemical mechanical planarization process
US6468134B1 (en) * 2000-06-30 2002-10-22 Lam Research Corporation Method and apparatus for slurry distribution
JP3768399B2 (ja) * 2000-11-17 2006-04-19 株式会社荏原製作所 ドレッシング装置及びポリッシング装置
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US6554688B2 (en) 2001-01-04 2003-04-29 Lam Research Corporation Method and apparatus for conditioning a polishing pad with sonic energy
US6752698B1 (en) 2001-03-19 2004-06-22 Lam Research Corporation Method and apparatus for conditioning fixed-abrasive polishing pads
US6910949B1 (en) 2001-04-25 2005-06-28 Lam Research Corporation Spherical cap-shaped polishing head in a chemical mechanical polishing apparatus for semiconductor wafers
US6767427B2 (en) * 2001-06-07 2004-07-27 Lam Research Corporation Apparatus and method for conditioning polishing pad in a chemical mechanical planarization process
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KR100462868B1 (ko) * 2001-06-29 2004-12-17 삼성전자주식회사 반도체 폴리싱 장치의 패드 컨디셔너
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US6561880B1 (en) * 2002-01-29 2003-05-13 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for cleaning the polishing pad of a linear polisher
US20030190874A1 (en) * 2002-04-02 2003-10-09 So Joseph K. Composite conditioning tool
US6958005B1 (en) * 2004-03-30 2005-10-25 Lam Research Corporation Polishing pad conditioning system
US6969307B2 (en) * 2004-03-30 2005-11-29 Lam Research Corporation Polishing pad conditioning and polishing liquid dispersal system
US6935938B1 (en) 2004-03-31 2005-08-30 Lam Research Corporation Multiple-conditioning member device for chemical mechanical planarization conditioning
US8251776B2 (en) * 2006-01-23 2012-08-28 Freescale Semiconductor, Inc. Method and apparatus for conditioning a CMP pad
KR100943740B1 (ko) * 2008-06-02 2010-02-23 세메스 주식회사 Ｌｃｄ 패널 및 반도체 기판의 연마 장치
US20100062693A1 (en) * 2008-09-05 2010-03-11 Taiwan Semiconductor Manufacturing Co., Ltd. Two step method and apparatus for polishing metal and other films in semiconductor manufacturing
US20100291841A1 (en) * 2009-05-14 2010-11-18 Chien-Min Sung Methods and Systems for Water Jet Assisted CMP Processing
CN102049730B (zh) * 2010-12-29 2012-02-15 清华大学 一种用于化学机械抛光设备的晶圆交换装置
JP5878441B2 (ja) * 2012-08-20 2016-03-08 株式会社荏原製作所 基板洗浄装置及び基板処理装置
US20140310895A1 (en) * 2013-04-19 2014-10-23 Applied Materials, Inc. Scrubber brush force control assemblies, apparatus and methods for chemical mechanical polishing
JP5554440B2 (ja) * 2013-07-30 2014-07-23 ニッタ・ハース株式会社 研磨パッドのコンディショナー
US11059145B2 (en) * 2017-08-10 2021-07-13 Tokyo Electron Limited Dressing apparatus and dressing method for substrate rear surface polishing member
JP7079164B2 (ja) 2018-07-06 2022-06-01 株式会社荏原製作所 基板洗浄装置および基板洗浄方法

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7425172B2 (en) 2003-03-25 2008-09-16 Nexplanar Corporation Customized polish pads for chemical mechanical planarization
US7704122B2 (en) 2003-03-25 2010-04-27 Nexplanar Corporation Customized polish pads for chemical mechanical planarization
TWI394637B (zh) * 2005-08-30 2013-05-01 Tokyo Seimitsu Co Ltd 墊調節器、墊調節方法及拋光裝置
TWI451938B (zh) * 2010-05-10 2014-09-11 Samsung Electronics Co Ltd 化學機械研磨設備之調節器

Also Published As

Publication number Publication date
EP1128932A1 (en) 2001-09-05
US6328637B1 (en) 2001-12-11
US6086460A (en) 2000-07-11
EP1128932A4 (en) 2007-01-10
WO2000027585A1 (en) 2000-05-18
KR20010092725A (ko) 2001-10-26
AU1224400A (en) 2000-05-29
KR100642405B1 (ko) 2006-11-03
JP2002529924A (ja) 2002-09-10

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GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees